CN104023299B - A kind of advance sound MEMS microphone - Google Patents
A kind of advance sound MEMS microphone Download PDFInfo
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- CN104023299B CN104023299B CN201410285224.1A CN201410285224A CN104023299B CN 104023299 B CN104023299 B CN 104023299B CN 201410285224 A CN201410285224 A CN 201410285224A CN 104023299 B CN104023299 B CN 104023299B
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Abstract
The present invention provides a kind of advance sound MEMS microphones comprising：MEMS chip and asic chip are built between the cavity that shell and printed circuit board are formed, the MEMS chip and the asic chip are fixed on the printed circuit board, the connection between the printed circuit board, the MEMS chip and the asic chip is realized by metal wire, two side walls are stretched out at the both ends of the bottom plate of the printed circuit board straight up, the section of the printed circuit board is U-shaped, and the shell is located between two side walls of the printed circuit board on the bottom plate；Sound hole is located on the printed circuit board below the shell；Two pads are located at the top of two side walls of the printed circuit board.The present invention provides a kind of advance sound MEMS microphones, the advance sound MEMS microphone with zero elevation structure, and back cavity volume is big, the advance sound MEMS microphone with high s/n ratio.
Description
Technical field
The present invention relates to MEMS microphone fields, specifically, being related to a kind of MEMS wheats generating high s/n ratio advance sound
Gram wind.
Background technology
MEMS microphone is that (Microelectromechanical Systems, are abbreviated as based on Micro Electro Mechanical System
MEMS) the microphone of technology manufacture.In the prior art, MEMS microphone is according to textural classification, including zero elevation MEMS microphone
With advance sound MEMS microphone.Fig. 1 a are the structural schematic diagrams of zero elevation MEMS microphone in the prior art.Fig. 1 b are existing
The structural schematic diagram of advance sound MEMS microphone in technology.
As illustrated in figs. 1A and ib, the main common ground of two kinds of MEMS microphones is that all have MEMS chip 2 ' and ASIC
(Application Specific Integrated Circuit, be abbreviated as ASIC) chip 3 ' is located on printed circuit board 1 ',
Three is connected by conducting wire 4 '.The main distinction of two kinds of MEMS microphones is that the setting of sound hole 5 ' of zero elevation MEMS microphone is printing
Printed circuit board 1 ' is interior, and the setting of pad 7 ' is in 1 ' lower section of printed circuit board, and the setting of the sound hole 5 ' of advance sound MEMS microphone is outside
On shell 6 ', pad 7 ' is arranged in 1 ' lower section of printed circuit board.
The structure of two kinds of MEMS microphones is different, causes the signal-to-noise ratio of the two different.Signal-to-noise ratio is related to back cavity size, after
Chamber is bigger, and the signal-to-noise ratio that can accomplish is higher.As shown above, ante-chamber is the corresponding cavity of sound hole, and back cavity refers to MEMS cores
The cavity of piece bottom, therefore, small volume.In addition, since the sound hole and pad of zero elevation MEMS microphone are respectively positioned on printing electricity
It is poor without vertical height therebetween on the plate of road, and the sound hole and pad of advance sound MEMS microphone are located at printed circuit
It is poor at a distance of certain vertical height therebetween on plate and shell, so, before the signal-to-noise ratio of zero elevation MEMS microphone is higher than
Into the signal-to-noise ratio of sound MEMS microphone.Signal-to-noise ratio refers to the power of the output signal of amplifier and the noise power that exports simultaneously
Ratio, the signal-to-noise ratio of equipment is higher, and the noise for showing that it is generated is fewer.Signal-to-noise ratio is bigger, illustrates that the noise being mixed in signal is got over
Small, the sound quality of acoustic playback is higher.The signal-to-noise ratio of zero elevation MEMS microphone is higher than the noise of advance sound MEMS microphone
Than.
Therefore, it is necessary on the basis of not changing the position of sound hole of advance sound MEMS microphone, to advance sound MEMS wheats
Gram wind is improved, to improve the signal-to-noise ratio of advance sound MEMS microphone.
Invention content
Technical problem to be solved by the invention is to provide a kind of advance sound MEMS microphones, before having zero elevation structure
Into sound MEMS microphone, back cavity volume is big, the advance sound MEMS microphone with high s/n ratio.
