CN103139694A - Microphone package technology and package structure according to technology - Google Patents
Microphone package technology and package structure according to technology Download PDFInfo
- Publication number
- CN103139694A CN103139694A CN201210557327XA CN201210557327A CN103139694A CN 103139694 A CN103139694 A CN 103139694A CN 201210557327X A CN201210557327X A CN 201210557327XA CN 201210557327 A CN201210557327 A CN 201210557327A CN 103139694 A CN103139694 A CN 103139694A
- Authority
- CN
- China
- Prior art keywords
- intermediate plate
- microphone
- plate
- copper foil
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention relates to microphone package technology and a package structure according to the technology. The technology comprises the following steps: step one, conductive adhesive films are carried out on punching, a plurality of openings are formed in the conductive adhesive films; step two, an intermediate plate is provided, the intermediate plate is drilled to form an intermediate plate through-hole and the inner wall of the intermediate plate through-hole is metalized; step three, two surfaces of the intermediate plate are respectively bonded with the conductive adhesive film; step four, a release liner of a conductive adhesive film on one of the surfaces of the intermediate plate is removed and a baseboard is bonded on the surface; step five, microphone functional components are respectively arranged in a plurality of cavities formed in step four; step six, a release liner of a conductive adhesive film on the other surface of the intermediate plate is removed and a cover plate is pressed on the surface; step seven, a connection plate is divided into a plurality of microphone units. The microphone package technology and the package structure according to the technology have the advantages that the technological process is simple, bonding glue quantity and the shape of an adhesive surface are easy to control, the package structure is installed stably, and the sealing effect and the electromagnetic shielding effect are good.
Description
Technical field
The present invention relates to the production technology of microphone and the encapsulating structure field of microphone, specifically a kind of encapsulating structure that utilizes microphone package technique that the solid conduction adhesive film carries out packaging shell and this technique to obtain.
Background technology
Microphone is a kind of collected sound signal and the energy transducer that is converted into the accessible signal of telecommunication, also claims microphone or microphone.Common microphone has electret capcitor microphone and MEMS microphone, take electret capcitor microphone as example, its operation principle is: utilize vibrating diaphragm and back pole plate to form two pole plates of electric capacity, acoustic pressure drives the vibrating diaphragm vibration changes the distance between two-plate, thereby cause that electric capacity changes, and then make change in voltage, the size of change in voltage, the power that has reflected extraneous acoustic pressure, this change in voltage frequency has namely reflected the frequency of external sound, and the circuit structures such as the built-in PCB circuit board of microphone or wiring board can receive above-mentioned voltage signal and output after treatment.Aforesaid each parts can be referred to as the functional unit of microphone, and for the MEMS microphone, its functional unit comprises MEMS chip, MEMS vibrating diaphragm and connects gold thread etc.In the encapsulation of microphone, the functional unit of microphone need to be encapsulated in a box body, wherein the requisite technique for sticking that needs.In view of the development trend of the miniaturization microminiaturization in the demand of the large production of modernization and microphone field, the packaging technology of microphone is also had higher requirement.
Technique for sticking common in microphone package technique has:
1) liquid conduction rubber seal dress
Liquid conduction rubber seal packing technique is the encapsulation technology that a kind of liquid glue that uses mixed metal powder carries out bonding and conducting between plate;
2) tin cream encapsulation
The tin cream encapsulation technology is that a kind of bonding reflux technique of tin cream that uses is bonding and realize the encapsulation technology of conducting function with two-ply;
3) non-conductive solid gum encapsulation
Non-conductive solid gum encapsulation technology is to realize with the solid film encapsulation technology that plate is bonding.
In above-mentioned technique: 1) liquid conduction rubber seal packing technique is because its bonding agent that uses is liquid glue, concrete consumption for glue can't effectively be controlled, can not control the shape of glue, it is inhomogeneous and cause the situation of adhesive failure to occur that the glue amount easily appears, simultaneously, glue is easy to enter the inside of microphone and causes inner functional unit performance bad; 2) the tin cream encapsulation technology is because its bonding agent that uses is tin cream, and tin cream is fusing again in reflux course, if when inside is packaged with elastomeric element, has the hidden danger of adhesive failure; 3) solid non-conductive glue bonding only can realize between plate bondingly, can't realize the electrical connection between plate, must increase technique and be electrically connected to, and in the process of miniaturization microminiaturization, due to limitations, complex process is difficult to realize.
The conductive adhesive film that a kind of solid is arranged at present, its integral body is film-form, and has mixed the metal dust that is used for conduction in it.If it is bonding to utilize the conductive adhesive film of this kind solid that the whole shell structure of microphone is carried out, can overcomes the shortcoming that exists in existing various bonding packaging technology, and more can satisfy the demand of large-scale production and the development trend of miniaturization microminiaturization.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of microphone package technique; this packaging technology utilizes the conductive adhesive film of solid to carry out bonding encapsulation to the shell structure of microphone; technological process is simple; the shape of the conducting resinl in bonding process and thickness all can conveniently be controlled; not only be conducive to the miniaturization of microphone and microminiaturized development but also be convenient to large-scale production, simultaneously, this technique can guarantee sealing and bonding fastness; do not need again additional process to be electrically connected to, save bonding space.
