CN217216896U - Bone conduction microphone and vibration assembly thereof - Google Patents
Bone conduction microphone and vibration assembly thereof Download PDFInfo
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- CN217216896U CN217216896U CN202121906992.6U CN202121906992U CN217216896U CN 217216896 U CN217216896 U CN 217216896U CN 202121906992 U CN202121906992 U CN 202121906992U CN 217216896 U CN217216896 U CN 217216896U
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Abstract
The application discloses bone conduction microphone and vibration subassembly thereof, this vibration subassembly includes: a first housing having a side plate and a bottom plate connected to each other; the vibrating diaphragm is connected with the side plate of the first shell and surrounds the first shell to limit a first cavity; and the support ring is positioned outside the first cavity and opposite to the side plate of the first shell, wherein the diaphragm is clamped between the connecting ring and the side plate of the first shell. This vibration subassembly has increased the area of vibrating diaphragm in limited space through fixing the vibrating diaphragm between curb plate and the support ring of first casing, and then has promoted this vibration subassembly's sensitivity.
Description
Technical Field
The present application relates to the field of MEMS sensor technology, and more particularly, to a bone conduction microphone and a vibration component thereof.
Background
Microphones manufactured based on Micro Electro Mechanical Systems (MEMS) are called MEMS microphones, which are gaining attention due to their extremely small size and good performance. The MEMS microphone generally includes a MEMS chip and a signal processing chip electrically connected to the MEMS chip, wherein the MEMS chip mainly includes a vibrating membrane and a back plate, and a gap is formed between the vibrating membrane and the back plate. The change of the air pressure can cause the vibration film to deform, and the capacitance value between the vibration film and the conductive layer is changed, so that the vibration film is converted into an electric signal to be output.
The bone conduction microphone realizes the microphone for sound transmission by utilizing a bone conduction mode, realizes clear sound restoration in a noisy environment, avoids noise interference generated by air transmission sound, and extremely ensures the sound quality. Compared with a common MEMS microphone, the bone conduction microphone is additionally provided with a vibration component, and the sensitivity of the vibration component can influence the overall sensitivity of the bone conduction microphone. In addition, the bone conduction microphone is complicated to package due to the addition of the vibration component, which is not favorable for mass production.
It is therefore desirable to provide a bone conduction microphone and a vibration assembly thereof to improve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a bone conduction microphone and vibration subassembly thereof through fixing the vibrating diaphragm between the curb plate of first casing and support ring, has increased the area of vibrating diaphragm in limited space, and then has promoted the sensitivity of this vibration subassembly.
According to an aspect of the embodiments of the present invention, there is provided a vibration assembly of a bone conduction microphone, the vibration assembly comprising a first housing having a side plate and a bottom plate connected to each other; the vibrating diaphragm is connected with the side plate of the first shell and surrounds the first shell to limit a first cavity; and the support ring is positioned outside the first cavity and opposite to the side plate of the first shell, wherein the diaphragm is clamped between the connecting ring and the side plate of the first shell.
Optionally, the first housing, the support ring, and the diaphragm are integrated, wherein the side plate of the first housing, the support ring, and the diaphragm are fixed by pressing.
Optionally, the bottom plate of the first housing has at least one first through hole, and the first through hole communicates the first cavity with an external environment.
Optionally, the vibration isolation device further includes a mass fixed on the diaphragm, wherein the mass and the support ring are located on the same side of the diaphragm.
Optionally, the diaphragm further includes at least one air release hole, and each air release hole penetrates through the mass and the diaphragm.
According to another aspect of the embodiments of the present invention, there is provided a bone conduction microphone, which includes the vibration component as described above.
Optionally, the vibration isolator further comprises a substrate connected to the support ring, wherein the vibration membrane, the support ring and the substrate surround to define a second cavity, and the first cavity and the second cavity are respectively located on two opposite sides of the vibration membrane.
Optionally, the method further comprises: the micro-electromechanical structure is positioned on the substrate and is electrically connected with the substrate; and the signal processing chip is electrically connected with the micro-electromechanical structure, wherein the micro-electromechanical structure and the signal processing chip are both positioned outside the second cavity, the substrate is provided with a second through hole, and the second cavity is communicated with the back cavity of the micro-electromechanical structure through the second through hole.
Optionally, the micro-electro-mechanical system further comprises a second shell, the second shell is provided with a side plate and a bottom plate which are connected, the substrate is connected with the side plate of the second shell and surrounds the second shell to define a third cavity, the second cavity and the third cavity are respectively located on two opposite sides of the substrate, and the micro-electro-mechanical system structure and the signal processing chip are both located in the third cavity.
Optionally, the side plate of the first housing, the support ring, and the side plate of the second housing are aligned.
Optionally, the first housing, the support ring and the substrate are PCB substrates.
