CN113161092A - Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode - Google Patents
Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode Download PDFInfo
- Publication number
- CN113161092A CN113161092A CN202110357141.9A CN202110357141A CN113161092A CN 113161092 A CN113161092 A CN 113161092A CN 202110357141 A CN202110357141 A CN 202110357141A CN 113161092 A CN113161092 A CN 113161092A
- Authority
- CN
- China
- Prior art keywords
- tin
- copper
- electrode
- plating
- piezoresistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Abstract
The invention discloses a manufacturing method of a strontium titanate annular piezoresistor copper-tin electrode, which comprises the following steps: 1) printing the ring pressing electrode on the ring pressing magnet through copper paste, and sintering to form a copper electrode; 2) carrying out tin plating processing on the copper electrode in the step 1), wherein the tin plating is carried out in two modes, one mode is tin immersion, the copper electrode is immersed into a solution containing tin ions, and copper is replaced by tin; the other is electroplating tin, and the rolling plating method is adopted, the piezoresistor with the copper electrode is placed in a cathode rolling plating tank, the tin metal is connected with an anode, and the copper electrode is electroplated by the tin after the electroplating solution passes through the current. Compared with the prior art, the invention has the advantages that: the copper paste sintered electrode greatly reduces the rigor of the process for sintering the copper electrode, and is formed by tinning, the copper-tin electrode is good in tin soldering and not easy to be ablated when tin soldering is carried out, the inner layer copper is protected by the tin layer and is not easy to be oxidized, the production technology is mature and reliable, and the cost is low.
Description
Technical Field
The invention relates to the manufacture of industrial parts, in particular to a method for manufacturing a strontium titanate annular piezoresistor copper-tin electrode.
Background
The strontium titanate annular piezoresistor is used for a miniature direct current motor and plays roles in weakening electric sparks of a conductive electric brush and resisting electromagnetic interference. Thereby prolonging the service stability and the service life thereof.
The resistor matrix is strontium titanate, belongs to ceramics, can not be directly soldered, and can be soldered only by attaching a layer of specific metal electrode on the surface, and the copper wire of the motor rotor is connected by soldering, and the manufacture of the electrode is an important process of the product. The electrodes are currently divided into two types, silver electrodes and copper electrodes. At present, silver electrodes are mainly produced in China, copper electrodes are produced by TDK company in Japan, and the copper electrodes tend to be produced in large quantities in China.
The electrode has the functions of welding the conductive tabs of the motor rotor and ohmic contact magnets. The resistor has three sections of electrodes at least, each section of electrode is soldered once, and the resistor has the advantages and disadvantages of silver and copper electrodes: the silver is coated with tin, but is easy to be ablated by the tin forming an interfused alloy; copper is resistant to ablation, but the technical content of the production process is high, the copper surface is easy to oxidize, and the oxidation is not easy to load tin, so the production process is difficult to control to ensure that the copper surface is not oxidized, and the copper electrode needs to be sintered in a pure nitrogen atmosphere. Silver belongs to precious metals and is high in cost, but the domestic production mainstream. The cost of copper is low, the domestic technical difficulty is high, and the mass production is difficult. Although some manufacturers apply for the copper electrode patent, the mass production is not seen.
Disclosure of Invention
The invention aims to solve the technical problems that the existing silver electrode uses noble metal silver as an electrode, the production raw material is high and easy to be ablated by soldering tin; the copper electrode is easy to be oxidized; the sintering process is too harsh and difficult to realize industrially.
In order to solve the technical problems, the technical scheme provided by the invention is as follows: a manufacturing method of a strontium titanate annular piezoresistor copper-tin electrode comprises the following steps:
1) printing the ring pressing electrode on the ring pressing magnet through copper paste, and sintering to form a copper electrode;
2) carrying out tin plating processing on the copper electrode in the step 1), wherein the tin plating is carried out in two modes, one mode is tin immersion, the copper electrode is immersed into a solution containing tin ions, and copper is replaced by tin; the other is electroplating tin, and the rolling plating method is adopted, the piezoresistor with the copper electrode is placed in a cathode rolling plating tank, the tin metal is connected with an anode, and the copper electrode is electroplated by the tin after the electroplating solution passes through the current.
