CN201820753U - Multi-chip encapsulation module for electronic equipments under coal mine - Google Patents
Multi-chip encapsulation module for electronic equipments under coal mine Download PDFInfo
- Publication number
- CN201820753U CN201820753U CN2010202630741U CN201020263074U CN201820753U CN 201820753 U CN201820753 U CN 201820753U CN 2010202630741 U CN2010202630741 U CN 2010202630741U CN 201020263074 U CN201020263074 U CN 201020263074U CN 201820753 U CN201820753 U CN 201820753U
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- Prior art keywords
- encapsulation module
- metal shell
- circuit board
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 19
- 239000003245 coal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000012856 packing Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000010962 carbon steel Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003063 flame retardant Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000004382 potting Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000002360 explosive Substances 0.000 abstract description 15
- 230000015654 memory Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 2
- 238000004880 explosion Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to electronic equipment used in explosive gas environments, in particular to a multi-chip encapsulation module used for electronic equipments under coal mines. The multi-chip encapsulation module comprises a multi-layer circuit board, a plurality of central processors, a plurality of digital signal processors, a plurality of memories, a plurality of power management chips, a plurality of special integration circuits, a plurality of logic circuits, a plurality of capacitors, a plurality of inductors, a plurality of resistors, a plurality of pins, a plurality of heat conducting blocks, a metal shell and the like. In the utility model, the multi-chip encapsulation module has the safety performance which complies with the requirements of Anti-explosion electrical apparatus for explosive atmospheres Intrinsically safe circuits and electrical apparatus (GB 3836-2000), and has the characteristics that the safety is high, the reliability is high, the three-dimensional heat transfer capability can be achieved, and the manufacture is convenient and the like.
Description
[technical field]
The utility model relates to the explosive gas atmosphere electronic equipment, the multi-core encapsulation module that particularly a kind of colliery downhole electronics is used (Multi-Chip Module--MCM).
[background technology]
Because current central processing unit (CPU), digital signal processor (DSP), memory (FLASH, SRAM, DRAM), application-specific integrated circuit (ASIC) (ASIC), components and parts such as logical circuit all develop to trend toward miniaturization, therefore its heat radiation is because the narrow and small difficulty more that becomes in space, if CPU with commercially available routine, DSP, memory, ASIC, components and parts such as logical circuit directly use in the downhole electronics of colliery, because it the time will produce a large amount of heats in work, can't satisfy the regulation of " explosive atmosphere usefulness electrical apparatus for explosive atmospheres essential safe type circuit and electric equipment (GB 3836-2000) " operating ambient temperature range if heat dispersion is bad.Though system in package (the system in package--SIP) technology of customization can satisfy the regulation of " explosive atmosphere electrical apparatus for explosive atmospheres essential safe type circuit and electric equipment (GB3836-2000) " operating ambient temperature range at present, has shortcomings such as cost height, fabrication cycle length, complex manufacturing technology.
[utility model content]
The purpose of this utility model be to provide a kind of can be directly with commercially available common electronic devices and components, be directly installed in the downhole electronics of colliery, its perfect heat-dissipating can be guaranteed, and the multi-core encapsulation module of explosive atmosphere can be satisfied with electrical apparatus for explosive atmospheres essential safety standard.
The utility model is to realize by following technical scheme: the multi-core encapsulation module that a kind of colliery downhole electronics is used, comprise a circuit board, some components and parts and metal shell, described some components and parts weld respectively and are assemblied on the circuit board, the entire circuit plate metal shell of packing into, described multi-core encapsulation module also comprises some heat-conducting blocks, described heat-conducting block is installed between each components and parts and the metal shell, and closely contact with metal shell with each components and parts respectively, the entire circuit plate comprises that all components and parts and the heat-conducting block that are assemblied on the circuit board all use resin-encapsulated in metal shell, and the pin of circuit board stretches out outside the metal shell.
Described circuit board is the flame retardant type epoxy glass cloth copper-clad plate of single or multiple lift.
Described resin-encapsulated is to adopt resin embedding, the embedding of AB glue, electron pouring sealant embedding, or the special-purpose potting resin of integrated circuit is hot-forming.
Described pin adopts circuit board connector, or the integrated circuit dedicated pin.
Described metal shell is to adopt stainless steel, carbon steel or light metal to make.
The heat-resisting value of its limit of described resin is at least-40 ℃～80 ℃.
When described metal shell uses light metal, press outer cover quality percentage, the total content of aluminium, titanium, magnesium is not more than 15%, and the total content of titanium, magnesium is not more than 8%.
