CN202178870U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
- Publication number
- CN202178870U CN202178870U CN2011203058114U CN201120305811U CN202178870U CN 202178870 U CN202178870 U CN 202178870U CN 2011203058114 U CN2011203058114 U CN 2011203058114U CN 201120305811 U CN201120305811 U CN 201120305811U CN 202178870 U CN202178870 U CN 202178870U
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- Prior art keywords
- wiring board
- bending
- bending wiring
- mems microphone
- mems
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005452 bending Methods 0.000 claims description 94
- 230000005236 sound signal Effects 0.000 claims description 13
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 abstract 5
- 239000007795 chemical reaction product Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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Abstract
The utility model discloses an MEMS microphone, comprising a packaging structure combined by a circuit board and a housing. The circuit board surface in the packaging structure is provided with an MEMS acoustic chip; the packaging structure is provided with a first sound aperture, wherein the external part of the packaging structure is provided with a folding circuit board, a first end portion of which is fixed on the external surface of the circuit board; a second end portion of the folding circuit board is fixed on the housing base; the mid portion of the folding circuit board is arranged on a side surface of the packaging structure; and the folding circuit board is provided with a second sound aperture corresponding with the first sound aperture; the second end portion external surface of the folding circuit board is provided a plurality of pads used for installing the MEMS microphone; a plurality of electrodes on the MEMS acoustic chip realize the electric connection with the pads through the circuit board and the folding circuit board and finally the consistent arrangement requirements of terminal products and the MEMS are arrived.
Description
Technical field
The utility model is specifically related to a kind of acoustic-electric conversion equipment, relates in particular to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology; In recent years; Along with electronic product volumes such as mobile phone, notebook computer constantly reduce; People are also increasingly high to the performance requirement of these portable electronic products, thereby also require the volume of supporting with it electronic component constantly to reduce, performance and consistency improve constantly.Under this background; A lot of novel products has also been released in microphone products field as one of strength member of above-mentioned portable electronic products; Be representative wherein, be illustrated in figure 1 as conventional MEMS microphone, comprise that openend by wiring board 1 and groove form casing 2 combines the encapsulating structure that constitutes with the MEMS microphone; On wiring board 1 surface of encapsulating structure inside MEMS acoustics chip 3 is installed; Encapsulating structure is provided with 4, the first holes 4, first hole that are used to receive the external sound signal and can be arranged on wiring board 1 or the shell 2, and the structure among Fig. 1 is that first hole 4 is arranged on the shell 2.But the MEMS microphone of this structure; Needs from the connection of the electrode on the MEMS acoustics chip 3; Must MEMS acoustics chip 3 be installed on the wiring board 1; And the electrode on the MEMS acoustics chip 3 must be connected on the wiring board 1; The pad 11 that is used for installing M EMS microphone and is used for transmission circuit also must be arranged on the outer surface of wiring board 1, and this has just caused not convenient that the MEMS microphone installs, for example sometimes the end product wiring board that requires to be provided with MEMS microphone pad need and the wiring board of installing M EMS acoustics chip inconsistent.This just requires to design a kind of novel MEMS microphone.
The utility model content
In view of the above problems, the purpose of the utility model provides and a kind ofly requires to be provided with consistent a kind of MEMS microphone with end product.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
First kind of technical scheme as realization the utility model: a kind of MEMS microphone; Comprise by the openend of wiring board and groove form casing and combine the encapsulating structure that constitutes; On the PCB surface of said encapsulating structure inside MEMS acoustics chip is installed; Said outer casing bottom is provided with first hole that is used to receive the external sound signal; Wherein, Said encapsulating structure outer setting has the bending wiring board, and the first end of said bending wiring board is fixed on the outer surface of said wiring board, and the second end of said bending wiring board is fixed on said outer casing bottom; The mid portion of said bending wiring board is arranged at the side of said encapsulating structure; And the second end of said bending wiring board is provided with said first hole correspondence, is used to receive the rising tone hole of external sound signal, and the second end outer surface of said bending wiring board is provided with a plurality of pads that are used to install said MEMS microphone, the second end of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said wiring board, said bending wiring board, said bending wiring board realize with said pad between be electrically connected.