Compared with the prior art, the invention has the advantages that: the copper paste sintering electrode is formed by tinning, the copper-tin electrode is good in tin soldering, and not easy to ablate during tin soldering, the production technology is mature and reliable, the cost is low, and the ring pressing work of rotor welding can be conveniently completed in the aspect of tinning processing.
As an improvement, the oxygen control condition during the copper electrode sintering in the step 1) is not required to be strict, a small amount of oxide film is allowed to exist, and the subsequent tin plating processing is not influenced.
As an improvement, after the copper electrode is plated with the tin layer in the step 2), the color of the electrode is changed from yellow to white, and the tin layer is adhered to the surface, so that the tin wire is butted with the tin layer during rotor soldering, the tin is conveniently plated, and the inner copper material is protected by the tin surface to play an anti-oxidation role.
As an improvement, in the step 2), the surface of the copper electrode is a tin layer, the bottom layer is made of copper, and the copper is resistant to tin ablation, so that the electrode is not easy to burn out.
Detailed Description
In specific implementation, the method for manufacturing the strontium titanate annular piezoresistor copper-tin electrode comprises the following steps:
1) printing the ring pressing electrode on the ring pressing magnet through copper paste, and sintering to form a copper electrode;
2) carrying out tin plating processing on the copper electrode in the step 1), wherein the tin plating is carried out in two modes, one mode is tin immersion, the copper electrode is immersed into a solution containing tin ions, and copper is replaced by tin; the other is electroplating tin, and the rolling plating method is adopted, the piezoresistor with the copper electrode is placed in a cathode rolling plating tank, the tin metal is connected with an anode, and the copper electrode is electroplated by the tin after the electroplating solution passes through the current.
In the step 1), the oxygen control condition is not required to be harsh during the copper electrode sintering, a small amount of oxide film is allowed to exist, and the subsequent tin plating processing is not influenced.
After the copper electrode is plated with the tin layer in the step 2), the color of the electrode is changed from yellow to white, and the tin layer is attached to the surface, so that the tin wire is in butt joint with the tin layer during rotor tin soldering, the tin is conveniently plated, and the tin surface protects the copper material of the inner layer to play a role in preventing oxidation.
In the step 2), the surface of the copper electrode is a tin layer, the bottom layer is made of copper, and the copper is resistant to tin ablation, so that the electrode is not easy to burn out.
The working principle of the invention is as follows: the invention adopts a ring-pressed electrode, the ring-pressed electrode is printed on a ring-pressed magnet through copper paste, the ring-pressed magnet is sintered into a copper electrode, and the copper electrode is tinned to form the copper-tin electrode. The method not only solves the defects of high cost and easy ablation of the silver electrode, but also successfully reduces the manufacturing difficulty of the copper electrode, has subsequent tin plating, carries out copper electrode etching in the previous step, does not need rigor oxygen control of copper, allows a little oxidation film, and does not influence the subsequent tin plating. After the copper electrode is coated with the tin layer, the color of the electrode is changed from yellow of copper to white of tin, and the tin layer is adhered to the surface, so that tin wires are in butt joint with the tin layer during rotor soldering, and tin is well coated.
During manufacturing, the copper paste is printed on the ring pressing, and the ring pressing of the copper electrode is sintered. The copper has the property of generating ohmic contact with the pressure sensitive body, and the electrical property of the ring-pressing magnet is exerted through the copper electrode. The subsequent process is tin plating. Tin plating is carried out in two modes, one mode is tin immersion: in the solution containing tin ions, tin displaces copper. The other is electroplating tin, and by adopting a barrel plating method, a piezoresistor with a copper electrode is placed in a cathode barrel plating tank, tin metal is connected with an anode, and the tin can be electroplated with the copper electrode when the electroplating solution passes through a current.
The surface of the copper electrode is a tin layer, the bottom layer is made of copper, and the copper is resistant to tin ablation, so that the electrode is not easy to burn out. The minimum number of the piezoresistor is 3, the numbers of the piezoresistor are 5, 6, 7 and the like, each electrode is welded once, the more the number of the electrodes is, the higher the burning probability of the silver electrode is, and the copper-tin electrode cannot be burnt.
