CN112577539A - Waterproof sensor and electronic device - Google Patents
Waterproof sensor and electronic device Download PDFInfo
- Publication number
- CN112577539A CN112577539A CN202011420768.6A CN202011420768A CN112577539A CN 112577539 A CN112577539 A CN 112577539A CN 202011420768 A CN202011420768 A CN 202011420768A CN 112577539 A CN112577539 A CN 112577539A
- Authority
- CN
- China
- Prior art keywords
- shell
- waterproof
- section
- shell section
- waterproof sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000007789 sealing Methods 0.000 claims description 30
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000000565 sealant Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/16—Elements for restraining, or preventing the movement of, parts, e.g. for zeroising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/26—Windows; Cover glasses; Sealings therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
- G01D3/08—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups with provision for safeguarding the apparatus, e.g. against abnormal operation, against breakdown
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a waterproof sensor and an electronic device. Wherein, waterproof sensor includes: a substrate; the shell is internally provided with a containing cavity and comprises a first shell section and a second shell section, the first shell section is connected to the base plate, the second shell section is connected to the first shell section and forms an included angle alpha with the first shell section, and the included angle alpha is more than 90 degrees and less than 180 degrees; and the sensor chip is arranged on the substrate and is positioned in the accommodating cavity. The waterproof sensor of the technical scheme of the invention can conveniently discharge air bubbles and ensure the performance of products.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a waterproof sensor and electronic equipment with the waterproof sensor.
Background
In a waterproof sensor in the related art, as shown in fig. 1, a housing 1 is mostly formed by integrally forming two housing sections with different diameters. Generally, after the sensor chip 3 is connected to the substrate 2, the housing 1 is connected to the substrate 2, and then the waterproof sealant 4 is poured into the housing to protect and waterproof the sensor chip 3 by the waterproof sealant 4. However, in this kind of waterproof sensor, because the junction of two shell sections of shell 1 forms the right angle and connects, causes the dead angle, leads to after pouring into waterproof sealant 4, and waterproof sealant 4 is difficult to discharge in the bubble that the solidification process produced, influences the performance of sensor.
Disclosure of Invention
The invention mainly aims to provide a waterproof sensor, which aims to facilitate the discharge of air bubbles and ensure the performance of a product.
In order to achieve the above object, the present invention provides a waterproof sensor, including:
a substrate;
the shell is internally provided with a containing cavity and comprises a first shell section and a second shell section, the first shell section is connected to the base plate, the second shell section is connected to the first shell section and forms an included angle alpha with the first shell section, and the included angle alpha is more than 90 degrees and less than 180 degrees; and
the sensor chip is arranged on the substrate and is positioned in the accommodating cavity.
Optionally, the second shell section is an arc-shaped column section, a tangent line of a part of the second shell section, which is connected with the first shell section, and the included angle α is formed between the tangent line and the first shell section;
and/or the included angle α satisfies the relationship: alpha is more than or equal to 120 degrees and less than 180 degrees.
Optionally, the first shell segment is a straight or curved column segment.
Optionally, an end of the second shell section, which is far away from the first shell section, is provided with an opening, and the opening is in flaring arrangement;
and/or the first shell section and the second shell section are of an integral structure.
Optionally, the waterproof sensor further comprises a seal disposed around an outer sidewall of the second shell segment.
Optionally, the outer side wall surface of the second casing section and the inner side wall surface of the sealing element are arc-shaped wall surfaces which are mutually attached.
Optionally, the outer side wall surface of the sealing member is an arc-shaped wall surface protruding outwards.
Optionally, the sealing member is made of rubber, silica gel or silicone rubber.
Optionally, the seal member is an injection molded part and is of unitary construction with the second shell segment.
The invention also provides an electronic device, comprising a device body and a waterproof sensor mounted on the device body, wherein the waterproof sensor comprises:
a substrate;
the shell is internally provided with an accommodating cavity and comprises a first shell section and a second shell section, the first shell section is connected to the base plate, and the second shell section is an arc-shaped section and is in arc transition connection with the first shell section; and
the sensor chip is arranged on the substrate and is positioned in the accommodating cavity.
