CN101515497A - Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof - Google Patents
Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof Download PDFInfo
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- CN101515497A CN101515497A CNA200910006438XA CN200910006438A CN101515497A CN 101515497 A CN101515497 A CN 101515497A CN A200910006438X A CNA200910006438X A CN A200910006438XA CN 200910006438 A CN200910006438 A CN 200910006438A CN 101515497 A CN101515497 A CN 101515497A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Abstract
The invention relates to a resistance metallic plate low-resistance value sheet shape resistor and the manufacturing method thereof, provides a method for manufacturing high reliable low-resistance value sheet shape resistor with resistance value below 1momega without complex processes, which is characterized in that: welding a copper sheet (13) to one or two surfaces of a resistance metallic plate (11) by scolder (12); removing oxide-film from the surface; forming tinning film (14) on the whole surface of the copper sheet; forming a combined multi-sheet body (20); cutting the combined multi-sheet body into a rectangle with a desired width to form a rectangle multi-sheet body (22); cutting from the basic center of the opposite short sides on the one ore two surface with tinning film of the rectangle multi-sheet body along the long sides according to a defined width; removing the tinning film, copper sheet, scolder and at least the scolder diffusion layer of the resistance metallic plate; forming concave sections (15) on one or two surfaces, forming a protective film (16) on the bottom of the concave sections; cutting off the rectangle multi-sheet body in the desired width; and manufacturing sheet shape resistor (10).
Description
Technical field
The present invention relates to resistance metallic plate low-resistance value sheet shape resistor and manufacture method thereof.
Background technology
When being switched on, the control circuit of engine or switching regulaor detects the electronic units such as shunt resistor of electric current, what use is the metallic plate sheet resistor that is formed with electrode layer at the two ends of the tabular metallic resistance body that contains alloy all the time, its resistance value is lower, is set at a few m Ω to about 1 Ω.For such metallic plate sheet resistor, wish that its temperature coefficient of resistance and current characteristics are stable, inductance value is suppressed at low-level and will detect electric current accurately, has put down in writing the manufacture method with the corresponding chip resistor of above-mentioned expectation in Japanese Patent Application Publication 2003-115401 number (JP-2003-115401-A).
Promptly; in JP-2003-115401-A; put down in writing a kind of manufacture method of low resistance device; it is by crimping or welding and the thin slice of high conductivity material such as copper is fixed at the both ends of metallic resistance body; form electrode, alongst the side with the metallic resistance body reams, and perhaps on thickness direction the top and bottom of metallic resistance body is reamed; regulate resistance value by the size of adjusting this cut, and diaphragm is set on the face in exposing of metallic resistance body.
There are the following problems for the manufacture method of described low resistance device: the side of metallic resistance body or top and bottom are being cut the operation spended time too of regulating resistance value, productivity reduces, in addition, for being used for the thin slice crimping of high conductivity material such as copper or the also not record of the concrete method of welding on the metallic resistance body, it is difficult that the method for JP-2003-115401-A is imported to actual production scene.
In addition, open the Japanese Patent Application Publication spy and to have put down in writing a kind of shunt resistance element in flat 11-97203 number (JP-11-97203-A), it is to contain the superimposed surface at ceramic substrate of thin plate resistive element of copper alloys such as contamin, constantan, simultaneously make copper coin superimposed inside, be bonded into one by the activated metal method of using silver solder etc. again, and at the two ends of thin plate resistive element resistive element electric current is set, bonding electrodes portion that voltage detecting is used.
But, when utilizing the scolder contain reactive metal that ceramic substrate and thin plate resistive element (resistance metallic plate) are engaged, there is following problems: this scolder costliness, engage too spended time, productivity reduces.
Summary of the invention
The present invention makes in order to solve above-mentioned problem, its purpose is to provide a kind of method that can make the low-resistance value sheet shape resistor that is lower than 1m Ω with high reliability without complicated step, because it is higher at the current value ratio that detects, for example be 5A when above, need resistance value to be lower than the resistance metallic plate low-resistance value sheet shape resistor of 1m Ω.
