JP2009043958A - Chip type metal plate resistor, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type metal plate resistor and a manufacturing method of the chip type metal plate resistor, capable of stabilizing the value of resistance. <P>SOLUTION: The chip type metal plate resistor includes: a resistor 1 composed of a metal plate mainly made of Cu or Ni; a pair of electrodes 2 provided at both the ends of the resistor 1; and a plated layer 3 provided on the surface of the electrodes 2. By heat-treating the plate layer 3, resistor 1 and electrodes 2 in a nitrogen atmosphere, the resistor 1 is joined to the electrodes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a chip-type metal plate resistor used for detecting a current value of various electronic devices and a manufacturing method thereof.

  A conventional chip-type metal plate resistor of this type includes a resistor composed of a metal plate and a pair of electrodes provided on both ends of the resistor and having a plating layer formed on the surface thereof. Was configured. Further, the resistor and the pair of electrodes are joined by heating the resistor and the pair of electrodes to melt the plating layer.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
International Publication No. 99/18584 Pamphlet

  In the above-described conventional chip-type metal plate resistor, since the resistor and the electrode are connected via the plating layer, contact resistance occurs due to the plating layer interposed between the resistor and the electrode, This has a problem that the resistance value is not stable.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a chip-type metal plate resistor capable of stabilizing a resistance value and a manufacturing method thereof.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, there is provided a resistor composed of a metal plate mainly composed of Cu or Ni, a pair of electrodes provided at both ends of the resistor, and a surface of the electrode. The resistor and the electrode are joined by heat-treating the plating layer, the resistor, and the electrode in a nitrogen atmosphere. According to this configuration, the resistor and the electrode are connected to each other. In addition, since a metal layer in which the plating layer and the electrode are diffused is configured, there is almost no contact resistance between the resistor and the electrode, and the bonding strength between the resistor and the electrode is increased. The effect that the value can be stabilized is obtained.

  According to the second aspect of the present invention, the plating layer is composed of at least one metal of Cu, Sn, Ag, and Zn. According to this configuration, the metal layer in which the plating layer and the electrode are diffused is used. The effect that it is easy to construct is obtained.

  According to a third aspect of the present invention, there is provided a process for forming a plating layer on the surfaces of a pair of electrodes, and the pair of electrodes at both ends of a resistor composed of a metal plate mainly composed of Cu or Ni. And a step of heating the plating layer, the resistor and the electrode at a temperature of 600 ° C. to 1000 ° C. in a nitrogen atmosphere. According to this manufacturing method, the resistor and the electrode Since a metal layer in which the plating layer and the electrode are diffused can be formed between them, there is almost no contact resistance between the resistor and the electrode, and the bonding strength between the resistor and the electrode is increased. The effect that it can be stabilized is obtained.

  As described above, the chip-type metal plate resistor of the present invention joins the resistor and the electrode by heat-treating the plating layer, the resistor and the electrode in a nitrogen atmosphere. Therefore, a metal layer formed by diffusing the plating layer and the electrode can be formed, so that contact resistance is hardly generated between the resistor and the electrode, and the bonding strength between the resistor and the electrode is high. Therefore, the excellent effect that the resistance value can be stabilized is exhibited.

  Hereinafter, a chip-type metal plate resistor according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a chip-type metal plate resistor according to an embodiment of the present invention, and FIG. 2 is a perspective view of the chip-type metal plate resistor with a protective film removed.

  As shown in FIGS. 1 and 2, a chip-type metal plate resistor according to an embodiment of the present invention includes a resistor 1 composed of a metal plate mainly composed of Cu or Ni, and the resistor 1. A pair of electrodes 2 provided at both ends and a plating layer 3 provided on the surface of the electrode 2 are provided, and the plating layer 3, the resistor 1 and the electrode 2 are heat-treated in a nitrogen atmosphere. Thus, the resistor 1 and the electrode 2 are joined together.

  In the above configuration, the resistor 1 is made of a metal plate mainly composed of Cu or Ni made of copper nickel, nickel chromium, copper manganese nickel, etc., and has a length of 0.4 to 15 mm and a width of 0.1 mm. The thickness is 15 to 10 mm, and the thickness is 50 to 1000 μm. Further, a protective film 4 made of an insulating material such as epoxy resin or polyimide resin is formed on the lower surface and upper surface of the resistor 1 where the pair of electrodes 2 are not formed, and on the side surface of the resistor 1, The resistor 1 has a notch (not shown) for adjusting the resistance value.

  The pair of electrodes 2 is made of a metal made of Cu that is separate from the resistor 1, and its length is 1/10 to 1/3 of the length of the resistor 1. Yes. The pair of electrodes 2 are formed in a U-shaped cross section, and are provided so that both ends of the resistor 1 are fitted into the recesses of the U-shaped electrode 2.

  Further, the plated layer 3 made of Sn is formed on the entire surface of the pair of electrodes 2, whereby the chip-type metal plate resistor is mounted on the substrate. The plating layer 3 is not limited to Sn, and may be composed of Cu, Ag, Ni, or Zn. Further, a base plating made of Ni may be formed on the surface of the electrode 2, and a plating layer 3 such as Sn may be further formed on the surface.

  A metal layer 5 formed by diffusing the plating layer 3 and the electrode 2 is formed between the resistor 1 and the electrode 2, and this metal layer 5 is formed of Cu constituting the electrode 2. And Sn etc. which comprise the plating layer 3 are the part which diffused and mixed, and has a thickness of 0.1-1 micrometer.

  Next, the manufacturing method of the chip type metal plate resistor in one embodiment of the present invention will be described.