Another technical problem that the present invention will solve is to provide a kind of microphone package, this encapsulating structure is by the sheet material cavity body structure of bonding formation microphone successively, the bonding conductive adhesive film by solid of each plate is completed, the even thickness of bonding plane and electrical connection are reliable, encapsulating structure is simple, can realize shield effectiveness preferably, and the functional unit of encapsulating structure inside is installed solid and reliable.
For solving first technical problem of the present invention, microphone package technique of the present invention comprises the following steps:
Step 1 is chosen the conductive adhesive film, sets out the perforate that the cavity geometries a plurality of and microphones that needs encapsulate are complementary on the conductive adhesive film;
Step 2 is chosen intermediate plate, and intermediate plate comprises the intermediate plate base material and overlays on intermediate plate copper foil layer on intermediate plate base material two sides; Boring forms the intermediate plate through hole that the cavity geometry with the microphone that needs encapsulation is complementary and also the inwall of intermediate plate through hole is made metalized on intermediate plate, the inwall of intermediate plate through hole form after metalized can the above-mentioned two-layer intermediate plate copper foil layer of conducting the metal internal ring wall;
Step 4, the base plate of fitting on the wherein one side of intermediate plate forms a plurality of open-topped cavity body structures; Base plate has on the base plate copper foil layer of can be bonding with intermediate plate and being electrically connected to and base plate and has the base plate sound hole corresponding with above-mentioned each cavity;
in above-mentioned technical process, utilize sheet material mutually bonding and offer at intermediate plate the cavity body structure that through hole constructs microphone, can conveniently control the height of the inner chamber of microphone by the thickness of controlling intermediate plate, facilitate the microphone to various functions to carry out encapsulated moulding, use the conductive adhesive film of solid to carry out bonding to each sheet material, first will cut with the part of inner chamber coupling according to the shape of cavity inner chamber, remaining conductive adhesive film is namely the adhesive glue that needs reservation, this kind mode can be come by the thickness of controlling the conductive adhesive film glue consumption of bonding plane between control board, and by the mode that is hot bonding, make bonding firmly and guaranteed the reliability of conduction, the inwall of intermediate plate is made metalized, but the copper foil layer on conducting intermediate plate two sides, be convenient to be electrically connected between base plate in the microphone of some function and the circuit on cover plate, for example, for electret microphone, if offer sound hole on base plate, establish circuit structure on cover plate, one of them of two pole plates of the electric capacity of electret microphone can be directly be electrically connected to circuit on cover plate, another needs circuit next by bottom-up conductive mechanism and on cover plate to be connected, the metal internal ring wall of intermediate plate has namely played the effect that is electrically connected to base plate and cover plate, meanwhile, the metal internal ring wall has also formed ringle and can protect the parts in cavity to avoid electromagnetic interference.
Complete by Heat sealer in the step 3 of packaging technology of the present invention and the applying in step 4 and the pressing in step 6, the temperature of fitting in step 3 and step 4 is that 120-170 ℃, pressure are that 0.4-9.0Mpa, time are 1-10Min, and in step 6, the temperature of pressing is that 150-210 ℃, pressure are that 1-14Mpa, time are 20-60Min.
Make water cutting or dry type cutting machine cutting apart in the step 7 of packaging technology of the present invention.
Also be included in spraying one deck insulating material formation insulation ring wall on the metal internal ring wall in the step 2 of packaging technology of the present invention; Microphone functional unit in step 5 comprises elastic metallic gasket ring, electret back plate, insulation spacer, electret vibrating membrane and the polar ring of packing into successively; Cover plate also has the circuit board that can be electrically connected to polar ring.This process is that the present invention is to the encapsulation process of electret capcitor microphone, wherein, the process of adding the insulation ring wall is in order to have realized the function of the insulation cavity ring of microphone in the prior art, soon the inwall of the functional unit in the microphone inner chamber and cavity insulate, and has avoided two short circuit of polars of electret capacitor.Because the functional part of electret microphone is more, almost take whole cavity space, therefore, need the insulating wrapped effect of insulation ring wall.In addition, the elastic metallic gasket ring of first packing into reinstalls other each parts, hold out against on polar ring by cover plate at last, utilized the elastic force of elastic metallic gasket ring, make the press fit of each parts firm, can not produce looseningly, and the contact that is electrically connected to is tightr, has guaranteed the reliability that is electrically connected to.