To achieve the above object, the present invention provides a kind of advance sound MEMS microphone comprising：MEMS chip and ASIC cores
Piece is built between the cavity that shell and printed circuit board are formed, and the MEMS chip and the asic chip are fixed on the print
On printed circuit board, the connection between the printed circuit board, the MEMS chip and the asic chip is realized by metal wire,
Two side walls are stretched out at the both ends of the bottom plate of the printed circuit board straight up, and the section of the printed circuit board is U-shaped, described
Shell is located between two side walls of the printed circuit board on the bottom plate；Sound hole is located at described below the shell
On printed circuit board；Two pads are located at the top of two side walls of the printed circuit board.
Preferably, the vertical height of two side walls of the printed circuit board is equal to the vertical height of the shell.
Preferably, the shell seals to form cavity by fluid sealant with the printed circuit board.
Preferably, the MEMS chip bottom passes through fixed glue sticking, the asic chip bottom with the printed circuit board
Portion passes through fixed glue sticking with the printed circuit board.
Preferably, fluid sealant is covered on the asic chip to be packaged.
Furthermore it is preferred that the sound hole is located on the printed circuit board below the MEMS chip.
From the description above and practice it is found that advance sound MEMS microphone provided by the invention, first, ante-chamber is sound hole pair
The cavity answered, back cavity are the cavitys excluded in shell other than MEMS chip, thus, volume is larger, and signal-to-noise ratio improves；Second, print
The both ends of printed circuit board are set there are two the side wall extended straight up, and pad is located at the top of side wall, the vertical height etc. of side wall
In the vertical height of shell, and sound hole is located at the bottom plate of printed circuit board, at a distance of certain vertical distance between pad and sound hole,
So the advance sound MEMS microphone of zero elevation structure is equivalent to, therefore, it is possible to improve the noise of advance sound MEMS microphone
Than.
Description of the drawings
By that will become more to the description of embodiment, features described above of the invention and technological merit below in conjunction with the accompanying drawings
Understand and is readily appreciated that.In the accompanying drawings,
Fig. 1 a are the structural schematic diagrams of zero elevation MEMS microphone in the prior art；
Fig. 1 b are the structural schematic diagrams of advance sound MEMS microphone in the prior art；
Fig. 2 is the schematic diagram of the advance sound MEMS microphone described in one embodiment of the invention；
Fig. 3 is the printed circuit board schematic diagram of advance sound MEMS microphone shown in Fig. 2.
MEMS microphone 100 '
1′：Printed circuit board；2′：MEMS chip；3′：Asic chip；4′：Gold thread；
5′：Sound hole；6′：Shell；7′：Pad；
Advance sound MEMS microphone 100
1：Printed circuit board；11：Bottom plate；12：Side wall；
2：MEMS chip；3：Asic chip；4：Metal wire；
5：Fluid sealant；6：Shell；7：Sound hole；8：Pad；9：Fixing glue；
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
Fig. 2 is the schematic diagram of the advance sound MEMS microphone described in one embodiment of the invention.Fig. 3 is advance shown in Fig. 2
The printed circuit board schematic diagram of sound MEMS microphone.As shown in Fig. 2, advance sound MEMS microphone 100 include printed circuit board 1,
MEMS chip 2, asic chip 3, metal wire 4, shell 6, sound hole 7 and pad 8.
MEMS chip 2 and asic chip 3 are built between the cavity that shell 6 and printed circuit board 1 are formed.Preferably, outside
Shell 6 forms cavity with printed circuit board 1 by the sealing of fluid sealant 5.MEMS chip 2 and asic chip 3 are fixed on printed circuit board 1
On, it is preferable that 2 bottom of MEMS chip is be bonded by fixing glue 9 with printed circuit board 1,3 bottom of asic chip and printed circuit board
1 is bonded by fixing glue 9.Preferably, fluid sealant 5 is covered on asic chip 3 to be packaged.
Preferably, it is connected by metal wire between printed circuit board 1, MEMS chip 2 and asic chip 3.Here, MEMS cores
It is realized and is connected by metal wire 4 between piece 2 and asic chip 3, it is real by metal wire 4 between asic chip 3 and printed circuit board 1
Now connect.
As shown in figure 3, two side walls 12, printed circuit board 1 are stretched out in the both ends of the bottom plate 11 of printed circuit board 1 straight up
Section it is U-shaped, shell 6 is located between two side walls 12 of printed circuit board 1 on bottom plate 11.
