CN108811412A - Packaging body, switch power module, PCB modules and air conditioner - Google Patents
Packaging body, switch power module, PCB modules and air conditioner Download PDFInfo
- Publication number
- CN108811412A CN108811412A CN201810887027.5A CN201810887027A CN108811412A CN 108811412 A CN108811412 A CN 108811412A CN 201810887027 A CN201810887027 A CN 201810887027A CN 108811412 A CN108811412 A CN 108811412A
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- Prior art keywords
- draw pin
- packaging body
- package casing
- vessel
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 239000011810 insulating material Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- XBVSGJGMWSKAKL-UHFFFAOYSA-N 1,3,5-trichloro-2-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=CC=2Cl)Cl)=C1 XBVSGJGMWSKAKL-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010070 extrusion (rubber) Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 238000005245 sintering Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention discloses a kind of packaging body, switch power module, PCB modules and air conditioner.Wherein, which includes package casing, which is equipped with vessel；Internal PCB, the Internal PCB are set in the vessel；And draw pin；One end of the draw pin is electrically connected to the Internal PCB, and the other end runs through position through the package casing, and for being electrically connected with external pcb board, the draw pin is molded as one with the package casing through position.Technical solution of the present invention is by the way that draw pin and package casing to be molded as one, to ensure the spacing of draw pin.I.e., Internal PCB is set in package casing, component is electrically connected to Internal PCB, Internal PCB is connected with draw pin, draw pin is electrically connected through the package casing with external pcb board, through package casing and being molded as one with package casing, package casing limits draw pin and fixes draw pin, avoids draw pin from one end to the other end due to vacantly apart from long and the variation of position occurs.
Description
Technical field
The present invention relates to electronic component encapsulation technology field, more particularly to a kind of packaging body, switch power module, PCB
Module and air conditioner.
Background technology
Each discrete component is carried out modularized encapsulation by packaging body, to form the higher mould of volume smaller, power density
Block.For example, being equipped with Internal PCB in packaging body, component is soldered on Internal PCB, and internal PCB is electrically connected to by draw pin
External pcb board, is electrically connected with external circuit, but the draw pin of packaging body in the prior art is not easy to be soldered to outside
In pcb board.
Invention content
The main object of the present invention is to provide a kind of packaging body, it is intended to which the draw pin for solving packaging body in the prior art is not easy to
The problem of being soldered to external pcb board.
To achieve the above object, the invention discloses a kind of packaging body, the packaging body includes：
Package casing, the package casing are equipped with vessel；
Internal PCB, the Internal PCB are set in the vessel；And
One end of draw pin, the draw pin is electrically connected to the Internal PCB, and the other end runs through through the package casing
Position, for being electrically connected with external pcb board, the draw pin is molded as one structure with the package casing through position.
Optionally, the package casing includes end plate and cover body, and the vessel is set in the cover body, and the cover body is equipped with
Opening, the opening are connected to the vessel, and the end plate is set to the opening to block the vessel, and the end plate is described
Package casing runs through position；The Internal PCB be set to the vessel in, the draw pin through the end plate and with the end
Sheet metal forming is structure as a whole, for being electrically connected with external pcb board.
Optionally, draw pin position corresponding with the vessel is coated with insulating layer.
Optionally, the draw pin and the insulating layer are molded as one structure.
Optionally, draw pin position corresponding with the vessel is coated with insulating layer, the insulating layer and the end plate
It is molded as one structure.
Optionally, the insulating layer includes body part and the stage portion that is connect with the body part, the body part and institute
It states stage portion to be molded as one structure and coat the draw pin, the stage portion is molded as one structure with the end plate；It is described
Stage portion is more than radial size of the body part along the draw pin along the radial size of the draw pin.
Optionally, the insulating layer is prepared by insulating materials；
Or, the insulating layer is prepared by insulating materials, the insulating materials is plastics, rubber or coatings.
Optionally, the packaging body further includes component, and the component is set in the vessel, and is electrically connected to described
Internal PCB.
The invention also discloses a kind of switch power module, the switch power module includes packaging body as described above.
The invention also discloses a kind of PCB modules, the PCB modules include external pcb board and are electrically connected to exterior PC B
Switch power module on plate, the switch power module are switch power module as described above.
The invention also discloses a kind of PCB modules, the PCB modules include external pcb board and are electrically connected to exterior PC B
Switch power module on plate, the switch power module are switch power module as described above.