Microphone functional unit in the step 5 of packaging technology of the present invention comprises MEMS vibrating diaphragm and MEMS chip, by gold thread, each function element and function element is electrically connected to the base plate copper foil layer.This process is that the present invention is to the encapsulation process of MEMS microphone.Because the functional part of MEMS microphone is less, therefore, when the package of MEMS microphone, at first, can with the thickness reduction of intermediate plate, the insulation ring wall can also needn't be processed in addition.But, if technical process allows, also can process simultaneously the insulation ring wall.That is: also be included on the metal internal ring wall spraying one deck insulating material in step 2 and form the insulation ring wall; Microphone functional unit in step 5 comprises MEMS vibrating diaphragm and MEMS chip, by gold thread, each function element and function element is electrically connected to the base plate copper foil layer.
For solving second technical problem of the present invention, the design feature of microphone package of the present invention is to comprise supreme bonding base plate, intermediate plate and the cover plate successively end of from, intermediate plate is the hollow structure that offers the intermediate plate through hole, the microphone functional unit is installed in the intermediate plate through hole, intermediate plate comprises intermediate plate base material and the intermediate plate copper foil layer that overlays on two faces of intermediate plate base material, and the inwall of intermediate plate through hole is provided with the metal internal ring wall that one deck can be electrically connected to above-mentioned two intermediate plate copper foil layers; The end face of base plate is provided with the base plate copper foil layer, offers the base plate sound hole on base plate; The bottom surface of cover plate is provided with the cover plate copper foil layer; Intermediate plate copper foil layer between intermediate plate copper foil layer on base plate copper foil layer and intermediate plate bottom surface, on cover plate copper foil layer and intermediate plate end face all closes bonding by the conductive adhesive mould, offer the perforate corresponding with described intermediate plate through hole on the conductive adhesive film.
Adopt this kind encapsulating structure, utilize mutual bonding between sheet material and offer at intermediate plate the inner-cavity structure that through hole forms microphone, and realize bonding by the conductive adhesive film of solid between each plate and be electrically connected to, make shape and the thickness of bonding plane between plate controlled, thereby can guarantee bonding firmly, what can guarantee again to be electrically connected to is reliable; The setting of metal internal ring wall has realized electromagnetic shielding, has guaranteed the reliability of the signal of microphone.
Also be coated with insulating material on described metal internal ring wall and form the insulation ring wall; Described microphone functional unit comprises the supreme elastic metallic gasket ring that sets gradually, electret back plate, insulation spacer, electret vibrating membrane and the polar ring end of from, the electret back plate is electrically connected to by the elastic metallic gasket ring with the base plate copper foil layer, the bottom surface of described cover plate is provided with circuit board, and the bottom of polar ring is electrically connected to electret vibrating membrane, the top is electrically connected to circuit board.Said structure is the microphone construction of electret capacitor type; Wherein, for encapsulating structure of the present invention, the elastic metallic gasket ring is set is electrically connected to base plate copper foil layer and electret back plate, simultaneously, utilize the elastic force of elastic metallic gasket ring, each parts can be pressed fastening, what can guarantee to be electrically connected to is reliable, can avoid again parts loosening.
Described microphone functional unit comprises MEMS vibrating diaphragm and MEMS chip, and the MEMS vibrating diaphragm is arranged on base plate sound hole place, between MEMS vibrating diaphragm and MEMS chip, all be electrically connected to by gold thread between MEMS chip and base plate copper foil layer.Said structure is the structure of MEMS microphone.Functional unit in this structure is less, and therefore the insulation ring wall is not set.Simultaneously, if conditions permit also can arrange the insulation ring wall, can play the effect of avoiding gold thread to touch cavity inner wall.Namely adopt following structure: also be coated with the insulation ring wall that is formed by insulating material on the metal internal ring wall; Described microphone functional unit comprises MEMS vibrating diaphragm and MEMS chip, and the MEMS vibrating diaphragm is arranged on base plate sound hole place, between MEMS vibrating diaphragm and MEMS chip, all be electrically connected to by gold thread between MEMS chip and base plate copper foil layer.
In sum, microphone package technique of the present invention have that technological process is simple, bonded adhesives amount and the bonding plane shape is easily controlled, bonding firmly advantage; That the encapsulating structure of microphone of the present invention has advantages of is simple in structure, it is reliable to be electrically connected to, inner components is installed firm, sealing and effectiveness is good.
Description of drawings
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Fig. 1 is the structural representation of a kind of execution mode of the electret-type microphone of encapsulated moulding in the present invention;
Fig. 2 is the structural representation of a kind of execution mode of the MEMS microphone of encapsulated moulding in the present invention;
Fig. 3 is the structural representation of the conductive adhesive film that is complementary of use and microphone square cavity in packaging technology of the present invention after die-cut;
Fig. 4 is the structural representation of the conductive adhesive film that is complementary of use and microphone circular cavity in packaging technology of the present invention after die-cut;
Fig. 5 is the structural representation after intermediate plate in packaging technology of the present invention and conductive adhesive film are fitted;
Fig. 6 is the structural representation after intermediate plate in packaging technology of the present invention and base plate are fitted;
Fig. 7 is the structural representation after the microphone functional unit in packaging technology of the present invention is installed;
Fig. 8 is cover plate in packaging technology of the present invention and the structural representation after the intermediate plate pressing.