The first embodiment is as follows:
the varistor ceramic substrate is screened and printed with copper slurry according to a required pattern, dried and sintered into the copper electrode varistor at the temperature of 750-. The product is put into a copper polishing agent (purchased) solution for 10 to 60 seconds, the oxidation film on the surface of the copper electrode is removed, and then the product is washed for 1 to 3 times by water to remove the residual copper polishing agent. Immersing in tin plating solution (purchased) for 10-180 seconds, obtaining copper elementary electron by tin ion, and separating tin on the surface of the copper electrode to finish tin plating. The color of the copper-tin alloy is changed from copper yellow to tin white, and then the copper-tin alloy is washed for 1 to 3 times, the residual tin plating solution is washed off, and the surface moisture is dried.
Example two:
the varistor ceramic substrate is screened and printed with copper slurry according to a required pattern, dried and sintered into the copper electrode varistor at the temperature of 750-. The product is directly immersed into the tin plating solution without a copper polishing agent, because the tin plating solution (purchased) is acidic, acid radicals can directly react to remove copper oxide on the surface to leak copper simple substances, the product is immersed into the tin plating solution for 10-180 seconds, tin ions obtain copper simple substance electrons, and tin is separated out on the surface of a copper electrode to finish tin plating. The color of the copper-tin alloy is changed from copper yellow to tin white, and then the copper-tin alloy is washed for 1 to 3 times, the residual tin plating solution is washed off, and the surface moisture is dried. This process is clearly the simplest and requires only one step for tin plating.
Example three:
the varistor ceramic substrate is screened and printed with copper slurry according to a required pattern, dried and sintered into the copper electrode varistor at the temperature of 750-. The subsequent barrel plating is carried out by a professional manufacturer for processing, and the process is mainly as follows: removing an oxide film by using an acidic or copper polishing agent, washing with water, barrel-plating and tinning (mature process), washing with water and drying.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the invention, "plurality" means two or more unless explicitly specifically defined otherwise.
In the present invention, unless otherwise specifically stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is higher in degree celsius than the second feature. The first feature being "under," "below," and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is lower in degree celsius than the second feature.
In the description herein, reference to the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (4)
1. A manufacturing method of a strontium titanate annular piezoresistor copper-tin electrode is characterized by comprising the following steps:
1) printing the ring pressing electrode on the ring pressing magnet through copper paste, and sintering to form a copper electrode;
2) carrying out tin plating processing on the copper electrode in the step 1), wherein the tin plating is carried out in two modes, one mode is tin immersion, the copper electrode is immersed into a solution containing tin ions, and copper is replaced by tin; the other is electroplating tin, and the rolling plating method is adopted, the piezoresistor with the copper electrode is placed in a cathode rolling plating tank, the tin metal is connected with an anode, and the copper electrode is electroplated by the tin after the electroplating solution passes through the current.
2. The manufacturing method of the strontium titanate annular piezoresistor copper-tin electrode according to claim 1, characterized in that: in the step 1), the oxygen control condition is not required to be harsh during the copper electrode sintering, a small amount of oxide film is allowed to exist, and the subsequent tin plating processing is not influenced.
3. The manufacturing method of the strontium titanate annular piezoresistor copper-tin electrode according to claim 1, characterized in that: after the copper electrode is plated with the tin layer in the step 2), the color of the electrode is changed from yellow to white, and the tin layer is attached to the surface, so that the tin wire is in butt joint with the tin layer during rotor tin soldering, the tin is conveniently plated, and the tin surface protects the copper material of the inner layer to play a role in preventing oxidation.