Technical solution of the present invention by draw pin and package casing by being molded as one structure, to ensure the spacing of draw pin.Tool
Body is that Internal PCB is set in package casing, and component is electrically connected on Internal PCB, and Internal PCB is connected with draw pin,
Draw pin is electrically connected through the package casing with external pcb board, and draw pin through package casing and is molded as one knot with package casing
Structure, package casing form limit to draw pin and fix, ensure that the distance between each draw pin, avoid draw pin from one end to the other end
Due to vacantly apart from long and the variation of position occurs.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is that packaging body is installed on exterior PC B plate structure schematic diagrams；
Fig. 2 is packaging body stereogram；
Fig. 3 is packaging body stereogram (another visual angle)；
Fig. 4 is packaging body front view；
Fig. 5 is package body structure schematic diagram；
Fig. 6 is packaging body exploded view；
Fig. 7 is packaging body exploded view；
Fig. 8 is draw pin, insulating layer and tip plate configurations schematic diagram；
Fig. 9 is cover body stereogram；
Figure 10 is cover body front view.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 1 | Packaging body | 122 | Second protruding part |
| 2 | External pcb board | 130 | End plate |
| 100 | Package casing | 140 | Insulating layer |
| 110 | Cover body | 141 | Body part |
| 111 | It is open | 142 | Stage portion |
| 112 | Vessel | 210 | Draw pin |
| 120 | Protrusion | 220 | Internal PCB |
| 121 | First protruding part | 230 | Component |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining relative position relation, motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. shall be understood in a broad sense,
For example, " fixation " may be a fixed connection, it may be a detachable connection, or integral；It can be mechanical connection, can also be
Electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary the connection inside two elements or two
The interaction relationship of a element, unless otherwise restricted clearly.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and should not be understood as
It indicates or implies its relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment
Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical solution
Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not the present invention claims guarantor
Within the scope of shield.
The present invention proposes a kind of packaging body.
As shown in Figures 1 to 10, in the present embodiment, the packaging body 1 includes：
Package casing 100, the package casing 100 are equipped with vessel 112；
Internal PCB 220, the Internal PCB 220 are set in the vessel 112；And
One end of draw pin 210, the draw pin 210 is electrically connected to the Internal PCB 220, and the other end runs through the encapsulation
Shell 100 runs through position, for being electrically connected with external pcb board 2, the through-Penetration portion of the draw pin 210 and the package casing 100
Position is molded as one structure.
In the present embodiment, Internal PCB 220 is encapsulated by the packaging body 1 by package casing 100, the encapsulation
Shell 100 plays the effects that installation, fixation, sealing, protection.The Internal PCB is internal for being electrically connected each component 230
Pcb board 220 is electrically connected with draw pin 210, which runs through the package casing 100, for being electrically connected to external pcb board 2,
Realize the connection of the circuit and external circuit inside packaging body 1.
In the prior art, draw pin 210 is directly exposed from package casing 100, therefore one end of draw pin 210 is (with Internal PCB
The ends of 220 electrical connections) to hanging apart from long, the appearance of each draw pin 210 of the other end (end be electrically connected with external pcb board 2)
It is vulnerable to the variation for touching and occurring relative position, for packaging body so when installation is to external pcb board 2, draw pin 210 can not
The welding region of alignment outside pcb board 2 very well, leads to welding difficulty.Therefore in the present embodiment, draw pin 210 is run through into the envelope
Casing 100, and draw pin 210 and package casing 100 are molded as one structure through position, therefore the through-Penetration portion potential energy is fixed
The relative position of each draw pin 210 is prevented due to vacantly apart from excessive and the relative position between each draw pin 210 is caused to become
Change, to facilitate packaging body 1 to be soldered in external pcb board 2.It is described through position be the structure combined with draw pin 220, can be with
Individually separated from package casing 100, it is easy to produce to be convenient to place Internal PCB 220 in vessel 112.
At work, 1 inside of packaging body can give off heat the packaging body 1, therefore the material of the package casing 100 is chosen as
Ambroin, ceramics of high heat conduction etc..
The Internal PCB 220 is set in the vessel 112, can be fixed on by glue in vessel 112, can also
It is realized and is fixed by the cavity wall of Internal PCB 220 and vessel 112 interference fit, the present embodiment does not limit.External pcb board 2 is
The carrier of external component, packaging body 1 can be electrically connected to by draw pin 210 on external pcb board 2.