Embodiment
With reference to accompanying drawing, a kind of execution mode of the packaging technology of microphone of the present invention is for comprising the following steps:
Step 1 provides conductive adhesive film 1, conductive adhesive film 1 is carried out die-cut, sets out the perforate 10 that the cavity geometries of a plurality of microphones with needing encapsulation are complementary on conductive adhesive film 1.Wherein, conductive adhesive film 1 wherein the one side on be covered with one deck release film layer 1-1, when using conductive adhesive film 1, first will not have the one side of release film layer 1-1 to use as bonding plane, when needs use another side, release film layer 1-1 is removed, then the face that will remove release film layer 1-1 is as follow-up bonding plane.Release film layer 1-1 is equivalent to the packaging protecting film of conductive adhesive film 1, and when die-cut, conductive adhesive film 1 is processed jointly together with release film layer 1-1.The Main Function of release film layer 1-1 is the follow-up bonding plane of protection conductive adhesive film 1, avoid when die-cut and in follow-up bonding process impurity etc. fall on conductive adhesive film 1 and have influence on conductivity and the cementability of conductive adhesive film 1.The cavity geometry of microphone is according to the difference of its function and installation site, can be for circular or square etc., conductive adhesive film 1 that the microphone cavity geometry different from two kinds the be complementary schematic diagram after die-cut has been shown in Fig. 3 and Fig. 4, Fig. 3 is that cavity is the conductive adhesive film 1 of using in the packaging technology of square microphone, in figure perforate 10 be shaped as square.The conductive adhesive film 1 for using in the packaging technology of cavity for circular microphone shown in Fig. 4, in figure, perforate 10 is shaped as circle.In addition, the opening of Fig. 3 and Fig. 4 edge is location hole 101, is used for advancing shape with following intermediate plate 2 and locates.
Step 2 provides intermediate plate 2, and the intermediate plate through hole 20 that the cavity geometry of the microphone that boring forms and need to encapsulate on intermediate plate 2 is complementary is also made metalized with the inwall of intermediate plate through hole 20.Wherein, intermediate plate 2 comprises intermediate plate base material 2-1 and overlays on intermediate plate copper foil layer 2-2 on intermediate plate base material 2-1 two sides, the inwall of intermediate plate through hole 20 form after metalized can the above-mentioned two-layer intermediate plate copper foil layer 2-2 of conducting metal internal ring wall 21.Form the cavity cavity of microphone due to intermediate plate through hole 20, therefore, the thickness of intermediate plate 2 has determined the height of microphone cavity, in this step, select the intermediate plate 2 of different-thickness namely to determine the type of the microphone that will process in the future, for example, for the microphone of electret capacitor type, the thickness of the intermediate plate 2 of its use is thicker than the thickness of MEMS microphone.The inwall of intermediate plate through hole 20 is made metalized, namely at the inner surface of intermediate plate through hole 20 plating layer of metal layer or directly do the metal pad pasting and process, as aluminium coated, do the processing such as Copper Foil pad pasting, is prior art, does not repeat them here.
Step 4, the release film layer 1-1 on the conductive adhesive film 1 on the wherein one side of intermediate plate 2 is removed and on this face applying base plate 3, form a plurality of open-topped cavity body structures; Base plate 3 have can with this step in removed release film layer 1-1 conductive adhesive film 1 coordinate and have the base plate sound hole 30 corresponding with above-mentioned each cavity on bonding base plate copper foil layer 3-2 and base plate 3.This step is embodied in Fig. 6, as shown in the figure, base plate copper foil layer 3-2 is adhered on the bottom surface of intermediate plate 2.wherein, for base plate copper foil layer 3-2, it can be the structure of multilayer copper foil plate, also can be made into the base plate wiring board take Copper Foil as binding post, only establish base plate copper foil layer 3-2 on the position corresponding with intermediate plate copper foil layer 2-2 of base plate 3, be electrically connected to the bottom surface of intermediate plate 2 by base plate copper foil layer 3-2, as the MEMS microphone that embodies in Fig. 2, the functional unit unification of MEMS microphone is arranged on base plate 3, has base plate wiring board 3-3 on its base plate 3, base plate copper foil layer 3-2 is only as the binding post of base plate wiring board 3-3, be used for and the electrical connection of intermediate plate copper foil layer.。For the terminal that picks out of base plate wiring board 3-3, it can be electrically connected to intermediate plate 2 by conductive adhesive film 1, and then is electrically connected on cover plate 4 and draws from cover plate 4 and pick out terminal, also can directly pass base plate 3 and pick out terminal in the formation of the bottom surface of base plate 3.
