CN211352443U - Circuit board for MEMS microphone and MEMS microphone - Google Patents
Circuit board for MEMS microphone and MEMS microphone Download PDFInfo
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- CN211352443U CN211352443U CN201922333260.1U CN201922333260U CN211352443U CN 211352443 U CN211352443 U CN 211352443U CN 201922333260 U CN201922333260 U CN 201922333260U CN 211352443 U CN211352443 U CN 211352443U
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Abstract
The application discloses circuit board and MEMS microphone for MEMS microphone to solve the problem that external electromagnetic field interference influences microphone performance among the prior art, this circuit board includes: a base frame comprising a cavity, the cavity comprising a top side wall, two side walls, and a bottom side wall; the side wall of the cavity is provided with a shielding layer, and the side wall is an arc surface. The side walls of the cavity are designed into arc surfaces, so that the cavity can be connected more smoothly, the cavity can be conveniently processed, and meanwhile, the shielding layer of the side wall of the cavity can be prevented from being broken, so that the electromagnetic shielding performance of the MEMS microphone is better, the interference of electromagnetic signals to chips inside the MEMS microphone can be inhibited, and the stability and the reliability of the MEMS microphone are enhanced.
Description
Technical Field
The utility model relates to an electronic product technical field especially relates to a circuit board and MEMS microphone for MEMS microphone.
Background
The microphone is an energy conversion device for converting a sound signal into an electric signal, the microphone is an important component in the existing electronic products as an acoustoelectric transducer, and with the rapid development of the related electronic technology, the microphone has been widely applied to the daily life of people, common microphones are classified into moving-coil microphones, condenser microphones, electrets and recently emerging silicon Micro microphones (i.e. MEMS microphones), and MEMS (Micro Electro Mechanical System) microphones have the obvious advantages of stable performance at different temperatures, small size and the like compared with traditional microphones, the MEMS microphone becomes a microphone device which is most applied to electronic products such as mobile phones, intelligent watches, tablet computers and the like, due to the escalating consumer demand for electronics, those skilled in the art are also constantly improving the acoustic performance and stability of MEMS microphones.
At present, along with the increase of functions of electronic products such as mobile phones, smart watches and tablet computers, more and more circuits, electromagnetic devices and the like are arranged in the electronic products, so that a complex electromagnetic environment is formed in the electronic products. The MEMS microphone is an electronic device sensitive to the electromagnetic environment, and if the MEMS microphone is interfered by the external electromagnetic field, the normal sound-electricity conversion performance of the MEMS microphone is affected, which may cause the quality of the user's call and recording to be degraded, and even may cause unrecoverable performance damage to the MEMS microphone when the MEMS microphone is subjected to severe electromagnetic interference.
Therefore, in the present stage, it is necessary to optimize and modify the structure of the MEMS microphone to have a certain electromagnetic shielding capability, so as to prevent the interference of the external electromagnetic field, and provide a good and stable sound-electricity conversion effect.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, an object of the present invention is to provide a circuit board for a MEMS microphone and a MEMS microphone, which are designed into a curved surface through a plurality of side walls of the cavity, so that the connection is more smooth, the cavity can be conveniently processed, and the shielding layer of the side wall of the cavity can be prevented from being broken, so that the electromagnetic shielding performance of the MEMS microphone is better, and the stability and reliability of the MEMS microphone are enhanced.
According to an aspect of the utility model provides a circuit board for MEMS microphone, a serial communication port, include: a base frame comprising a cavity, the cavity comprising a top side wall, two side walls, and a bottom side wall; wherein, the side lateral wall is the cambered surface.
Preferably, the sidewall of the cavity is provided with a shielding layer, and the upper surface and the lower surface of the substrate frame are provided with metal layers.
Preferably, an insulating layer is disposed on a surface of the metal layer, and an opening is disposed in a connection position of the metal layer on the insulating layer.
Preferably, the shielding layer is connected to at least a part of the metal layer.
