JP2010245488A - Resistor and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistor and manufacturing method of the same for reducing variations in characteristics in a manufacturing process, in a small resistor manufactured by processing a material composed of an alloy. <P>SOLUTION: An alloy wire material with a nearly circular cross section obtained by machining an ingot which has a resistive element 1 and connection terminals 2a, 2b, whose cross section is formed to a lateral U-shape by rolling is cut depending on the measured value of the thickness of the resistive element 1. A solder plating is formed on the connection surface of the connection terminals 2a, 2b, and an insulating film is formed in the resistive element 1. Thus, the small resistor which can be surface-mounted, and has an extremely small variation in properties is obtained. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resistor used for various electric and electronic devices and a method for manufacturing the same, and in particular, a resistor having a shape in which the overall dimensions are approximately 7 mm or less and a connection terminal is provided at both ends of a small plate-like resistor element portion. The present invention relates to a container and a manufacturing method thereof.

  As represented by mobile phones, demands for downsizing of electric and electronic devices in recent years have become stricter, and parts used for them are required to be downsized and to improve accuracy of characteristics. Also, from the viewpoint of structure, in order to cope with the automation of assembly work, it is an essential requirement to be a surface mounting type.

  One of such components is a resistor of about several mΩ used for battery packs such as mobile phones and notebook personal computers. FIG. 4 is a perspective view showing a conventional example of such a resistor. In FIG. 4, 7 is a resistance element portion, and 8a and 8b are connection terminal portions subjected to solder plating. In general, an insulating film is formed on the resistance element portion 7.

  Such a resistor is manufactured by a method in which an alloy plate whose resistance value is adjusted is cut into a required shape and then subjected to an insulation treatment or solder plating, and is obtained at low cost. However, in such a resistor, due to variations in the thickness of the plate material and variations in the cutting process, the variation in resistance value as a product is about ± 5%, which may not meet the required characteristics.

  In addition to the accuracy of the manufacturing process, the conventional resistor has a problem of promoting an increase in resistance value variation due to variations in the soldering state in the surface mounting process. As a coping method, Patent Document 1 discloses a resistor in which an oxide film is formed on a portion other than the terminal portion to suppress variation in the area to be bonded to the substrate by solder. However, this patent document does not necessarily sufficiently disclose the above-described variation in manufacturing process.

  JP 2002-075714 A

  Accordingly, an object of the present invention is to provide a resistor in which variation in characteristics in a manufacturing process is reduced in a small resistor manufactured by processing an alloy material, and a manufacturing method thereof.

  The present invention has been made as a result of reviewing the manufacturing process and the method of adjusting the resistance value.

  That is, the present invention is provided at a resistance element portion made of a metal plate member, a connection terminal projecting substantially perpendicular to both ends of one surface of the resistance element portion, and a tip end portion of the connection terminal. A resistor having an insulating coating formed on a portion other than the tip portion.

  In the present invention, the metal component is 6.0 to 8.0 wt% Mn, 1.5 to 3.0 wt% Sn, and the balance is Cu. It is a vessel.

  Further, the present invention is the resistor described above, wherein the plating layer is made of solder containing Sn and Ag.

  In addition, the present invention is a rod-shaped material made of metal and having a substantially circular cross section, and is rolled between a roll having a concave portion on the surface and a roll having a convex portion on the surface, and the cross section is U-shaped. A step of forming a band-shaped material, a step of forming a member having projecting portions substantially perpendicular to both ends of one surface of the plate-shaped member, a step of forming an insulating film on the band-shaped member, and the projecting The method of manufacturing a resistor according to claim 1, further comprising a step of plating the tip of the part, and a step of cutting the strip material in a direction perpendicular to the length direction.

  Moreover, this invention has the process of determining the cutting length of the said strip | belt-shaped material by the measured value of the thickness of the substantially center part of the said plate-shaped member, The manufacturing method of the said resistor characterized by the above-mentioned.

  In the method of manufacturing a resistor according to the present invention, the resistance element portion and the terminal portion are formed by rolling the rod-shaped metal material with a roll, so that the thickness of the resistance element portion can be controlled with high accuracy. Product characteristic variation can be reduced.

  Furthermore, since the resistance value in the manufacturing process can be adjusted by feeding back the measurement result of the thickness of the resistance element portion to the cutting length of the rolled material, it is possible to contribute to further reducing product characteristic variations.

  Also, solder plating can be applied to the connection terminal part to improve the reliability of the mounting process, and an insulating film is formed on the part other than the terminal, so there is no extra solder in the mounting process. It is not attached to the portion of the resistance element, and the cause of characteristic variation can be reduced.

  In the present invention, the metal component used as a material is limited to obtain a required resistance value and the result of considering the workability of rolling, and the composition of the solder used for plating is limited. This is a result of not using Pb in consideration of environmental load and considering the heat resistance of the insulating coating.

  The perspective view which shows an example of the resistor which concerns on this invention   The flowchart which shows the manufacturing process of the resistor of this invention.   The figure which showed typically the roll rolling in the manufacturing process of the resistor of this invention   The figure which shows an example of the conventional resistor

  Next, an embodiment of the present invention will be described.