In addition, another object of the present invention is to provide a kind of resistance metallic plate chip resistor of the low resistance that is lower than 1m Ω that can make without complicated step, because it is higher at the current value ratio that detects, for example be 5A when above, need resistance value to be lower than the resistance metallic plate low-resistance value sheet shape resistor of 1m Ω.
In the present invention, the scheme of (1)～(5) by following record solves above-mentioned problem.
(1) the invention provides a kind of manufacture method of resistance metallic plate low-resistance value sheet shape resistor; it is characterized in that; copper coin is welded on the one or both sides of resistance metallic plate; remove oxide-film from the surface again; form tin-plated coating film on the whole surface of above-mentioned copper coin then; form set multilayer plate body thus; should gather the multilayer plate body with the width of expectation and be cut into rectangle; form rectangular multilayer plate body; the one or both sides that are formed with tin-plated coating film from this rectangular multilayer plate body cut along long side direction with the width of stipulating the basic central authorities of short side direction again; remove tin-plated coating film; copper coin; at least the diffusion layer of scolder and resistance metallic plate and scolder; form recess at one or both sides; and at the bottom surface of this recess formation diaphragm; width with expectation cuts off above-mentioned rectangular multilayer plate body then, thereby makes the resistor of sheet.
(2) the invention provides the manufacture method of above-mentioned (1) described resistance metallic plate low-resistance value sheet shape resistor, wherein, above-mentioned resistance metallic plate is the alloy that contains the above copper of 90 weight %.
(3) the invention provides the manufacture method of above-mentioned (1) described resistance metallic plate low-resistance value sheet shape resistor, wherein, above-mentioned resistance metallic plate and above-mentioned copper coin are welded by the scolder that comprises copper-Yin bianry alloy.
(4) the invention provides the manufacture method of above-mentioned (1) described resistance metallic plate low-resistance value sheet shape resistor, wherein, form diaphragm in the bottom surface of above-mentioned recess by the material that contains polyamide-imide resin.
(5) the invention provides a kind of resistance metallic plate low-resistance value sheet shape resistor; described resistance metallic plate low-resistance value sheet shape resistor is following formation: copper coin is welded on the one or both sides of resistance metallic plate; remove oxide-film from the surface again; form tin-plated coating film on the whole surface of above-mentioned copper coin then; form set multilayer plate body thus; to gather the multilayer plate body with the width of expectation and be cut into rectangle; the one or both sides that are formed with tin-plated coating film from rectangular multilayer plate body cut along long side direction with the width of stipulating the basic central authorities of short side direction again; remove tin-plated coating film; copper coin; at least the diffusion layer of scolder and resistance metallic plate and scolder; form recess at one or both sides; and at the bottom surface of this recess formation diaphragm, the width with expectation is cut to sheet with rectangular multilayer plate body then.
In addition, at the one or both sides that are formed with tin-plated coating film the basic central authorities of short side direction are cut along long side direction with the width of stipulating from rectangular multilayer plate body, remove the diffusion layer at least of tin-plated coating film, copper coin, scolder and resistance metallic plate and scolder, thereby form in the operation of recess at one or both sides, the cutting depth of recess for example can utilize microscope etc. by perusal etc. instrumentation to be carried out in the cross section of the rectangular multilayer plate body of sampling, is set at the degree of depth that can positively remove the diffusion layer of resistance metallic plate and scolder thus.Therefore, in this operation, except diffusion layer, resistance metallic plate also has some thickness to be cut.