Preferably, the substrate frame is further provided with a through hole communicating the upper surface and the lower surface of the substrate frame.
Preferably, the number of the through holes is multiple, and the cross section of the through hole is any one of a circle, a semicircle, a sector, a triangle, a rectangle and a polygon.
Preferably, a metal wire for electrical connection is provided in the through hole.
Preferably, the top side wall is also cambered, and the through holes are respectively positioned on one side of the cambered bulge of the top side wall
Preferably, the metal layer includes a land, the land being annular, the end face of the cavity and the end face of the via both being located within an annular enclosure of the land.
According to another aspect of the present invention, there is provided a MEMS microphone, comprising: the substrate frame comprises a cavity, the side wall of the cavity is provided with a shielding layer, the cavity comprises a top side wall, two side walls and a bottom side wall, and the side walls are cambered surfaces; the first substrate is positioned above the circuit board and connected with the circuit board; the second substrate is positioned below the circuit board and connected with the circuit board; and the MEMS chip and the ASIC chip are arranged on the first substrate and/or the second substrate and are positioned in the cavity.
Preferably, the sidewall of the cavity is provided with a shielding layer, and the upper surface and the lower surface of the substrate frame are provided with metal layers.
Preferably, an insulating layer is disposed on a surface of the metal layer, and an opening is disposed in a connection position of the metal layer on the insulating layer.
Preferably, the shielding layer is connected to at least a part of the metal layer.
Preferably, the substrate frame is further provided with a through hole communicating the upper surface and the lower surface of the substrate frame.
Preferably, the number of the through holes is multiple, and the cross section of the through hole is any one of a circle, a semicircle, a sector, a triangle, a rectangle and a polygon.
Preferably, a metal wire for electrical connection is provided in the through hole.
Preferably, the top side wall is also cambered, and the through holes are respectively positioned on one side of the cambered bulge of the top side wall
Preferably, the metal layer includes a land, the land being annular, the end face of the cavity and the end face of the via both being located within an annular enclosure of the land.
The embodiment of the utility model has following advantage or beneficial effect: the utility model provides a circuit board for MEMS microphone, this circuit board are provided with the shielding layer including the base plate frame that has the cavity, this cavity lateral wall, can provide good electromagnetic shield ability, and the lateral wall is the cambered surface, makes its easily preparation more, and is favorable to the cover of shielding layer, avoids the shielding layer fracture to influence electromagnetic shield effect. Furthermore, the cambered surface design of the side wall also enables the cavity to have a relatively larger volume, so that a microphone chip with a larger size can be accommodated on one hand, and better performance is obtained; on the other hand, when the cavity is used as a front cavity of the microphone under the condition that the specification of the microphone chip is not changed, the larger volume of the cavity can reduce the resonance frequency of the front cavity and improve the frequency response of the microphone in a specific frequency band, and if the cavity is used as a back cavity of the microphone, the diaphragm of the microphone is less extruded by air in the cavity, so that higher sensitivity can be obtained.
Further, the utility model provides a MEMS microphone, the base plate frame through first base plate and second base plate with the circuit board presss from both sides wherein for the cavity lateral wall of base plate frame and the upper and lower side of cavity are provided with shielding layer and metal level respectively, so that the cavity obtains better electromagnetic shield ability, prevent that MEMS chip and ASIC chip in the cavity from being disturbed by the electromagnetic field in the external environment, the stability and the reliability of reinforcing MEMS microphone have improved and have produced property ability and product quality, have very strong practicality.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 is a top view of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a circuit board according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a MEMS microphone according to an embodiment of the present invention;
fig. 4 is a top view of a MEMS microphone according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a cross-section a-a of a MEMS microphone according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a MEMS microphone B-B cross section according to an embodiment of the present invention;
Detailed Description
Various embodiments of the present invention will be described in more detail below, but the present invention is not limited to only these embodiments. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and procedures have not been described in detail so as not to obscure the present invention.
