CN202190380U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
- Publication number
- CN202190380U CN202190380U CN2011203058082U CN201120305808U CN202190380U CN 202190380 U CN202190380 U CN 202190380U CN 2011203058082 U CN2011203058082 U CN 2011203058082U CN 201120305808 U CN201120305808 U CN 201120305808U CN 202190380 U CN202190380 U CN 202190380U
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- China
- Prior art keywords
- wiring board
- bending wiring
- cavity
- bending
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005452 bending Methods 0.000 claims description 78
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims description 4
- 230000005236 sound signal Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 239000000047 product Substances 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The utility model discloses an MEMS microphone, comprising a bend circuit board and a cavity. A first end portion of the bend circuit board is covered on one end of the cavity, and meanwhile a second end portion of the bend circuit board is covered on the other end of the cavity. A central part of the bend circuit board is arranged on one side surface of the cavity. The first end portion, the second end portion of the bend circuit board and the cavity are combined to form a packaging structure. The first end portion of the bend circuit board in the packaging structure is provided with an MEMS acoustic chip. The packaging structure is provided with a sound aperture; the external surface of the second end portion of the bend circuit board is provided with a plurality of pads. A plurality of electrodes on the MEMS acoustic chip are in electric connection with the pads through the first end portion, the central part and the second end portion of the bend circuit board. Accordingly the purpose is arrived that the pad circuit board of the MEMS microphone disaccords with the circuit board for installing the MEMS acoustic chip and design requirements of terminal products are met.
Description
Technical field
The utility model is specifically related to a kind of acoustic-electric conversion equipment, relates in particular to a kind of MEMS microphone.
Background technology
Along with the progress of society and the development of technology; In recent years; Along with electronic product volumes such as mobile phone, notebook computer constantly reduce; People are also increasingly high to the performance requirement of these portable electronic products, thereby also require the volume of supporting with it electronic component constantly to reduce, performance and consistency improve constantly.Under this background; A lot of novel products has also been released in microphone products field as one of strength member of above-mentioned portable electronic products; Be representative wherein, be illustrated in figure 1 as conventional MEMS microphone, comprise the encapsulating structure that constitutes by wiring board 21 and shell 22 with the MEMS microphone; On the PCB surface of said encapsulating structure inside MEMS acoustics chip 3 is installed; Said encapsulating structure is provided with the sound hole 4 that is used to receive the external sound signal, and sound hole 4 can be arranged on the bottom of wiring board 21 or shell 22, and the structure among Fig. 1 is the bottom that sound hole 4 is arranged on shell 22.But the MEMS microphone of this structure; Needs from the connection of the electrode on the MEMS acoustics chip 3; Must MEMS acoustics chip 3 be installed on the wiring board 21; And the electrode on the MEMS acoustics chip 3 must be connected on the wiring board 21, and the pad 5 that is used for installing M EMS microphone and is used for transmission circuit also must be arranged on the outer surface of wiring board 21, and this has just caused not convenient that the MEMS microphone installs; For example sometimes the end product wiring board that requires to be provided with MEMS microphone pad need and the wiring board of installing M EMS acoustics chip inconsistent, this just requires to design a kind of novel MEMS microphone.
The utility model content
In view of the above problems, the purpose of the utility model provides a kind of wiring board of MEMS microphone pad and the inconsistent a kind of MEMS microphone of wiring board of installing M EMS acoustics chip.
For solving the problems of the technologies described above; The utility model adopts following technical scheme: a kind of MEMS microphone; Comprise bending wiring board and cavity; The first end of said bending wiring board covers an end of said cavity; The second end of said bending wiring board covers the other end of said cavity, and the mid portion of said bending wiring board is arranged on the side of said cavity, and the second end of the first end of said bending wiring board, said bending wiring board and said cavity combine to form encapsulating structure; The first end of the inner said bending wiring board of said encapsulating structure is equipped with MEMS acoustics chip; Said encapsulating structure is provided with the sound hole that is used to receive the external sound signal, and the second end outer surface of said bending wiring board is provided with a plurality of pads, being electrically connected between the second end realization of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said bending wiring board, said bending wiring board and the said pad.