As a kind of preferred version, said groove form casing is made up of a circuit board frame and a wiring board base plate.
As a kind of preferred version, said groove form casing is a metal square groove shape shell.
As a kind of preferred version, said bending wiring board is FPCB.
As a kind of preferred version, the first end of said bending wiring board and the second end are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
Second kind of technical scheme as realization the utility model: a kind of MEMS microphone; Comprise by the openend of wiring board and groove form casing and combine the encapsulating structure that constitutes; On the PCB surface of said encapsulating structure inside MEMS acoustics chip is installed; Said wiring board is provided with first hole that is used to receive the external sound signal; Wherein, Said encapsulating structure outer setting has the bending wiring board, and the first end of said bending wiring board is fixed on the outer surface of said wiring board, and the second end of said bending wiring board is fixed on said outer casing bottom; The mid portion of said bending wiring board is arranged at the side of said encapsulating structure; And the first end of said bending wiring board is provided with said first hole correspondence, is used to receive the rising tone hole of external sound signal, and the second end outer surface of said bending wiring board is provided with a plurality of pads that are used to install said MEMS microphone, the second end of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said wiring board, said bending wiring board, said bending wiring board realize with said pad between be electrically connected.
As a kind of preferred version, said groove form casing is made up of a circuit board frame and a wiring board base plate.
As a kind of preferred version, said groove form casing is a metal square groove shape shell.
As a kind of preferred version, said bending wiring board is FPCB.
As a kind of preferred version, the first end of said bending wiring board and the second end partly are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
Utilize above-mentioned MEMS microphone according to the utility model; Owing to the bending wiring board is arranged in the encapsulating structure outer setting; And the second end outer surface of bending wiring board is provided with a plurality of pads that are used for installing M EMS microphone; Make the second end of mid portion and the bending wiring board of first end through wiring board, bending wiring board of a plurality of electrodes on the MEMS acoustics chip, bending wiring board realize with said pad between be electrically connected; A plurality of pads through on the second end outer surface of bending wiring board are connected with end product, finally reach end product and with the MEMS microphone the consistent of requirement are set.
Description of drawings
Through with reference to below in conjunction with the explanation of accompanying drawing and the content of claims, and along with the more complete understanding to the utility model, other purpose of the utility model and result will understand more and reach easy to understand.In the accompanying drawings:
Fig. 1 is the profile of microphone in the utility model background technology.
Fig. 2 is the profile of the utility model embodiment one microphone.
Fig. 3 is the profile of the microphone of the utility model embodiment one another kind of form.
Fig. 4 is the structural representation of the utility model embodiment one bending wiring board.
Fig. 5 is the profile of the utility model embodiment two microphones.
Fig. 6 is the profile of the microphone of the utility model embodiment two another kind of forms.
Fig. 7 is the structural representation of the utility model embodiment two bending wiring boards.
Identical label is indicated similar or corresponding feature or function in institute's drawings attached.
Embodiment
Below will combine accompanying drawing that the specific embodiment of the utility model is described in detail.
Embodiment one
Fig. 2 is the profile of the utility model embodiment one microphone; Fig. 3 is the profile of the microphone of the utility model embodiment one another kind of form; Fig. 4 is the structural representation of the utility model embodiment one bending wiring board; Shown in Fig. 2-4; A kind of MEMS microphone; Comprise that openend by wiring board 1 and groove form casing 2 combines the encapsulating structure that constitutes; On wiring board 1 surface of said encapsulating structure inside MEMS acoustics chip 3 is installed; Said shell 2 bottoms are provided with first hole 4 that is used to receive the external sound signal, and wherein, said encapsulating structure outer setting has bending wiring board 5; The first end 51 of said bending wiring board 5 is fixed on the outer surface of said wiring board 1; The second end 52 of said bending wiring board 5 is fixed on said shell 2 bottoms, and the mid portion 53 of said bending wiring board is arranged at the side of said encapsulating structure, and the second end 52 of said bending wiring board 5 is provided with said first hole 4 correspondence, is used to receive the rising tone hole 6 of external sound signal; The second end 52 outer surfaces of said bending wiring board 5 are provided with a plurality of pads 7 that are used to install said MEMS microphone, the second end 52 of mid portion 53 and the said bending wiring board 5 of a plurality of electrodes on the said MEMS acoustics chip 3 through said wiring board 1, the first end 51 of said bending wiring board 5, said bending wiring board 5 realize with said pad 7 between be electrically connected.