Sound hole 7 is located on the printed circuit board 1 of 6 lower section of shell；Sound hole connection outside and shell 6 and 1 shape of printed circuit board
At cavity.Preferably, sound hole 7 is located on the printed circuit board 1 of 2 lower section of MEMS chip.
Two pads 8 are located at the top of the two side walls 12 of printed circuit board 1.Preferably, the two of printed circuit board 1
The vertical height of side wall 12 is equal to the vertical height of shell 6.
The advance sound MEMS microphone provided by the embodiment that aforementioned present invention provides corresponds to first, ante-chamber is sound hole
Cavity, back cavity is the cavity excluded in shell other than MEMS chip, thus, volume is larger, and signal-to-noise ratio improves；Second, printing
The both ends of circuit board are set there are two the side wall extended straight up, and pad is located at the top of side wall, and the vertical height of side wall is equal to
The vertical height of shell, and sound hole is located at the bottom plate of printed circuit board, at a distance of certain vertical distance, institute between pad and sound hole
The advance sound MEMS microphone of zero elevation structure is equivalent to, therefore, it is possible to improve the signal-to-noise ratio of advance sound MEMS microphone.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Within the technical scope disclosed by the invention, the change or replacement that can be readily occurred in should all be covered any people for being familiar with the technology
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (6)
1. a kind of advance sound MEMS microphone comprising：MEMS chip and asic chip are built in shell and printed circuit board shape
At cavity between, the MEMS chip and the asic chip are fixed on the printed circuit board, are realized by metal wire
Connection between the printed circuit board, the MEMS chip and the asic chip, which is characterized in that
Two side walls are stretched out at the both ends of the bottom plate of the printed circuit board straight up, and the section of the printed circuit board is U-shaped,
The shell is located between two side walls of the printed circuit board on the bottom plate；
Sound hole is located on the printed circuit board below the shell；
Two pads are located at the top of two side walls of the printed circuit board.
2. advance sound MEMS microphone as described in claim 1, which is characterized in that two sides of the printed circuit board
The vertical height of wall is equal to the vertical height of the shell.
3. advance sound MEMS microphone as described in claim 1, which is characterized in that the shell is logical with the printed circuit board
Fluid sealant is crossed to seal to form cavity.
4. advance sound MEMS microphone as described in claim 1, which is characterized in that the MEMS chip bottom and the printing
Circuit board passes through fixed glue sticking by fixed glue sticking, the asic chip bottom with the printed circuit board.
5. advance sound MEMS microphone as described in claim 1, which is characterized in that be covered with fluid sealant on the asic chip
It is packaged.
6. advance sound MEMS microphone as described in claim 1, which is characterized in that the sound hole is located under the MEMS chip
On the printed circuit board of side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410285224.1A CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410285224.1A CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
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| Publication Number | Publication Date |
|---|---|
| CN104023299A CN104023299A (en) | 2014-09-03 |
| CN104023299B true CN104023299B (en) | 2018-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410285224.1A Active CN104023299B (en) | 2014-06-24 | 2014-06-24 | A kind of advance sound MEMS microphone |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219612B (en) * | 2014-09-29 | 2019-06-28 | 山东共达电声股份有限公司 | A kind of advance sound MEMS microphone |
| US10587942B1 (en) | 2018-09-28 | 2020-03-10 | Apple Inc. | Liquid-resistant packaging for electro-acoustic transducers and electronic devices |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
| CN203933950U (en) * | 2014-06-24 | 2014-11-05 | 山东共达电声股份有限公司 | The one sound MEMS microphone that advances |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG130158A1 (en) * | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
| CN201260243Y (en) * | 2008-08-15 | 2009-06-17 | 歌尔声学股份有限公司 | Automatic adhesion microphone |
-
2014
- 2014-06-24 CN CN201410285224.1A patent/CN104023299B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| CN103475983A (en) * | 2013-09-13 | 2013-12-25 | 山东共达电声股份有限公司 | Mems microphone and electronic equipment |
| CN203590457U (en) * | 2013-10-08 | 2014-05-07 | 歌尔声学股份有限公司 | Mems microphone |
| CN203933950U (en) * | 2014-06-24 | 2014-11-05 | 山东共达电声股份有限公司 | The one sound MEMS microphone that advances |
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| CN104023299A (en) | 2014-09-03 |
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Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee before: Shandong Gettop Acoustic Co.,Ltd. |