CN211181815U - Electromagnetic coil structure and expansion valve - Google Patents
Electromagnetic coil structure and expansion valve Download PDFInfo
- Publication number
- CN211181815U CN211181815U CN201922249162.XU CN201922249162U CN211181815U CN 211181815 U CN211181815 U CN 211181815U CN 201922249162 U CN201922249162 U CN 201922249162U CN 211181815 U CN211181815 U CN 211181815U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mounting surface
- electromagnetic coil
- coil structure
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229920003023 plastic Polymers 0.000 claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 33
- 239000000084 colloidal system Substances 0.000 claims description 13
- 230000013011 mating Effects 0.000 claims description 12
- 238000004804 winding Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000012466 permeate Substances 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 210000003298 dental enamel Anatomy 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Landscapes
- Electromagnets (AREA)
Abstract
The utility model provides an electromagnetic coil structure and expansion valve. Wherein, the solenoid structure includes: the plastic packaging piece comprises a connecting part and a supporting part, the connecting part is provided with an installation surface, and the connecting part is used for being in inserting fit with the contact pin; the supporting part is arranged on the mounting surface, the end face, far away from the mounting surface, of the supporting part is a matching surface, and the matching surface is used for being abutted against the circuit board so that the circuit board and the mounting surface are arranged at intervals. The technical scheme of the utility model the poor problem of welding reliability between circuit board and the contact pin among the prior art has been solved.
Description
Technical Field
The utility model relates to a solenoid technical field particularly, relates to a solenoid structure and expansion valve.
Background
In the related art, the circuit board of the electromagnetic coil structure is attached to the plastic package part, and no gap exists between the circuit board and the plastic package part, so that when the pin and the circuit board are welded, solder cannot permeate to the other side of the circuit board, and poor welding reliability is caused.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide an electromagnetic coil structure and an expansion valve to solve the problem of poor reliability of welding between the circuit board and the contact pin in the prior art.
In order to achieve the above object, according to an aspect of the present invention, there is provided a solenoid structure including: the plastic packaging piece comprises a connecting part and a supporting part, the connecting part is provided with an installation surface, and the connecting part is used for being in inserting fit with the contact pin; the supporting part is arranged on the mounting surface, the end face, far away from the mounting surface, of the supporting part is a matching surface, and the matching surface is used for being abutted against the circuit board so that the circuit board and the mounting surface are arranged at intervals.
Further, the connecting portion include the circumference surface of being connected with the installation face, and circumference surface and supporting part are located the both sides of installation face respectively, are equipped with on the circumference surface to be the annular waterproof groove that sets up.
Further, a plurality of supporting parts are arranged on the mounting surface at intervals.
Further, the electromagnetic coil structure further includes: the winding part comprises a contact pin, the plastic package part is coated outside the winding part, the contact pin is in insertion fit with the connecting part, and the contact pin extends out of the mounting surface by a preset distance; the height of the support portion is less than a predetermined distance along the length direction of the pin.
Furthermore, the plurality of contact pins are arranged at intervals along the first direction; the two supporting parts are arranged at intervals along the first direction and are respectively positioned on two sides of the plurality of contact pins.
Further, the electromagnetic coil structure further includes: the circuit board is provided with a through hole, and the circuit board is sleeved on the contact pin through the through hole and is abutted against the matching surface; the circuit board is welded with the contact pin, and the solder permeates from one side of the circuit board to the other side of the circuit board through the via hole.
Furthermore, the mounting surface is a plane, the matching surface is a plane, the mounting surface is parallel to the matching surface, and the mounting surface is parallel to the circuit board.
Further, the electromagnetic coil structure further includes: and one end of the lead is connected with the circuit board, and the other end of the lead is used for being connected with an external structure.
Further, the electromagnetic coil structure further includes: the shell is connected with the plastic package part and covers the circuit board, and a filling cavity is formed between the shell and the plastic package part; the insulating colloid is filled in the filling cavity; and a filling gap is formed between the circuit board and the mounting surface, and the filling gap is filled with insulating colloid so that the circuit board is wrapped by the insulating colloid.