The following describes in further detail embodiments of the present invention with reference to examples.
Fig. 1 and fig. 2 respectively show a top view and a perspective view of a circuit board according to an embodiment of the present invention, as shown in fig. 1, the circuit board includes a substrate frame 100, the substrate frame 100 is, for example, rectangular, a cavity 110 is disposed at a middle position thereof, the cavity 110, for example, penetrates through an upper surface and a lower surface of the substrate frame 100, a cross section of the cavity 110 is approximately elliptical, the cavity 110 includes a top side wall 111, two side walls 112 and a bottom side wall 113, the cavity 110 is defined by the 4 side walls being smoothly connected to each other, preferably, a shielding layer is disposed on each of the 4 side walls, the shielding layer is, for example, formed by coating a metal material, the top side wall 111, the side walls 112 and the bottom side wall 113 are, for example, respectively, an arc degree of the top side wall 111 is greater than an arc degree of the side wall 112, the substrate frame 100 further includes, for example, a, for example, 2 through holes 120 are symmetrically disposed on the left and right sides of the arc-shaped protrusion of the top side wall 111, and metal lines 121 are further disposed in the through holes 120, and the metal lines 121 may be used to electrically connect the upper surface and the lower surface of the substrate frame 100; the greater curvature of the top sidewall 111 may allow for a larger area of vias 120 or an increased number of vias 120, reducing process difficulties and requirements, and the increased number of vias may allow for the addition of more metal lines 121 and corresponding pins for connection, thereby avoiding pin reuse. As shown in fig. 2, the end of the metal line 121 is further provided with a connecting sheet 1211, and the connecting sheet 1211 is used for electrical connection and also protects the through hole 120 and the metal line 121 in the through hole 120. Of course, the number of the through holes 120 may also be multiple, the cross section of the through holes 120 may be circular, semicircular, fan-shaped, triangular, rectangular or other polygonal shapes, and the side walls of the through holes 120 may also be provided with corresponding metal coatings for electromagnetic shielding.
The bottom side wall 113 is also, for example, a curved surface, and meets the side wall 112 by an arc-shaped chamfer. This lateral wall setting makes cavity 110's volume bigger, still makes cavity 110's lateral wall more mellow and smooth, and the coating metal material of being convenient for forms the shielding layer, has effectively avoided the shielding layer fracture, influences electromagnetic shield effect.
Further, metal layers are disposed on the upper surface and the lower surface (not shown in the figure) of the substrate frame 100, the metal layers may be configured into a specific shape according to needs, the metal layers may also play a certain electromagnetic shielding role, an insulating layer (not shown in the figure) is disposed on a part of the surface of the metal layers, the insulating layer is used for protecting the metal layers, and openings are disposed on the insulating layer at positions where the metal layers need to be connected. Specifically, the metal layer on the upper surface includes a land 131, the land 131 is used for connecting with other circuit boards, the land 131 is, for example, annular, the end surface of the cavity 110 and the end surface of the through hole 120 are both located in the annular enclosure of the land 131, and the metal layer on the lower surface also includes the corresponding land 131. Part of the metal layer is grounded and the shield layer in the cavity 110 is connected to, for example, a partially grounded metal layer, thereby grounding the shield layer.
Fig. 3 is a schematic view of a MEMS microphone according to an embodiment of the present invention, which includes a substrate frame 100 (a cavity is not shown), a first substrate 200, and a second substrate 300, wherein the first substrate 200 and the second substrate 300 are respectively located above and below the substrate frame 100, and are connected to the substrate frame 100. The upper and lower surfaces of the substrate frame 100 are provided with metal layers 130, the lower surface of the first substrate 200 is provided with a metal layer 210, the upper surface of the second substrate 300 is provided with a metal layer 310, each metal layer is provided with an insulating layer 132 to be spaced apart from each other, further, the insulating layer 132 may be provided with an opening at a position where electrical connection is required, and the lower surface of the second substrate 300 is provided with a pad 320 for connection. The insulating layer 132 is, for example, a non-conductive adhesive, and the substrate frame 100 is connected to the first substrate 200 and the second substrate 300 through the insulating layer 132, and further, an area requiring electrical connection between the first substrate 200 and the substrate frame 100 or between the second substrate 300 and the substrate frame 100 may be connected by reflow soldering using a solder paste (not shown).