As a kind of preferred version, the first end of said bending wiring board and the second end are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
As a kind of preferred version, the quadra of said cavity for surrounding by wiring board.
As a kind of preferred version, said sound hole is arranged on the first end of said bending wiring board.
As a kind of preferred version, said sound hole is arranged on the second end of said bending wiring board.
Utilize above-mentioned MEMS microphone according to the utility model; Because being electrically connected between the second end realization that the bending wiring board makes a plurality of electrodes on MEMS acoustics chip mid portion and said bending wiring board through the first end of said bending wiring board, said bending wiring board and the pad; Reached the inconsistent purpose of wiring board of the wiring board and the installing M EMS acoustics chip of MEMS microphone pad, realized and the end product designing requirement.
Description of drawings
Through with reference to below in conjunction with the explanation of accompanying drawing and the content of claims, and along with the more complete understanding to the utility model, other purpose of the utility model and result will understand more and reach easy to understand.In the accompanying drawings:
Fig. 1 is the profile of MEMS microphone in the utility model background technology.
Fig. 2 is the profile of the utility model embodiment one MEMS microphone.
Fig. 3 is the vertical view of cavity.
Fig. 4 is the structural representation of the utility model embodiment one bending wiring board.
Fig. 5 is the profile of the utility model embodiment two microphones.
Fig. 6 is the structural representation of the utility model embodiment two bending wiring boards.
Embodiment
Below will combine accompanying drawing that the specific embodiment of the utility model is described in detail.
Embodiment one
Fig. 2 is the profile of the utility model embodiment one MEMS microphone; Fig. 3 is the vertical view of cavity;
Fig. 4 is the structural representation of the utility model embodiment one bending wiring board; Like Fig. 2, shown in Figure 3; A kind of MEMS microphone; Comprise bending wiring board 1 and cavity 2; As shown in Figure 4; Bending wiring board 1 is made up of first end 11, mid portion 13 and the second end 12, and the first end 11 of said bending wiring board 1 covers an end of said cavity 2, and the second end 12 of said bending wiring board 1 covers the other end of said cavity 2; The mid portion 13 of said bending wiring board 1 is arranged on the side of said cavity 2; The first end 11 of said bending wiring board 1, the second end 12 of said bending wiring board 1 and said cavity 2 combine to form encapsulating structure, and the first end 11 of the inner said bending wiring board 1 of said encapsulating structure is equipped with MEMS acoustics chip 3, and on the first end 11 of the bending wiring board 1 on the said encapsulating structure, are provided with the sound hole 4 that is used to receive voice signal; The second end 12 outer surfaces of said bending wiring board 1 are provided with a plurality of pads 5, the second end 12 of mid portion 13 and the said bending wiring board 1 of a plurality of electrodes on the said MEMS acoustics chip 3 through the first end 11 of said bending wiring board 1, said bending wiring board 1 realize with said pad 5 between be electrically connected.
As a kind of preferred version, the first end 11 and the second end 12 of said bending wiring board 1 are the rigidity wiring board, and the mid portion 13 of said bending wiring board is FPCB, are convenient to the installation of MEMS acoustics chip and fixing of cavity.
As a kind of preferred version, the quadra of said cavity 2 for surrounding by wiring board, simplicity of design is convenient to be complementary with the bending wiring board.
Utilize above-mentioned MEMS microphone according to the utility model; Because being electrically connected between the second end realization that the bending wiring board makes a plurality of electrodes on MEMS acoustics chip mid portion and said bending wiring board through the first end of said bending wiring board, said bending wiring board and the pad; Reached the inconsistent purpose of wiring board of the wiring board and the installing M EMS acoustics chip of MEMS microphone pad, realized and the end product designing requirement.