As a kind of preferred version, said groove form casing 2 is made up of a circuit board frame 21 and a wiring board base plate 22, simplicity of design, production and processing easily.
As a kind of preferred version, said groove form casing 2 is a metal square groove shape shell, and structure is single, is convenient to assembling.
As a kind of preferred version, said bending wiring board 5 is FPCB, has flexible, not fragile preferably.
As a kind of preferred version, the first end 51 and the second end 52 of said bending wiring board 5 are the rigidity wiring board, and the mid portion 53 of said bending wiring board is FPCB, and this design is convenient to be complementary with the MEMS microphone.
Utilize above-mentioned MEMS microphone according to the utility model; Owing to the bending wiring board is arranged in the encapsulating structure outer setting; And the second end outer surface of bending wiring board is provided with a plurality of pads that are used for installing M EMS microphone; Make the second end of mid portion and the bending wiring board of first end through wiring board, bending wiring board of a plurality of electrodes on the MEMS acoustics chip, bending wiring board realize with said pad between be electrically connected; A plurality of pads through on the second end outer surface of bending wiring board are connected with end product, finally reach end product and with the MEMS microphone the consistent of requirement are set.
Embodiment two
Fig. 5 is the profile of the utility model embodiment two microphones; Fig. 6 is the profile of the microphone of the utility model embodiment two another kind of forms; Fig. 7 is the structural representation of the utility model embodiment two bending wiring boards; Shown in Fig. 5-7; A kind of MEMS microphone; Comprise that openend by wiring board 1 and groove form casing 2 combines the encapsulating structure that constitutes; On wiring board 1 surface of said encapsulating structure inside MEMS acoustics chip 3 is installed; Said wiring board 1 is provided with first hole 4 that is used to receive the external sound signal, and wherein, said encapsulating structure outer setting has bending wiring board 5; The first end 51 of said bending wiring board 5 is fixed on the outer surface of said wiring board 1; The second end 52 of said bending wiring board 5 is fixed on said shell 2 bottoms, and the mid portion 53 of said bending wiring board 5 is arranged at the side of said encapsulating structure, and the first end 51 of said bending wiring board 5 is provided with said first hole 4 correspondence, is used to receive the rising tone hole 6 of external sound signal; The second end 52 outer surfaces of said bending wiring board 5 are provided with a plurality of pads 7 that are used to install said MEMS microphone, the second end 52 of mid portion 53 and the said bending wiring board 5 of a plurality of electrodes on the said MEMS acoustics chip 3 through said wiring board 1, the first end 51 of said bending wiring board 5, said bending wiring board 5 realize with said pad 7 between be electrically connected.
As a kind of preferred version, said groove form casing 2 is made up of a circuit board frame 21 and a wiring board base plate 22, and simplicity of design is made easily.
As a kind of preferred version, said groove form casing 2 is a metal square groove shape shell, and structure is single, is convenient to assembling.
As a kind of preferred version, said bending wiring board 5 is FPCB, has flexible, not fragile preferably.
As a kind of preferred version, the first end 51 and the second end 52 of said bending wiring board 5 are the rigidity wiring board, and the mid portion 53 of said bending wiring board is FPCB, and this design is convenient to be complementary with the MEMS microphone.
