CN201425893Y - Ceramic capacitor - Google Patents
Ceramic capacitor Download PDFInfo
- Publication number
- CN201425893Y CN201425893Y CN2009200571799U CN200920057179U CN201425893Y CN 201425893 Y CN201425893 Y CN 201425893Y CN 2009200571799 U CN2009200571799 U CN 2009200571799U CN 200920057179 U CN200920057179 U CN 200920057179U CN 201425893 Y CN201425893 Y CN 201425893Y
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- ceramic capacitor
- capacitor
- copper
- silver
- ceramic
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Abstract
The utility model discloses a ceramic capacitor which comprises a ceramic capacitor body and a capacitance leading-out terminal. The capacitor body is constructed by printing copper inner electrode layers on the front and back surfaces of a laminar ceramic chip. Compared with prior art, the inner electrodes of the ceramic capacitor are copper electrodes, the cost of copper is much lower than the cost of silver; correspondingly, the welding paste can be lead-free welding paste with low silver content or without silver. Besides, the inert copper ions cannot transfer during the production and useprocess of the capacitor. The ceramic capacitor has high reliability and stability, low production cost and accords with the environmental protection requirement.
Description
Technical field
The utility model relates to a kind of ceramic capacitor, relates in particular to the ceramic capacitor that a kind of interior electrode structure changes.
Background technology
At present traditional AC capacitor inner electrode uses the high silver slurry of price.When welding, the production of disk ceramic capacitor finished product need use expensive argentiferous scolding tin just may obtain good welding effect.But silver ion is more active, is easy to produce migration.When the conventional silver electrode capacitor was worked under high temperature or high voltage condition, the hydrone that infiltrates capacitor inside produced electrolysis, and produced oxidation reaction at anode, and silver ion combines with hydroxide ion and generates silver hydroxide.Produce reduction reaction at negative electrode, silver hydroxide and hydrogen ion reaction generate silver and water.Because electrode reaction, the silver ion of anode constantly becomes discontinuous metal silver granuel to cathodic reduction, connects into tree-shaped anode by moisture film and extends.The silver ion migration does not occur over just the inorganic medium surface, and silver ion can also be diffused into inorganic medium inside, causes that leakage current increases, and can make dead short circuit between two silver electrodes when serious, causes capacitor breakdown.In addition, the price of silver slurry is very expensive.Simultaneously, silver just needs with silver soldering tin cream welding lead, by drawing capacitor volume as the inner electrode layer of electric capacity.So the disk ceramic capacitor production cost of Ag inner electrode is very high.
The utility model content
The technical problem that the utility model need solve provides a kind of product reliability and good stability, ceramic capacitor that production cost is low.
The technical problem that the utility model need solve is achieved through the following technical solutions: a kind of ceramic capacitor, comprise the body of ceramic condenser and the leading-out terminal of capacitance, described capacitor body is to be printed with the copper inner electrode layer at laminar ceramic dielectric chip tow sides.
Further: in above-mentioned copper inner electrode ceramic capacitor, described ceramic dielectric chip is a kind of in disk, square sheet, the elliptical piece.
Described capacity leading-out terminal is the lead-in wire that is welded on the copper electrode layer outside with soldering-tin layer.For further reducing production costs, described soldering-tin layer is low silver or the lead-free soldering tin layer that does not have silver.The capacitor body appearance also is provided with the epoxy resin or the phenolic resins encapsulated layer of protection body.The integral body of ceramic capacitor is the disk shape.
Compared with prior art, the interior electrode of ceramic capacitor is the copper inner electrode layer, and when the capacitor chip of copper inner electrode and external electrode wire bonds, interior electrode metal copper can not be dissolved in the scolder (scolding tin), promptly can not fly copper (copper erosion) phenomenon, so the inner solder joint of capacitor is more reliable.When producing and using this capacitor, the copper of inertia can not produce migration, so all the capacitor than Ag inner electrode is good for reliability of products and stability.In addition, the price of silver is very high, during solder taul, needs the high silver soldering tin paste layer of price.So copper electrode ceramic capacitor production cost is low.
