CN212785847U - Vibration sensor - Google Patents
Vibration sensor Download PDFInfo
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- CN212785847U CN212785847U CN202021263081.1U CN202021263081U CN212785847U CN 212785847 U CN212785847 U CN 212785847U CN 202021263081 U CN202021263081 U CN 202021263081U CN 212785847 U CN212785847 U CN 212785847U
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- cavity
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
Abstract
The utility model provides a vibration sensor, which comprises a circuit board, a shell, a vibration component and an MEMS microphone; the vibration assembly comprises a gasket, a vibrating diaphragm and a mass block; the gasket, the vibrating diaphragm and the circuit board are encircled together to form a first cavity, and the vibrating assembly is also provided with a first pressure relief hole penetrating through the vibrating assembly; the MEMS microphone comprises a substrate fixed on the vibrating diaphragm and a back plate which is supported at one end of the substrate, far away from the vibrating diaphragm, and forms a capacitor structure with the vibrating diaphragm at intervals, the substrate, the back plate and the vibrating diaphragm jointly enclose a second cavity, and the first cavity is communicated with the second cavity through a first pressure relief hole; the shell is provided with a second pressure relief hole penetrating through the shell; when a vibration signal or a pressure signal is input to one side of the shell, which is far away from the resonant cavity, and/or one side of the circuit board, which is far away from the resonant cavity, the vibration component vibrates, and the air pressure in the first cavity is changed. Compared with the prior art, the utility model discloses a vibration sensor sensitivity is higher, the production of being convenient for.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an acoustoelectric conversion field especially relates to a vibration sensor for bone conduction electronic product.
[ background of the invention ]
And the vibration sensor is used for converting the vibration signal into an electric signal. The existing MEMS vibration sensor comprises a vibration component serving as a vibration sensing device and an MEMS microphone serving as a vibration detection device for converting a vibration signal into an electric signal, and the vibration sensing device and the vibration detection device are integrated, so that the structure is complex, and the bandwidth of a signal which can be picked up is small.
Therefore, there is a need to provide a new vibration sensor to solve the above technical problems.
[ Utility model ] content
An object of the utility model is to provide a vibration sensor that sensitivity is high, be convenient for produce.
In order to achieve the above object, the present invention provides a vibration sensor, which includes a circuit board, a housing covering the circuit board and enclosing a resonant cavity together with the circuit board, a vibration component accommodated in the resonant cavity, and an MEMS microphone covering the MEMS microphone and fixed to the vibration component and electrically connected to the circuit board;
the vibration component comprises a gasket fixed on the circuit board, a vibrating diaphragm fixed at one end of the gasket, which is close to the MEMS microphone, and a mass block fixedly connected with the vibrating diaphragm; the gasket, the vibrating diaphragm and the circuit board enclose a first cavity together, and the vibrating assembly is further provided with a first pressure relief hole penetrating through the vibrating assembly;
the MEMS microphone comprises a substrate fixed on the vibrating diaphragm and a back plate which is supported at one end of the substrate far away from the vibrating diaphragm and forms a capacitor structure with the vibrating diaphragm at intervals, the substrate, the back plate and the vibrating diaphragm jointly enclose a second cavity, and the first pressure relief hole is used for communicating the first cavity with the second cavity;
the shell is provided with a second pressure relief hole penetrating through the shell;
when a vibration signal or a pressure signal is input to one side of the shell, which is far away from the resonant cavity, and/or one side of the circuit board, which is far away from the resonant cavity, the vibration component vibrates, and the air pressure in the first cavity is changed.
Preferably, the vibration sensor further comprises an ASIC chip, and the ASIC chip is accommodated in the resonant cavity and electrically connected to the MEMS microphone.
Preferably, the housing includes a housing plate opposite to the circuit board at an interval and a side plate bent and extended from the periphery of the housing plate to the circuit board and fixed to the circuit board, and the second pressure relief hole penetrates through the housing plate.
Preferably, the mass block is attached to one side of the diaphragm close to the first cavity and/or one side of the diaphragm close to the second cavity.