According to another aspect of the present invention, there is provided an expansion valve, comprising a solenoid structure, wherein the solenoid structure is the above-mentioned solenoid structure.
Use the technical scheme of the utility model, having optimized the structure of plastic-sealed piece, having set up connecting portion and supporting part, the fitting surface of supporting part and the interval setting between the installation face of connecting portion, the fitting surface of supporting part be used for with the circuit board butt to make circuit board and installation face interval set up. Therefore, when the pin and the circuit board are welded, the solder can permeate to the other side of the circuit board, and the welding reliability between the pin and the circuit board is improved.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 shows a schematic cross-sectional structural view of a solenoid structure according to an alternative embodiment of the present invention;
FIG. 2 shows an exploded schematic view of the solenoid structure of FIG. 1;
FIG. 3 shows an enlarged schematic view of the structure at A in FIG. 2;
fig. 4 is a schematic diagram showing an assembly structure of the plastic package, the pins and the circuit board of the solenoid structure of fig. 1.
Wherein the figures include the following reference numerals:
10. molding the part; 11. a connecting portion; 111. a mounting surface; 112. a circumferential surface; 113. a waterproof groove; 12. a support portion; 121. a mating surface; 20. a winding member; 21. inserting a pin; 30. a circuit board; 31. a via hole; 40. a lead wire; 50. a housing; 60. insulating colloid; 100. the gap is filled.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In order to solve the poor problem of welding reliability between the circuit board among the prior art and the contact pin, the utility model provides an electromagnetic coil structure and expansion valve.
As shown in fig. 1 to 4, the electromagnetic coil structure includes a plastic package 10, the plastic package 10 includes a connecting portion 11 and a supporting portion 12, the connecting portion 11 has a mounting surface 111, and the connecting portion 11 is used for being inserted and matched with a pin 21; the support portion 12 is provided on the mounting surface 111, an end surface of the support portion 12 away from the mounting surface 111 is a mating surface 121, and the mating surface 121 is configured to abut against the circuit board 30 so that the circuit board 30 is spaced apart from the mounting surface 111.
In the present embodiment, the structure of the plastic package 10 is optimized, the connection portion 11 and the support portion 12 are provided, the mating surface 121 of the support portion 12 and the mounting surface 111 of the connection portion 11 are spaced apart, and the mating surface 121 of the support portion 12 is configured to abut against the circuit board 30, so that the circuit board 30 and the mounting surface 111 are spaced apart. Thus, when the pin 21 and the circuit board 30 are soldered, solder can effectively permeate to the other side of the circuit board 30, so that the soldering reliability between the pin 21 and the circuit board 30 is improved, and the soldering quality of the electromagnetic coil structure is improved.
As shown in fig. 3, the connecting portion 11 includes a circumferential surface 112 connected to the mounting surface 111, the circumferential surface 112 and the supporting portion 12 are respectively located on both sides of the mounting surface 111, and a waterproof groove 113 provided in an annular shape is provided on the circumferential surface 112. In this way, the waterproof performance of the solenoid coil structure can be improved by providing the waterproof groove 113.
Specifically, the waterproof groove 113 can increase a bypassing route of water vapor, and prevent the water vapor from penetrating to the circuit board 30, thereby reducing the possibility of the circuit board 30 being affected with damp.
Alternatively, a plurality of support portions 12 are provided on the mounting surface 111 at intervals. In this way, by increasing the number of the supporting parts 12, the contact area between the supporting parts 12 and the circuit board 30 is increased, so that the circuit board 30 can be better supported, and the positioning accuracy of the circuit board 30 is improved.
In specific implementation, the number and positions of the supporting portions 12 can be flexibly set, and the circuit board 30 can be reliably supported only by ensuring that the supporting portions 12 do not interfere with the pins 21.
As shown in fig. 3 and 4, the electromagnetic coil structure further includes a winding part 20, the winding part 20 includes a pin 21, the plastic package 10 covers the winding part 20, the pin 21 is in plug-in fit with the connecting portion 11, and the pin 21 extends out of the mounting surface 111 by a predetermined distance; the height of the support portion 12 is less than a predetermined distance along the length of the pin 21. Thus, the interference between the mating surface 121 of the supporting portion 12 and the circuit board 30 is avoided, and the circuit board 30 is ensured to be smoothly sleeved on the contact pin 21 and abut against the mating surface 121.