According to the waterproof sensor in the technical scheme, the first shell section of the shell is connected to the substrate, the sensor chip is arranged on the substrate and is positioned in the accommodating cavity, so that the shell and the substrate can be stably fixed, and the sensor is protected. The second shell section of the shell is connected to the first shell section, and an included angle alpha formed by the second shell section and the first shell section is larger than 90 degrees and smaller than 180 degrees, so that after the first shell section is connected with the second shell section, right-angle connection cannot be formed between the first shell section and the second shell section, smooth transition can be performed without dead angles, and then blocking of bubbles generated when the waterproof sealant is solidified cannot be caused, the bubbles can be easily discharged, and the performance of a product is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a prior art waterproof sensor;
FIG. 2 is a schematic structural diagram of a waterproof sensor according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a waterproof sensor according to an embodiment of the present invention.
The reference numbers illustrate:
reference numerals | Name (R) | Reference numerals | Name (R) | |
1 | |
2 | |
|
3 | Sensor chip | 4 | |
|
100 | |
200 | Outer casing | |
210 | A |
220 | |
|
300 | |
400 | |
|
500 | |
600 | |
|
221 | Opening of the |
| Containing cavity | |
1000 | Waterproof sensor |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 2 and fig. 3, in the manufacturing process of the waterproof sensor 1000, the housing 200 is usually connected to the substrate 100 to form a package structure, so that the sensor chip 300 disposed on the substrate 100 is located in the accommodating cavity 200a of the housing 200. In order to ensure the waterproof performance, a waterproof sealant 500 (e.g., silicone gel) is generally filled into the accommodating cavity 200a of the housing 200, and the waterproof sealant 500 can protect the sensor chip 300 from water and corrosion, and when the external pressure changes, the waterproof sealant 500 is slightly deformed, so as to act on the sensitive membrane of the sensor chip 300. In practical applications, the waterproof sealant 500 is filled to generate bubbles when being solidified, so that the bubbles are discharged in time to ensure the performance of the product.
The present invention provides a waterproof sensor 1000.
In an embodiment of the present invention, the waterproof sensor 1000 includes:
a substrate 100;
a housing 200 having a receiving cavity 200a therein, the housing 200 including a first housing section 210 and a second housing section 220, the first housing section 210 being connected to the base plate 100, the second housing section 220 being connected to the first housing section 210 and forming an angle α with the first housing section 210, 90 ° < α < 180 °; and
the sensor chip 300 is disposed on the substrate 100, and the sensor chip 300 is located in the accommodating cavity 200 a.
In an embodiment of the present application, the substrate 100 may be a PCB, which may be used to carry the sensor chip 300 and output a signal detected by the sensor chip 300. The housing 200 is provided in a cylindrical shape, and the material of the housing 200 may be a metal material, for example, stainless steel 304, stainless steel 316L, or the like. The material of the housing 200 may also be a high temperature resistant plastic material, for example, LCP (liquid crystal polymer), PS (polystyrene), etc. The materials have excellent forming and processing performances, high strength and good durability, are not easy to damage, and can play a good role in protecting the sensor chip 300 inside.
The lower end surface of the housing 200 may be fixedly coupled to the substrate 100 by an adhesive. Wherein, the adhesive can adopt any one of silver thick liquid, tin cream, epoxy glue, and this application does not limit this. Of course, the housing 200 and the substrate 100 may be connected by other fixing connection methods known to those skilled in the art, such as welding, etc.
In this embodiment, the included angle α is greater than 90 ° and less than 120 °, so that a dead angle cannot be formed due to an excessively small included angle α, and the installation of other components of the waterproof sensor 1000 cannot be affected due to an excessively large included angle α. Preferably, in the present application, the angle α formed by the second shell segment 220 and the first shell segment 210 is greater than or equal to 120 ° and less than 180 °. Thus, a flatter transitional connection structure can be formed between the second shell section 220 and the first shell section 210, so that the bending angle of the part where the two shell sections are connected is smaller, a dead angle cannot be formed, and the bubble discharge is facilitated. It is understood that, in practical applications, the specific value of the included angle α may also be 100 °, 130 °, 150 °, 170 °, or the like.
In an embodiment of the present application, the first casing section 210 and the second casing section 220 are an integrated structure, for example, the first casing section 210 and the second casing section 220 are integrated by injection molding, so that the casing 200 can be integrally injection molded, the production efficiency is high, and the sealing performance is good.