In above-mentioned technical process, utilize sheet material mutually bonding and offer the cavity body structure that intermediate plate through hole 20 constructs microphone on intermediate plate 2, can conveniently control the height of the inner chamber of microphone by the thickness of controlling intermediate plate 2.Use 1 pair of each sheet material of conductive adhesive film of solid to carry out bonding, first will cut with the part of inner chamber coupling according to the shape of cavity inner chamber, remaining conductive adhesive film 1 is namely as bonding plane, this kind mode can be come by the thickness of controlling conductive adhesive film 1 glue consumption of bonding plane between control board, and by the bonding mode of hot pressing, make bonding firmly and guaranteed the reliability of conduction.intermediate plate through hole 20 inwalls are made metalized, but the copper foil layer on conducting intermediate plate two sides, be convenient to be electrically connected between base plate 3 in some function microphone and cover plate 4, for example, for electret microphone, as shown in Figure 1, if offer base plate sound hole 30 on base plate 3, establish circuit structure on cover plate 4, one of them can be directly be connected two pole plates of the electric capacity of electret microphone with circuit structure on cover plate 4, another needs circuit next by bottom-up conductive mechanism and on cover plate 4 to be connected, the metal internal ring wall 21 of intermediate plate 2 has namely played the effect that is electrically connected to base plate 3 and cover plate 4, meanwhile, metal internal ring wall 21 has also formed the version around the microphone inner chamber, it can protect the parts in cavity to avoid electromagnetic interference.
Mentioned applying and pressing in technical process of the present invention, for fitting and pressing, it is all completed by Heat sealer, and the pressure setting of applying is less than the pressure setting of pressing.Be that applying in step 3 and step 4 and the pressing in step 6 are completed by Heat sealer, wherein, preferred parameter is set to: the temperature of fitting in step 3 and step 4 is that 120-170 ℃, pressure are that 0.4-9.0Mpa, time are 1-10Min, and in step 6, the temperature of pressing is that 150-210 ℃, pressure are that 1-14Mpa, time are 20-60Min.
For the MEMS microphone, the microphone functional unit in the step 5 of packaging technology of the present invention comprises MEMS vibrating diaphragm 11 and MEMS chip 12, by gold thread 13, each function element and function element is electrically connected to base plate copper foil layer 3-2.Because the functional part of MEMS microphone is less, therefore, when the package of MEMS microphone, at first, can with the thickness reduction of intermediate plate 2, can also needn't process in addition insulation ring wall 22.But, if technical process allows, also can process simultaneously insulation ring wall 22, insulation ring wall 22 can play the phenomenon of avoiding gold thread 13 to touch the microphone internal chamber wall and affecting the circuit connection.The step of processing insulation ring wall 22 is: also be included in spraying one deck insulating material formation insulation ring wall 22 on metal internal ring wall 21 in step 2; Microphone functional unit in step 5 comprises MEMS vibrating diaphragm 11 and MEMS chip 12, by gold thread 13, each function element and function element is electrically connected to base plate copper foil layer 3-2.
With reference to accompanying drawing, a kind of execution mode of microphone package of the present invention is to comprise supreme bonding base plate 3, intermediate plate 2 and the cover plate 4 successively end of from, intermediate plate 2 is for offering the hollow structure of intermediate plate through hole 20, the interior installation microphone of intermediate plate through hole 20 functional unit, intermediate plate 2 comprises intermediate plate base material 2-1 and the intermediate plate copper foil layer 2-2 that overlays on two faces of intermediate plate base material 2-1, and the inwall of intermediate plate through hole 20 is provided with the metal internal ring wall 21 that one deck can be electrically connected to above-mentioned two intermediate plate copper foil layer 2-2; The end face of base plate 3 is provided with base plate copper foil layer 3-2, offers base plate sound hole 30 on base plate 3; The bottom surface of cover plate 4 is provided with cover plate copper foil layer 4-2; Be respectively equipped with conductive adhesive film 1 between intermediate plate copper foil layer 2-2 between intermediate plate copper foil layer 2-2 on base plate copper foil layer 3-2 and intermediate plate 2 bottom surfaces, on cover plate copper foil layer 4-2 and intermediate plate end face, offer the perforate corresponding with intermediate plate through hole 20 10 on conductive adhesive film 1.Utilize mutual bonding between sheet material and offer intermediate plate through hole 20 at intermediate plate 2 to form the inner-cavity structure of microphones, and realize bonding by the conductive adhesive film 1 of solid between each plate and be electrically connected to, make the shape of bonding plane between plate and thickness controlled.The setting of metal internal ring wall 21 is used for electromagnetic shielding, avoids the parts of microphone inside to avoid electromagnetic interference.