Advantage of the present utility model is: after adopting construction packages described in the utility model, because integral heat sink mode through heat-conducting block, resin and metal shell body, the heat of components and parts can generate heat each, be delivered to surface of shell rapidly, its heat dispersion can meet the regulation of " explosive atmosphere electrical apparatus for explosive atmospheres essential safe type circuit and electric equipment (GB 3836-2000) " operating ambient temperature range; And can select the commonly used commercially available components and parts of different size model according to the design needs, make design have more flexibility, can satisfy the designing requirement of different performance, have the low characteristics of cost; And owing to can adopt commercially available components and parts commonly used, its manufacture craft all can adopt the conventional electrical manufacture craft, does not need to entrust specialty to survey envelope producer, have easy to make, the design cycle short and cost-effective characteristics.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the internal structure schematic diagram of multi-core encapsulation module of the present utility model.
Fig. 2 is a multi-core encapsulation module cross-sectional view of the present utility model.
Fig. 3 is a multi-core encapsulation module outside drawing of the present utility model.
[embodiment]
See also Fig. 1, Fig. 2 and Fig. 3, it is the internal structure schematic diagram of the multi-core encapsulation module used of a kind of colliery of the present utility model downhole electronics, profile and outside drawing, comprise circuit board 1, central processing unit (CPU) 2, digital signal processor (DSP) 3, memory (FLASH, SRAM, DRAM) 4, power management chip (LDO, DC-DC) 5, application-specific integrated circuit (ASIC) (ASIC) 6, logical circuit 7, electric capacity 8, inductance 9, resistance 10, pin 11 etc., above-mentioned each components and parts weld respectively and are assemblied on the circuit board 1, entire circuit plate 1 metal shell 12 of packing into, heat-conducting block 14 is installed between each components and parts and the metal shell 12, and closely contact with metal shell 12 with each components and parts, entire circuit plate 1 comprises that all components and parts and the heat-conducting block 14 that are assemblied on the circuit board 1 all are encapsulated in the metal shell 12 with resin 13, and the pin 11 of circuit board 1 stretches out outside the metal shell 12.Because heat-conducting block 14 places between heater members (as CPU) and the metal shell 12, the two sides respectively and be close on CPU and the metal shell 12, play the effect of heat conduction, its advantage is the heat when built-in heater members (as CPU) generation, can be transmitted to metal shell by resin and heat-conducting block smoothly, metal shell can reach three-dimensional effect to the air heat radiation, can reach the safety requirements of " explosive atmosphere electrical apparatus for explosive atmospheres essential safe type circuit and electric equipment (GB3836-2000) " operating ambient temperature range.
Wherein, described multilayer circuit board 1 is the copper-clad plate of flame retardant type epoxy glass cloth, can be individual layer, also can be multilayer; Described CPU is commercially available conventional central processing unit, can select specifications and models and packing forms according to the design needs; Described DSP is commercially available conventional digital signal processor, can select specifications and models and packing forms according to the design needs; Described memory is commercially available conventional FLASH, SRAM, DRAM etc., can be according to design needs selection memory specifications and models and packing forms; Described power management chip is commercially available conventional LDO, DC-DC etc., can select specifications and models and packing forms according to the design needs; Described ASIC is commercially available conventional application-specific integrated circuit (ASIC), can be according to design needs selection memory specifications and models and packing forms; Described logical circuit is commercially available conventional logical circuit, can be according to design needs selection memory specifications and models and packing forms; Described electric capacity is commercially available conventional capacitor, can select specifications and models and packing forms according to the design needs; Described inductance is commercially available conventional inductor, can select inductance specifications and models and packing forms according to the design needs; The commercially available conventional resistor of described resistance can be selected resistance specifications and models and packing forms according to the design needs; Described resin-encapsulated can be the epoxy resin embedding, also can be the embedding of AB glue, also can be the electron pouring sealant embedding, also can be that the special-purpose potting resin of integrated circuit is hot-forming, described resin, the heat-resisting value of its limit is at least-40 ℃-80 ℃; Described pin can be a circuit board connector, also can be the integrated circuit dedicated pin; Described metal shell can be stainless steel, also can be carbon steel, also can be light metal; When described metal shell uses light metal, press outer cover quality percentage, the total content of aluminium, titanium, magnesium is not more than 15%, and the total content of titanium, magnesium is not more than 8%.
After adopting construction packages described in the utility model, because integral heat sink mode through heat-conducting block, resin and metal shell body, the heat of components and parts can generate heat each, be delivered to surface of shell rapidly, its heat dispersion can meet the regulation of " explosive atmosphere electrical apparatus for explosive atmospheres essential safe type circuit and electric equipment (GB 3836-2000) " operating ambient temperature range.
Claims (5)
1. multi-core encapsulation module that the colliery downhole electronics is used, comprise a circuit board, some components and parts and metal shell, described some components and parts weld respectively and are assemblied on the circuit board, the entire circuit plate metal shell of packing into, described multi-core encapsulation module also comprises some heat-conducting blocks, described heat-conducting block is installed between each components and parts and the metal shell, and closely contact with metal shell with each components and parts respectively, the entire circuit plate comprises that all components and parts and the heat-conducting block that are assemblied on the circuit board all use resin-encapsulated in metal shell, and the pin of circuit board stretches out outside the metal shell.