Preferably, the mass located on the same side of the diaphragm includes a plurality of mass units spaced apart from each other.
Preferably, the mass is wrapped by the diaphragm to form a fixation.
Preferably, the vibrating diaphragm comprises two sub-vibrating diaphragms which are fixed on the gasket and are overlapped with each other, and the mass block is clamped and wrapped between the two sub-vibrating diaphragms.
Preferably, the first pressure relief hole penetrates through the diaphragm.
Compared with the prior art, in the vibration sensor of the utility model, a resonant cavity is enclosed by the circuit board and the shell, and a vibration component and an MEMS microphone are arranged in the resonant cavity, wherein the vibration component comprises a gasket fixed on the circuit board, a vibrating diaphragm fixed on one end of the gasket, which is close to the MEMS microphone, and a mass block fixedly connected with the vibrating diaphragm; the gasket, the vibrating diaphragm and the circuit board enclose a first cavity together, and the vibrating assembly is further provided with a first pressure relief hole penetrating through the vibrating assembly; the MEMS microphone comprises a substrate fixed on the vibrating diaphragm and a back plate which is supported at one end of the substrate far away from the vibrating diaphragm and forms a capacitor structure with the vibrating diaphragm at intervals, the substrate, the back plate and the vibrating diaphragm jointly enclose a second cavity, and the first pressure relief hole is used for communicating the first cavity with the second cavity; the shell is provided with a second pressure relief hole penetrating through the shell. Through the structural design, the vibration component and the MEMS microphone are contained in the resonant cavity, and the MEMS microphone and the vibration component are simple in structure, convenient to produce and large in signal broadband capable of being picked up; in addition, first pressure release hole will first chamber with the second chamber intercommunication, just the back plate with the vibrating diaphragm forms the variable capacitance structure for the MEMS microphone can be better responds by the vibration that the vibration subassembly produced, and turns into the signal of telecommunication with the vibration signal of response, thereby realizes all having better vibration response to the high frequency vibration of first chamber transmission and low frequency vibration, has effectively improved sensitivity.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic perspective view of a vibration sensor according to the present invention;
fig. 2 is an exploded schematic view of the three-dimensional structure of the vibration sensor of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 4 is a schematic structural diagram of a second embodiment of a manner of fixing a mass and a diaphragm of the vibration sensor in FIG. 3;
FIG. 5 is a schematic structural diagram of a third embodiment of a manner of fixing a mass and a diaphragm of the vibration sensor in FIG. 3;
FIG. 6 is a schematic structural diagram of another embodiment of the mass block of FIG. 5 after structural modification;
fig. 7 is a schematic structural view of a fourth embodiment of the fixing mode of the mass block and the diaphragm in the vibration sensor of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that the technical solutions in the embodiments can be combined with each other, but must be based on the realization of those skilled in the art.
Referring to fig. 1-3, the present invention provides a vibration sensor 100, which includes a circuit board 1, a housing 2, a vibration component 3 and a MEMS microphone 4.
The shell 2 is fixed on the circuit board 1 in a covering manner and encloses a resonant cavity 20 together with the circuit board 1.
The housing 2 includes a housing plate 21 facing the circuit board 1 at a distance, and a side plate 22 bent and extended from a peripheral edge of the housing plate 21 toward the circuit board 1 and fixed to the circuit board 1.
In this embodiment, the housing 2 is provided with a second pressure relief hole 23 penetrating therethrough, and specifically, the second pressure relief hole 23 is one and penetrates through the housing plate 21. When complete machine SMT assembles, this second pressure release hole 23 set up the effect of playing balanced atmospheric pressure, specifically do, shell plate 21 pastes through surface assembly technique and establishes the inside that is fixed in the mobile device, and plugs up second pressure release hole 23 realizes the sealed of resonant cavity 20, has effectively avoided external air conduction acoustic signal to disturb, and then has improved vibration sensor 100 bone conduction sensitivity and frequency characteristic. Of course, the position and number of the second pressure relief holes 23 are not limited thereto, and the principle is the same.
