CN108811412B - Package, switching power supply module, PCB module and air conditioner - Google Patents
Package, switching power supply module, PCB module and air conditioner Download PDFInfo
- Publication number
- CN108811412B CN108811412B CN201810887027.5A CN201810887027A CN108811412B CN 108811412 B CN108811412 B CN 108811412B CN 201810887027 A CN201810887027 A CN 201810887027A CN 108811412 B CN108811412 B CN 108811412B
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- pcb
- package
- end plate
- insulating layer
- packaging shell
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- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 10
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- WABPQHHGFIMREM-AKLPVKDBSA-N lead-210 Chemical compound [210Pb] WABPQHHGFIMREM-AKLPVKDBSA-N 0.000 description 34
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- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 2
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- YFSLABAYQDPWPF-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,3,5-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 YFSLABAYQDPWPF-UHFFFAOYSA-N 0.000 description 1
- XBVSGJGMWSKAKL-UHFFFAOYSA-N 1,3,5-trichloro-2-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=CC=2Cl)Cl)=C1 XBVSGJGMWSKAKL-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
Abstract
The invention discloses a package, a switching power supply module, a PCB module and an air conditioner. The packaging body comprises a packaging shell, wherein the packaging shell is provided with a containing cavity; the inner PCB is arranged in the accommodating cavity; and, a needle; one end of the lead pin is electrically connected to the inner PCB, the other end of the lead pin penetrates through the penetrating part of the packaging shell and is electrically connected with the outer PCB, and the lead pin and the penetrating part of the packaging shell are integrally formed. According to the technical scheme, the guide pins and the packaging shell are integrally formed, so that the distance between the guide pins is ensured. That is, the inside PCB board sets up in the encapsulation shell, and components and parts electricity is connected in inside PCB board, and inside PCB board is connected with the guide pin, and the guide pin runs through this encapsulation shell and is connected with outside PCB board electricity, and the guide pin runs through encapsulation shell and with encapsulation shell shaping as an organic wholely, encapsulation shell is spacing fixed to the guide pin, has avoided the guide pin to take place the change of position because unsettled distance overlength from one end to the other end.
Description
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to a packaging body, a switching power supply module, a PCB module and an air conditioner.
Background
The package body modularly packages each discrete component, so that a module with smaller volume and higher power density is formed. For example, an internal PCB board is provided in the package body, the components are soldered to the internal PCB board, the internal PCB board is electrically connected to the external PCB board through pins, and is electrically connected to an external circuit, but the pins of the package body in the prior art are inconvenient to be soldered to the external PCB board.
Disclosure of Invention
The invention mainly aims to provide a packaging body and aims to solve the problem that a lead pin of the packaging body is inconvenient to weld to an external PCB in the prior art.
To achieve the above object, the present invention discloses a package comprising:
the packaging shell is provided with a containing cavity;
the inner PCB is arranged in the accommodating cavity; and
And one end of the guide pin is electrically connected to the inner PCB, the other end of the guide pin penetrates through the penetrating part of the packaging shell and is electrically connected with the outer PCB, and the guide pin and the penetrating part of the packaging shell are formed into an integrated structure.
Optionally, the packaging shell comprises an end plate and a cover body, the cavity is arranged in the cover body, the cover body is provided with an opening, the opening is communicated with the cavity, the end plate is arranged in the opening to block the cavity, and the end plate is a penetrating part of the packaging shell; the inner PCB board is arranged in the containing cavity, and the guide pin penetrates through the end plate and is integrally formed with the end plate and used for being electrically connected with the outer PCB board.
Optionally, an insulating layer is coated at a position of the guide pin corresponding to the accommodating cavity.
Optionally, the lead and the insulating layer are formed as a unitary structure.
Optionally, the part of the pin corresponding to the cavity is coated with an insulating layer, and the insulating layer and the end plate are formed into an integrated structure.
Optionally, the insulation layer includes a body portion and a step portion connected to the body portion, the body portion and the step portion are formed into an integral structure and cover the lead, and the step portion and the end plate are formed into an integral structure; the step portion has a dimension along the radial direction of the needle that is greater than a dimension along the radial direction of the needle of the body portion.
Optionally, the insulating layer is made of an insulating material;
Or the insulating layer is prepared from an insulating material, wherein the insulating material is plastic, rubber or insulating paint.