The draw pin 210 and the package casing 110 through position be molded as one structure can by injection molding or
Sinter molding.
Electrical connection as described above, to those skilled in the art, being welded by tin cream or other welding materials is
A kind of method of relatively easy realization, similarly hereinafter.
Further, as shown in Fig. 3, Fig. 6 and Fig. 7, the package casing 100 includes end plate 130 and cover body 110, described
Vessel 112 is set in the cover body 110, and the cover body 110 is equipped with opening 111, described open 111 and is connected to the vessel 112,
The end plate 130 is set to described open 111 to block the vessel 112, and the end plate 130 is passing through for the package casing 100
Wear position；The Internal PCB 220 be set to the vessel 112 in, the draw pin 210 through the end plate 130 and with the end
Plate 130 is molded as one structure, for being connect with external pcb board electricity 2.
It that is to say, the end plate 130 is through position.In the present embodiment, the cover body 110 forms opening 111, is convenient for
Each component is placed, the cover body 110 and the end plate 130 are combined forms protection to the component being placed in vessel 112 jointly.
The end plate 130 be set to described open 111, it is to be understood that the end plate 130 can adhesive bonding by way of with
The bonding of the cover body 110 blocks the vessel 112 to realize, or in 1 encapsulation process of packaging body, in the vessel 112
Embedding Material is perfused by elder generation in interior perfusion Embedding Material in cover body 110, can be with Embedding Material knot when lid sets end plate 130
It closes, it can fixed charge method end plate 130 after potting material cure；Alternatively, running through due to the draw pin 210 and the package casing 100
Position is molded as one structure, and the draw pin 210 is welded on Internal PCB 220, when perfusion Embedding Material in cover body 110,
Internal PCB 220 and draw pin 210 realize that fixation namely end plate 130 also achieve fixation.Embedding Material can be polyurethane, silicon
Glue, epoxy resin.
Further, the position corresponding with the vessel 112 of the draw pin 210 is coated with insulating layer 140.Work as package casing
When 100 encapsulation component 230, since the inner space of package casing 100 is limited, work as the position of draw pin 210 and component 230
Set too close to when, in 1 manufacturing process of packaging body, which is easy to touch component 230, so as to cause short circuit
Occur.Therefore, as shown in Figure 7 and Figure 8, by being coated with insulating layer at the position corresponding with the vessel 112 of the draw pin 210
140, even if when draw pin 210 touches component 230, due to there is the presence of insulating layer 140, also it has been avoided that the hair of short circuit
It is raw, to improve product yield.It is understood that as described above, the setting of the insulating layer 140 is in order to avoid draw pin
210 touch component 230 and cause short circuit, therefore the position corresponding with the vessel 112 of draw pin 210 is easy and component
230 positions touched, as long as the position coats insulating layer 140, you can prevent the generation of short circuit phenomenon.
The draw pin 210 can be mutually nested with the insulating layer 140.That is, insulating layer 140 is first prepared, the insulating layer
140 have tubular, and then draw pin 210 is embedded in the insulating layer 140.In order to further increase production efficiency, such as Fig. 6 to figure
Shown in 8, the draw pin 210 is molded as one structure with the insulating layer 140.By being molded as one structure, to improve production
Efficiency.This is molded as one structure and can refer to forming technique in the prior art, for example, the insulating materials of melting (is prepared exhausted
The material of edge layer 140) it pours in mold, draw pin 210 has been placed in the mold, and insulating layer 140 can be formed after being cooled to
It is molded as one structure with draw pin 210；It is one by sinter molding alternatively, by the blank to be sintered in 210 outer cladding of draw pin
Body structure.It is molded as one structure by draw pin 210 and the insulating layer 140, moreover it is possible to which the bond strength for improving the two avoids drawing
Needle 210 is deviate from from the insulating layer 140.
Further, as shown in Figure 6 to 8, the position corresponding with the vessel 112 of the draw pin 210 is coated with insulation
Layer 140, the insulating layer 140 are molded as one structure with the end plate 130.In the present embodiment, the insulating layer 140 and institute
State that end plate 130 is molded as one the structure namely insulating layer 140, end plate 130 and 210 three of draw pin is molded as one structure,
To improve production efficiency.Secondly, three is molded as one between structure namely three and combines closely, and prevents draw pin 210 and end plate
130 junction is cracked and loosens, and ensures fixed effect.