The sensor chip 300 may be a chip commonly known in the art, and generally includes a sensitive film capable of sensing external pressure changes. In the embodiment of the present application, the sensor chip 300 may be fixedly connected to the substrate 100 through a colloid, and electrically connected to the substrate 100, for example, the colloid may be a die bond, the sensor chip 300 may be fixed to the substrate 100 through the die bond, and the sensor chip 300 is bonded by the die bond and has a high bonding strength, so that the sensor chip 300 is firmly fixed to the substrate 100. The sensor chip 300 can be connected to the substrate 100 by gold wires 400, and the gold wires 400 are used for electrical connection between the sensor chip 300 and the substrate 100.
Therefore, according to the waterproof sensor 1000 of the present invention, the first shell section 210 of the shell 200 is connected to the substrate 100, the sensor chip 300 is disposed on the substrate 100, and the sensor chip 300 is located in the accommodating cavity 200a, such that the shell 200 and the substrate 100 can be stably fixed, and the sensor can be protected. The second shell section 220 of the shell is connected to the first shell section 210, and an included angle alpha formed by the second shell section 220 and the first shell section 210 is larger than 90 degrees and smaller than 180 degrees, so that after the first shell section 210 is connected with the second shell section 220, right-angle connection cannot be formed between the first shell section 210 and the second shell section 220, flat transition can be performed without dead angles, and then blocking of bubbles generated when the waterproof sealant 500 is solidified cannot be caused, so that the bubbles can be easily discharged, and the performance of a product is ensured.
Further, in an embodiment of the present application, the second shell segment 220 is an arc-shaped column segment, and a tangent line of a portion where the second shell segment 220 is connected to the first shell segment 210 forms the included angle α with the first shell segment 210. In this embodiment, the second shell section 220 is set as an arc-shaped column section, so that the inner wall surface and the outer wall surface of the second shell section 220 can be formed into arc-shaped surfaces and can form an arc transition connection with the first shell section 210, and because the tangent of the second shell section 220 forms a larger connection angle with the first shell section 210, when bubbles are generated, the bubbles can be discharged along the shell wall, and the bubbles are prevented from remaining in the accommodating cavity 200a to affect the product performance.
In an embodiment of the present application, the first shell section 210 is a straight column section or an arc column section. It can be understood that when the first casing section 210 is configured as a straight column section, the casing 200 is formed into a cylindrical shape at an end close to the substrate 100, so that when the first casing section 210 is connected to the substrate 100 and the waterproof sealant 500 is filled in the accommodating cavity 200a, the waterproof sealant 500 can cover and wrap the sensor chip 300 more uniformly, and a good protection is formed. And the straight column section is convenient to machine and form, and the production and manufacturing efficiency is high. And the first shell section 210 is set as an arc-shaped column section, so that the first shell section and the second shell section 220 can be further in smooth transition, the generation of a break angle is reduced, and the discharge of bubbles is facilitated.
Further, in an embodiment of the present application, the diameter of the first shell section 210 is larger than the diameter of the second shell section 220. So set up for shell 200 forms the tube structure of width under the narrow top, so be convenient for pour into waterproof sealed glue 500, and the guard action to sensor chip 300 is better.
In an embodiment of the present application, an end of the second shell section 220 away from the first shell section 210 has an opening 221, and the opening 221 is in a flaring configuration. In this embodiment, the opening 221 is located at the upper end of the second shell section 220, and when the waterproof sealant 500 is poured, the waterproof sealant can be poured through the opening 221. The opening 221 is a flared opening, and may be a chamfered opening or a tapered opening, so that when the waterproof sealant 500 is poured, the pouring can be facilitated, and the operation is more convenient.
Further, in an embodiment of the present application, the waterproof sensor 1000 further includes a sealing member 600, and the sealing member 600 is disposed around an outer sidewall of the second casing section 220. It is understood that the sealing member 600 is provided to waterproof-seal the waterproof sensor 1000 as a whole when the waterproof sensor 1000 is mounted on other devices, such as an electronic device and a wearable device, thereby ensuring the effectiveness of the waterproof sensor 1000.