Optionally, the package further includes a component, where the component is disposed in the cavity and electrically connected to the internal PCB board.
The invention also discloses a switching power supply module which comprises the packaging body.
The invention also discloses a PCB module, which comprises an external PCB and a switch power supply module electrically connected to the external PCB, wherein the switch power supply module is the switch power supply module.
The invention also discloses a PCB module, which comprises an external PCB and a switch power supply module electrically connected to the external PCB, wherein the switch power supply module is the switch power supply module.
According to the technical scheme, the guide pins and the packaging shell are formed into an integrated structure, so that the distance between the guide pins is ensured. Specifically, inside PCB board sets up in encapsulation shell, and components and parts electricity is connected on inside PCB board, and inside PCB board is connected with the guide pin, and the guide pin runs through this encapsulation shell and is connected with outside PCB board electricity, and the guide pin runs through encapsulation shell and with encapsulation shell shaping structure as an organic whole, encapsulation shell forms spacing fixedly to the guide pin, has guaranteed the distance between each guide pin, has avoided the guide pin to take place the change of position because unsettled distance overlength from one end to the other end.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a package mounted on an external PCB structure;
FIG. 2 is a perspective view of a package;
FIG. 3 is a perspective view of the package (another view);
FIG. 4 is a front view of the package;
FIG. 5 is a schematic diagram of a package structure;
FIG. 6 is an exploded view of the package;
FIG. 7 is an exploded view of the package;
FIG. 8 is a schematic view of the structure of the pins, insulating layer and end plates;
FIG. 9 is a perspective view of the cover;
fig. 10 is a front view of the housing.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 1 | Package body | 122 | Second protruding piece |
| 2 | External PCB | 130 | End plate |
| 100 | Packaging shell | 140 | Insulating layer |
| 110 | Cover body | 141 | Body part |
| 111 | Open mouth | 142 | Step part |
| 112 | Containing cavity | 210 | Guiding needle |
| 120 | Projection part | 220 | Internal PCB |
| 121 | First protruding piece | 230 | Component and device |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a package.
As shown in fig. 1 to 10, in the present embodiment, the package 1 includes:
A package housing 100, wherein the package housing 100 is provided with a containing cavity 112;
an inner PCB 220, wherein the inner PCB 220 is disposed in the cavity 112; and
And a lead 210, wherein one end of the lead 210 is electrically connected to the inner PCB 220, and the other end penetrates through the penetration portion of the package housing 100, and is electrically connected to the outer PCB 2, and the lead 210 and the penetration portion of the package housing 100 are formed into an integral structure.
In this embodiment, the package body 1 encapsulates the inner PCB 220 through the package housing 100, and the package housing 100 performs the functions of mounting, fixing, sealing, protecting, etc. The inner PCB board is used for electrically connecting each component 230, the inner PCB board 220 is electrically connected with a lead 210, and the lead 210 penetrates through the package housing 100 and is electrically connected to the outer PCB board 2, so as to connect the circuit inside the package body 1 with the circuit outside.
In the prior art, the pins 210 are directly exposed from the package housing 100, so that the suspension distance from one end (the end electrically connected to the inner PCB 220) to the other end (the end electrically connected to the outer PCB 2) of the pins 210 is too long, each pin 210 is easily touched to change the relative position, and when the package is mounted to the outer PCB 2, the pins 210 cannot be well aligned with the soldering area of the outer PCB 2, which results in difficulty in soldering. Therefore, in the embodiment, the pins 210 penetrate through the package housing 100, and the penetrating portions of the pins 210 and the package housing 100 are formed into an integral structure, so that the penetrating portions can fix the relative positions of the pins 210, and prevent the relative positions of the pins 210 from being changed due to the overlarge suspension distance, so as to facilitate the soldering of the package 1 to the external PCB 2. The penetrating part is a structure combined with the lead 220, and can be separated from the package housing 100 alone, so that the internal PCB 220 can be placed in the cavity 112 conveniently, and the production is facilitated.
When the package 1 is in operation, heat is generated inside the package 1, so the material of the package housing 100 may be selected from insulating plastic, ceramic, etc. with high heat conductivity.
The inner PCB 220 is disposed in the cavity 112, and may be fixed in the cavity 112 by glue, or may be fixed by interference fit between the inner PCB 220 and a wall of the cavity 112, which is not limited in this embodiment. The external PCB 2 is a carrier of external components, and the package 1 may be electrically connected to the external PCB 2 through the lead 210.
