CN209949424U - MEMS microphone and electronic equipment - Google Patents

MEMS microphone and electronic equipment Download PDF

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Publication number
CN209949424U
CN209949424U CN201920739318.XU CN201920739318U CN209949424U CN 209949424 U CN209949424 U CN 209949424U CN 201920739318 U CN201920739318 U CN 201920739318U CN 209949424 U CN209949424 U CN 209949424U
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China
Prior art keywords
connector
base plate
mems
chip
mems microphone
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CN201920739318.XU
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Chinese (zh)
Inventor
徐达
郭文娟
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Goertek Microelectronics Inc
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Goertek Techology Co Ltd
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Priority to CN201920739318.XU priority Critical patent/CN209949424U/en
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Abstract

The utility model discloses a MEMS microphone, including shell and first base plate, the shell with first base plate constitutes enclosed construction, be equipped with the phonate hole on the first base plate, first base plate is kept away from one side of shell is provided with the pad, the shell with one side that the phonate hole is relative is equipped with MEMS chip and ASIC chip, be equipped with the connector on the first base plate, the MEMS chip or the ASIC chip passes through the connector with first base plate electricity is connected. The technical scheme of the utility model the influence of test system to microphone chip performance when aiming at weakening on the chip direct mount is on first base plate.

Description

MEMS microphone and electronic equipment
Technical Field
The utility model relates to a microphone technical field, in particular to MEMS microphone and electronic equipment.
Background
Microphones are commonly used in mobile phones, notebook computers, tablet computers and wearable devices as sound receiving devices. In recent years, with rapid development of technology, a Micro-Electro-Mechanical System (MEMS) microphone has come into play. MEMS microphones have the advantages of small size, high temperature resistance, easy mounting, etc., and are gradually replacing conventional electret microphones at present. In a typical MEMS microphone structure, a MEMS chip is disposed on a surface of a substrate, and a pad is disposed on another surface of the substrate, so that the performance of the MEMS microphone needs to be tested during production and manufacturing, for example, the pad is pressed by a probe, and at this time, a small deformation of the MEMS chip due to an excessive pressure of the probe may occur, thereby affecting the performance of the entire microphone.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a MEMS microphone aims at weakening the problem that probe pressure too big leads to MEMS microphone chip to produce deformation when testing.
In order to achieve the above object, the utility model provides a MEMS microphone, including shell and first base plate, the shell with first base plate constitutes enclosed construction, be equipped with the sound hole on the first base plate, first base plate is kept away from one side of shell is provided with the pad, a serial communication port, the shell with one side that the sound hole is relative is equipped with MEMS chip and ASIC chip, be equipped with the connector on the first base plate, the MEMS chip or the ASIC chip passes through the connector with first base plate electricity is connected.
Preferably, the other end of the connector is fixed to the housing by glue.
Preferably, the connector includes a supporting block and a metal layer on a surface of the supporting block.
Preferably, the supporting block includes a circuit board, and the metal layer includes a copper foil.
Preferably, the connector comprises a support block and a metalized through hole located inside the support block.
Preferably, the housing includes a side wall and an upper wall, and the MEMS chip and the ASIC chip are disposed on the upper wall.
Preferably, the connector is provided in plurality.
Preferably, the connector includes a first connector and a second connector, the MEMS chip is electrically connected to the first substrate through the first connector, and the ASIC chip is electrically connected to the first substrate through the second connector.
The utility model also provides an electronic equipment, include as above MEMS microphone and second base plate, the second base plate with first base plate electricity is connected.
The utility model discloses a MEMS microphone, including shell and first base plate, the shell with first base plate constitutes enclosed construction, be equipped with the sound hole on the first base plate, first base plate is kept away from one side of shell is provided with the pad, wherein, the shell with one side that the sound hole is relative is equipped with MEMS chip and ASIC chip, be equipped with the connector on the first base plate, MEMS chip or ASIC chip pass through the connector with first base plate electricity is connected, the utility model discloses a MEMS microphone is through setting up MEMS chip and ASIC chip on the shell of keeping away from the base plate to be connected with the base plate electricity through designing the connector structure, when having guaranteed each device electrical connection of microphone, because the pressure that probe or other components produced the microphone chip when effectively having reduced the test, thereby promoted the performance of whole product.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of an MEMS microphone according to the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the MEMS microphone of the present invention.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
1 Outer casing 6 ASIC chip
2 First substrate 7 Connector with a locking member
3 Sound hole 8 Supporting block
4 Bonding pad 9 Metal layer
5 MEMS chip 10 Conductive metal hole
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements or in a relationship wherein two elements interact, unless expressly limited otherwise; the terms "electrically connected," "coupled," or any variant thereof, mean any direct or indirect connection or coupling between two or more elements, the particular meaning of which in the present disclosure may be understood as appropriate by one of ordinary skill in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
The utility model provides a MEMS microphone sets up on the shell of keeping away from the base plate through with MEMS chip and ASIC chip to be connected through design connector structure and base plate electricity, when having guaranteed each device electrical connection of microphone, because the pressure that probe or other components produced the microphone chip when effectively having reduced the test, thereby promoted the performance of whole product.
As shown in fig. 1, in an embodiment of the MEMS microphone of the present invention, the MEMS microphone includes a housing 1 and a first substrate 2, the housing 1 and the first substrate 2 form a closed structure, the first substrate 2 is provided with a sound hole 3, one side of the first substrate 2 away from the housing 1 is provided with a pad 4, one side of the housing 1 opposite to the sound hole 3 is provided with a MEMS chip 5 and an ASIC chip 6, the first substrate 2 is provided with a connector 7, and the ASIC chip 6 is connected to the first substrate 2 through the connector 7.
In this embodiment, the acoustic holes 3 are disposed on the first substrate 2, and the MEMS chip 5 is disposed on one side of the housing 1 away from the first substrate 2, compared with the structure in which the MEMS chip is disposed on the first substrate, the MEMS chip is disposed on the housing instead of the second substrate, so that the performance impact on the MEMS chip caused by the pressing of an external member such as a probe on the pad during testing can be effectively reduced. Meanwhile, in order to electrically connect the MEMS chip/ASIC chip with the substrate, a connector 7 is provided on the substrate, and the connector 7 electrically connects and conducts the ASIC chip 6 with the first substrate 2, facilitating signal transmission.
In this embodiment, one end of the connector 7 is fixed to the first substrate 2, and the other end is fixed to the housing 1 by adhesive. Through the fixed mode in both ends, inside the enclosed construction was firmly located to connector 7, supported in the middle of first base plate 2 and shell 1, improved microphone overall structure's stability to a certain extent.
Specifically, the connector 7 includes a supporting block 8 and a metal layer 9 on the surface of the supporting block 8, and the metal layer 9 may be deposited on the surface of the supporting block 8 by, for example, an electroplating process. The connector 7 is fixed on the first substrate 2, for example, the connector 7 may be directly fixed on the first substrate 2 by a general adhesive paste, or the metal layer 9 may be fixed on the first substrate 2 by a conductive paste. Further, in this embodiment, the connector 7 may be a circuit board, and correspondingly, the metal layer 9 is a copper foil layer disposed on a surface of the circuit board, and the ASIC chip 6 is electrically connected to the copper foil layer through a gold wire, so as to be electrically connected and conducted with the substrate.
In another embodiment, as shown in fig. 2, the MEMS microphone is provided with a connector 7, one end of which is fixed to the first substrate 2 and the other end of which is suspended in the closed structure. Further, the connector 7 includes a supporting block 8 and a via metal hole 10 located inside thereof, and the ASIC chip 6 is electrically connected to the via metal hole 10 through gold wires so as to be electrically connected to the first substrate 2.
In another embodiment, the microphone housing comprises a side wall and an upper wall, i.e. a MEMS microphone of three-layer structure, the MEMS chip 5 and the ASIC chip 6 being arranged on the upper wall.
In another embodiment, the MEMS microphone is provided with a plurality of connectors 7, for example, two connectors may be provided, including a first connector and a second connector, the MEMS chip is electrically connected to the first substrate through the first connector, and the ASIC chip is electrically connected to the first substrate through the second connector.
The utility model also provides an electronic equipment, this electronic equipment include as before MEMS microphone and second base plate, the second base plate can be electronic equipment's mainboard or be connected for the electricity the subplate of mainboard, the concrete structure of this MEMS microphone refers to aforementioned embodiment, the second base plate is connected with first base plate electricity, so, electronic equipment can switch on with MEMS microphone electricity to utilize the MEMS microphone to carry out the radio reception operation. Since the electronic device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by all the technical solutions of all the embodiments are achieved, and no further description is given here.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (9)

