CN103824821A - Plastically sealed and packaged switch power supply module and preparation method thereof - Google Patents
Plastically sealed and packaged switch power supply module and preparation method thereof Download PDFInfo
- Publication number
- CN103824821A CN103824821A CN201410086373.5A CN201410086373A CN103824821A CN 103824821 A CN103824821 A CN 103824821A CN 201410086373 A CN201410086373 A CN 201410086373A CN 103824821 A CN103824821 A CN 103824821A
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- wiring board
- switch power
- pad
- power module
- input
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a plastically sealed and packaged switch power supply module and a preparation method thereof. The plastically sealed and packaged switch power supply module is characterized in that the device comprises a circuit board, bonding pads, electronic components, leads, a plastic packaging body and input and output pins, wherein the bonding pads are arranged on the two side surfaces of the circuit board; the electronic components, the leads and the input and output pins are electrically communicated with the circuit board through the bonding pads; the circuit board, the electronic components and the leads are packaged into the interior of the plastic packaging body. The preparation method of the plastically sealed and packaged switch power supply module comprises the following steps: welding the electronic elements and the leads onto the circuit board, and then packaging with an injection molding technology; meanwhile, exposing the bonding pads of the switch power supply module for connecting the input and output pins, sealing all the electronic elements in the plastic packaging body, and then welding the input and output pins so as to form the plastically sealed and packaged switch power supply module. The switch power supply module disclosed by the invention has the advantages of good heat dissipation, high mechanical strength, high degree of assembling automation and good working stability.
Description
Technical field
The present invention relates to field of switch power, particularly switch power module of a kind of plastics enclosed package and preparation method thereof.
Background technology
As the energy supply device of electronic system, the stability of Switching Power Supply is most important, and the stability of Switching Power Supply comprises thermal stability, corrosion-resistant level, mechanical strength etc.Electronic component in conventional Switching Power Supply is exposed in air, dispels the heat inhomogeneous, and element is not corrosion-resistant, and mechanical strength is low.
Current many switch power modules adopt metal or plastic casing encapsulation; fill with Embedding Materials such as resins in portion space in the enclosure; only expose the input and output pin of module, shell can be protected inner wiring board and electronic component effectively, improves corrosion-resistant level and mechanical strength.Meanwhile, the conductive coefficient of inner Embedding Material can be adjusted according to demand, to improve the capacity of heat transmission of module.But because inner Embedding Material is thermoplastic, hot properties is bad, solid-state chance high temperature is easily out of shape, and even melts temperature when this module can not be born Reflow Soldering.
The companies such as current Linear have developed the small-power switching power-supply module of LGA encapsulation, and its wiring board is the wiring board of BT base material, and all devices are arranged on a face of wiring board, and another face of wiring board is exposed, the semiconductor packaging process of its encapsulation employing standard.Being limited in of this power module: work as complex circuit, and when device is many, all devices are arranged on to a face can make module volume become very large, be unfavorable for miniaturization, and heat is concentrated, heat radiation difficulty, and encapsulation is carried out for single wiring board mostly, this not only makes packaging efficiency low, has also increased the cost of encapsulation.
Summary of the invention
The object of this invention is to provide switch power module of a kind of plastics enclosed package and preparation method thereof, this device changes original packaged type and preparation method, make wiring board both sides all be fixed with electronic component and connector, not only increase the packing density of components and parts, also reduce the volume of Switching Power Supply, the encapsulation of employing thermosetting plastic, has improved heat dispersion greatly, thereby improves useful life and the operating efficiency of switch power module.
In order to reach above object, the technical solution used in the present invention is: a kind of switch power module of plastics enclosed package, it is characterized in that, this device comprises wiring board (1), pad (2), electronic component (3), wire (4), plastic packaging body (5) and input and output pin (6), described pad (2) is installed on two sides of wiring board (1), described electronic component (3), wire (4), input and output pin (6) are by pad (2) and wiring board (1) electrical communication, described plastic packaging body (5) is made up of upper injection molding body (501) and lower injection molding body (502), wiring board (1) is arranged between injection molding body (501) and lower injection molding body (502), the pad (2) of wiring board (1) top panel, electronic component (3), wire (4) is all encapsulated in the inside of injection molding body (501), the part pad (2) of wiring board (1) lower panel, electronic component (3), wire (4) is encapsulated in the inside of lower injection molding body (502), expose on wiring board (1) lower panel for connecting the pad (2) of input and output pin (6), described input and output pin (6) is connected in the pad (2) exposing.
The edge of described electronic component, connector is no more than the edge of wiring board.
Described input/output pads surface is zinc-plated surface, or gold-plated surface, or silver-plated surface.