Further, as shown in figure 8, the insulating layer 140 includes body part 141 and connect with the body part 141
Stage portion 142, the body part 141 and the stage portion 142 are molded as one structure and coat the draw pin 210, described
Rank portion 142 is molded as one structure with the end plate 130；The stage portion 142 is more than along the radial size of the draw pin 210
Radial size of the body part 141 along the draw pin 210.
In the present embodiment, the ontology is more than by the radial size by the stage portion 142 along the draw pin 210
Portion 141 enhances the bond strength between end plate 130 and insulating layer 140, anti-not-go-end along the radial size of the draw pin 210
It is broken between plate 130 and insulating layer 140.It also just so, can be by end plate when producing the packaging body 1 of the present embodiment
130, insulating layer 140 and draw pin 210 are soldered to as a whole in Internal PCB 220, to improve production efficiency.
It is molded as one structure as described above, can be noted by ceramic raw material sinter molding, or by plastic raw materials
It is moulding at or passing through rubber extrusion forming etc..In the present embodiment, it is described be molded as one structure be by Shooting Technique at
Type improves production efficiency, reduces the weight of product.
Further, the insulating layer is prepared by insulating materials.The insulating materials is not led in the case where allowing voltage
The material of electricity.Such as common plastics, rubber, ceramics or coatings etc..When using coatings when, can by coating to
Form insulating layer.
Further, as shown in fig. 7, the packaging body 1 further includes component 230, the component 230 is set to the appearance
In chamber 112 and it is electrically connected to the Internal PCB 220.Different types of first device may be selected according to the difference of the specification of packaging body
Part.
Further, as shown in Figures 1 to 10, the package casing 100 is equipped with protrusion 120, and the protrusion 120 is used
It offsets in external pcb board 2, so that space and free surrounding space defined by between the package casing 100 and external pcb board 2
Connection.
In the present embodiment, by the way that protrusion 120 is arranged on package casing 100, when packaging body 1 is electrically connected to outside
When pcb board 2, the protrusion 120 offsets with external pcb board 2, is limited jointly between package casing 100 and external pcb board 2
Space, and the space is connected to due to the presence of protrusion 120 with free surrounding space, wet air is not easy to be gathered in envelope
Between casing 100 and external pcb board 2.When encountering moist environment or quick temperature changing environment, air can be in package casing
100 and external pcb board 2 defined by flowed between space and free surrounding space, it is not easy to aggregation and form condensation water, to prevent
The decline of 2 surface insulation performance of external pcb board, avoids the failure of 2 circuit of external pcb board caused by the formation of condensation water.
The free surrounding space mean the space defined by between package casing 100 and external pcb board 2 in addition to space,
Realize the air circulation in air space with defined by of free surrounding space.
Further, the protrusion 120 is set to the cover body 110 or the end plate 130.
Further, as shown in figure 3, the protrusion 120 is set to the bottom of the open 111 corresponding cover body 110
Edge.In the present embodiment, by protrusion 120 be set to the cover body 110 root edge, in order to the bottom of package casing 100 with
Space is formed between external pcb board 2, and can reduce the occupancy to volume in a limited space.
In one embodiment, the protrusion 120 is set to the end plate 130.It according to different requirements, also can be by protrusion
120 are set to the end plate 130.Further, the protrusion 120 is set to the edge of the end plate 130.By that will protrude
Portion 120 is set to the edge of end plate 130, and the arrangement to draw pin 210 is avoided to impact.
Further, the protrusion 120 protrude the package casing 100 degree can be more than or less than draw pin 210 it is convex
Go out the degree of the package casing 100.When the degree that protrusion 120 protrudes is more than the degree that draw pin 210 is protruded, it is necessary to right
The structure of external pcb board 2 is transformed, such as 2 corresponding position of external pcb board is thickened, to ensure draw pin 210 and outside
The connection of pcb board 2 can also prevent being bonded for package casing 100 and outside pcb board 2 simultaneously, but since this mode is related to pair
External pcb board 2 carries out the transformation of structure, increases cost.Therefore, in the present embodiment, as shown in figure 4, along the draw pin 210
Direction, the size of the protrusion 120 is less than the size that the draw pin 210 protrudes from the position of the end plate 130.Work as draw pin
When 210 end is electrically connected to external pcb board 2, protrusion 120 offsets with external pcb board 2, plays the work of positioning and carrying
With.When the protrusion 120 offsets with external pcb board 2, the end of draw pin 130 is embedded in the 2 corresponding welding of external pcb board
Position will not be embedded in excessive or embedded very few and lead to rosin joint, and in the welding process, protrusion 120 plays carrying encapsulation
The effect of shell 100 so that welding is easy to carry out.