Optionally, the winding component 20 includes a stator plate, a stator housing, a bobbin, and an enamel wire wound on the bobbin, and the outlet of the enamel wire is connected to the contact pin 21.
Alternatively, the connecting portion 11 and the supporting portion 12 of the plastic package 10 are integrally injection-molded, that is, a resin layer is coated outside the winding component 20 by an injection molding process to form an encapsulating layer, and at least a portion of the pin 21 is exposed to facilitate connection with the circuit board 30.
As shown in fig. 4, a plurality of pins 21 are arranged at intervals in a first direction; the two supporting portions 12 are spaced apart in the first direction and are respectively located at both sides of the plurality of pins 21. In this way, by providing two support portions 12 on both sides of the plurality of pins 21, reliable positioning and support of the wiring board 30 is ensured, thereby facilitating subsequent soldering. In the alternative embodiment shown in fig. 4 of the present application, the plastic package 10 is provided with only two supporting portions 12, which has the advantages of simple structure and low cost.
Alternatively, the shape of the supporting portion 12 may be flexibly set, and it is only necessary to ensure that the supporting portion 12 does not interfere with the contact pins 21, and the circuit board 30 can be reliably supported.
Alternatively, the cross-sectional shape of the support portion 12 in the direction perpendicular to the length direction of the pin 21 is triangular, circular, rectangular, or irregular.
In an alternative embodiment shown in fig. 4 of the present application, the support portion 12 is a rectangular parallelepiped structure.
As shown in fig. 3, the electromagnetic coil structure further includes a circuit board 30, the circuit board 30 has a through hole 31, and the circuit board 30 is sleeved on the contact pin 21 through the through hole 31 and abuts against the matching surface 121; the circuit board 30 is welded with the pins 21, and solder permeates from one side of the circuit board 30 to the other side of the circuit board 30 through the through holes 31, so that the welding quality of the pins 21 and the circuit board 30 is improved.
As shown in fig. 1, the mounting surface 111 is a plane, the mating surface 121 is a plane, the mounting surface 111 and the mating surface 121 are parallel, and the mounting surface 111 is parallel to the wiring board 30. Therefore, the preset distances of the plurality of pins 21 can be ensured to be equal during assembly, and the situation that a part of the pins 21 cannot be reliably welded with the circuit board 30 due to the deflection of the circuit board 30 is avoided.
As shown in fig. 1 and 2, the electromagnetic coil structure further includes a lead wire 40, one end of the lead wire 40 is connected to the circuit board 30, and the other end of the lead wire 40 is used for connection to an external structure.
In a specific implementation, the number of the leads 40 is multiple, and the multiple leads 40 are arranged in one-to-one correspondence with the multiple pins 21, so that the corresponding transmission of signals is realized.
In a specific implementation, the wiring board 30 is pre-provided with a lead hole for connecting the lead 40, and at least a portion of the lead 40 is inserted into the lead hole so that the lead 40 is connected to the pin 21 through the wiring board 30, thereby connecting the wiring board 30 to the winding member 20.
As shown in fig. 1 and fig. 2, the electromagnetic coil structure further includes a housing 50 and an insulating colloid 60, the housing 50 is connected with the plastic package 10 and covers the circuit board 30, a filling cavity is formed between the housing 50 and the plastic package 10, and the insulating colloid 60 is filled in the filling cavity; a filling gap 100 is formed between the circuit board 30 and the mounting surface 111, and the filling gap 100 is filled with an insulating colloid 60, so that the circuit board 30 is wrapped by the insulating colloid 60. In this way, the filling gap 100 is provided to cover the entire circuit board 30 with the insulating resin 60, thereby improving the insulating performance of the circuit board 30 and the insulating performance of the electromagnetic coil structure.