With reference to accompanying drawing, also be coated with insulating material on metal internal ring wall 21 and form insulation ring wall 22, the microphone functional unit comprises the supreme elastic metallic gasket ring 5 that sets gradually, electret back plate 6, insulation spacer 7, electret vibrating membrane 8 and polar ring 9 end of from, electret back plate 6 is electrically connected to by elastic metallic gasket ring 5 with base plate copper foil layer 3-2, the bottom surface of cover plate 4 is provided with circuit board 4-3, and the bottom of polar ring 9 is electrically connected to electret vibrating membrane 8, the top is electrically connected to circuit board 4-3.This kind structure is the structure of electret-type microphone, with reference to Fig. 1, for electret microphone, because its functional part is more, almost takes whole cavity space, and insulation ring wall 22 is used for isolation microphone functional unit and cavity inner wall.Elastic metallic gasket ring 5 is set can be electrically connected to base plate copper foil layer 3-2 and electret back plate 6, simultaneously, utilize the elastic force of elastic metallic gasket ring 5, each parts can be pressed fasteningly, what can guarantee to be electrically connected to is reliable, can avoid again parts loosening.The pad of the annular that elastic metallic gasket ring 5 is complementary for the shape with cavity, the internal ring wall of this annular gasket upwarps to form has heaving of certain elastic deformation amount.
With reference to accompanying drawing, the microphone functional unit comprises MEMS vibrating diaphragm 11 and MEMS chip 12, and MEMS vibrating diaphragm 11 is arranged on base plate sound hole 30 places, between MEMS vibrating diaphragm 11 and MEMS chip 12, all be electrically connected to by gold thread 13 between MEMS chip 12 and base plate copper foil layer 3-2.This kind structure is the structure of MEMS microphone, the functional part of MEMS microphone is installed on base plate 3, base plate 3 is established base plate wiring board 3-3, base plate copper foil layer 3-2 is as the binding post of base plate wiring board 3-3, the picking out terminal and can guide on cover plate 4 by base plate copper foil layer 3-2 and pick out of microphone also can directly pass base plate 3 and form and pick out terminal.In addition, for the MEMS microphone, as shown in Figure 2, cover plate copper foil layer 4-2 can be for overlaying on the structure on whole cover plate 2 bottom surfaces, and itself and metal internal ring wall 21 and conductive adhesive film 1 surround the protective cover with anti-electromagnetic interference jointly, can carry out effective electromagnetic shielding.
In addition, for the MEMS microphone, if process conditions allow, it also can establish insulation ring wall 22, also is coated with the insulation ring wall 22 that is formed by insulating material on metal internal ring wall 21 that is:; The microphone functional unit comprises MEMS vibrating diaphragm 11 and MEMS chip 12, and MEMS vibrating diaphragm 11 is arranged on base plate sound hole 30 places, between MEMS vibrating diaphragm 11 and MEMS chip 12, all be electrically connected to by gold thread 13 between MEMS chip 12 and base plate copper foil layer 3-2.Under this kind structure, insulation ring wall 22 can avoid gold thread 13 to touch metal internal ring wall 21 and the impact electrical connection, guarantees the reliability that is electrically connected to.
In sum, the invention is not restricted to above-mentioned embodiment.Those skilled in the art under the premise without departing from the spirit and scope of the present invention, can do some changes and modification.Protection scope of the present invention should be as the criterion with claim of the present invention.
Claims (10)
1. microphone package technique is characterized in that comprising the following steps:
Step 1 is chosen conductive adhesive film (1), sets out the perforate (10) that the cavity geometries a plurality of and microphones that needs encapsulate are complementary on conductive adhesive film (1);
Step 2 is chosen intermediate plate (2), and intermediate plate (2) comprises intermediate plate base material (2-1) and overlays on intermediate plate copper foil layer (2-2) on intermediate plate base material (2-1) two sides; Form the intermediate plate through hole (20) that the cavity geometry with the microphone that needs encapsulation is complementary and the inwall of intermediate plate through hole (20) made metalized in the upper boring of intermediate plate (2), the inwall of intermediate plate through hole (20) form after metalized can the above-mentioned two-layer intermediate plate copper foil layer of conducting (2-2) metal internal ring wall (21);
Step 3, the conductive adhesive film (1) of fitting respectively on two faces of intermediate plate (2); The perforate (10) of conductive adhesive film (1) is corresponding with the position of intermediate plate through hole (20);
Step 4, the upper applying base plate (3) of wherein one side at intermediate plate (2) forms a plurality of open-topped cavity body structures; Base plate (3) has on the base plate copper foil layer (3-2) of can be bonding with intermediate plate (2) and being electrically connected to and base plate (3) and has the base plate sound hole (30) corresponding with above-mentioned each cavity;
Step 5 is respectively charged into the microphone functional unit in a plurality of cavitys that form in step 4;
Step 6, pressing cover plate (4) on intermediate plate (2) another side; Cover plate (4) has the cover plate copper foil layer (4-2) of can be bonding with intermediate plate and being electrically connected to;
Step 7, the disjunctor plate with a plurality of microphone constructions unit that step 1 is completed to the step 6 is divided into a plurality of microphone units.