In the embodiment of the present application, the outer side wall surface of the second casing section 220 and the inner side wall surface of the sealing member 600 are arc-shaped wall surfaces that are attached to each other. It can be understood that, the arrangement is such that the outer side wall surface of the second casing section 220 can completely fit with the sealing member 600 to form a continuous sealing area, so as to increase the contact area between the sealing member 600 and the second casing section 220, thereby improving the waterproof sealing effect after the sealing member 600 is installed.
Further, based on the above-described embodiments, the outer side wall surface of the seal 600 in the present application is an arc-shaped wall surface that protrudes outward. So set up for the outer wall face of sealing member 600 can form into smooth outward appearance face, avoids the outward appearance face of the sealing washer among the correlation technique to produce the phenomenon of segment difference, thereby when waterproof sensor 1000 installs in other equipment, the laminating with this equipment that the outside wall face of sealing member 600 can be better, and then realizes good sealed effect.
In the embodiment of the present application, the sealing member 600 is made of rubber, silicon gel, or silicon rubber. The rubber seal 600 is made of elastic polymer material, has a wide temperature range, and generates large deformation when a small stress is applied to different media, and the deformation can provide contact pressure, compensate leakage clearance and achieve good sealing. The silicone sealing member 600 may also be a waterproof sensor 1000 with good sealing effect due to temperature resistance, physiological inertia, low surface tension, and low surface energy. The silicon rubber has the obvious characteristics of high-temperature stability and physical and mechanical properties, and can ensure that the silicon rubber still has a better waterproof sealing effect at high temperature.
In an embodiment of the waterproof sensor 1000 of the present application, the sealing member 600 is an injection molded part and is integrated with the second casing section 220. In this embodiment, the sealing member 600 and the housing 200 are integrally formed by injection molding and are formed on the outer wall surface of the second casing section 220, so that no gap exists between the sealing member 600 and the second casing section 220, the sealing performance between the sealing member 600 and the second casing section 220 is ensured, and the sealing effect is favorably improved.
The invention also provides an electronic device, wherein the electronic device can be a watch, a bracelet, a smart phone, a tablet computer and the like. The electronic device comprises a device body and the waterproof sensor 1000 installed on the device body, and the specific structure of the waterproof sensor 1000 refers to the above embodiments.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A waterproof sensor, comprising:
a substrate;
the shell is internally provided with a containing cavity and comprises a first shell section and a second shell section, the first shell section is connected to the base plate, the second shell section is connected to the first shell section and forms an included angle alpha with the first shell section, and the included angle alpha is more than 90 degrees and less than 180 degrees; and
the sensor chip is arranged on the substrate and is positioned in the accommodating cavity.
2. The waterproof sensor of claim 1, wherein the second shell segment is an arc-shaped column segment, and a tangent line of a portion of the second shell segment connecting the first shell segment forms the included angle α with the first shell segment;
and/or the included angle α satisfies the relationship: alpha is more than or equal to 120 degrees and less than 180 degrees.
3. The waterproof sensor of claim 1, wherein the first shell segment is a straight or curved post segment.
4. The waterproof sensor of claim 3, wherein the second shell segment has an opening at an end thereof remote from the first shell segment, the opening being flared;
and/or the first shell section and the second shell section are of an integral structure.
5. The waterproof sensor of any one of claims 1 to 4, further comprising a seal disposed around an outer sidewall of the second shell segment.
6. The waterproof sensor according to claim 5, wherein the outer side wall surface of the second case segment and the inner side wall surface of the sealing member are curved wall surfaces that are fitted to each other.
7. The waterproof sensor according to claim 6, wherein the outer side wall surface of the seal member is an arc-shaped wall surface that protrudes outward.
8. The waterproof sensor of claim 5, wherein the sealing member is made of rubber, silicone rubber, or silicone rubber.
9. The waterproof sensor of claim 5, wherein the seal is an injection molded piece and is of unitary construction with the second housing section.