The vibration component 3 is accommodated in the resonant cavity 20, and the vibration component 3 includes a gasket 31 fixed on the circuit board 1, a diaphragm 32 fixed on one end of the gasket 31 close to the MEMS microphone 4, and a mass 33 fixedly connected with the diaphragm 32; the spacer 31, the diaphragm 32 and the circuit board 1 together enclose a first cavity 30, i.e. the spacer 31 is used for spacing the diaphragm 32 from the circuit board 1 to provide a vibration space.
The MEMS (micro electro Mechanical systems) microphone 4, i.e. a MEMS microphone, is accommodated in the resonant cavity 20, and the MEMS microphone 4 is covered and fixed on the vibration component 3 and electrically connected to the circuit board 1.
Further, the MEMS microphone 4 includes a substrate 41 fixed to the diaphragm 32, and a back plate 42 supported at one end of the substrate 41 far from the diaphragm 32 and spaced from the diaphragm 32 to form a capacitor structure, where the substrate 41, the back plate 42 and the diaphragm 32 together enclose a second cavity 40.
It should be noted that the back plate 42 and the diaphragm 32 form a capacitor structure at an interval, and the size of the capacitor generated by the MEMS microphone 3 is changed by changing the distance between the diaphragm 32 and the back plate 42, so as to change the electrical signal.
In this embodiment, the vibration assembly 3 is provided with a first pressure relief hole 34 penetrating therethrough, and the first pressure relief hole 34 communicates the first cavity 30 and the second cavity 40 to balance the air pressure of the first cavity 30 and the air pressure of the second cavity 40. Specifically, the first pressure relief hole 34 is one and penetrates through the diaphragm 32. Of course, the location and number of the first pressure relief holes 34 are not limited thereto, and the principle is the same.
In the vibration sensor 100 with the above structure, the MEMS microphone 4 and the vibration component 3 are both accommodated in the resonant cavity 20, and the MEMS microphone 4 and the vibration component 3 have simple structures, are convenient to produce, and have a large signal bandwidth capable of being picked up.
In this embodiment, when a vibration signal or a pressure signal is input to a side of the housing 2 away from the resonant cavity 20 and/or a side of the circuit board 1 away from the resonant cavity 20, the vibration component 3 vibrates and changes the air pressure in the first cavity 30. Specifically, the mass block 33 vibrates to push the diaphragm 32 to vibrate, and the distance between the diaphragm 32 and the back plate 42 is changed, that is, the capacitance generated by the MEMS microphone 4 is changed, so that a vibration signal is converted into an electrical signal, and the converted electrical signal is transmitted to the circuit board 1, so that the MEMS microphone 3 converts an external input vibration signal or a pressure signal into an electrical signal, and the vibration signal is converted into the electrical signal. For example, the circuit board 1 and/or the housing 2 of the vibration sensor 100 is attached to the neck, and when a person speaks, bone conduction is achieved to transmit vibration signals, so that the above conversion process is achieved.
In the process, the MEMS microphone 4 directly senses and detects an external input vibration signal, and the air pressure passes through the first cavity 30 and the second cavity 40 in sequence, but the air pressure does not attenuate to reduce the energy of the air pressure, so that the MEMS microphone 3 can ensure accurate detection to the change of the air pressure to the maximum extent, and particularly has accurate response to high-frequency vibration greater than 1KHz, thereby effectively improving the sensitivity and reliability of the vibration sensor 100.
Because the performance of the MEMS microphone 4 is stable under different temperature conditions, the sensitivity of the MEMS microphone is basically not influenced by factors such as temperature, vibration, time and the like, and the MEMS microphone has good reliability and high stability. Since the MEMS microphone 4 can be subjected to reflow soldering at a high temperature of 260 ℃ without affecting the performance, the basic performance with high accuracy can be achieved even if the audio debugging process is omitted after assembly.
Preferably, in the above structure, the vibration component 3 is accommodated in the resonant cavity 20 and clamped and fixed between the circuit board 1 and the MEMS microphone 4, and the arrangement of the structure makes the vibration component 3 not need to additionally arrange a connecting structure to fix the position thereof, thereby simplifying the assembly process, improving the production efficiency, and not occupying too much space of the resonant cavity 20.