4. The manufacturing method of the strontium titanate annular piezoresistor copper-tin electrode according to claim 1, characterized in that: in the step 2), the surface of the copper electrode is a tin layer, the bottom layer is made of copper, and the copper is resistant to tin ablation, so that the electrode is not easy to burn out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110357141.9A CN113161092A (en) | 2021-04-01 | 2021-04-01 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110357141.9A CN113161092A (en) | 2021-04-01 | 2021-04-01 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113161092A true CN113161092A (en) | 2021-07-23 |
Family
ID=76886196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110357141.9A Pending CN113161092A (en) | 2021-04-01 | 2021-04-01 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113161092A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2332040Y (en) * | 1997-09-11 | 1999-08-04 | 浙江万马集团电子有限公司 | Perforated multilayer electrod piezoresistor |
| CN1629986A (en) * | 2003-12-18 | 2005-06-22 | 广东风华高新科技集团有限公司 | Copper electrode strontium titanate annular piezoresistor and method for making same |
| CN101515497A (en) * | 2008-02-18 | 2009-08-26 | 釜屋电机株式会社 | Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof |
| CN101523522A (en) * | 2005-11-09 | 2009-09-02 | 谢清雄 | An electroplating method in the manufacture of the surface mount precision metal resistor |
| CN201425893Y (en) * | 2009-05-22 | 2010-03-17 | 广东风华高新科技股份有限公司 | Ceramic capacitor |
| CN101945544A (en) * | 2009-07-09 | 2011-01-12 | 厦门达尔电子有限公司 | Method for manufacturing flexible circuit board |
| CN102354575A (en) * | 2011-08-23 | 2012-02-15 | 浙江省浦江县百川产业有限公司 | Tinning copper clad aluminum wire production technology |
| CN107587095A (en) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带（河南）有限公司 | A kind of environmentally friendly copper and copper alloy plate strip surface hot-dip tinning method |
| CN209243150U (en) * | 2018-12-24 | 2019-08-13 | 重庆群崴电子材料有限公司 | A kind of copper strips hot dipped tinning device |
-
2021
- 2021-04-01 CN CN202110357141.9A patent/CN113161092A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2332040Y (en) * | 1997-09-11 | 1999-08-04 | 浙江万马集团电子有限公司 | Perforated multilayer electrod piezoresistor |
| CN1629986A (en) * | 2003-12-18 | 2005-06-22 | 广东风华高新科技集团有限公司 | Copper electrode strontium titanate annular piezoresistor and method for making same |
| CN101523522A (en) * | 2005-11-09 | 2009-09-02 | 谢清雄 | An electroplating method in the manufacture of the surface mount precision metal resistor |
| CN101515497A (en) * | 2008-02-18 | 2009-08-26 | 釜屋电机株式会社 | Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof |
| CN201425893Y (en) * | 2009-05-22 | 2010-03-17 | 广东风华高新科技股份有限公司 | Ceramic capacitor |
| CN101945544A (en) * | 2009-07-09 | 2011-01-12 | 厦门达尔电子有限公司 | Method for manufacturing flexible circuit board |
| CN102354575A (en) * | 2011-08-23 | 2012-02-15 | 浙江省浦江县百川产业有限公司 | Tinning copper clad aluminum wire production technology |
| CN107587095A (en) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带（河南）有限公司 | A kind of environmentally friendly copper and copper alloy plate strip surface hot-dip tinning method |
| CN209243150U (en) * | 2018-12-24 | 2019-08-13 | 重庆群崴电子材料有限公司 | A kind of copper strips hot dipped tinning device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3881480B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| US4316171A (en) | Non-linear resistance elements and method for manufacturing same | |
| JPH07320982A (en) | Manufacture of capacitor element for tantalum solid electrolytic capacitor | |
| WO2002089160A3 (en) | Electrical multilayer component and method for the production thereof | |
| CN113161092A (en) | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode | |
| US4303480A (en) | Electroplating of thick film circuitry | |
| US20130152351A1 (en) | Method and apparatus for producing a ceramic electronic component | |
| US4639836A (en) | Unencapsulated chip capacitor | |
| JPH04256306A (en) | Chip type solid electrolytic capacitor with fuse and manufacture thereof | |
| JPH11279800A (en) | Method for plating small-sized electronic parts | |
| CN107331486A (en) | sulfuration resistant resistor and preparation method thereof | |
| JP4452917B2 (en) | Tab terminal for electrolytic capacitor | |
| JP2696603B2 (en) | Manufacturing method of tantalum solid electrolytic capacitor | |
| CN100369169C (en) | Producing method for solid electrolytic capacitor | |
| JPS5926590Y2 (en) | solid electrolytic capacitor | |
| JP2555770B2 (en) | Copper thick film circuit substrate and method of manufacturing the same | |
| JPH0244512Y2 (en) | ||
| CN114783650B (en) | Bottom ohmic silver paste for strontium titanate annular piezoresistor and preparation method and application thereof | |
| JP2000340596A (en) | Manufacture of semiconductor device | |
| TWI270089B (en) | Method for manufacturing varistor with phosphate insulation layer | |
| JP3531794B2 (en) | Method for forming terminal electrodes of ceramic electronic components | |
| JPH0314040Y2 (en) | ||
| JP4646373B2 (en) | Wiring board and manufacturing method thereof | |
| GB2177258A (en) | Production of solid electrolyte capacitors | |
| JPH09272993A (en) | Drum for metal foil electrodeposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210723 |