Further, the protrusion 120 is molded as one structure with the end plate 130 or the cover body 130.In this reality
It applies in example, protrusion 120 and end plate 130 or cover body 110 is molded as one structure, avoid the need for individually connecting protrusion 120
It is connected to end plate 130 or cover body 110, molding obtains simultaneously in 110 manufacturing process of end plate 130 or cover body, improves production efficiency.It can
With understanding, it includes being realized by injection molding process realization or sintering forming process to be molded as one structure.
Further, as shown in Figures 1 to 10, the cover body 110 is rectangular parallelepiped structure, and the protrusion 120 is set to institute
State cover body 110, and the corner of the root edge positioned at the cover body 110.In the present embodiment, cover body 110 is set to cuboid
Structure maximally utilizes the space that vessel is surrounded to adapt to the topology requirement of Internal PCB.In addition protrusion 120 is set to
The corner of the root edge of the cover body 110, namely in the present embodiment, the quantity of the protrusion 120 is four, is distributed in cover body
The corner of 110 root edge has larger space between adjacent protrusion 120 so that and air is easier to flow, into
One step avoids the aggregation of humid air.
Further, in the present embodiment, the height of the protrusion is 0.8~3.5mm.By adjusting the protrusion
120 height, to ensure to prevent the formation of condensation water under the premise of being not take up excessive volume, this highly can be 0.8mm,
1.3mm, 1.9mm, 2.4mm, 2.7mm, 3.1mm or 3.5mm.
Further, as shown in figure 3, the protrusion 120 includes the first protruding part 121 and second protrusion of intersection connection
Part 122, first protruding part 121 and second protruding part 122 are connected to the corner of the root edge of the cover body 110.?
It is in the first protruding part 121 and the second protruding part 122, the first protruding part 121 and second by the setting of protrusion 120 in the present embodiment
The intersection setting of protruding part 122, is adapted with the corner of the root edge of cover body 110, therefore when packaging body 1 is installed on external pcb board 2
When, the presence of the protrusion 120 can guarantee that four corners of cover body 110 are consistent at a distance from external pcb board 2, namely encapsulation
Shell 100 is consistent at a distance from external pcb board 2, avoids the crooked of local packaging body 1.In addition, the protrusion 120 is ensureing to seal
While 100 support effect of casing, can take into account between package casing 100 and external pcb board 2 defined by space and outside it is empty
Between between air circulation.
The invention also discloses a kind of switch power module, the switch power module includes packaging body 1 as described above.
Switch power module is that the discrete component in Switching Power Supply is carried out modularized encapsulation, to form volume more
Small, the higher modular power source of power density.Since this switch power module includes whole skills of all embodiments as described above
Art scheme, therefore at least all advantageous effects caused by the technical solution with embodiment as described above, herein no longer one by one
It repeats.
Further, can refer to switch power module in the prior art, set by component include transformer, electricity
It is one or more in sense, electrolytic capacitor.
The invention also discloses a kind of PCB modules, the PCB modules include external pcb board 2 and are electrically connected to outside
Switch power module on pcb board 2, the switch power module are switch power module as described above.
Since this PCB modules include whole technical solutions of all embodiments as described above, at least have as above
All advantageous effects caused by the technical solution of the embodiment, this is no longer going to repeat them.
The invention also discloses a kind of air conditioner, the air conditioner includes PCB modules as described above.The present embodiment uses
Whole technical solutions of above-mentioned all embodiments, therefore at least all caused by the technical solution with above-described embodiment have
Beneficial effect, this is no longer going to repeat them.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
In the scope of patent protection that other related technical areas are included in the present invention.