It should be noted that, in order to further improve the sensitivity of the vibration sensor 100, in the present embodiment, the vibration sensor further includes an ASIC (application Specific Integrated circuit) chip 5, and the ASIC chip 5 is accommodated in the resonant cavity 20 and electrically connected to the MEMS microphone 4. The ASIC chip 5 provides external bias for the MEMS microphone 4, the effective bias can ensure that the MEMS microphone 4 can keep stable acoustic sensitivity and electrical parameters in the whole working temperature range, and microphone structure design with different sensitivities can be supported, and the design is more flexible and reliable.
In this embodiment, the mass 33 is attached to a side of the diaphragm 32 close to the first cavity 30 and/or a side of the diaphragm 32 close to the second cavity 40.
As shown in fig. 3, the mass 33 is attached to the diaphragm 32 near the first cavity 30. The mass block 33, the diaphragm 32 and the spacer 31 are all located in the resonant cavity 20, so that space is saved and production is facilitated.
Fig. 4 is a schematic structural diagram of a second embodiment of a fixing manner of a mass and a diaphragm of the vibration sensor in the embodiment of fig. 3. The vibration sensor 200 of this embodiment is distinguished in that: the mass 233 is attached to one side of the diaphragm 232 close to the second cavity 240. The modification of this embodiment reduces the occupation of the volume of the first cavity 230 by the mass 233, further improving the sensitivity of the vibration sensor 200. Otherwise, it is the same as the embodiment shown in fig. 1 and will not be described herein.
Fig. 5 is a schematic structural diagram of a third embodiment of a fixing manner of a mass and a diaphragm of the vibration sensor in fig. 3. The vibration sensor 300 of this embodiment is distinguished in that: the mass 333 is attached to one side of the diaphragm 332 close to the first cavity 330 and one side of the diaphragm 332 close to the second cavity 340. That is, the mass 333 includes two sets, which are respectively attached to two opposite sides of the diaphragm 332. This structural design further increases the amount of inertia of the vibrating assembly, thereby further improving sensitivity. Otherwise, it is the same as the embodiment shown in fig. 1 and will not be described herein.
Please refer to fig. 6, which is a schematic structural diagram of another embodiment of the mass block of fig. 5 after structural changes. In the vibration sensor 400 of this embodiment, the mass 433 on the same side of the diaphragm 432 includes a plurality of mass units 4331 spaced apart from each other. The structural design also increases the amount of inertia of the vibrating assembly to further increase sensitivity. Otherwise, it is the same as the embodiment shown in fig. 3 and will not be described herein.
Please refer to fig. 7, which is a schematic structural diagram of a fourth embodiment of the fixing method of the mass block and the diaphragm in the vibration sensor of the present invention. Compared with other embodiments of the present invention, the main difference is that the mass block 533 is wrapped by the diaphragm 532 to form a fixing.
Specifically, the diaphragm 532 includes two sub diaphragms 5321 fixed to the spacer 531 and stacked on each other, and the mass block 533 is sandwiched and wrapped between the two sub diaphragms 5321. This structural design increases the fixing strength of the mass block 533, further improving the reliability.