2. microphone package technique as claimed in claim 1, it is characterized in that applying in step 3 and step 4 and the pressing in step 6 complete by Heat sealer, the temperature of fitting in step 3 and step 4 is that 120-170 ℃, pressure are that 0.4-9.0Mpa, time are 1-10Min, and in step 6, the temperature of pressing is that 150-210 ℃, pressure are that 1-14Mpa, time are 20-60Min.
3. microphone package technique as claimed in claim 1, is characterized in that making water cutting or dry type cutting machine cutting apart in step 7.
4. as claim 1 or 2 or 3 described microphone package techniques, it is characterized in that also being included in step 2 the upper spraying of metal internal ring wall (21) one deck insulating material and form insulation ring wall (22); Microphone functional unit in step 5 comprises elastic metallic gasket ring (5), electret back plate (6), insulation spacer (7), electret vibrating membrane (8) and the polar ring (9) of packing into successively, has the circuit board (4-3) that can be electrically connected to polar ring on cover plate (4).
5. as claim 1 or 2 or 3 described microphone package techniques, it is characterized in that the microphone functional unit in step 5 comprises MEMS vibrating diaphragm (11) and MEMS chip (12), is electrically connected to each function element and function element by gold thread (13) with base plate copper foil layer (3-2).
6. as claim 1 or 2 or 3 described microphone package techniques, it is characterized in that also being included in step 2 the upper spraying of metal internal ring wall (21) one deck insulating material and form insulation ring wall (22); Microphone functional unit in step 5 comprises MEMS vibrating diaphragm (11) and MEMS chip (12), by gold thread (13), each function element and function element is electrically connected to base plate copper foil layer (3-2).
7. microphone package, it is characterized in that comprising supreme bonding base plate (3), intermediate plate (2) and the cover plate (4) the successively end of from, intermediate plate (2) is installed the microphone functional unit for offering the hollow structure of intermediate plate through hole (20) in intermediate plate through hole (20); Intermediate plate (2) comprises intermediate plate base material (2-1) and overlays on intermediate plate copper foil layer (2-2) on two faces of intermediate plate base material (2-1), and the inwall of described intermediate plate through hole (20) is provided with the metal internal ring wall (21) that one deck can be electrically connected to above-mentioned two intermediate plate copper foil layers (2-2); The end face of base plate (3) is provided with base plate copper foil layer (3-2), offers base plate sound hole (30) on base plate (3); The bottom surface of cover plate (4) is provided with cover plate copper foil layer (4-2); Between intermediate plate copper foil layer (2-2) on base plate copper foil layer (3-2) and intermediate plate (2) bottom surface, that cover plate copper foil layer (4-2) and intermediate plate copper foil layer (2-2) on the intermediate plate end face all carry out pressing by conductive adhesive film (1) is bonding, offers the perforate (10) corresponding with described intermediate plate through hole (20) on conductive adhesive film (1).
8. microphone package as claimed in claim 7, is characterized in that also being coated with on described metal internal ring wall (21) insulating material and form insulation ring wall (22); Described microphone functional unit comprises the supreme elastic metallic gasket ring (5) that sets gradually, electret back plate (6), insulation spacer (7), electret vibrating membrane (8) and polar ring (9) end of from, electret back plate (6) is electrically connected to by elastic metallic gasket ring (5) with base plate copper foil layer (3-2), the bottom surface of described cover plate (4) is provided with circuit board (4-3), and the bottom of polar ring (9) is electrically connected to electret vibrating membrane (8), the top is electrically connected to circuit board (4-3).
9. microphone package as claimed in claim 7, it is characterized in that described microphone functional unit comprises MEMS vibrating diaphragm (11) and MEMS chip (12), MEMS vibrating diaphragm (11) is arranged on base plate sound hole (30) and locates, between MEMS vibrating diaphragm (11) and MEMS chip (12), all be electrically connected to by gold thread (13) between MEMS chip (12) and base plate copper foil layer (3-2).