Optionally, the housing 50 and the plastic package 10 are made of plastics of different materials, in the cooling process after encapsulation, a small gap is easily generated between the two plastics of different materials due to different shrinkage rates, when the product is exposed in a humid environment, water vapor easily enters the filling cavity through the gap between the housing 50 and the plastic package 10 and permeates towards one side of the circuit board 30, so that the circuit board 30 is easily affected with damp, the service life of the circuit board 30 is affected, the arrangement of the waterproof groove 113 can increase the circuitous route of the water vapor, and the possibility that the circuit board 30 is affected with damp is reduced.
In specific implementation, the circuit board 30 and the pins 21 are connected together by soldering, the solder starts to be welded on one side of the circuit board 30 far away from the plastic package 10, and the solder can penetrate to the other side of the circuit board 30, namely one side of the circuit board 30 close to the plastic package 10, through the through holes 31 reserved on the circuit board 30, so that the welding quality of the product is improved; then the shell 50 and the plastic package 10 are connected together through ultrasonic welding, the circuit board 30 and the pins 21 are covered by the shell 50 and the plastic package 10, then the insulating colloid 60 is filled in a filling cavity enclosed by the shell 50 and the plastic package 10, and the insulating colloid 60 can wrap the circuit board 30 integrally, so that the insulating property of the product is improved.
Optionally, the insulating gel 60 is an epoxy gel.
Optionally, the housing 50 is an insulating housing.
The application also provides an expansion valve, which comprises an electromagnetic coil structure, wherein the electromagnetic coil structure is the electromagnetic coil structure. Because the electromagnetic coil structure that this application provided has advantages such as welding quality is good, insulating properties, waterproof performance are good to the performance of expansion valve has been promoted.
In the related art, the plastic package 10 includes a fastener, the fastener is disposed on the mounting surface 111, the circuit board 30 and the fastener are in snap fit, the fastener is required to be elastically deformed during the snap fit, the fastener is easily broken at an end portion, which results in difficulty in assembly and risk of easy damage to the plastic package 10, and after the snap fit, the contact area between the fastener and the circuit board 30 is small, and the fastener can be elastically deformed, which affects the connection reliability between the circuit board 30 and the plastic package 10; in addition, the clamping piece also has the problems of complex structure, complex mold design of the injection molding process and the like. This application directly supports the location to circuit board 30 through setting up supporting part 12, guarantees that circuit board 30 and installation face 111 interval set up, is favorable to reducing the manufacturing cost of solenoid structure, is favorable to promoting structural strength, quality, connection reliability and the life of solenoid structure.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electromagnetic coil structure, comprising:
the plastic package piece (10), the plastic package piece (10) comprises a connecting part (11) and a supporting part (12), the connecting part (11) is provided with a mounting surface (111), and the connecting part (11) is used for being in plug-in fit with a contact pin (21); the supporting part (12) is arranged on the mounting surface (111), the end face, far away from the mounting surface (111), of the supporting part (12) is a matching surface (121), and the matching surface (121) is used for being abutted against a circuit board (30) so that the circuit board (30) and the mounting surface (111) are arranged at intervals.
2. The electromagnetic coil structure according to claim 1, characterized in that the connecting portion (11) includes a circumferential surface (112) connected to the mounting surface (111), the circumferential surface (112) and the support portion (12) are respectively located on both sides of the mounting surface (111), and a waterproof groove (113) is provided on the circumferential surface (112) in an annular arrangement.
3. The electromagnetic coil structure according to claim 1, characterized in that a plurality of the support portions (12) are provided on the mounting surface (111) at intervals.
4. The electromagnetic coil structure according to claim 1, further comprising:
the winding component (20), the winding component (20) comprises the contact pin (21), the plastic package part (10) covers the outside of the winding component (20), the contact pin (21) is in plug fit with the connecting part (11), and the contact pin (21) extends out of the mounting surface (111) by a preset distance; the height of the supporting part (12) is smaller than the predetermined distance along the length direction of the insertion pin (21).
5. The electromagnetic coil structure according to claim 4, characterized in that a plurality of the pins (21) are arranged at intervals in a first direction; the two supporting parts (12) are arranged at intervals along the first direction and are respectively positioned on two sides of the plurality of inserting pins (21).