  First, a plate-like resistor 1 is formed by cutting a metal plate made of copper nickel, nickel chrome, copper manganese nickel, etc., and punched into a metal made of Cu separate from the resistor 1 A pair of U-shaped electrodes 2 is formed by processing, pressing, or the like. Thereafter, the plating layer 3 made of Sn is formed by performing electrolytic plating on the entire surface of the electrode 2.

  Next, as shown in FIGS. 1 and 2, both ends of the resistor 1 are fitted into the recesses of the U-shaped electrode 2.

  Next, the resistor 1, the electrode 2, and the plating layer 3 configured as described above are heat-treated by heating at a temperature of 600 ° C. to 1000 ° C. in a nitrogen atmosphere. In this case, the nitrogen atmosphere indicates an atmosphere in which the resistor 1, the electrode 2, and the plating layer 3 are not oxidized. For example, the atmosphere may be nitrogen or green gas.

  The reason why the heating temperature in the heat treatment is set to 600 ° C. or more is that, as shown in FIG. 3, the bonding strength between the resistor 1 and the electrode 2 can be set to 30 N or more. In this case, generally, a bonding strength of 30 N or more is required. In FIG. 3, the resistor 1 is made of nickel chrome, the electrode 2 is made of Cu, and the plating layer 3 is made of Sn. Furthermore, the heating temperature is set to 1000 ° C. or lower because when the temperature exceeds 1000 ° C., the temperature becomes close to the melting point of Cu constituting the electrode 2 and the shape of the electrode 2 is not stable.

  Thus, if the resistor 1, the electrode 2, and the plating layer 3 are heated at a temperature of 600 ° C. to 1000 ° C. in a nitrogen atmosphere, the plating layer 3 and the electrode 2 are interposed between the resistor 1 and the electrode 2. The metal which comprises each can be spread | diffused and the metal layer 5 can be formed.

  Next, a notch (not shown) is formed in the resistor 1 with a laser for adjusting the resistance value.

  Finally, the protective film 4 is formed on the lower surface and upper surface of the resistor 1 where the electrode 2 is not formed and on the side surface of the resistor 1.

  In the above-described chip-type metal plate resistor according to one embodiment of the present invention, the resistor 1 and the electrode 2 are joined by heat-treating the plating layer 3, the resistor 1 and the electrode 2 in a nitrogen atmosphere. The metal layer 5 formed by diffusing the plating layer 3 and the electrode 2 can be formed between the resistor 1 and the electrode 2, whereby the contact resistance is provided between the resistor 1 and the electrode 2. Since the bonding strength between the resistor and the electrode is increased, the resistance value can be stabilized.

  That is, the resistance value of the pair of electrodes 2 in contact with the mounting substrate is the resistance value of the chip-type metal plate resistor, but if a plating layer is interposed between the resistor 1 and the electrode 2, the resistance 1 Since a contact resistance occurs between the electrode layer 2 and the electrode layer 2 and the plating layer, there is a possibility that a desired resistance value may not be obtained, and this contact is particularly desired when securing a low resistance value of 10 mΩ or less. Resistance cannot be ignored. On the other hand, in one embodiment of the present invention, the resistor 1 and the plating layer 3 are subjected to heat treatment at a high temperature of 600 ° C. or higher without interposing the plating layer between the resistor 1 and the electrode 2 as it is. Since the electrodes 2 and the plating layer 3 are bonded to each other by the metal layer 5 in which these metals are diffused, there is almost no contact resistance. As a result, the bonding between the resistor 1 and the electrode 2 Strength also increases.

  Furthermore, since it is not necessary to apply high pressure to the resistor 1 and the electrode 2, the resistor 1 and the electrode 2 can be firmly joined without deforming the shape of the resistor 1 and the electrode 2.

  In addition, the plating layer 3 formed on the entire surface of the electrode 2 not only has a function of enabling the chip-type metal plate resistor to be mounted on the mounting substrate, but also enables suppression of the generation of contact resistance as described above. It has both functions.

  In the above-described embodiment of the present invention, the case where both ends of the resistor 1 are fitted into the recesses of the U-shaped electrode 2 has been described. However, as shown in FIG. It may be configured to be bent in a letter shape so that both ends of the resistor 1 are wrapped with the U-shaped electrode 2, and a pair of electrodes 2 are provided only on the lower surfaces of both ends of the resistor 1. It may be a thing.

  The chip-type metal plate resistor according to the present invention has an effect that the resistance value can be stabilized, and in particular, the chip-type metal plate resistor used for detecting the current value of various electronic devices and the like It becomes useful when applied to a manufacturing method or the like.

Sectional drawing of the chip-type metal plate resistor in one embodiment of this invention Perspective view of the chip type metal plate resistor with the protective film removed The figure which shows the relationship between the heating temperature in the heat treatment of the same chip type metal plate resistor and the bonding strength of the electrode and the resistor Perspective view showing another example of the same chip type metal plate resistor

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resistor 2 A pair of electrodes 3 Plating layer

Claims (3)

A resistor comprising a metal plate mainly composed of Cu or Ni, a pair of electrodes provided at both ends of the resistor, and a plating layer provided on the surface of the electrode, the plating layer A chip type metal plate resistor in which the resistor and the electrode are joined by heat-treating the resistor and the electrode in a nitrogen atmosphere. The chip-type metal plate resistor according to claim 1, wherein the plating layer is made of at least one metal of Cu, Sn, Ag, and Zn. A step of forming a plating layer on the surface of the pair of electrodes, a step of forming the pair of electrodes on both ends of a resistor composed of a metal plate mainly composed of Cu or Ni, and 600 ° C. in a nitrogen atmosphere. The manufacturing method of the chip-type metal plate resistor provided with the process of heating the said plating layer, a resistor, and an electrode at the temperature of -1000 degreeC.

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