Claims (11)
1. a kind of packaging body, which is characterized in that the packaging body includes：
Package casing, the package casing are equipped with vessel；
Internal PCB, the Internal PCB are set in the vessel；And
One end of draw pin, the draw pin is electrically connected to the Internal PCB, and the other end runs through the through-Penetration portion of the package casing
Position, for being electrically connected with external pcb board, the draw pin is molded as one structure with the package casing through position.
2. packaging body as described in claim 1, which is characterized in that the package casing includes end plate and cover body, the vessel
In the cover body, the cover body is equipped with opening, and opening be connected to the vessel, the end plate set on the opening with
The vessel is blocked, the end plate is the package casing through position；The Internal PCB is set in the vessel, institute
Draw pin is stated through the end plate and is molded as one structure with the end plate, for being electrically connected with external pcb board.
3. packaging body as described in claim 1, which is characterized in that draw pin position corresponding with the vessel is coated with absolutely
Edge layer.
4. packaging body as claimed in claim 3, which is characterized in that the draw pin and the insulating layer are molded as one structure.
5. packaging body as claimed in claim 2, which is characterized in that draw pin position corresponding with the vessel is coated with absolutely
Edge layer, the insulating layer are molded as one structure with the end plate.
6. packaging body as claimed in claim 5, which is characterized in that the insulating layer includes body part and connects with the body part
The stage portion connect, the body part and the stage portion are molded as one structure and coat the draw pin, the stage portion and institute
It states end plate and is molded as one structure；The stage portion is more than the body part along the draw pin along the radial size of the draw pin
Radial size.
7. such as claim 3 to 6 any one of them packaging body, which is characterized in that the insulating layer prepared by insulating materials and
At；
Or, the insulating layer is prepared by insulating materials, the insulating materials is plastics, rubber or coatings.
8. packaging body as described in claim 1, which is characterized in that the packaging body further includes component, and the component is set
In in the vessel, and it is electrically connected to the Internal PCB.
9. a kind of switch power module, which is characterized in that the switch power module includes any one of claim 1 to 8 institute
The packaging body stated.
10. a kind of PCB modules, which is characterized in that the PCB modules include external pcb board and are electrically connected on external pcb board
Switch power module, the switch power module be claim 9 described in switch power module.
11. a kind of air conditioner, which is characterized in that the air conditioner includes PCB modules according to any one of claims 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810887027.5A CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810887027.5A CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811412A true CN108811412A (en) | 2018-11-13 |
| CN108811412B CN108811412B (en) | 2024-04-26 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810887027.5A Active CN108811412B (en) | 2018-08-06 | 2018-08-06 | Package, switching power supply module, PCB module and air conditioner |
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| CN103515058A (en) * | 2013-09-09 | 2014-01-15 | 陕西长岭电子科技有限责任公司 | Isolation transformer for MIL-STD-1553B |
| CN203466176U (en) * | 2013-09-26 | 2014-03-05 | 深圳市矽旺半导体有限公司 | Novel packaging structure of IC |
| CN107613703A (en) * | 2017-07-18 | 2018-01-19 | 北方电子研究院安徽有限公司 | A kind of pot electronics circuit |
| CN207558783U (en) * | 2017-12-18 | 2018-06-29 | 芜湖美智空调设备有限公司 | Power module and air conditioner |
| CN208445892U (en) * | 2018-08-06 | 2019-01-29 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101329945A (en) * | 2007-06-22 | 2008-12-24 | 至美电器股份有限公司 | Electrolytic capacitor with circumscribe type pins |
| CN201820753U (en) * | 2010-07-19 | 2011-05-04 | 福州华虹智能科技开发有限公司 | Multi-chip encapsulation module for electronic equipments under coal mine |
| CN103515058A (en) * | 2013-09-09 | 2014-01-15 | 陕西长岭电子科技有限责任公司 | Isolation transformer for MIL-STD-1553B |
| CN203466176U (en) * | 2013-09-26 | 2014-03-05 | 深圳市矽旺半导体有限公司 | Novel packaging structure of IC |
| CN107613703A (en) * | 2017-07-18 | 2018-01-19 | 北方电子研究院安徽有限公司 | A kind of pot electronics circuit |
| CN207558783U (en) * | 2017-12-18 | 2018-06-29 | 芜湖美智空调设备有限公司 | Power module and air conditioner |
| CN208445892U (en) * | 2018-08-06 | 2019-01-29 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108811412B (en) | 2024-04-26 |
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