The present invention is owing to be the resistor of making sheet as follows; therefore can implement cutting process and make the resistance metallic plate low-resistance value sheet shape resistor that is lower than 1m Ω efficiently the resistor of each sheet with high reliability; the method of resistor of described manufacturing sheet is: copper coin is welded on the one or both sides of resistance metallic plate; whole surface at copper coin forms tin-plated coating film; form rectangular multilayer plate body; from the one or both sides that are formed with tin-plated coating film the basic central authorities of short side direction are cut along long side direction with the width of stipulating then; remove tin-plated coating film from one or both sides once thus; copper coin; at least the diffusion layer of scolder and resistance metallic plate and scolder; thereby formation recess; and at the bottom surface of this recess formation diaphragm, the width with expectation cuts off rectangular multilayer plate body then.
In the present invention, owing to use and contain the alloy of the above copper of 90 weight % as resistance metallic plate, therefore, at resistance metallic plate be welded between the copper coin on the one or both sides of this resistance metallic plate, the coefficient of expansion can not produce great difference, even after in welding sequence, carrying out high-temperature process, also can not produce warpage, thereby can prevent the reduction of the machining accuracy that causes by warpage.
In the present invention, owing to resistance metallic plate and copper coin are welded, therefore can make resistance metallic plate and copper coin generation ohmic contact (ohmic properties contacts or ohmic contact) by the scolder that comprises copper-Yin bianry alloy.
In the present invention, because the material by containing polyamide-imide resin forms diaphragm in the bottom surface of recess, therefore can guarantee to have considered environment resistant characteristic with resistance metallic plate.
Description of drawings
Fig. 1 is the stereogram of an embodiment of the invention.
Fig. 2 is the stereogram of the execution mode different with Fig. 1.
Fig. 3 shows each operation of the resistance metallic plate low-resistance value sheet shape resistor of shop drawings 1.
Fig. 4 shows each operation of the resistance metallic plate low-resistance value sheet shape resistor of shop drawings 2.
Fig. 5 is a resistance metallic plate low-resistance value sheet shape resistor of the present invention at the curve chart of at each temperature temperature coefficient of resistance, in the note on the use in the lump the resistance value of record be resistance value under 25 ℃ room temperature.
Symbol description
10 resistance metallic plate low-resistance value sheet shape resistors
11 resistance metallic plates
12 scolders
13 copper coins
14 tin-plated coating films
15 recesses
16 diaphragms
20 set multilayer plate bodys
22 rectangle multilayer plate bodys
23 diffusion layers
30 resistance metallic plate low-resistance value sheet shape resistors
31 resistance metallic plates
32 scolders
33 copper coins
34 tin-plated coating films
35 recesses
36 diaphragms
40 set multilayer plate bodys
42 rectangle multilayer plate bodys
43 diffusion layers
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described, but the present invention is not limited to these execution modes.
Fig. 1 is the stereogram of the resistance metallic plate low-resistance value sheet shape resistor 10 of an execution mode, and Fig. 2 is the stereogram of the resistance metallic plate low-resistance value sheet shape resistor 30 of another execution mode.
In the resistance metallic plate low-resistance value sheet shape resistor 10 of Fig. 1; on a face of resistance metallic plate 11, welded copper coin 13 by scolder 12 as electrode; and on copper coin 13, form tin-plated coating film 14; remove the diffusion layer of tin-plated coating film 14, copper coin 13, scolder 12 and scolder 12 and resistance metallic plate 11 then from basic central portion; form recess 15, and form diaphragm 16 in the bottom surface of this recess 15.
In the resistance metallic plate low-resistance value sheet shape resistor 30 of Fig. 2, on two faces of resistance metallic plate 31, welded copper coin 33 by scolder 32,32; 33, and on two copper coins 33,33, form tin-plated coating film 34; 34, remove tin-plated coating film 34,34, copper coin 33 from the basic central portion of two faces then; 33, the diffusion layer at least of scolder 32,32 and scolder 32,32 and resistance metallic plate 31; form recess 35,35, and at recess 35; 35 bottom surface forms diaphragm 36,36.