6. The electromagnetic coil structure according to claim 1, further comprising:
the circuit board (30), the said circuit board (30) has via holes (31), the said circuit board (30) is fitted over the said contact pin (21) and supported with the said mating surface (121) through the said via hole (31); the circuit board (30) is welded with the pins (21), and solder permeates from one side of the circuit board (30) to the other side of the circuit board (30) through the through holes (31).
7. The electromagnetic coil structure according to claim 6, characterized in that the mounting surface (111) is a plane, the mating surface (121) is a plane, the mounting surface (111) and the mating surface (121) are parallel, and the mounting surface (111) is parallel to the wiring board (30).
8. The electromagnetic coil structure according to claim 6, further comprising:
and one end of the lead (40) is connected with the circuit board (30), and the other end of the lead (40) is used for being connected with an external structure.
9. The electromagnetic coil structure according to claim 6, further comprising:
the shell (50) is connected with the plastic package part (10) and covers the circuit board (30), and a filling cavity is formed between the shell (50) and the plastic package part (10);
the insulating colloid (60) is filled in the filling cavity;
a filling gap (100) is formed between the circuit board (30) and the mounting surface (111), and the insulating colloid (60) is filled in the filling gap (100) so that the circuit board (30) is wrapped by the insulating colloid (60).
10. An expansion valve comprising a solenoid structure, wherein the solenoid structure is as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922249162.XU CN211181815U (en) | 2019-12-12 | 2019-12-12 | Electromagnetic coil structure and expansion valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922249162.XU CN211181815U (en) | 2019-12-12 | 2019-12-12 | Electromagnetic coil structure and expansion valve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211181815U true CN211181815U (en) | 2020-08-04 |
Family
ID=71808621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922249162.XU Ceased CN211181815U (en) | 2019-12-12 | 2019-12-12 | Electromagnetic coil structure and expansion valve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211181815U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021203925A1 (en) * | 2020-04-10 | 2021-10-14 | 浙江盾安人工环境股份有限公司 | Electronic coil and electronic expansion valve having same |
-
2019
- 2019-12-12 CN CN201922249162.XU patent/CN211181815U/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021203925A1 (en) * | 2020-04-10 | 2021-10-14 | 浙江盾安人工环境股份有限公司 | Electronic coil and electronic expansion valve having same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6861776B2 (en) | Stator structure of motor | |
| JPS63157649A (en) | Induction generator and manufacture of the same | |
| JP6343141B2 (en) | Reactor | |
| JP2008508732A (en) | Holder for electrical components | |
| US20170104272A1 (en) | Antenna device and manufacturing method of antenna device | |
| CN211181815U (en) | Electromagnetic coil structure and expansion valve | |
| US3046452A (en) | Agent | |
| JPH0393204A (en) | Bobbin body for magnetic component | |
| CN108831673A (en) | Electromagnetic coil | |
| CN112992464A (en) | Electromagnetic coil structure and expansion valve | |
| US20190378641A1 (en) | Inductor and inductor manufacturing method | |
| KR20070093904A (en) | A stator structure of motor | |
| JP6041666B2 (en) | RFID tag, RFID tag manufacturing method, mold | |
| CN111383827B (en) | Coil device | |
| CN210034603U (en) | Solenoid and have its solenoid valve | |
| CN210489987U (en) | Connector assembly | |
| JP3722985B2 (en) | Interrogator for non-contact mobile object identification device | |
| CN114391171A (en) | Resin molded solenoid coil and solenoid valve provided with resin molded solenoid coil | |
| CN220816720U (en) | Stator assembly with lead and electromagnetic valve | |
| CN209785680U (en) | Solenoid valve and coil thereof | |
| CN217824452U (en) | Plastic package stator structure and motor using same | |
| CN218351794U (en) | Electric connection assembly | |
| CN213064813U (en) | Conductive piece and valve body | |
| CN216849610U (en) | Electromagnetic coil | |
| CN219201873U (en) | Packaged leakage current sensor structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20230508 Decision number of declaring invalidation: 561021 Granted publication date: 20200804 |
|
| IW01 | Full invalidation of patent right |