Described input and output pin is cuboid metal derby, or cylindrical metal, or " L " shape metal derby.
Described wiring board (1) by resin pottery or silicon make.
A preparation method for the switch power module of plastics enclosed package, is characterized in that:
Step 1: pad, electronic component, wire and connector are assembled in the circuit board, be installed on the two ends of single wiring board downside for connecting the pad of input and output pin, several wiring boards that welded electronic device are lined up array;
Step 2: will stick adhesive tape for the pad that connects input and output pin on wiring board, and the platform of the pad alignment lower mold half for connecting input and output pin is fixed, after fixing, install half mold, upper mold half and lower mold half mould are closed, then carry out injection moulding;
Step 3: remove mould after injection moulding completes, adopt the method for machine cuts or laser cutting to separate switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at wiring board downside two ends, completes the plastics enclosed package of switch power module.
Described injection mold is upper mold half and lower mold half, upper mold half is inverted u shape, lower mold half is provided with corresponding with wiring board array quantity for supporting the platform of wiring board, and the sidewall of lower mold half is than the side thickness of upper mold half, and the sidewall ledge of lower mold half is used for supporting wiring board.
Described injected plastics material is thermoset plastics.
The position of platform of described lower mold half is just to the pad for connecting input and output pin.
Beneficial effect of the present invention: (1) the present invention adopts the plastics of thermal conductivity as encapsulating material, thus the thermal diffusivity of switch power module improved, and the totally-enclosed encapsulation of this device employing, good operating stability, and module mechanical strength after injection mo(u)lding is high.
(2) the present invention makes somebody a mere figurehead pcb board in encapsulating housing, thereby can make the two-sided of pcb board can place dissipative cell, not only can increase the packing density of components and parts, reduces volume, is also more conducive to the heat dissipation design of power module, improves stability.
(3) the present invention adopts semiconductor packaging process, and the temperature while making switch power module to bear Reflow Soldering is convenient to the automatic welding of module.
(4) the present invention adopts array injection molding packaging to replace original single injection molding packaging, after injection moulding completes, cuts into independent switch power module, and this has not only improved the production efficiency of injection molding packaging, has also saved packaging cost.
(5) lower mold half of the present invention is provided with platform, not only plays the effect of supporting wiring board, has also protected pad not to be packaged into injection molding body the inside, and pad just can be out exposed, so that the welding of pin.
Accompanying drawing explanation
Fig. 1 is the vertical view of wiring board.
Fig. 2 is the structural representation of wiring board.
Fig. 3 is the structural representation of single power module.
Fig. 4 is the structural representation with the power module of " L " shape pin.
Fig. 5 is the structural representation of wiring board array.
Fig. 6 is the structural representation of injection mold.
Fig. 7 is the structural representation of the power module array after injection moulding completes.
Be expressed as at the numerical reference described in Figure of description: 1, wiring board; 2, pad; 3, electronic component; 4, wire; 5, plastic packaging body; 501, upper injection molding body; 502, lower injection molding body; 6, input and output pin; 7, upper mold half; 8, platform; 9, lower mold half; 10, line of cut.
Embodiment
In order to make those skilled in the art understand better technical scheme of the present invention, describe the present invention below in conjunction with accompanying drawing, the description of this part is only exemplary and explanatory, should not have any restriction to protection scope of the present invention.
Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, a kind of switch power module of plastics enclosed package, this device comprises wiring board 1, pad 2, electronic component 3, wire 4, plastic packaging body 5 and input and output pin 6.Pad 2 is installed on two sides of wiring board 1, and electronic component 3, wire 4, input and output pin 6 are by pad 2 and wiring board 1 electrical communication.
Referring to Fig. 4, Fig. 5, Fig. 6, Fig. 7, the preparation method of the switch power module of plastics enclosed package is:
Step 1: pad, electronic component, wire and connector are assembled in the circuit board, be installed on the two ends of single wiring board downside for connecting the pad of input and output pin, 4 wiring boards that welded electronic device are lined up to array.
Step 2: will stick adhesive tape for the pad that connects input and output pin on wiring board, and the platform of the pad alignment lower mold half for connecting input and output pin is fixed, after fixing, install half mold, upper mold half and lower mold half mould are closed, then adopt thermosets to carry out injection moulding.
Step 3: remove mould after injection moulding completes, adopt the method for machine cuts or laser cutting to separate switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at wiring board downside two ends, completes the plastics enclosed package of switch power module.
Injection mold is upper mold half 7 and lower mold half 9, upper mold half 7 is inverted u shape, lower mold half 9 is provided with corresponding with wiring board array quantity for supporting the platform 8 of wiring board, the sidewall of lower mold half 9 is than the side thickness of upper mold half 7, and the sidewall ledge of lower mold half 9 is used for supporting wiring board.