10. An electronic device comprising a device body and a waterproof sensor mounted on the device body, wherein the waterproof sensor is the waterproof sensor according to any one of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011420768.6A CN112577539A (en) | 2020-12-07 | 2020-12-07 | Waterproof sensor and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011420768.6A CN112577539A (en) | 2020-12-07 | 2020-12-07 | Waterproof sensor and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112577539A true CN112577539A (en) | 2021-03-30 |
Family
ID=75128009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011420768.6A Pending CN112577539A (en) | 2020-12-07 | 2020-12-07 | Waterproof sensor and electronic device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112577539A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113551707A (en) * | 2021-07-19 | 2021-10-26 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005061973A (en) * | 2003-08-11 | 2005-03-10 | National Institute For Materials Science | Water detector |
CN101852964A (en) * | 2010-06-01 | 2010-10-06 | 友达光电股份有限公司 | Display device |
CN201653350U (en) * | 2010-03-30 | 2010-11-24 | 中国船舶重工集团公司第七〇二研究所 | Water-proof sealing structure of strain gauge |
CN102654711A (en) * | 2010-12-17 | 2012-09-05 | 友达光电股份有限公司 | Electronic paper unit and manufacturing method thereof |
CN103471638A (en) * | 2013-08-19 | 2013-12-25 | 无锡合普瑞传感科技有限公司 | Sensor and detection circuit |
CN110631620A (en) * | 2019-09-29 | 2019-12-31 | 歌尔股份有限公司 | Sensor device |
CN210953183U (en) * | 2019-10-28 | 2020-07-07 | 歌尔微电子有限公司 | Waterproof pressure sensor |
-
2020
- 2020-12-07 CN CN202011420768.6A patent/CN112577539A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005061973A (en) * | 2003-08-11 | 2005-03-10 | National Institute For Materials Science | Water detector |
CN201653350U (en) * | 2010-03-30 | 2010-11-24 | 中国船舶重工集团公司第七〇二研究所 | Water-proof sealing structure of strain gauge |
CN101852964A (en) * | 2010-06-01 | 2010-10-06 | 友达光电股份有限公司 | Display device |
CN102654711A (en) * | 2010-12-17 | 2012-09-05 | 友达光电股份有限公司 | Electronic paper unit and manufacturing method thereof |
CN103471638A (en) * | 2013-08-19 | 2013-12-25 | 无锡合普瑞传感科技有限公司 | Sensor and detection circuit |
CN110631620A (en) * | 2019-09-29 | 2019-12-31 | 歌尔股份有限公司 | Sensor device |
CN210953183U (en) * | 2019-10-28 | 2020-07-07 | 歌尔微电子有限公司 | Waterproof pressure sensor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113551707A (en) * | 2021-07-19 | 2021-10-26 | 歌尔微电子股份有限公司 | Combined sensor and electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN205785644U (en) | MEMS minute-pressure pressure transducer | |
JP2001527210A (en) | Universal media package for pressure sensing devices | |
CN213688772U (en) | Sensor packaging structure and differential pressure sensor | |
KR20120065940A (en) | Semiconductor pressure sensor and manufacturing method thereof | |
CN112577539A (en) | Waterproof sensor and electronic device | |
JP2004361308A (en) | Physical quantity detector, and storage case for physical quantity detecting means | |
CN110174209A (en) | Media-isolated pressure sensor | |
US20200045477A1 (en) | Mems microphone | |
CN215726163U (en) | Ultrasonic sensor and meter body integrated flowmeter | |
CN110954262A (en) | Water-resistant and oil-proof packaged differential pressure sensor | |
CN209105453U (en) | MEMS microphone and electronic equipment | |
CN108344530A (en) | Strength sensor | |
CN213455953U (en) | Sensor packaging structure and differential pressure sensor | |
CN102932721B (en) | MEMS microphone | |
CN211504505U (en) | Sensor packaging structure | |
CN116481706A (en) | Waterproof sensor and electronic equipment | |
CN110631620A (en) | Sensor device | |
CN214149670U (en) | Force sensor | |
CN206056832U (en) | Pressure transducer | |
CN210513525U (en) | Barometer capable of preventing glue climbing | |
CN219956591U (en) | Pressure and temperature sensor | |
CN204881659U (en) | Environmental sensor | |
CN207556746U (en) | A kind of waterproof MEMS pressure sensor | |
CN115683204A (en) | Sensor with a sensor element | |
CN115683199A (en) | Sensor with a sensor element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210330 |