1. The utility model provides a MEMS microphone, includes shell and first base plate, the shell with first base plate constitutes enclosed construction, be equipped with the sound hole on the first base plate, first base plate is kept away from one side of shell is provided with the pad, a serial communication port, the shell with one side that the sound hole is relative is equipped with MEMS chip and ASIC chip, be equipped with the connector on the first base plate, the MEMS chip or the ASIC chip passes through the connector with first base plate electricity is connected.
2. The MEMS microphone of claim 1, wherein the other end of the connector is fixed to the housing by glue.
3. The MEMS microphone of claim 1, wherein the connector comprises a support block and a metal layer on a surface of the support block.
4. The MEMS microphone of claim 3, wherein the support block comprises a circuit board and the metal layer comprises a copper foil.
5. The MEMS microphone of claim 1, wherein the connector comprises a support block and a metalized via located inside the support block.
6. The MEMS microphone of any of claims 1 to 5, wherein the housing comprises a side wall and an upper wall, the MEMS chip and the ASIC chip being disposed on the upper wall.
7. The MEMS microphone of any one of claims 1 to 5, wherein the connector is plural.
8. The MEMS microphone of claim 7, wherein the connector comprises a first connector and a second connector, the MEMS chip being electrically connected to the first substrate through the first connector, the ASIC chip being electrically connected to the first substrate through the second connector.
9. An electronic device comprising the MEMS microphone of any of claims 1-8 and a second substrate, the second substrate being electrically connected to the first substrate.
CN201920739318.XU 2019-05-22 2019-05-22 MEMS microphone and electronic equipment Active CN209949424U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920739318.XU CN209949424U (en) 2019-05-22 2019-05-22 MEMS microphone and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920739318.XU CN209949424U (en) 2019-05-22 2019-05-22 MEMS microphone and electronic equipment

Publications (1)

Publication Number Publication Date
CN209949424U true CN209949424U (en) 2020-01-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920739318.XU Active CN209949424U (en) 2019-05-22 2019-05-22 MEMS microphone and electronic equipment

Country Status (1)

Country Link
CN (1) CN209949424U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022067897A1 (en) * 2020-09-29 2022-04-07 瑞声声学科技(深圳)有限公司 Ultrasonic microphone and mobile terminal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022067897A1 (en) * 2020-09-29 2022-04-07 瑞声声学科技(深圳)有限公司 Ultrasonic microphone and mobile terminal

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Effective date of registration: 20200616

Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province

Patentee after: Goer Microelectronics Co.,Ltd.

Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong

Patentee before: GOERTEK TECHNOLOGY Co.,Ltd.