According to the utility model provides a bone conduction microphone and vibration subassembly thereof, through fixing the vibrating diaphragm between the curb plate of first casing and support ring, increased the area of vibrating diaphragm in limited space, and then promoted this vibration subassembly's sensitivity.
The side plate, the support ring and the vibrating diaphragm of the first shell are fixed in a pressing mode, so that the first shell, the support ring and the vibrating diaphragm are combined into a whole, the combination process of the vibration assembly and the MEMS microphone is simplified, the packaging efficiency of the bone conduction microphone is improved, and mass production is facilitated.
Set up first through-hole through the bottom plate at first casing, be favorable to gas outgoing in the casing under high temperature environment, reduced the risk of exploding the shell.
Through setting up the disappointing hole that runs through quality piece and vibrating diaphragm for first cavity and second cavity intercommunication are favorable to the equilibrium of the internal atmospheric pressure of first cavity and second cavity under high temperature environment.
The second cavity in the vibrating assembly is directly communicated with the back cavity of the micro-electromechanical structure through the second through hole of the substrate, and compared with a mode that air pressure of the second cavity firstly passes through the third cavity and then acts on the back cavity, the indirect transmission process of the air pressure is reduced, and the sensitivity of the bone conduction microphone is further improved.
By aligning the side plate of the first housing, the support ring, and the side plate of the second housing with the edge of the base plate, the flatness of the entire structure of the bone conduction microphone is improved.
Through all setting up first casing, support ring and base plate into the PCB base plate to can process first casing, support ring and base plate simultaneously, be convenient for realize whole board processing production, thereby improve machining efficiency. Preferably, the side plate and the support ring of the first shell are aligned with the edge of the substrate, so that typesetting is facilitated, and the processing efficiency is further improved.
Therefore, the utility model provides a bone conduction microphone and vibration subassembly thereof can improve the performance and the encapsulation efficiency, the reduce cost of product greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.
Fig. 1 shows a schematic configuration diagram of a bone conduction microphone in the related art.
Fig. 2 shows a schematic structural diagram of a vibration component of a bone conduction microphone according to an embodiment of the present invention.
Fig. 3 shows a schematic structural diagram of a MEMS microphone of a bone conduction microphone according to an embodiment of the present invention.
Fig. 4 shows a schematic structural diagram of a bone conduction microphone according to an embodiment of the present invention.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown. For simplicity, the semiconductor structure obtained after several steps can be described in one figure.
It will be understood that when a layer or region is referred to as being "on" or "over" another layer or region, it can be directly on the other layer or region or intervening layers or regions may also be present in the structure of the device. And, if the device is turned over, that layer, region, or regions would be "under" or "beneath" another layer, region, or regions.
If for the purpose of describing the situation directly on another layer, another area, the expressions "directly on … …" or "on … … and adjacent thereto" will be used herein.
Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
The present invention may be presented in a variety of forms, some of which are described below.
Fig. 1 shows a schematic structural diagram of a bone conduction microphone in the related art.
As shown in fig. 1, in the related art, a bone conduction microphone includes a MEMS microphone and a vibration member. The MEMS microphone includes: the micro-electromechanical structure comprises a substrate 110, a micro-electromechanical structure 160, a signal processing chip 170 and a shell 180. The vibration assembly includes: support ring 120, diaphragm 130, mass 140, and housing 150. The substrate 110, the housing 150 and the housing 180 respectively surround to define two accommodating cavities, and the two accommodating cavities are located on two opposite sides of the substrate 110. The micro-electromechanical structures 160 are electrically connected with the signal processing chip 170 and are all located in one of the accommodating cavities 103. The support ring 120, the diaphragm 130 and the mass 140 are located in another accommodating cavity, and the diaphragm 130 and the support ring 120 divide the accommodating cavity into the first cavity 101 and the second cavity 102. The substrate 110 has a through hole 110a for communicating the first cavity 101 with the back cavity of the micro-electromechanical structure 160. When the bone conduction microphone receives the vibration signal, the vibration component generates vibration to compress the air in the first cavity 101, and further pushes the membrane on the micro-electromechanical structure 160 to vibrate, and an electrical signal varying with the vibration frequency and amplitude is generated.
In the process of packaging the bone conduction microphone, the MEMS microphone is packaged first, then the support ring 120 and the mass block 140 are required to be attached to two sides of the diaphragm 130, then the support ring 120 is attached to the substrate 110, and finally the housing 150 is fastened to the substrate 110.
In the structure shown in fig. 1, the support ring 120 is located in the housing 150, and the size of the diaphragm 130 is defined by the support ring 120, so that the area of the diaphragm 130 is small, thereby reducing the sensitivity of the bone conduction microphone. In addition, in the packaging process of the bone conduction microphone, the assembly process flow of the vibration component is more, which is not beneficial to mass production. To the above problem, the utility model provides a modified bone conduction microphone and encapsulation subassembly thereof.