Fig. 4 is a top view of a MEMS microphone according to an embodiment of the present invention, and fig. 5 and 6 are schematic cross-sectional views of different cross-sectional lines in fig. 4. As shown in fig. 4, the MEMS microphone includes a circuit board, a first substrate 200 and a second substrate 300, wherein only the first substrate 200 is visible in a top view, the first substrate 200 and the second substrate 300 are, for example, also rectangular matching with the substrate frame 100 in the circuit board, the first substrate 200 is provided with a sound inlet 220 at a position covering the cavity 110 of the substrate frame 100, the sound inlet 220 is, for example, circular, and the periphery of the sound inlet 220 has an annular flange 221.
Fig. 5 and 6 are schematic cross-sectional views taken along a sectional line a-a and a sectional line B-B in fig. 4, respectively, with a portion of an insulating layer not shown, the second substrate 300 having a pad 320 on a lower surface thereof, a metal layer (not shown) on an upper surface thereof, and a portion connected to the land 131 on the lower surface of the substrate frame 100; similarly, the first substrate 200 is provided with a metal layer (not shown) on the lower surface thereof, and a partial area is connected to the land 131 on the upper surface of the substrate frame 100. Chips (not shown) required by the MEMS microphone are further disposed in the cavity 110, for example, the chips include a MEMS chip and an ASIC chip, the MEMS chip and the ASIC chip can be attached to the lower surface of the first substrate 200 and/or the upper surface of the second substrate 300, and interference of external electromagnetic signals to the chips in the cavity 110 can be suppressed by the shielding layer on the sidewall of the cavity 110 and the metal layers of the first substrate 200 and the second substrate 300. The substrate frame 100 is further provided with a metal line 121 in the through hole, and two ends of the metal line 121 are respectively provided with a connecting piece 1211 for connection, which is respectively connected with the first substrate 200 and the second substrate 300.
To sum up, the embodiment of the utility model has following advantage or beneficial effect: the utility model provides a circuit board, this circuit board are provided with the shielding layer including the base plate frame that has the cavity, and this cavity lateral wall can provide good electromagnetic shielding ability, and the lateral wall is the cambered surface, makes its easily preparation more, and is favorable to the cover of shielding layer, avoids the shielding layer fracture to influence electromagnetic shield effect. Furthermore, the cambered surface design of the side wall also enables the cavity to have a relatively larger volume, so that a microphone chip with a larger size can be accommodated on one hand, and better performance is obtained; on the other hand, when the cavity is used as a front cavity of the microphone under the condition that the specification of the microphone chip is not changed, the larger volume of the cavity can reduce the resonance frequency of the front cavity and improve the frequency response of the microphone in a specific frequency band, and if the cavity is used as a back cavity of the microphone, the diaphragm of the microphone is less extruded by air in the cavity, so that higher sensitivity can be obtained. The utility model also provides a MEMS microphone, the base plate frame with the circuit board through first base plate and second base plate presss from both sides wherein for base plate frame's cavity lateral wall and top and bottom are provided with shielding layer and metal level respectively, so that the cavity obtains better electromagnetic shield ability, prevent that MEMS chip and ASIC chip in the cavity from being disturbed by the electromagnetic field in the external environment, the stability and the reliability of reinforcing MEMS microphone have improved and have produced property ability and product quality, have very strong practicality.