Platform 8 positions of lower mold half 9 are just to the pad for connecting input and output pin, and owing to there being platform, pad just can not be packaged into injection molding body the inside, and pad just can be out exposed, so that the welding of pin.
In the time of actual design, should consider according to aspects such as wiring board size, Injection Mold Design requirement and costs the quantity of wiring board in appropriate design wiring board array.
Applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above example is just for helping to understand method of the present invention and core concept thereof.The above is only the preferred embodiment of the present invention, should be understood that, due to the finiteness of literal expression, and objectively there is unlimited concrete structure, for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvement, retouching or variation, also above-mentioned technical characterictic can be combined by rights; These improve retouching, change or combination, or without improving, the design of invention and technical scheme are directly applied to other occasion, all should be considered as protection scope of the present invention.
Claims (9)
1. a switch power module for plastics enclosed package, is characterized in that, this device comprises wiring board (1), pad (2), electronic component (3), wire (4), plastic packaging body (5) and input and output pin (6), described pad (2) is installed on two sides of wiring board (1), described electronic component (3), wire (4), input and output pin (6) are by pad (2) and wiring board (1) electrical communication, described plastic packaging body (5) is made up of upper injection molding body (501) and lower injection molding body (502), wiring board (1) is arranged between injection molding body (501) and lower injection molding body (502), the pad (2) of wiring board (1) top panel, electronic component (3), wire (4) is all encapsulated in the inside of injection molding body (501), the part pad (2) of wiring board (1) lower panel, electronic component (3), wire (4) is encapsulated in the inside of lower injection molding body (502), expose on wiring board (1) lower panel for connecting the pad (2) of input and output pin (6), described input and output pin (6) is connected in the pad (2) exposing.
2. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that: the edge of described electronic component (3) is no more than the edge of wiring board (1).
3. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described pad (2) surface is zinc-plated surface, or gold-plated surface, or silver-plated surface.
4. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described input and output pin (6) is cuboid metal derby, or cylindrical metal, or " L " shape metal derby.
5. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described wiring board (1) by resin pottery or silicon make.
6. according to the preparation method of the switch power module of any one plastics enclosed package described in claim 1-5, it is characterized in that:
Step 1: pad, electronic component, wire and connector are assembled in the circuit board, be installed on the two ends of single wiring board downside for connecting the pad of input and output pin, the wiring board that several have been welded to electronic device is lined up array;
Step 2: will stick adhesive tape for the pad that connects input and output pin on wiring board, and the platform of the pad alignment lower mold half for connecting input and output pin is fixed, after fixing, install half mold, after upper mold half and lower mold half mould are closed, then carry out injection moulding;
Step 3: remove mould after injection moulding completes, adopt the method for machine cuts or laser cutting to separate switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at the wiring board downside two ends of single switch power module, completes the plastics enclosed package of switch power module.
7. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 6, it is characterized in that, described injection mold is upper mold half and lower mold half, upper mold half is inverted u shape, lower mold half is provided with corresponding with wiring board array quantity for supporting the platform of wiring board, the sidewall of lower mold half is than the side thickness of upper mold half, and the sidewall ledge of lower mold half is used for supporting wiring board.
8. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 6, is characterized in that, described injected plastics material is thermoset plastics.
9. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 6, is characterized in that, the position of platform of described lower mold half is just to the pad for connecting input and output pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086373.5A CN103824821B (en) | 2014-03-11 | 2014-03-11 | Switch power module of a kind of plastics enclosed package and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410086373.5A CN103824821B (en) | 2014-03-11 | 2014-03-11 | Switch power module of a kind of plastics enclosed package and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN103824821A true CN103824821A (en) | 2014-05-28 |
| CN103824821B CN103824821B (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410086373.5A Active CN103824821B (en) | 2014-03-11 | 2014-03-11 | Switch power module of a kind of plastics enclosed package and preparation method thereof |
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| Country | Link |
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| CN (1) | CN103824821B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105225971A (en) * | 2014-06-27 | 2016-01-06 | 三菱电机株式会社 | The manufacture method of semiconductor device |
| WO2022021094A1 (en) * | 2020-07-28 | 2022-02-03 | 华为技术有限公司 | Power module, and preparation mold and apparatus |
| WO2022042584A1 (en) * | 2020-08-25 | 2022-03-03 | 华为技术有限公司 | Encapsulation module and electronic device |
| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105225971A (en) * | 2014-06-27 | 2016-01-06 | 三菱电机株式会社 | The manufacture method of semiconductor device |
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| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103824821B (en) | 2016-04-06 |
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