  FIG. 1 is a perspective view showing an example of a resistor according to the present invention. In FIG. 1, 1 is a resistance element portion, 2a and 2b are connection terminal portions, and 3a and 3b are solder plating layers. The metal components used in this example are 2.0% by weight of Mn, 2.3% by weight of Sn, and the balance is Cu. In addition, an insulating coating made of polyimide is formed on the portions excluding the connection terminals 2a and 2b and the cut surface.

  Here, polyimide was used for forming the insulating film, but it is not limited to this as long as it has heat resistance that does not lose the characteristics as the insulating film in the reflow process. ) And a polymer material of polyamide-imide and the like can be used. Various inorganic oxides can also be used, but it is desirable to use the above-described polymer material in consideration of mechanical strength as an insulating film.

  The overall width and depth are 6 to 7 mm and 3 to 4 mm, respectively. The width and thickness of the resistive element 1 part are 2 mm and 0.2 mm, respectively, and are connected to the resistive element 1 part. The total thickness of the terminal 2a or 2b portion is 0.3 mm, and the width of the connection terminal 2a or 2b portion is 2 mm. The resistance value obtained with such dimensions is approximately 0.5 mΩ.

  FIG. 2 is a flowchart showing a manufacturing process of the resistor of the present invention, and FIG. 3 is a diagram schematically showing roll rolling in the manufacturing process of the resistor of the present invention. In FIG. 3, 4 is a rod-shaped metal material, 5 is a roll having concave portions formed on the surface, and 6 is a roll having convex portions formed on the surface.

  Hereafter, the manufacturing process of the resistor concerning this invention is demonstrated, referring the flowchart of FIG. First, raw materials were weighed so that Mn was 2.0% by weight, Sn was 2.3% by weight, and Cu was 95.7% by weight, and melted using a high-frequency melting furnace to obtain an ingot.

  Next, the obtained ingot was hot-rolled using a multistage roll to form a plate having a thickness of about 3 mm. The plate-like material was cut into a width, and then subjected to a die drawing process and a centerless polishing process to obtain a wire having a circular cross section with a diameter of 2 mm. If there is a scratch on the surface of the wire, a large defect may be generated on the surface of the finished product. Therefore, polishing for removing the scratch on the surface was performed before the next step.

  Next, as shown in FIG. 3, the wire 5 is rolled using the roll 5 having a concave portion formed on the surface and the roll 6 having a convex portion formed on the surface, and the portion of the resistance element 1 and the connection terminal It was set as the cross-sectional shape which has the part of 2a, 2b. After making the cross section the same as the product shape in this way, a polyimide resin precursor made of a polyamic acid solution was used to form a polyimide resin insulating film having a thickness of about 30 μm.

  Next, the thickness of the portion of the resistance element 1 was measured, the cutting length was determined based on the obtained measurement value, and press cutting was performed. Plating was performed using solder having a composition of Ag of 3.5% by weight and the balance of Sn. Incidentally, the solid line of this Sn-Ag solder is 221 ° C. and the liquid phase 223 ° C., and the thermal degradation of the insulating coating in the reflow process is extremely small.

  As described above, the resistance element of the present invention is extremely small in size and has very little variation in characteristics, and contributes to miniaturization and high performance of electrical and electronic equipment. Note that the present invention is not limited to the above-described embodiment, and various modifications that can be conceived by those having ordinary knowledge in the field of the present invention, for example, using another material as the insulating coating. Needless to say, even if there is a design change within a range that does not depart from the gist including the correction, it is included in the present invention.

DESCRIPTION OF SYMBOLS 1,7 Resistance element part 2a, 2b, 8a, 8b Connection terminal part 3a, 3b Solder plating layer 4 Rod-shaped metal material 5 Roll with the concave part formed on the surface 6 Roll with the convex part formed on the surface

Claims (5)

  A resistance element portion made of a metal plate-like member, a connection terminal projecting substantially perpendicular to both ends of one surface of the resistance element portion, and a plating layer provided at the tip of the connection terminal; A resistor having an insulating film formed on a portion other than the tip portion.   The resistor according to claim 1, wherein the metal component is 6.0 to 8.0 wt% Mn, 1.5 to 3.0 wt% Sn, and the balance is Cu.   The resistor according to claim 1, wherein the plated layer is made of solder containing Sn and Ag.   A step of rolling a bar-shaped material made of metal and having a substantially circular cross section between a roll having a concave portion on the surface and a roll having a convex portion on the surface to form a band-shaped material having a U-shaped cross section; Thus, a step of forming a member having protruding portions substantially perpendicular to both ends of one surface of the plate-shaped member, a step of forming an insulating film on the belt-shaped member, and a plating treatment on the tip of the protruding portion The method of manufacturing a resistor according to any one of claims 1 to 3, further comprising a step of cutting the strip-shaped material in a direction perpendicular to a length direction.   5. The method of manufacturing a resistor according to claim 4, further comprising a step of determining a cutting length of the band-shaped material from a measured value of a thickness of a substantially central portion of the plate-shaped member.

Images