Wherein, above-mentioned resistance metallic plate 11,31 can use the plate body of the alloy that contains the above copper of 90 weight %, as such alloy, for example can enumerate the alloy that contains Cu and Ni; The alloy that contains Cu, Mn and Sn; Contain the alloy of Cu, Mn, Sn and Ge etc.In addition, above-mentioned scolder 12,32 can use the scolder that comprises copper-Yin binary eutectic alloy, for example can use the silver solder that is defined as BAg-8 in JIS.Z.3261.BAg-8 contains the Cu of 72% Ag and 28% and the solidus and the liquidus curve of melt temperature is 780 ℃ silver solder.Said protection film 16,36 can be formed by polysiloxane coupling agent, perhaps by forming as the polyamidoimide that contains the inorganic-organic composite material of silicon dioxide.
Then, with reference to Fig. 1 and Fig. 3 the manufacture method of the resistance metallic plate low-resistance value sheet shape resistor 10 of Fig. 1 is described.
For example, when making the resistance metallic plate low-resistance value sheet shape resistor 10 of long 13mm, wide 6.3mm, at first, in the stove of atmosphere of hydrogen, use the scolder 12 that comprises copper-Yin eutectic alloy with 850 ℃ of welding copper coins 13 on a face of the resistance metallic plate 11 that comprises the alloy plate body that contains the above copper of 90 weight % of peak temperature.
Wherein, resistance metallic plate 11 for example uses that thickness is the alloy plate body of 0.5mm; Scolder 12 for example uses, and thickness is the BAg-8 of 0.05mm; Copper coin 13 for example uses, and thickness is the no-oxygen copper plate of 0.2mm; Above-mentioned material all uses about long 500mm, the material about wide 200mm.
Use contains the alloy plate body of the above copper of 90 weight % as resistance metallic plate 11, uses no-oxygen copper plates as the copper coin 13 of electrode, the coefficient of expansion that makes described resistance metallic plate 11 and copper coin 13 thus much at one, thereby produce warpage can prevent to weld the time.On the contrary, when using the copper containing ratio to be lower than 90% alloy, for example, in the time of will being welded on the alloy sheets of contamin (Cu85%, Mn 12%, Ni 2%, Fe 1%) as the copper coin of electrode, it is big that warpage becomes, therefore, in the present invention, preferably using the copper containing ratio is alloy plate body more than 90%.
In addition, owing to used the scolder 12 that comprises copper-Yin binary eutectic alloy, so be ohmic contact between resistance metallic plate 11 and the copper coin 13, can will be suppressed at extremely low level as near the resistance the copper coin 13 of electrode.
After copper coin 13 being welded on the face of resistance metallic plate 11, utilization is that the solution of principal component carries out alkali degreasing with NaOH, sodium metasilicate, removes the lubricant component attached to the metal surface, then, be immersed in the aqueous solution of dilute sulfuric acid, remove oxide-film.Remove after the oxide-film, form the tin-plated coating film 14 of the about 5 μ m of thickness by galvanoplastic on the whole surface of copper coin 13.
By implementing above operation, shown in Fig. 3 (a), copper coin 13 is engaged with on the face of resistance metallic plate 11 by scolder 12, and has formed tin-plated coating film 14 on this copper coin 13, thereby forms set multilayer plate body 20.For example length is about 500mm the set multilayer plate body 20 that forms, width is about 200mm, thickness is about 1.0mm.
Then, shown in the chain-dotted line 21 among Fig. 3 (a), will gather multilayer plate body 20 with the width W 1 of regulation and be cut into rectangle, form rectangular multilayer plate body 22.The cutting width W1 of this rectangular multilayer plate body 22 (the length W1 of minor face) is owing to be the position as length of the resistance metallic plate low-resistance value sheet shape resistor 10 that will make, therefore, be set at this and be 13mm, in addition, the length on long limit for example is about 500mm.