2. multi-core encapsulation module according to claim 1 is characterized in that: described circuit board is the flame retardant type epoxy glass cloth copper-clad plate of single or multiple lift.
3. multi-core encapsulation module according to claim 1 is characterized in that: described resin-encapsulated is to adopt resin embedding, the embedding of AB glue, electron pouring sealant embedding, or the special-purpose potting resin of integrated circuit is hot-forming.
4. multi-core encapsulation module according to claim 1 is characterized in that: described pin adopts circuit board connector, or the integrated circuit dedicated pin.
5. multi-core encapsulation module according to claim 1 is characterized in that: described metal shell is to adopt stainless steel, carbon steel to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202630741U CN201820753U (en) | 2010-07-19 | 2010-07-19 | Multi-chip encapsulation module for electronic equipments under coal mine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202630741U CN201820753U (en) | 2010-07-19 | 2010-07-19 | Multi-chip encapsulation module for electronic equipments under coal mine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820753U true CN201820753U (en) | 2011-05-04 |
Family
ID=43918697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202630741U Expired - Lifetime CN201820753U (en) | 2010-07-19 | 2010-07-19 | Multi-chip encapsulation module for electronic equipments under coal mine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201820753U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682425A (en) * | 2016-03-11 | 2016-06-15 | 华中科技大学 | Radiating method for high-power device of logging instrument |
| CN108811412A (en) * | 2018-08-06 | 2018-11-13 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB modules and air conditioner |
| CN108901168A (en) * | 2018-08-06 | 2018-11-27 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
| CN108917971A (en) * | 2018-06-29 | 2018-11-30 | 成都泰盟软件有限公司 | A kind of toy anus temperature measurement probe and its packaging technology |
| CN109346450A (en) * | 2018-12-05 | 2019-02-15 | 西安石油大学 | It is a kind of for cooling down the device and method of the semiconductor devices of downhole tool |
| CN109729642A (en) * | 2019-02-28 | 2019-05-07 | 中国工程物理研究院化工材料研究所 | Double-side aluminum microampere protects chip powder charge circuit board |
| WO2020134290A1 (en) * | 2018-12-29 | 2020-07-02 | 华为技术有限公司 | Chip device and electronic equipment |
-
2010
- 2010-07-19 CN CN2010202630741U patent/CN201820753U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682425A (en) * | 2016-03-11 | 2016-06-15 | 华中科技大学 | Radiating method for high-power device of logging instrument |
| CN108917971A (en) * | 2018-06-29 | 2018-11-30 | 成都泰盟软件有限公司 | A kind of toy anus temperature measurement probe and its packaging technology |
| CN108811412A (en) * | 2018-08-06 | 2018-11-13 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB modules and air conditioner |
| CN108901168A (en) * | 2018-08-06 | 2018-11-27 | 广东美的制冷设备有限公司 | Packaging body, switch power module, PCB module and air conditioner |
| CN108901168B (en) * | 2018-08-06 | 2024-03-26 | 广东美的制冷设备有限公司 | Package, switching power supply module, PCB module and air conditioner |
| CN108811412B (en) * | 2018-08-06 | 2024-04-26 | 广东美的制冷设备有限公司 | Package, switching power supply module, PCB module and air conditioner |
| CN109346450A (en) * | 2018-12-05 | 2019-02-15 | 西安石油大学 | It is a kind of for cooling down the device and method of the semiconductor devices of downhole tool |
| WO2020134290A1 (en) * | 2018-12-29 | 2020-07-02 | 华为技术有限公司 | Chip device and electronic equipment |
| CN109729642A (en) * | 2019-02-28 | 2019-05-07 | 中国工程物理研究院化工材料研究所 | Double-side aluminum microampere protects chip powder charge circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: FUZHOU HUAHONG SMART SCIENCE + TECHNOLOGY CO., LTD Free format text: FORMER NAME: FUZHOU HUAHONG INTELLIGENT TECHNOLOGY DEVELOPMENT CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 350003, Fujian Fuzhou Gulou District software Avenue 89, Fuzhou Software Park industrial base two, building 9, 2 floor Patentee after: FUZHOU HUAHONG INTELLIGENT TECHNOLOGY CO., LTD. Address before: 350003, 3F, building 3, West Science Park, 8 Changting Road, Fuzhou Road, Taijiang District, Fujian, China Patentee before: Fuzhou Huahong Intelligent Technology Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| DD01 | Delivery of document by public notice |
Addressee: Yang Meixian Document name: Notification of Passing Examination on Formalities |
|
| CX01 | Expiry of patent term |
Granted publication date: 20110504 |
|
| CX01 | Expiry of patent term |