CN104023299A - Top-port MEMS (micro-electromechanical system) microphone - Google Patents
Top-port MEMS (micro-electromechanical system) microphone Download PDFInfo
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- CN104023299A CN104023299A CN201410285224.1A CN201410285224A CN104023299A CN 104023299 A CN104023299 A CN 104023299A CN 201410285224 A CN201410285224 A CN 201410285224A CN 104023299 A CN104023299 A CN 104023299A
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Abstract
The invention provides a top-port MEMS (micro-electromechanical system) microphone. The microphone comprises an MEMS chip and an ASIC (application specific integrated circuit) chip, which are arranged between an enclosure and a cavity formed by a printed circuit board, wherein the MEMS chip and the ASIC chip are fixed on the printed circuit board, and are connected with the printed circuit board through metal wires; two sidewalls vertically and upwards extend from the two ends of a bottom plate of the printed circuit board; the printed circuit board has a U-shaped section; the enclosure is positioned on the bottom plate between the two sidewalls of the printed circuit board; a sound hole is formed in the printed circuit board below the enclosure; and two soldering-pans are positioned at the top ends of the two sidewalls of the printed circuit board respectively. The top-port MEMS microphone has a zero-height structure and a large rear cavity size, and is high in signal to noise ratio.
Description
Technical field
The present invention relates to MEMS microphone field, specifically, relate to a kind of advance MEMS microphone of sound of high s/n ratio that produces.
Background technology
MEMS microphone is the microphone of manufacturing based on Micro Electro Mechanical System (Microelectromechanical Systems, is abbreviated as MEMS) technology.In prior art, MEMS microphone, according to textural classification, comprises zero elevation MEMS microphone and the sound MEMS microphone that advances.Fig. 1 a is the structural representation of zero elevation MEMS microphone of the prior art.Fig. 1 b is the structural representation of the sound MEMS microphone that advances of the prior art.
As shown in Fig. 1 a and Fig. 1 b, the main common ground of two kinds of MEMS microphones is, all there is MEMS chip 2 ' and ASIC(Application Specific Integrated Circuit, be abbreviated as ASIC) chip 3 ' be positioned at printed circuit board (PCB) 1 ' upper, three is by wire 4 ' connection.The main distinction of two kinds of MEMS microphones is, the sound hole 5 of zero elevation MEMS microphone ' be arranged on printed circuit board (PCB) 1 ' in, pad 7 ' be arranged on printed circuit board (PCB) 1 ' below, and the sound hole 5 of the sound MEMS microphone that advances ' be arranged on shell 6 ' upper, pad 7 ' be arranged on printed circuit board (PCB) 1 ' below.
The structure difference of two kinds of MEMS microphones, causes the two signal to noise ratio difference.Signal to noise ratio is relevant to back cavity size, and back cavity is larger, and the signal to noise ratio that can accomplish is just higher.As shown above, ante-chamber is the cavity that sound hole is corresponding, and back cavity refers to the cavity of MEMS chip bottom, therefore, and small volume.In addition, because sound hole and the pad of zero elevation MEMS microphone are all positioned on printed circuit board (PCB), between the two, there is no vertical difference in height, and the sound hole of the sound MEMS microphone that advances and pad lay respectively on printed circuit board (PCB) and housing, between the two at a distance of certain vertical difference in height, so the signal to noise ratio of zero elevation MEMS microphone will be higher than the signal to noise ratio of the sound MEMS microphone that advances.Signal to noise ratio refers to the power and the ratio of noise power of output simultaneously of the output signal of amplifier, and the signal to noise ratio of equipment is higher shows that the noise that its produces is fewer.Signal to noise ratio is larger, illustrates that the noise being mixed in signal is less, and the sound quality of acoustic playback is higher.The signal to noise ratio of zero elevation MEMS microphone will be higher than the signal to noise ratio of the sound MEMS microphone that advances.
Therefore, need to, on the basis of position of sound hole that does not change the sound MEMS microphone that advances, the sound MEMS microphone that advances be improved, to improve the signal to noise ratio of the sound MEMS microphone that advances.
Summary of the invention
Technical problem to be solved by this invention is to provide the one sound MEMS microphone that advances, and has the sound MEMS microphone that advances of zero elevation structure, and back cavity volume is large, has the sound MEMS microphone that advances of high s/n ratio.
For achieving the above object, the invention provides the one sound MEMS microphone that advances, it comprises: MEMS chip and asic chip are built between shell and the cavity of printed circuit board (PCB) formation, described MEMS chip and described asic chip are fixed on described printed circuit board (PCB), realize described printed circuit board (PCB) by metal wire, connection between described MEMS chip and described asic chip, two sidewalls are stretched out at the two ends of the base plate of described printed circuit board (PCB) straight up, the cross section of described printed circuit board (PCB) is U-shaped, described shell is on described base plate between two described sidewalls of described printed circuit board (PCB), sound hole is positioned on the described printed circuit board (PCB) of described housing below, two pads lay respectively at the top of two described sidewalls of described printed circuit board (PCB).