The lead 210 and the penetration portion of the package housing 110 may be formed as an integral structure by injection molding or sintering.
The electrical connection as described above is a fairly easy way for a person skilled in the art to solder by means of solder paste or other soldering material, as follows.
Further, as shown in fig. 3, 6 and 7, the package housing 100 includes an end plate 130 and a cover 110, the cavity 112 is disposed in the cover 110, the cover 110 is provided with an opening 111, the opening 111 is communicated with the cavity 112, the end plate 130 is disposed in the opening 111 to block the cavity 112, and the end plate 130 is a penetrating portion of the package housing 100; the inner PCB 220 is disposed in the cavity 112, and the pins 210 penetrate through the end plate 130 and are integrally formed with the end plate 130, so as to be connected with the outer PCB 2.
That is, the end plate 130 is a penetration portion. In this embodiment, the cover 110 forms an opening 111 to facilitate placement of the components, and the cover 110 and the end plate 130 in combination together form a protection for the components placed in the cavity 112. The end plate 130 is disposed in the opening 111, it can be understood that the end plate 130 may be bonded to the cover 110 by an adhesive bonding manner so as to block the cavity 112, or a potting material is poured into the cavity 112 during the packaging process of the package 1, and the end plate 130 may be fixed after the potting material is cured by pouring the potting material into the cover 110, and then combining with the potting material when the end plate 130 is covered; or, because the lead 210 and the penetrating portion of the package housing 100 are formed into an integral structure, the lead 210 is welded on the inner PCB 220, and when the cover 110 is filled with the potting material, the inner PCB 220 and the lead 210 are fixed, that is, the end plate 130 is also fixed. The potting material can be polyurethane, silica gel or epoxy resin.
Further, the portion of the lead 210 corresponding to the cavity 112 is covered with an insulating layer 140. When the package can 100 encapsulates the component 230, since the internal space of the package can 100 is limited, when the pins 210 are positioned too close to the component 230, the pins 210 easily touch the component 230 during the manufacturing process of the package body 1, thereby causing a short circuit. Therefore, as shown in fig. 7 and 8, by coating the insulating layer 140 on the portion of the lead 210 corresponding to the cavity 112, even when the lead 210 contacts the component 230, the occurrence of short circuit is avoided due to the insulating layer 140, thereby improving the product yield. It should be understood that, as described above, the insulating layer 140 is disposed to avoid the pin 210 touching the component 230 to cause a short circuit, so the portion of the pin 210 corresponding to the cavity 112 is a portion that is easy to touch the component 230, and the insulating layer 140 is covered on the portion to prevent the short circuit.
The pins 210 and the insulating layer 140 may nest with each other. That is, the insulating layer 140 is prepared first, the insulating layer 140 has a cylindrical shape, and then the lead 210 is embedded in the insulating layer 140. In order to further improve the production efficiency, as shown in fig. 6 to 8, the lead 210 and the insulating layer 140 are formed as an integral structure. Through shaping structure as an organic whole to improve production efficiency. The integrated structure may refer to the molding technology in the prior art, for example, a molten insulating material (a material for preparing the insulating layer 140) is poured into a mold, the lead 210 is placed in the mold, and after cooling, the insulating layer 140 and the lead 210 are formed into an integrated structure; or by cladding the blank to be sintered outside the lead 210, and forming into an integral structure by sintering. The bonding strength of the lead 210 and the insulating layer 140 can be improved by forming the lead 210 and the insulating layer 140 into an integral structure, so that the lead 210 is prevented from falling out of the insulating layer 140.
Further, as shown in fig. 6 to 8, the portion of the lead 210 corresponding to the cavity 112 is covered with an insulating layer 140, and the insulating layer 140 and the end plate 130 are formed into an integral structure. In this embodiment, the insulating layer 140 and the end plate 130 are formed as an integral structure, that is, the insulating layer 140, the end plate 130 and the lead 210 are formed as an integral structure, so as to improve the production efficiency. Secondly, the three parts are formed into an integral structure, namely, the three parts are tightly combined, so that the joint of the guide pin 210 and the end plate 130 is prevented from being cracked and loosened, and the fixing effect is ensured.