Then, shown in Fig. 3 (c), the basic central authorities of the short side direction of rectangular multilayer plate body 22 are cut along long side direction with width W 2, for example width 4mm.In this cut, remove the diffusion layer of tin-plated coating film 14, copper coin 13, scolder 12 and scolder 12 and resistance metallic plate 11 from the one side that is formed with tin-plated coating film 14, thereby form recess 15.
Need to prove, shown in Fig. 3 (d), the diffusion layer 23 of scolder 12 and resistance metallic plate 11 is from the surface cut of tin-plated coating film 14 to the about degree of depth about d1=0.3mm, and make resistance metallic plate 11 in the recess 15 be approximately thickness about d2=0.46mm, thereby positively remove diffused layer removal 23.
Shown in Fig. 3 (c); on a face of rectangular multilayer plate body 22; after the basic central authorities of short side direction form the recess 15 that prolongs along long side direction, shown in Fig. 3 (e), in the bottom surface of this recess 15, just expose on the face of resistance metallic plate 11 and form diaphragm 16.Diaphragm 16 is formed by polysiloxane coupling agent, perhaps by forming as the polyamidoimide that contains the inorganic-organic composite material of silicon dioxide.After forming diaphragm 16, shown in the double dot dash line 24 of Fig. 3 (e), with the length (being 6.3mm here) of regulation rectangular multilayer plate body 22 is cut off, thereby make resistance metallic plate low-resistance value sheet shape resistor 10.
By implementing above operation, can make the resistance metallic plate low-resistance value sheet shape resistor 10 that resistance value is lower than 1.0m Ω and has high reliability.
Then, with reference to Fig. 2 and Fig. 4 the manufacture method of resistance metallic plate low-resistance value sheet shape resistor 30 is described.
For example, when making the resistance metallic plate low-resistance value sheet shape resistor 30 of long 13mm, wide 6.3mm, at first, in the stove of atmosphere of hydrogen, use comprises the scolder 32 of copper-Yin eutectic alloy, 32 with 850 ℃ of welding copper coins 33,33 on two faces of the resistance metallic plate 31 that comprises the alloy plate body that contains the above copper of 90 weight % of peak temperature.
Wherein, resistance metallic plate 31 for example uses that thickness is the alloy plate body of 0.5mm; Scolder 32 for example uses, and thickness is the BAg-8 of 0.05mm; Copper coin 33 for example uses, and thickness is the no-oxygen copper plate of 0.2mm; Above-mentioned material all uses about long 500mm, the material about wide 200mm.
Then, utilizing with NaOH, sodium metasilicate is that the solution of principal component carries out alkali degreasing, removes the lubricant component attached to the metal surface, is immersed in the aqueous solution of dilute sulfuric acid again, removes oxide-film.Then, on the whole surface that is fixed on the copper coin 33,33 on two faces of resistance metallic plate 31, form the tin-plated coating film 34,34 of the about 5 μ m of thickness respectively by galvanoplastic.
Through above operation, shown in Fig. 4 (a), copper coin 33,33 is engaged with on two faces of resistance metallic plate 31 by scolder 32,32, and has formed tin-plated coating film 34,34 respectively on this copper coin 33,33, thereby forms set multilayer plate body 40.For example length is about 500mm this set multilayer plate body 40, width is about 200mm, thickness is about 1.0mm.
Then, shown in the chain-dotted line 41 among Fig. 4 (a), will gather multilayer plate body 40 with the width W 3 of regulation and be cut into rectangle, form rectangular multilayer plate body 42.The cutting width W3 of this rectangular multilayer plate body 42 (the length W3 of minor face) is owing to be the position as length of the resistance metallic plate low-resistance value sheet shape resistor 30 that will make, therefore, be set at this and be 13mm, in addition, the length on long limit for example is about 500mm.