Utilize above-mentioned MEMS microphone according to the utility model; Owing to the bending wiring board is arranged in the encapsulating structure outer setting; And the second end outer surface of bending wiring board is provided with a plurality of pads that are used for installing M EMS microphone; Make the second end of mid portion and the bending wiring board of first end through wiring board, bending wiring board of a plurality of electrodes on the MEMS acoustics chip, bending wiring board realize with said pad between be electrically connected; A plurality of pads through on the second end outer surface of bending wiring board are connected with end product, finally reach end product and with the MEMS microphone the consistent of requirement are set.
FPC is shaped as the vertical bar shape in above cited embodiment; Also can be designed to other shape of being convenient to be complementary with microphone in the reality, unquestionable, these are all in the utility model protection range; Said those skilled in the art should be understood that and are not described in detail.
Claims (10)
1. MEMS microphone; Comprise by the openend of wiring board and groove form casing and combine the encapsulating structure that constitutes; On the PCB surface of said encapsulating structure inside MEMS acoustics chip is installed; Said outer casing bottom is provided with first hole that is used to receive the external sound signal; It is characterized in that: said encapsulating structure outer setting has the bending wiring board; The first end of said bending wiring board is fixed on the outer surface of said wiring board; The second end of said bending wiring board is fixed on said outer casing bottom, and the mid portion of said bending wiring board is arranged at the side of said encapsulating structure, and the second end of said bending wiring board is provided with said first hole correspondence, is used to receive the rising tone hole of external sound signal; The second end outer surface of said bending wiring board is provided with a plurality of pads that are used to install said MEMS microphone, the second end of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said wiring board, said bending wiring board, said bending wiring board realize with said pad between be electrically connected.
2. MEMS microphone as claimed in claim 1 is characterized in that: said groove form casing is made up of a circuit board frame and a wiring board base plate.
3. MEMS microphone as claimed in claim 1 is characterized in that: said groove form casing is a metal square groove shape shell.
4. MEMS microphone as claimed in claim 1 is characterized in that: said bending wiring board is FPCB.
5. MEMS microphone as claimed in claim 1 is characterized in that: the first end of said bending wiring board and the second end are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
6. MEMS microphone; Comprise by the openend of wiring board and groove form casing and combine the encapsulating structure that constitutes; On the PCB surface of said encapsulating structure inside MEMS acoustics chip is installed; Said wiring board is provided with first hole that is used to receive the external sound signal; It is characterized in that: said encapsulating structure outer setting has the bending wiring board; The first end of said bending wiring board is fixed on the outer surface of said wiring board; The second end of said bending wiring board is fixed on said outer casing bottom, and the mid portion of said bending wiring board is arranged at the side of said encapsulating structure, and the first end of said bending wiring board is provided with said first hole correspondence, is used to receive the rising tone hole of external sound signal; The second end outer surface of said bending wiring board is provided with a plurality of pads that are used to install said MEMS microphone, the second end of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said wiring board, said bending wiring board, said bending wiring board realize with said pad between be electrically connected.
7. MEMS microphone as claimed in claim 6 is characterized in that: said groove form casing is made up of a circuit board frame and a wiring board base plate.
8. MEMS microphone as claimed in claim 6 is characterized in that: said groove form casing is a metal square groove shape shell.
9. MEMS microphone as claimed in claim 6 is characterized in that: said bending wiring board is FPCB.
10. MEMS microphone as claimed in claim 6 is characterized in that: the first end of said bending wiring board and the second end are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203058114U CN202178870U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203058114U CN202178870U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202178870U true CN202178870U (en) | 2012-03-28 |
Family
ID=45868731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203058114U Expired - Lifetime CN202178870U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202178870U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102655617A (en) * | 2012-05-24 | 2012-09-05 | 歌尔声学股份有限公司 | Microphone and assembling method thereof |
-
2011
- 2011-08-22 CN CN2011203058114U patent/CN202178870U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102655617A (en) * | 2012-05-24 | 2012-09-05 | 歌尔声学股份有限公司 | Microphone and assembling method thereof |
| CN102655617B (en) * | 2012-05-24 | 2015-09-30 | 歌尔声学股份有限公司 | Microphone and assembly method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120328 |
|
| CX01 | Expiry of patent term |