Further, as shown in fig. 8, the insulating layer 140 includes a body portion 141 and a step portion 142 connected to the body portion 141, the body portion 141 and the step portion 142 are formed as a unitary structure and cover the lead 210, and the step portion 142 and the end plate 130 are formed as a unitary structure; the step portion 142 has a larger dimension in the radial direction of the lead 210 than the body portion 141 has in the radial direction of the lead 210.
In the present embodiment, by making the dimension of the stepped portion 142 in the radial direction of the lead 210 larger than the dimension of the body portion 141 in the radial direction of the lead 210, the bonding strength between the end plate 130 and the insulating layer 140 is enhanced, and the occurrence of breakage between the end plate 130 and the insulating layer 140 is prevented. As such, in producing the package body 1 of the present embodiment, the end plate 130, the insulating layer 140, and the pins 210 may be soldered as a whole into the internal PCB 220 to improve production efficiency.
The above-described molded integral structure may be formed by sintering a ceramic raw material, or by injection molding a plastic raw material, or by rubber extrusion molding, or the like. In this embodiment, the integrated structure is formed by injection molding, so that the production efficiency is improved, and the weight of the product is reduced.
Further, the insulating layer is made of an insulating material. The insulating material is a material that is not conductive at the allowable voltage. Such as common plastics, rubber, ceramics or insulating paint, etc. When an insulating paint is used, the insulating layer may be formed by coating.
Further, as shown in fig. 7, the package 1 further includes a component 230, and the component 230 is disposed in the cavity 112 and electrically connected to the internal PCB 220. Different types of components can be selected according to different specifications of the packaging body.
Further, as shown in fig. 1 to 10, the package case 100 is provided with a protrusion 120, and the protrusion 120 is used to abut against the external PCB 2, so that a space defined between the package case 100 and the external PCB 2 is communicated with an external space.
In this embodiment, by providing the protrusion 120 on the package case 100, when the package body 1 is electrically connected to the external PCB 2, the protrusion 120 is abutted against the external PCB 2, and a space is commonly defined between the package case 100 and the external PCB 2, and the space is communicated with the external space due to the presence of the protrusion 120, so that moist air is not easily collected between the package case 100 and the external PCB 2. When the environment is moist or the environment changes rapidly, air can flow between the space defined by the packaging shell 100 and the external PCB 2 and the external space, so that condensation water is not easy to gather to form, the reduction of the insulation performance of the surface of the external PCB 2 caused by the formation of the condensation water is prevented, and the failure of the circuit of the external PCB 2 is avoided.
The external space means a space other than the space defined between the package case 100 and the external PCB board 2, and air of the external space and air of the defined space are circulated.
Further, the protrusion 120 is provided on the cover 110 or the end plate 130.
Further, as shown in fig. 3, the protruding portion 120 is disposed at a bottom edge of the cover 110 corresponding to the opening 111. In this embodiment, the protruding portion 120 is disposed at the bottom edge of the cover 110, so that a space is formed between the bottom of the package housing 100 and the external PCB 2, and the occupation of the volume can be reduced in a limited space.
In one embodiment, the protrusion 120 is disposed on the end plate 130. The protrusion 120 may be provided on the end plate 130 according to different requirements. Further, the protrusion 120 is provided at an edge portion of the end plate 130. By providing the projection 120 at the edge portion of the end plate 130, the arrangement of the pins 210 is prevented from being affected.
Further, the protruding portion 120 may protrude from the package case 100 to a greater or lesser extent than the lead 210 protrudes from the package case 100. When the protruding degree of the protruding portion 120 is greater than that of the lead 210, the structure of the external PCB 2 needs to be modified, for example, the corresponding portion of the external PCB 2 is thickened, so that the connection between the lead 210 and the external PCB 2 is ensured, and the attachment between the package housing 100 and the external PCB 2 is prevented, but the cost is increased due to the modification of the structure of the external PCB 2. Therefore, in the present embodiment, as shown in fig. 4, the size of the protrusion 120 is smaller than the size of the portion of the lead 210 protruding from the end plate 130 in the direction of the lead 210. When the tip of the lead 210 is electrically connected to the external PCB 2, the protruding portion 120 abuts against the external PCB 2, which plays a role of positioning and bearing. When the protruding portion 120 abuts against the external PCB 2, the end of the lead 130 is embedded into the corresponding soldering position of the external PCB 2, so that the dummy solder is not caused by too much or too little embedding, and the protruding portion 120 plays a role of bearing the package housing 100 during soldering, so that soldering is easy to be performed.