Compared with the prior art, in the vibration sensor of the utility model, a resonant cavity is enclosed by the circuit board and the shell, and a vibration component and an MEMS microphone are arranged in the resonant cavity, wherein the vibration component comprises a gasket fixed on the circuit board, a vibrating diaphragm fixed on one end of the gasket, which is close to the MEMS microphone, and a mass block fixedly connected with the vibrating diaphragm; the gasket, the vibrating diaphragm and the circuit board enclose a first cavity together, and the vibrating assembly is further provided with a first pressure relief hole penetrating through the vibrating assembly; the MEMS microphone comprises a substrate fixed on the vibrating diaphragm and a back plate which is supported at one end of the substrate far away from the vibrating diaphragm and forms a capacitor structure with the vibrating diaphragm at intervals, the substrate, the back plate and the vibrating diaphragm jointly enclose a second cavity, and the first pressure relief hole is used for communicating the first cavity with the second cavity; the shell is provided with a second pressure relief hole penetrating through the shell. Through the structural design, the vibration component and the MEMS microphone are contained in the resonant cavity, and the MEMS microphone and the vibration component are simple in structure, convenient to produce and large in signal broadband capable of being picked up; in addition, first pressure release hole will first chamber with the second chamber intercommunication, just the back plate with the vibrating diaphragm forms the variable capacitance structure for the MEMS microphone can be better responds by the vibration that the vibration subassembly produced, and turns into the signal of telecommunication with the vibration signal of response, thereby realizes all having better vibration response to the high frequency vibration of first chamber transmission and low frequency vibration, has effectively improved sensitivity. Otherwise, it is the same as the embodiment shown in fig. 1 and will not be described herein.
The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.
Claims (8)
1. A vibration sensor is characterized by comprising a circuit board, a shell, a vibration component and an MEMS (micro-electromechanical systems) microphone, wherein the shell is fixedly covered on the circuit board and forms a resonant cavity together with the circuit board;
the vibration component comprises a gasket fixed on the circuit board, a vibrating diaphragm fixed at one end of the gasket, which is close to the MEMS microphone, and a mass block fixedly connected with the vibrating diaphragm; the gasket, the vibrating diaphragm and the circuit board enclose a first cavity together, and the vibrating assembly is further provided with a first pressure relief hole penetrating through the vibrating assembly;
the MEMS microphone comprises a substrate fixed on the vibrating diaphragm and a back plate which is supported at one end of the substrate far away from the vibrating diaphragm and forms a capacitor structure with the vibrating diaphragm at intervals, the substrate, the back plate and the vibrating diaphragm jointly enclose a second cavity, and the first pressure relief hole is used for communicating the first cavity with the second cavity;
the shell is provided with a second pressure relief hole penetrating through the shell;
when a vibration signal or a pressure signal is input to one side of the shell, which is far away from the resonant cavity, and/or one side of the circuit board, which is far away from the resonant cavity, the vibration component vibrates, and the air pressure in the first cavity is changed.
2. The vibration sensor of claim 1 further comprising an ASIC chip housed within the resonant cavity and electrically connected to the MEMS microphone.
3. The vibration sensor according to claim 2, wherein the housing includes a housing plate spaced apart from and facing the circuit board, and a side plate bent and extended from a periphery of the housing plate toward the circuit board and fixed to the circuit board, and the second pressure release hole is provided through the housing plate.
4. The vibrating sensor of claim 1, wherein the mass is attached to a side of the diaphragm adjacent to the first cavity and/or a side of the diaphragm adjacent to the second cavity.
5. The vibrating sensor of claim 4, wherein the mass on the same side of the diaphragm comprises a plurality of mass elements spaced apart from one another.
6. The vibrating sensor of claim 4, wherein the mass is wrapped by the diaphragm to form a fixation.
7. The vibration sensor according to claim 6, wherein the diaphragm includes two sub-diaphragms fixed to the spacer and stacked on each other, and the mass block is sandwiched and wrapped between the two sub-diaphragms.