Fig. 2 shows a schematic structural diagram of a vibration component of a bone conduction microphone according to an embodiment of the present invention.
As shown in fig. 2, the vibration component of the bone conduction microphone according to the embodiment of the present invention includes: a first housing 210, a diaphragm 220, a support ring 230, and a mass 240.
In the present embodiment, the first housing 210 has a side plate 212 and a bottom plate 211 connected thereto. The side plates 212 and the bottom plate 211 may be formed by fixing PCB substrates. The first housing 210 may also be integrally formed of a metallic material. The diaphragm 220 is connected to the side plate 212 of the first housing and surrounds the first housing 210 to define a first cavity 201. The material of the diaphragm 220 is silicon or polysilicon. The support ring 230 is located outside the first cavity 201 and opposite to the side plate 212 of the first housing, wherein the support ring 230 may be a PCB substrate, and the diaphragm 220 is sandwiched between the connection ring 230 and the side plate 212 of the first housing. The mass 240 is fixed on the diaphragm 220, wherein the mass 240 and the support ring 230 are located on the same side of the diaphragm 220, and the material of the mass 240 is metal. However, the embodiments of the present invention are not limited thereto, and those skilled in the art may make other arrangements on the materials of the first housing 210, the diaphragm 220, the support ring 230, and the mass block 240 as needed.
In this embodiment, the side plate 212, the support ring 230, and the diaphragm 220 of the first housing are fixed by pressing, so that the first housing 210, the support ring 230, and the diaphragm 220 form an integrated structure. The mass 240 is bonded to the diaphragm 220. However, the embodiment of the present invention is not limited thereto, and a person skilled in the art may perform other arrangements on the fixing manner of the first shell 210, the diaphragm 220, the support ring 230, and the mass block 240 as needed.
In some preferred embodiments, the bottom plate 211 of the first housing has at least one first through hole 210a, and the first through hole 210a communicates the first cavity 201 with the external environment.
In other preferred embodiments, the vibration assembly further comprises at least one air release hole 204, and each air release hole 204 penetrates the mass 240 and the diaphragm 220.
Fig. 3 shows a schematic structural diagram of a MEMS microphone of a bone conduction microphone according to an embodiment of the present invention.
As shown in fig. 3, the MEMS microphone of the bone conduction microphone according to the embodiment of the present invention includes: the micro-electromechanical system comprises a substrate 250, a micro-electromechanical structure 260, a signal processing chip 270 and a second shell 280.
In this embodiment, the second housing 280 has a side plate 282 and a bottom plate 281 connected, wherein the side plate 282 and the bottom plate 281 may be formed by fixing a PCB substrate. The second housing 280 may also be integrally formed of a metallic material. The substrate 250 is connected to the side plate 282 of the second housing and surrounds the second housing 280 to define the third cavity 203, wherein the substrate 250 is a PCB substrate. The micro-electromechanical structure 260 and the signal processing chip 270 are electrically connected and are both located in the third cavity 203, and more specifically, the micro-electromechanical structure 260 and the signal processing chip 270 are both fixed on the substrate 250, and the signal processing chip 270 is electrically connected with the substrate 250. The substrate 250 has a second through hole 250a for communicating the back cavity of the micro-electromechanical structure 260 with the external environment. However, the embodiments of the present invention are not limited thereto, and those skilled in the art may make other arrangements on the materials of the second housing 280 and the substrate 250 as needed.
Fig. 4 shows a schematic structural diagram of a bone conduction microphone according to an embodiment of the present invention.
As shown in fig. 4, the vibration assembly of the integrated structure is directly fixed on the substrate 250 during the packaging process, thereby completing the packaging of the bone conduction microphone. Specifically, the substrate 250 is connected to the supporting ring 230, wherein the diaphragm 220, the supporting ring 230 and the substrate 250 surround to define a second cavity 202, the first cavity 201 and the second cavity 202 are respectively located at two opposite sides of the diaphragm 220, and the second cavity 202 and the third cavity 203 are respectively located at two opposite sides of the substrate 250. The air release hole 204 connects the first cavity 201 and the second cavity 202, and the second through hole 250a of the substrate connects the second cavity 202 and the back cavity of the mems structure 260. In some preferred embodiments, the side plate 212 of the first housing, the support ring 230, and the side plate 282 of the second housing are aligned.
The utility model discloses bone conduction microphone can use in terminals such as TWS earphone, headphone and intelligent glasses.
According to the utility model provides a bone conduction microphone and vibration subassembly thereof, through fixing the vibrating diaphragm between the curb plate of first casing and support ring, increased the area of vibrating diaphragm in limited space, and then promoted this vibration subassembly's sensitivity.