Further, the protrusion 120 is formed as a unitary structure with the end plate 130 or the cover 130. In this embodiment, the protruding portion 120 and the end plate 130 or the cover body 110 are formed into an integral structure, which avoids the need to separately connect the protruding portion 120 to the end plate 130 or the cover body 110, and the protruding portion and the end plate 130 or the cover body 110 are formed at the same time during the manufacturing process, thereby improving the production efficiency. It is understood that forming the unitary structure includes being accomplished by an injection molding process or a sintering molding process.
Further, as shown in fig. 1 to 10, the cover 110 has a rectangular parallelepiped structure, and the protrusion 120 is disposed on the cover 110 and located at a corner of the bottom edge of the cover 110. In this embodiment, the cover 110 is configured as a cuboid structure to accommodate the structural requirement of the internal PCB board, and maximize the space enclosed by the cavity. In addition, the protruding portions 120 are disposed at the corners of the bottom edge of the cover 110, that is, in this embodiment, the number of the protruding portions 120 is four, and the protruding portions 120 are distributed at the corners of the bottom edge of the cover 110, so that a larger space is formed between adjacent protruding portions 120, so that air flows more easily, and aggregation of humid air is further avoided.
Further, in the present embodiment, the height of the protruding portion is 0.8 to 3.5mm. The height of the protrusion 120, which may be 0.8mm, 1.3mm, 1.9mm, 2.4mm, 2.7mm, 3.1mm or 3.5mm, is adjusted to ensure that formation of dew condensation water is prevented without taking up excessive volume.
Further, as shown in fig. 3, the protrusion 120 includes a first protrusion 121 and a second protrusion 122 connected to each other, and the first protrusion 121 and the second protrusion 122 are connected to corners of the bottom edge of the cover 110. In this embodiment, the protruding portion 120 is provided as the first protruding member 121 and the second protruding member 122, and the first protruding member 121 and the second protruding member 122 are intersected and arranged to be adapted to the corner of the bottom edge of the cover body 110, so when the package body 1 is mounted on the external PCB 2, the existence of the protruding portion 120 can ensure that the distances between the four corners of the cover body 110 and the external PCB 2 are consistent, that is, the distances between the package housing 100 and the external PCB 2 are consistent, so as to avoid the skew of the local package body 1. In addition, the protrusion 120 ensures the supporting effect of the package case 100 and also allows air circulation between the space defined between the package case 100 and the external PCB board 2 and the external space.
The invention also discloses a switch power supply module which comprises the package body 1.
The switch power supply module is used for carrying out modularized packaging on discrete components on the switch power supply, so that a module power supply with smaller volume and higher power density is formed. Because the switching power supply module comprises all the technical schemes of all the embodiments, the switching power supply module at least has all the beneficial effects brought by the technical schemes of the embodiments, and the description is omitted herein.
Further, reference may be made to a switching power supply module in the prior art, where the components include one or more of a transformer, an inductor, and an electrolytic capacitor.
The invention also discloses a PCB module, which comprises an external PCB2 and a switch power supply module electrically connected to the external PCB2, wherein the switch power supply module is the switch power supply module.
Because the present PCB module includes all the technical solutions of all the embodiments described above, at least the technical solutions of the embodiments described above have all the beneficial effects brought by the technical solutions of the embodiments described above, and will not be described in detail herein.
The invention also discloses an air conditioner which comprises the PCB module. The present embodiment adopts all the technical solutions of all the above embodiments, so at least has all the beneficial effects brought by the technical solutions of the above embodiments, and will not be described in detail herein.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. A package, the package comprising:
the packaging shell is provided with a containing cavity;
the inner PCB is arranged in the accommodating cavity; and
One end of the guide pin is electrically connected to the inner PCB, the other end of the guide pin penetrates through the penetrating part of the packaging shell and is used for being electrically connected with the outer PCB, and the guide pin and the penetrating part of the packaging shell are formed into an integrated structure;
The inner PCB and the penetrating part are arranged at the opposite ends of the packaging shell at intervals;
the packaging shell comprises an end plate and a cover body, the containing cavity is arranged in the cover body, the cover body is provided with an opening, the opening is communicated with the containing cavity, and the end plate is arranged at the opening to seal the containing cavity; the end plate is a penetrating part of the packaging shell; the guide pin penetrates through the end plate and is formed into an integrated structure with the end plate;
the packaging shell is provided with a protruding part, the size of the protruding part is smaller than that of the part of the guide pin protruding out of the end plate, and the protruding part is used for propping against the external PCB so as to enable a space defined between the packaging shell and the external PCB to be communicated with an external space; the convex part comprises a first convex part and a second convex part which are connected in an intersecting way, and the first convex part and the second convex part are connected at the corner of the bottom edge of the cover body.