Embodiment two
Fig. 5 is the profile of the utility model embodiment two microphones; Fig. 6 is the structural representation of the utility model embodiment two bending wiring boards; As shown in Figure 5; A kind of MEMS microphone; Comprise bending wiring board 1 and cavity 2; As shown in Figure 6; Bending wiring board 1 is made up of first end 11, mid portion 13 and the second end 12, and the first end 11 of said bending wiring board 1 covers an end of said cavity 2, and the second end 12 of said bending wiring board 1 covers the other end of said cavity 2; The mid portion 13 of said bending wiring board 1 is arranged on the side of said cavity 2; The first end 11 of said bending wiring board 1, the second end 12 of said bending wiring board 1 and said cavity 2 combine to form encapsulating structure, and the first end 11 of the inner said bending wiring board 1 of said encapsulating structure is equipped with MEMS acoustics chip 3, and on the second end 12 of the bending wiring board 1 on the said encapsulating structure, are provided with the sound hole 4 that is used to receive voice signal; The second end 12 outer surfaces of said bending wiring board 1 are provided with a plurality of pads 5, the second end 12 of mid portion 13 and the said bending wiring board 1 of a plurality of electrodes on the said MEMS acoustics chip 3 through the first end 11 of said bending wiring board 1, said bending wiring board 1 realize with said pad 5 between be electrically connected.
As a kind of preferred version, the first end 11 and the second end 12 of said bending wiring board 1 are the rigidity wiring board, and the mid portion 13 of said bending wiring board is FPCB, are convenient to the installation of MEMS acoustics chip and fixing of cavity.
As a kind of preferred version, the quadra of said cavity 2 for surrounding by wiring board, simplicity of design is convenient to be complementary with the bending wiring board.
Utilize above-mentioned MEMS microphone according to the utility model; Because being electrically connected between the second end realization that the bending wiring board makes a plurality of electrodes on MEMS acoustics chip mid portion and said bending wiring board through the first end of said bending wiring board, said bending wiring board and the pad; Reached the inconsistent purpose of wiring board of the wiring board and the installing M EMS acoustics chip of MEMS microphone pad, realized and the end product designing requirement.
FPC is shaped as the vertical bar shape in above cited embodiment; Also can be designed to other shape of being convenient to be complementary with microphone in the reality, unquestionable, these are all in the utility model protection range; Said those skilled in the art should be understood that and are not described in detail.
Claims (5)
1. MEMS microphone; Comprise bending wiring board and cavity; The first end of said bending wiring board covers an end of said cavity; The second end of said bending wiring board covers the other end of said cavity; The mid portion of said bending wiring board is arranged on the side of said cavity; The second end of the first end of said bending wiring board, said bending wiring board and said cavity combine to form encapsulating structure, and the first end of the inner said bending wiring board of said encapsulating structure is equipped with MEMS acoustics chip, and said encapsulating structure is provided with the sound hole that is used to receive the external sound signal; The second end outer surface of said bending wiring board is provided with a plurality of pads, the second end of mid portion and the said bending wiring board of a plurality of electrodes on the said MEMS acoustics chip through the first end of said bending wiring board, said bending wiring board realize with said pad between be electrically connected.
2. MEMS microphone as claimed in claim 1 is characterized in that: the first end of said bending wiring board and the second end are the rigidity wiring board, and the mid portion of said bending wiring board is FPCB.
3. MEMS microphone as claimed in claim 1 is characterized in that: the quadra of said cavity for being surrounded by wiring board.
4. MEMS microphone as claimed in claim 1 is characterized in that: said sound hole is arranged on the first end of said bending wiring board.
5. MEMS microphone as claimed in claim 1 is characterized in that: said sound hole is arranged on the second end of said bending wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203058082U CN202190380U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203058082U CN202190380U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202190380U true CN202190380U (en) | 2012-04-11 |
Family
ID=45921811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203058082U Expired - Lifetime CN202190380U (en) | 2011-08-22 | 2011-08-22 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202190380U (en) |
-
2011
- 2011-08-22 CN CN2011203058082U patent/CN202190380U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120411 |
|
| CX01 | Expiry of patent term |