The side plate, the support ring and the vibrating diaphragm of the first shell are fixed in a pressing mode, so that the first shell, the support ring and the vibrating diaphragm are combined into a whole, the combination process of the vibrating assembly and the MEMS microphone is simplified, the packaging efficiency of the bone conduction microphone is improved, and mass production is facilitated.
Set up first through-hole through the bottom plate at first casing, be favorable to gas outgoing in the casing under high temperature environment, reduced the risk of exploding the shell.
Through setting up the disappointing hole that runs through quality piece and vibrating diaphragm for first cavity and second cavity intercommunication are favorable to the equilibrium of first cavity and the internal atmospheric pressure of second cavity under high temperature environment.
The second cavity in the vibrating assembly is directly communicated with the back cavity of the micro-electromechanical structure through the second through hole of the substrate, and compared with a mode that air pressure of the second cavity firstly passes through the third cavity and then acts on the back cavity, the indirect transmission process of the air pressure is reduced, and the sensitivity of the bone conduction microphone is further improved.
By aligning the side plate of the first housing, the support ring, and the side plate of the second housing with the edge of the base plate, the flatness of the entire structure of the bone conduction microphone is improved.
Through all setting up first casing, support ring and base plate into the PCB base plate to can process first casing, support ring and base plate simultaneously, be convenient for realize whole board processing production, thereby improve machining efficiency. Preferably, the side plate and the support ring of the first shell are aligned with the edge of the substrate, so that typesetting is facilitated, and the processing efficiency is further improved.
Therefore, the utility model provides a bone conduction microphone and vibration subassembly thereof can improve the performance and the encapsulation efficiency, the reduce cost of product greatly.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present invention, and these alternatives and modifications are intended to fall within the scope of the present invention.
Claims (10)
1. A vibration assembly of a bone conduction microphone, comprising:
a first housing having a side plate and a bottom plate connected to each other;
the vibrating diaphragm is connected with the side plate of the first shell and surrounds the first shell to define a first cavity;
the support ring is positioned outside the first cavity and opposite to the side plate of the first shell; and
the mass block is fixed on the diaphragm, the mass block and the support ring are positioned on the same side of the diaphragm,
wherein the diaphragm is sandwiched between the support ring and a side plate of the first housing,
the first shell and the support ring are integrated into a PCB substrate.
2. The vibration assembly of claim 1 wherein the first housing, the support ring, and the diaphragm are a unitary structure,
the side plate of the first shell, the support ring and the diaphragm are fixed in a pressing mode.
3. The vibration assembly of claim 1 wherein the bottom plate of the first housing has at least one first through hole communicating the first cavity with the external environment.
4. The vibration assembly of claim 3, further comprising at least one relief hole, each relief hole extending through the mass and the diaphragm.
5. A bone conduction microphone comprising the vibration assembly as claimed in any one of claims 1 to 4.
6. The bone conduction microphone of claim 5, further comprising a substrate coupled to the support ring,
the vibrating diaphragm, the support ring and the substrate surround to define a second cavity, and the first cavity and the second cavity are respectively located on two opposite sides of the vibrating diaphragm.
7. The bone conduction microphone of claim 6, further comprising:
the micro-electromechanical structure is positioned on the substrate and is electrically connected with the substrate; and
a signal processing chip electrically connected with the micro-electromechanical structure,
the micro-electromechanical structure and the signal processing chip are both positioned on the outer side of the second cavity, the substrate is provided with a second through hole, and the second cavity is communicated with the back cavity of the micro-electromechanical structure through the second through hole.
8. The bone conduction microphone of claim 7, further comprising a second housing having a side plate and a bottom plate coupled thereto, the base plate coupled to the side plate of the second housing and defining a third cavity in surrounding relation with the second housing,
the second cavity and the third cavity are respectively located on two opposite sides of the substrate, and the micro-electromechanical structure and the signal processing chip are both located in the third cavity.
9. The bone conduction microphone of claim 8, wherein the side plate of the first housing, the support ring, and the side plate of the second housing are aligned with an edge of the substrate.
10. A bone conduction microphone according to any one of claims 6-9, wherein the substrate is a PCB substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121906992.6U CN217216896U (en) | 2021-08-16 | 2021-08-16 | Bone conduction microphone and vibration assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121906992.6U CN217216896U (en) | 2021-08-16 | 2021-08-16 | Bone conduction microphone and vibration assembly thereof |
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| Publication Number | Publication Date |
|---|---|
| CN217216896U true CN217216896U (en) | 2022-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121906992.6U Active CN217216896U (en) | 2021-08-16 | 2021-08-16 | Bone conduction microphone and vibration assembly thereof |
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| CN (1) | CN217216896U (en) |
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- 2021-08-16 CN CN202121906992.6U patent/CN217216896U/en active Active
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