10. microphone package as claimed in claim 7, is characterized in that also being coated with on described metal internal ring wall (21) the insulation ring wall (22) that is formed by insulating material; Described microphone functional unit comprises MEMS vibrating diaphragm (11) and MEMS chip (12), MEMS vibrating diaphragm (11) is arranged on base plate sound hole (30) and locates, between MEMS vibrating diaphragm (11) and MEMS chip (12), all be electrically connected to by gold thread (13) between MEMS chip (12) and base plate copper foil layer (3-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557327.XA CN103139694B (en) | 2012-12-20 | 2012-12-20 | Microphone package technology and package structure according to technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210557327.XA CN103139694B (en) | 2012-12-20 | 2012-12-20 | Microphone package technology and package structure according to technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103139694A true CN103139694A (en) | 2013-06-05 |
| CN103139694B CN103139694B (en) | 2015-07-08 |
Family
ID=48498894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210557327.XA Active CN103139694B (en) | 2012-12-20 | 2012-12-20 | Microphone package technology and package structure according to technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103139694B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| CN104427422A (en) * | 2013-09-03 | 2015-03-18 | 派卡阿库斯蒂克公司 | Electronic unit used for a microphone unit, the microphone unit, tool used for manufacturing the electronic unit and method for manufacturing the microphone unit |
| CN107925808A (en) * | 2015-08-24 | 2018-04-17 | 雅马哈株式会社 | Sound exports and pick device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360352A (en) * | 2008-08-27 | 2009-02-04 | 歌尔声学股份有限公司 | Miniature microphone having shielding construction and manufacturing method for circuit board frame |
| WO2010047056A1 (en) * | 2008-10-23 | 2010-04-29 | スター精密株式会社 | Method of manufacturing microphone and microphone |
| CN202979275U (en) * | 2012-12-20 | 2013-06-05 | 山东共达电声股份有限公司 | Encapsulation structure of microphone |
-
2012
- 2012-12-20 CN CN201210557327.XA patent/CN103139694B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101360352A (en) * | 2008-08-27 | 2009-02-04 | 歌尔声学股份有限公司 | Miniature microphone having shielding construction and manufacturing method for circuit board frame |
| WO2010047056A1 (en) * | 2008-10-23 | 2010-04-29 | スター精密株式会社 | Method of manufacturing microphone and microphone |
| CN202979275U (en) * | 2012-12-20 | 2013-06-05 | 山东共达电声股份有限公司 | Encapsulation structure of microphone |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427422A (en) * | 2013-09-03 | 2015-03-18 | 派卡阿库斯蒂克公司 | Electronic unit used for a microphone unit, the microphone unit, tool used for manufacturing the electronic unit and method for manufacturing the microphone unit |
| CN104427422B (en) * | 2013-09-03 | 2018-04-17 | 派卡阿库斯蒂克公司 | For the electronic unit of microphone unit, microphone unit, the apparatus for manufacturing electronic unit and the method for manufacturing microphone unit |
| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| CN107925808A (en) * | 2015-08-24 | 2018-04-17 | 雅马哈株式会社 | Sound exports and pick device |
| CN107925808B (en) * | 2015-08-24 | 2021-02-09 | 雅马哈株式会社 | Sound output and pickup device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103139694B (en) | 2015-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102917303B (en) | Microphone packaged by plastic casing | |
| CN205912258U (en) | Micro electromechanical microphone and electronic system | |
| CN106301283A (en) | The encapsulating structure of SAW filter and manufacture method | |
| TW201033113A (en) | MEMS microphone packages and fabrication method thereof | |
| CN102893632B (en) | There is electric device and the manufacture method of planar design | |
| TW201605248A (en) | MEMS microphone package structure having a non-planar substrate | |
| CN203503623U (en) | Monolithic integrated MEMS chip based on conductive pole wafer level packaging | |
| CN105897218B (en) | Groove buried via hole type surface sound filtering chip encapsulating structure and its manufacturing method | |
| CN206195735U (en) | Encapsulation structure of sound surface wave filter | |
| TW201126660A (en) | MEMS microphone packages and fabrication methods thereof | |
| CN105357616A (en) | Micro-electro-mechanical microphone packaging structure with three-dimensional substrate | |
| CN201226592Y (en) | Silicon microphone packaged by flexible circuit board | |
| CN103139694B (en) | Microphone package technology and package structure according to technology | |
| CN104394496B (en) | A kind of MEMS silicon microphone of small size high sensitivity high s/n ratio | |
| CN102118674B (en) | A kind of MEMS microphone and method for packing thereof | |
| CN205622875U (en) | MEMS microphone | |
| CN105742255B (en) | Round metal chip level groove buried via hole type surface sound filtering chip encapsulating structure and method | |
| CN202979275U (en) | Encapsulation structure of microphone | |
| CN102387456A (en) | Midget microphone and manufacturing method thereof | |
| CN203482165U (en) | Integrated packaging structure of surface acoustic wave filter | |
| TWI573469B (en) | Mems microphone module | |
| CN201450592U (en) | Miniature microphone with circuit board frame structure | |
| CN105762085B (en) | Metal disk buried via hole type surface sound filtering chip encapsulating structure and manufacturing method | |
| CN204180270U (en) | A kind of MEMS silicon microphone of small size high sensitivity high s/n ratio | |
| CN201846474U (en) | Silicon microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee before: Shandong Gettop Acoustic Co.,Ltd. |