Preferably, the vertical height that vertically highly equals described housing of two of described printed circuit board (PCB) described sidewalls.
Preferably, described shell and described printed circuit board (PCB) form cavity by sealant sealing.
Preferably, described MEMS chip bottom and described printed circuit board (PCB) are bonding by fixing glue, and described asic chip bottom is bonding by fixing glue with described printed circuit board (PCB).
Preferably, on described asic chip, being coated with fluid sealant encapsulates.
Preferably, between described printed circuit board (PCB), described MEMS chip and described asic chip, connect by metal wire.
In addition, preferably, described sound hole is positioned on the described printed circuit board (PCB) of described MEMS chip below.
From above-mentioned description with put into practice, the sound MEMS microphone that advances provided by the invention, one, ante-chamber is the cavity that sound hole is corresponding, and back cavity is the cavity of getting rid of in shell beyond MEMS chip, thereby volume is larger, and signal to noise ratio improves; They are two years old, the two ends of printed circuit board (PCB) are provided with two sidewalls that extend straight up, pad is positioned at the top of sidewall, the vertical height that vertically highly equals housing of sidewall, and sound hole is positioned at the base plate of printed circuit board (PCB), between pad and sound hole at a distance of certain vertical distance, so, be equivalent to the sound MEMS microphone that advances of zero elevation structure, thereby, the signal to noise ratio of the sound MEMS microphone that advances can be improved.
Brief description of the drawings
By the description to embodiment below in conjunction with accompanying drawing, above-mentioned feature of the present invention and technological merit will become apparent and easily understand.In the accompanying drawings,
Fig. 1 a is the structural representation of zero elevation MEMS microphone of the prior art;
Fig. 1 b is the structural representation of the sound MEMS microphone that advances of the prior art;
Fig. 2 is the schematic diagram of the sound MEMS microphone that advances described in one embodiment of the invention;
Fig. 3 is the printed circuit board (PCB) schematic diagram of the sound MEMS microphone that advances shown in Fig. 2.
MEMS microphone 100 '
1 ': printed circuit board (PCB); 2 ': MEMS chip; 3 ': asic chip; 4 ': gold thread;
5 ': sound hole; 6 ': shell; 7 ': pad;
Sound MEMS microphone 100 advances
1: printed circuit board (PCB); 11: base plate; 12: sidewall;
2:MEMS chip; 3:ASIC chip; 4: metal wire;
5: fluid sealant; 6: shell; 7: sound hole; 8: pad; 9: fixing glue.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 2 is the schematic diagram of the sound MEMS microphone that advances described in one embodiment of the invention.Fig. 3 is the printed circuit board (PCB) schematic diagram of the sound MEMS microphone that advances shown in Fig. 2.As shown in Figure 2, the sound MEMS microphone 100 that advances comprises printed circuit board (PCB) 1, MEMS chip 2, asic chip 3, metal wire 4, shell 6, sound hole 7 and pad 8.
MEMS chip 2 and asic chip 3 are built between the cavity that shell 6 and printed circuit board (PCB) 1 form.Preferably, shell 6 forms cavity with printed circuit board (PCB) 1 by fluid sealant 5 sealings.MEMS chip 2 and asic chip 3 are fixed on printed circuit board (PCB) 1, and preferably, MEMS chip 2 bottoms and printed circuit board (PCB) 1 are bonding by fixing glue 9, and asic chip 3 bottoms and printed circuit board (PCB) 1 are bonding by fixing glue 9.Preferably, on asic chip 3, being coated with fluid sealant 5 encapsulates.
Preferably, between printed circuit board (PCB) 1, MEMS chip 2 and asic chip 3, connect by metal wire.Here, between MEMS chip 2 and asic chip 3, realize and connecting by metal wire 4, between asic chip 3 and printed circuit board (PCB) 1, realize and connecting by metal wire 4.
As shown in Figure 3, two sidewalls 12 are stretched out at the two ends of the base plate 11 of printed circuit board (PCB) 1 straight up, and the cross section of printed circuit board (PCB) 1 is U-shaped, and shell 6 is on base plate 11 between two sidewalls 12 of printed circuit board (PCB) 1.
Sound hole 7 is positioned on the printed circuit board (PCB) 1 of housing 6 belows; Sound hole is communicated with the cavity that outside and shell 6 and printed circuit board (PCB) 1 form.Preferably, sound hole 7 is positioned on the printed circuit board (PCB) 1 of MEMS chip 2 belows.