Then, shown in Fig. 4 (c), cut respectively along long side direction with width W 4, for example width 4mm from the basic central authorities of the short side direction on the two sides of rectangular multilayer plate body 42.In the cut on the two sides of this rectangular multilayer plate body 42, remove tin-plated coating film 34 from the two sides that is formed with tin-plated coating film 34,34,34, copper coin 33,33, scolder 32,32 and scolder 32,32 and the diffusion layer 44 of resistance metallic plate 31, thus recess 35,35 formed.
Need to prove, shown in Fig. 4 (d), the diffusion layer 43 of scolder 32 and resistance metallic plate 31 is from tin-plated coating film 34,34 surface cut is the degree of depth about d3=0.3mm extremely approximately, and make recess 35, resistance metallic plate 31 in 35 is approximately the thickness about d4=0.4mm, thereby positively removes diffused layer removal 44.
Shown in Fig. 4 (c); basic central authorities at the short side direction of two faces of rectangular multilayer plate body 42 form the recess 35 that prolongs along long side direction; after 35; at this recess 35; 35 bottom surface separately, just expose on two faces of resistance metallic plate 31 by polyamidoimide etc. and form diaphragm 36,36.After forming diaphragm 36,36, shown in the double dot dash line 45 of Fig. 4 (e), with the length (being 6.3mm here) of regulation rectangular multilayer plate body 42 is cut off, thereby make resistance metallic plate low-resistance value sheet shape resistor 30.By above operation, can make the resistance metallic plate low-resistance value sheet shape resistor 30 that resistance value is lower than 1.0m Ω and has high reliability.
Then, Fig. 5 is resistance metallic plate low-resistance value sheet shape resistor 10 of the present invention and comparative example at the curve chart of at each temperature temperature coefficient of resistance (TCR), in the note on the use of Fig. 5 in the lump the resistance value of record be resistance value under 25 ℃ room temperature.
Wherein, Sample A is to use BCuP-3 as scolder, forms the resistance metallic plate low-resistance value sheet shape resistor of d2=0.39mm thickness, is shown as 0.61m Ω under 25 ℃ room temperature.BCuP-3 is the scolder of stipulating among the JIS.Z.3264, wherein contains 6% phosphorus (P), 5% silver (Ag), 89% copper (Cu).
Sample B is to use BAg-8 as scolder, forms the resistance metallic plate low-resistance value sheet shape resistor of d2=0.41mm thickness, is shown as 0.56m Ω under 25 ℃ room temperature.BAg-8 is the scolder of stipulating among the JIS.Z.3261, wherein contains 72% silver (Ag), 28% copper (Cu).
Sample C is to use the scolder of P-Cu system as scolder, forms the resistance metallic plate low-resistance value sheet shape resistor of d2=0.39mm thickness, is shown as 0.68m Ω under 25 ℃ room temperature.Just phosphorus (P) and copper (Cu) that the scolder of P-Cu system mainly contains.
The d2=0.39mm of Sample A, C, the d2=0.41mm of sample B, these thickness are basic identical, therefore, TCR and resistance value to described Sample A, B, C directly compare as can be known: use the Bag-8 that comprises copper-Yin bianry alloy minimum down 25 ℃ of room temperatures as the resistance value of the sample B of scolder, its TCR also roughly reduces.
Claims (5)
1. the manufacture method of a resistance metallic plate low-resistance value sheet shape resistor is characterized in that,
Copper coin is welded on the one or both sides of resistance metallic plate, removes oxide-film from the surface again, form tin-plated coating film on the whole surface of above-mentioned copper coin then, form set multilayer plate body thus,
Should gather the multilayer plate body with the width of expectation and be cut into rectangle, form rectangular multilayer plate body,
From the one or both sides that are formed with tin-plated coating film of this rectangular multilayer plate body the basic central authorities of short side direction are cut along long side direction with the width of stipulating; remove the diffusion layer at least of tin-plated coating film, copper coin, scolder and resistance metallic plate and scolder; form recess at one or both sides; and at the bottom surface of this recess formation diaphragm; width with expectation cuts off above-mentioned rectangular multilayer plate body then, thereby makes the resistor of sheet.