It should be noted that, in this document, relational terms such as one and two, a and B, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
In accordance with the embodiments of the present invention, as described above, the drawings are not drawn to scale in order to highlight the details of the technical solution of the present invention, the proportions and dimensions shown in the drawings should not limit the essential technical solution of the present invention, and the embodiments do not describe all the details in detail, nor limit the present invention to the specific embodiments described.
Claims (18)
1. A circuit board for a MEMS microphone, comprising:
a base frame comprising a cavity, the cavity comprising a top side wall, two side walls, and a bottom side wall;
wherein, the side lateral wall is the cambered surface.
2. The circuit board of claim 1, wherein the sidewalls of the cavity are provided with a shielding layer, and the upper and lower surfaces of the substrate frame are provided with a metal layer.
3. The circuit board according to claim 2, wherein the surface of the metal layer is provided with an insulating layer provided with an opening at a connection position of the metal layer.
4. The circuit board of claim 2, wherein the shielding layer is coupled to at least a portion of the metal layer.
5. The circuit board of claim 2, wherein the substrate frame is further provided with a through hole communicating upper and lower surfaces of the substrate frame.
6. The circuit board according to claim 5, wherein the through hole is a plurality of through holes, and the cross section of the through hole is any one of a circle, a semicircle, a sector, and a polygon.
7. The circuit board of claim 5, wherein a metal line is disposed in the via for electrical connection.
8. The circuit board of claim 5, wherein the top side wall is also curved, and the plurality of through holes are located on one side of the curved protrusion of the top side wall.
9. The circuit board of claim 5, wherein the metal layer includes a land, the land being annular, the cavity and the end surface of the via each being located within an annular enclosure of the land.
10. A MEMS microphone, comprising:
the base plate frame comprises a cavity, the cavity comprises a top side wall, two side walls and a bottom side wall, and the side walls are cambered surfaces;
the first substrate is positioned above the substrate frame and connected with the substrate frame;
the second substrate is positioned below the substrate frame and connected with the substrate frame;
and the MEMS chip and the ASIC chip are arranged on the first substrate and/or the second substrate and are positioned in the cavity.
11. The MEMS microphone of claim 10, wherein the sidewall of the cavity is provided with a shielding layer, and the upper surface and the lower surface of the substrate frame are provided with a metal layer.
12. The MEMS microphone of claim 11, wherein a surface of the metal layer is provided with an insulating layer, and the insulating layer is provided with an opening at a connection position of the metal layer.
13. The MEMS microphone of claim 11, wherein the shielding layer is connected to at least a portion of the metal layer.
14. The MEMS microphone of claim 11, wherein the substrate frame is further provided with a through hole communicating an upper surface and a lower surface of the substrate frame.
15. The MEMS microphone of claim 14, wherein the through hole is a plurality of through holes, and the cross section of the through hole is any one of a circle, a semicircle, a sector, and a polygon.
16. The MEMS microphone of claim 14, wherein a metal wire for electrical connection is disposed within the via.
17. The MEMS microphone of claim 14, wherein the top side wall is also an arc, and the plurality of through holes are located on one side of the arc protrusion of the top side wall.
18. The MEMS microphone of claim 14, wherein the metal layer comprises a land, the land being annular, the end face of the cavity and the end face of the via each being located within an annular enclosure of the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922333260.1U CN211352443U (en) | 2019-12-23 | 2019-12-23 | Circuit board for MEMS microphone and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922333260.1U CN211352443U (en) | 2019-12-23 | 2019-12-23 | Circuit board for MEMS microphone and MEMS microphone |
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| Publication Number | Publication Date |
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| CN211352443U true CN211352443U (en) | 2020-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922333260.1U Active CN211352443U (en) | 2019-12-23 | 2019-12-23 | Circuit board for MEMS microphone and MEMS microphone |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022104864A1 (en) * | 2020-11-20 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
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2019
- 2019-12-23 CN CN201922333260.1U patent/CN211352443U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022104864A1 (en) * | 2020-11-20 | 2022-05-27 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
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