Two pads 8 lay respectively at the top of two sidewalls 12 of printed circuit board (PCB) 1.Preferably, the vertical height that vertically highly equals housing 6 of two of printed circuit board (PCB) 1 sidewalls 12.
What the embodiment providing by the invention described above provided advance sound MEMS microphone, one, ante-chamber is the cavity that sound hole is corresponding, and back cavity is the cavity of getting rid of in shell beyond MEMS chip, thereby volume is larger, and signal to noise ratio improves; They are two years old, the two ends of printed circuit board (PCB) are provided with two sidewalls that extend straight up, pad is positioned at the top of sidewall, the vertical height that vertically highly equals housing of sidewall, and sound hole is positioned at the base plate of printed circuit board (PCB), between pad and sound hole at a distance of certain vertical distance, so, be equivalent to the sound MEMS microphone that advances of zero elevation structure, thereby, the signal to noise ratio of the sound MEMS microphone that advances can be improved.
The above; be only preferably embodiment of the present invention, but protection scope of the present invention is not limited to this, any people who is familiar with this technology is in the disclosed technical scope of the present invention; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (7)
1. the sound MEMS microphone that advances, it comprises: MEMS chip and asic chip are built between shell and the cavity of printed circuit board (PCB) formation, described MEMS chip and described asic chip are fixed on described printed circuit board (PCB), realize the connection between described printed circuit board (PCB), described MEMS chip and described asic chip by metal wire, it is characterized in that
Two sidewalls are stretched out at the two ends of the base plate of described printed circuit board (PCB) straight up, and the cross section of described printed circuit board (PCB) is U-shaped, and described shell is on described base plate between two described sidewalls of described printed circuit board (PCB);
Sound hole is positioned on the described printed circuit board (PCB) of described housing below;
Two pads lay respectively at the top of two described sidewalls of described printed circuit board (PCB).
2. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, the vertical height that vertically highly equals described housing of two described sidewalls of described printed circuit board (PCB).
3. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, described shell and described printed circuit board (PCB) form cavity by sealant sealing.
4. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, described MEMS chip bottom and described printed circuit board (PCB) are bonding by fixing glue, and described asic chip bottom is bonding by fixing glue with described printed circuit board (PCB).
5. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, is coated with fluid sealant and encapsulates on described asic chip.
6. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, between described printed circuit board (PCB), described MEMS chip and described asic chip, connects by metal wire.
7. the sound MEMS microphone that advances as claimed in claim 1, is characterized in that, described sound hole is positioned on the described printed circuit board (PCB) of described MEMS chip below.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410285224.1A CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410285224.1A CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
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| CN104023299A true CN104023299A (en) | 2014-09-03 |
| CN104023299B CN104023299B (en) | 2018-09-11 |
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| CN201410285224.1A Active CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| US10587942B1 (en) | 2018-09-28 | 2020-03-10 | Apple Inc. | Liquid-resistant packaging for electro-acoustic transducers and electronic devices |
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| EP1755360A1 (en) * | 2005-08-20 | 2007-02-21 | BSE Co., Ltd. | Silicon based condenser microphone and packaging method for the same |
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| CN201260243Y (en) * | 2008-08-15 | 2009-06-17 | 歌尔声学股份有限公司 | Automatic adhesion microphone |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
| CN203933950U (en) * | 2014-06-24 | 2014-11-05 | 山东共达电声股份有限公司 | The one sound MEMS microphone that advances |
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2014
- 2014-06-24 CN CN201410285224.1A patent/CN104023299B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1755360A1 (en) * | 2005-08-20 | 2007-02-21 | BSE Co., Ltd. | Silicon based condenser microphone and packaging method for the same |
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| CN201260243Y (en) * | 2008-08-15 | 2009-06-17 | 歌尔声学股份有限公司 | Automatic adhesion microphone |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
| CN203933950U (en) * | 2014-06-24 | 2014-11-05 | 山东共达电声股份有限公司 | The one sound MEMS microphone that advances |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219612A (en) * | 2014-09-29 | 2014-12-17 | 山东共达电声股份有限公司 | Front sound entering MEMS (Micro Electro Mechanical Systems) microphone |
| CN104219612B (en) * | 2014-09-29 | 2019-06-28 | 山东共达电声股份有限公司 | A kind of advance sound MEMS microphone |
| US10587942B1 (en) | 2018-09-28 | 2020-03-10 | Apple Inc. | Liquid-resistant packaging for electro-acoustic transducers and electronic devices |
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| Publication number | Publication date |
|---|---|
| CN104023299B (en) | 2018-09-11 |
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Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee before: Shandong Gettop Acoustic Co.,Ltd. |
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