2. the manufacture method of the described resistance metallic plate low-resistance value sheet shape resistor of claim 1, wherein, above-mentioned resistance metallic plate is the alloy that contains the above copper of 90 weight %.
3. the manufacture method of the described resistance metallic plate low-resistance value sheet shape resistor of claim 1 wherein, is welded above-mentioned resistance metallic plate and above-mentioned copper coin by the scolder that comprises copper-Yin bianry alloy.
4. the manufacture method of the described resistance metallic plate low-resistance value sheet shape resistor of claim 1 wherein, forms diaphragm by the material that contains polyamide-imide resin in the bottom surface of above-mentioned recess.
5. resistance metallic plate low-resistance value sheet shape resistor; described resistance metallic plate low-resistance value sheet shape resistor is following formation: copper coin is welded on the one or both sides of resistance metallic plate; remove oxide-film from the surface again; form tin-plated coating film on the whole surface of above-mentioned copper coin then; form set multilayer plate body thus; to gather the multilayer plate body with the width of expectation and be cut into rectangle; the one or both sides that are formed with tin-plated coating film from rectangular multilayer plate body cut along long side direction with the width of stipulating the basic central authorities of short side direction again; remove tin-plated coating film; copper coin; at least the diffusion layer of scolder and resistance metallic plate and scolder; form recess at one or both sides; and at the bottom surface of this recess formation diaphragm, the width with expectation is cut to sheet with rectangular multilayer plate body then.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008036164A JP4537465B2 (en) | 2008-02-18 | 2008-02-18 | Resistance metal plate low resistance chip resistor manufacturing method |
| JP2008036164 | 2008-02-18 | ||
| JP2008-036164 | 2008-02-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101515497A true CN101515497A (en) | 2009-08-26 |
| CN101515497B CN101515497B (en) | 2011-08-03 |
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| CN200910006438XA Active CN101515497B (en) | 2008-02-18 | 2009-02-18 | Resistance metallic plate low-resistance value sheet shape resistor and manufacturing method thereof |
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| Country | Link |
|---|---|
| JP (1) | JP4537465B2 (en) |
| KR (1) | KR101064534B1 (en) |
| CN (1) | CN101515497B (en) |
| TW (1) | TWI395233B (en) |
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| JP4452196B2 (en) * | 2004-05-20 | 2010-04-21 | コーア株式会社 | Metal plate resistor |
| JP2006019669A (en) * | 2004-07-01 | 2006-01-19 | Seiden Techno Co Ltd | Resistor of low resistance using cladding material, and manufacturing method |
-
2008
- 2008-02-18 JP JP2008036164A patent/JP4537465B2/en active Active
-
2009
- 2009-02-06 KR KR1020090009669A patent/KR101064534B1/en active IP Right Grant
- 2009-02-12 TW TW098104498A patent/TWI395233B/en active
- 2009-02-18 CN CN200910006438XA patent/CN101515497B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104376938A (en) * | 2013-08-13 | 2015-02-25 | 乾坤科技股份有限公司 | Resistance device |
| CN106356167A (en) * | 2015-07-17 | 2017-01-25 | 乾坤科技股份有限公司 | Microresistor |
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
| CN113161092A (en) * | 2021-04-01 | 2021-07-23 | 肇庆市鼎湖正科集志电子有限公司 | Method for manufacturing strontium titanate annular piezoresistor copper-tin electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101515497B (en) | 2011-08-03 |
| TW200949866A (en) | 2009-12-01 |
| KR101064534B1 (en) | 2011-09-14 |
| JP4537465B2 (en) | 2010-09-01 |
| TWI395233B (en) | 2013-05-01 |
| JP2009194316A (en) | 2009-08-27 |
| KR20090089256A (en) | 2009-08-21 |
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