8. The vibration sensor of claim 1, wherein the first pressure relief hole is disposed through the diaphragm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021263081.1U CN212785847U (en) | 2020-06-30 | 2020-06-30 | Vibration sensor |
| PCT/CN2020/115026 WO2022000793A1 (en) | 2020-06-30 | 2020-09-14 | Vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021263081.1U CN212785847U (en) | 2020-06-30 | 2020-06-30 | Vibration sensor |
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| CN212785847U true CN212785847U (en) | 2021-03-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021263081.1U Active CN212785847U (en) | 2020-06-30 | 2020-06-30 | Vibration sensor |
Country Status (2)
| Country | Link |
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| CN (1) | CN212785847U (en) |
| WO (1) | WO2022000793A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280907A (en) * | 2021-05-17 | 2021-08-20 | 歌尔微电子股份有限公司 | Vibration sensor and method for manufacturing vibration sensor |
| CN113411731A (en) * | 2021-05-28 | 2021-09-17 | 歌尔微电子股份有限公司 | Bone voiceprint sensor and electronic equipment |
| CN113630703A (en) * | 2021-08-27 | 2021-11-09 | 瑞声开泰科技(武汉)有限公司 | MEMS loudspeaker |
| WO2022062002A1 (en) * | 2020-09-25 | 2022-03-31 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone |
| CN114401478A (en) * | 2021-12-24 | 2022-04-26 | 歌尔微电子股份有限公司 | Bone voiceprint sensor |
| CN114501253A (en) * | 2022-01-25 | 2022-05-13 | 青岛歌尔智能传感器有限公司 | Vibration sensor and electronic device |
| CN114501252A (en) * | 2022-01-25 | 2022-05-13 | 青岛歌尔智能传感器有限公司 | Vibration assembly and preparation method thereof, bone voiceprint sensor and electronic equipment |
| EP4167596A4 (en) * | 2021-08-11 | 2023-04-26 | Shenzhen Shokz Co., Ltd. | Vibration sensor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104822118B (en) * | 2015-05-06 | 2018-11-30 | 歌尔股份有限公司 | A kind of encapsulating structure of MEMS microphone |
| CN206341428U (en) * | 2016-10-25 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Mems microphone |
| CN108513241B (en) * | 2018-06-29 | 2024-04-19 | 潍坊歌尔微电子有限公司 | Vibration sensor and audio device |
| CN209659621U (en) * | 2019-03-27 | 2019-11-19 | 歌尔科技有限公司 | Vibrating sensor and audio frequency apparatus |
-
2020
- 2020-06-30 CN CN202021263081.1U patent/CN212785847U/en active Active
- 2020-09-14 WO PCT/CN2020/115026 patent/WO2022000793A1/en active Application Filing
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062002A1 (en) * | 2020-09-25 | 2022-03-31 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone |
| CN113280907A (en) * | 2021-05-17 | 2021-08-20 | 歌尔微电子股份有限公司 | Vibration sensor and method for manufacturing vibration sensor |
| CN113411731B (en) * | 2021-05-28 | 2023-09-29 | 歌尔微电子股份有限公司 | Bone voiceprint sensor and electronic equipment |
| CN113411731A (en) * | 2021-05-28 | 2021-09-17 | 歌尔微电子股份有限公司 | Bone voiceprint sensor and electronic equipment |
| EP4167596A4 (en) * | 2021-08-11 | 2023-04-26 | Shenzhen Shokz Co., Ltd. | Vibration sensor |
| US11662248B2 (en) | 2021-08-11 | 2023-05-30 | Shenzhen Shokz Co., Ltd. | Vibration sensors |
| CN113630703A (en) * | 2021-08-27 | 2021-11-09 | 瑞声开泰科技(武汉)有限公司 | MEMS loudspeaker |
| CN114401478A (en) * | 2021-12-24 | 2022-04-26 | 歌尔微电子股份有限公司 | Bone voiceprint sensor |
| CN114401478B (en) * | 2021-12-24 | 2024-03-08 | 歌尔微电子股份有限公司 | Bone voiceprint sensor |
| CN114501253A (en) * | 2022-01-25 | 2022-05-13 | 青岛歌尔智能传感器有限公司 | Vibration sensor and electronic device |
| CN114501252A (en) * | 2022-01-25 | 2022-05-13 | 青岛歌尔智能传感器有限公司 | Vibration assembly and preparation method thereof, bone voiceprint sensor and electronic equipment |
| CN114501253B (en) * | 2022-01-25 | 2023-10-03 | 青岛歌尔智能传感器有限公司 | Vibration sensor and electronic device |
| CN114501252B (en) * | 2022-01-25 | 2023-11-17 | 青岛歌尔智能传感器有限公司 | Vibration component, preparation method thereof, bone voiceprint sensor and electronic equipment |
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|---|---|
| WO2022000793A1 (en) | 2022-01-06 |
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