Above-mentioned ceramic capacitor is to select for use by the exploitation of copper electrode paste, cooperates the atmosphere firing process, with the interior electrode of metallic copper as the disk ceramic capacitor.It is sealed and tests through green compact moulding, ceramic substrate sintering, print copper slurry, copper electrode sintering (needing with suitable atmosphere), welding external lead wire, insulation, produces copper electrode disk ceramic capacitor.It is used existing oxidizing atmosphere ceramic substrate is carried out sintering, use suitable reducing atmosphere sintered copper electrode then, make the copper electrode capacitor chip, adopt cheap low silver content scolder that capacitor is welded then, thereby saved the capacitor production cost, improved the stability and the reliability of capacitor again.
Description of drawings
Fig. 1 is front half schematic diagram of the utility model execution mode;
Fig. 2 is the longitudinal section schematic diagram of the utility model execution mode.
Wherein: 1 ceramic dielectric chip, 2 copper inner electrode layers, 3 lead-in wires, 4 lead-free soldering tin layers, 5 epoxies or phenolic resins encapsulated layer.
Specific embodiments
With reference to accompanying drawing 1～2 and embodiment the utility model is described.
A kind of ceramic capacitor comprises the body of ceramic condenser and the leading-out terminal of capacitance, and described capacitor body is to be printed with copper inner electrode layer 2 at laminar ceramic dielectric chip 1 tow sides.In Fig. 1, described ceramic dielectric chip 1 is the disk shape, and it also can the side's of being sheet, a kind of in the elliptical piece.Be welded with lead-in wire 3 in the copper inner electrode layer outside with low silver or the lead-free soldering tin layer that do not have silver as the capacity leading-out terminal.This capacitor body appearance also is provided with the epoxy or the phenolic resins encapsulated layer 5 of protection body.This capacitor global shape is the disk shape.
Compared with prior art, the interior electrode of ceramic capacitor is a copper inner electrode layer 2, when the capacitor chip 1 of copper inner electrode layer welds with external electrode lead-in wire 3, interior electrode metal copper can not be dissolved in the scolder (scolding tin), promptly can not fly copper (copper erosion) phenomenon, so the inner solder joint of capacitor is more reliable.When producing and using this capacitor, the copper of inertia can not produce migration, so all the capacitor than Ag inner electrode is good for reliability of products and stability.In addition, the price of silver is very high, during solder taul, needs the high silver soldering tin paste layer of price.And copper inner electrode is with hanging down silver or not having silver-colored soldering-tin layer when welding lead.So it is low that ceramic capacitor is produced adult.
The above is a preferred embodiment of the present utility model, is not breaking away under the utility model design situation, carries out any conspicuous distortion and replacement, all belongs to the utility model protection range.
Claims (6)
1, a kind of ceramic capacitor comprises the body of ceramic condenser and the leading-out terminal of capacitance, it is characterized in that: described capacitor body is to be printed with copper inner electrode layer (2) at laminar ceramic dielectric chip (1) tow sides.
2, ceramic capacitor according to claim 1 is characterized in that: described ceramic dielectric chip (1) is a kind of in disk, square sheet, the elliptical piece.
3, ceramic capacitor according to claim 2 is characterized in that: described leading-out terminal is the lead-in wire (3) that is welded on the copper electrode layer outside with soldering-tin layer.
4, ceramic capacitor according to claim 3 is characterized in that: described soldering-tin layer is low silver or the lead-free soldering tin layer (4) that does not have silver.
5, according to each described ceramic capacitor among the claim 1-4, it is characterized in that: described capacitor body appearance also is provided with the epoxy or the phenolic resins encapsulated layer (5) of protection body.
6, according to each described ceramic capacitor among the claim 1-4, it is characterized in that: described ceramic capacitor is the disk shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200571799U CN201425893Y (en) | 2009-05-22 | 2009-05-22 | Ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200571799U CN201425893Y (en) | 2009-05-22 | 2009-05-22 | Ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201425893Y true CN201425893Y (en) | 2010-03-17 |
Family
ID=42025348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200571799U Expired - Lifetime CN201425893Y (en) | 2009-05-22 | 2009-05-22 | Ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201425893Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN113161092A (en) * | 2021-04-01 | 2021-07-23 | 肇庆市鼎湖正科集志电子有限公司 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
-
2009
- 2009-05-22 CN CN2009200571799U patent/CN201425893Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN113161092A (en) * | 2021-04-01 | 2021-07-23 | 肇庆市鼎湖正科集志电子有限公司 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100317 |
|
| CX01 | Expiry of patent term |