2. The package of claim 1, wherein the portion of the lead corresponding to the cavity is covered with an insulating layer.
3. The package of claim 2, wherein the lead and the insulating layer are molded as a unitary structure.
4. The package of claim 1, wherein the portion of the lead corresponding to the cavity is covered with an insulating layer, and the insulating layer and the end plate are formed into an integral structure.
5. The package of claim 4, wherein the insulating layer comprises a body portion and a step portion connected to the body portion, the body portion and the step portion being molded as a unitary structure and encasing the lead, the step portion being molded as a unitary structure with the end plate; the step portion has a dimension along the radial direction of the needle that is greater than a dimension along the radial direction of the needle of the body portion.
6. The package according to any one of claims 2 to 5, wherein the insulating layer is made of an insulating material, the insulating material being plastic, rubber or insulating paint.
7. The package of claim 1, further comprising a component disposed within the cavity and electrically connected to the internal PCB.
8. A switching power supply module, characterized in that it comprises the package of any one of claims 1 to 7.
9. A PCB module, comprising an external PCB board and a switching power supply module electrically connected to the external PCB board, wherein the switching power supply module is the switching power supply module of claim 8.
10. An air conditioner comprising the PCB module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810887027.5A CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810887027.5A CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811412A CN108811412A (en) | 2018-11-13 |
| CN108811412B true CN108811412B (en) | 2024-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810887027.5A Active CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
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| CN (1) | CN108811412B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101329945A (en) * | 2007-06-22 | 2008-12-24 | 至美电器股份有限公司 | Electrolytic capacitor with circumscribe type pins |
| CN201820753U (en) * | 2010-07-19 | 2011-05-04 | 福州华虹智能科技开发有限公司 | Multi-chip encapsulation module for electronic equipments under coal mine |
| CN103515058A (en) * | 2013-09-09 | 2014-01-15 | 陕西长岭电子科技有限责任公司 | Isolation transformer for MIL-STD-1553B |
| CN203466176U (en) * | 2013-09-26 | 2014-03-05 | 深圳市矽旺半导体有限公司 | Novel packaging structure of IC |
| CN107613703A (en) * | 2017-07-18 | 2018-01-19 | 北方电子研究院安徽有限公司 | A kind of pot electronics circuit |
| CN207558783U (en) * | 2017-12-18 | 2018-06-29 | 芜湖美智空调设备有限公司 | Power module and air conditioner |
| CN208445892U (en) * | 2018-08-06 | 2019-01-29 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
-
2018
- 2018-08-06 CN CN201810887027.5A patent/CN108811412B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101329945A (en) * | 2007-06-22 | 2008-12-24 | 至美电器股份有限公司 | Electrolytic capacitor with circumscribe type pins |
| CN201820753U (en) * | 2010-07-19 | 2011-05-04 | 福州华虹智能科技开发有限公司 | Multi-chip encapsulation module for electronic equipments under coal mine |
| CN103515058A (en) * | 2013-09-09 | 2014-01-15 | 陕西长岭电子科技有限责任公司 | Isolation transformer for MIL-STD-1553B |
| CN203466176U (en) * | 2013-09-26 | 2014-03-05 | 深圳市矽旺半导体有限公司 | Novel packaging structure of IC |
| CN107613703A (en) * | 2017-07-18 | 2018-01-19 | 北方电子研究院安徽有限公司 | A kind of pot electronics circuit |
| CN207558783U (en) * | 2017-12-18 | 2018-06-29 | 芜湖美智空调设备有限公司 | Power module and air conditioner |
| CN208445892U (en) * | 2018-08-06 | 2019-01-29 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
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|---|---|
| CN108811412A (en) | 2018-11-13 |
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