JP2012099744A - Metal plate low resistance chip resistor and method of manufacturing the same - Google Patents

Metal plate low resistance chip resistor and method of manufacturing the same Download PDF

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JP2012099744A
JP2012099744A JP2010247973A JP2010247973A JP2012099744A JP 2012099744 A JP2012099744 A JP 2012099744A JP 2010247973 A JP2010247973 A JP 2010247973A JP 2010247973 A JP2010247973 A JP 2010247973A JP 2012099744 A JP2012099744 A JP 2012099744A
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plate
strip
resistance
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metal
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Kazumi Akatsu
和三 赤津
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Shintec Co Ltd
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PROBLEM TO BE SOLVED: To provide a metal plate low resistance chip resistor which allows for manufacturing cost reduction by a step for setting an exact resistance value easily.SOLUTION: In the metal plate low resistance chip resistor, both end sides of a metal resistance plate formed in substantially rectangular shape serve as a pair of terminal electrodes, notches are formed in both sides between the pair of terminal electrodes and a concave step is formed on the lower surface side as a fixed resistance part, and a protective film insulating the fixed resistance part and an electrode film insulating the pair of terminal electrodes are provided. Consequently, the manufacturing process can be simplified sharply, and the manufacturing cost can be reduced by decreasing the number of components.

Description

本発明は、簡易な工程で製造コストを低減できる金属板低抵抗チップ抵抗器およびその製造方法に関する。   The present invention relates to a metal plate low resistance chip resistor capable of reducing the manufacturing cost by a simple process and a method for manufacturing the same.

大電流の検出用に低抵抗器(シャント抵抗器)を用いることは良く知られている。   It is well known to use low resistors (shunt resistors) for the detection of large currents.

従来、電流検出用低抵抗器としては、例えば、特許文献1に記載されたように、板状の金属製抵抗体の裏面中央部が切削されて凹部が形成され、表面両端部に一対のボンディング用電極パッドが形成され、前記凹部に隣接する裏面両端部に一対の接続用電極が形成された電流検出用低抵抗器がある。   Conventionally, as a low-current resistor for current detection, for example, as described in Patent Document 1, a central portion on the back surface of a plate-shaped metal resistor is cut to form a recess, and a pair of bonding is formed at both ends of the surface. There is a current detection low resistor in which electrode pads are formed and a pair of connection electrodes are formed at both ends of the back surface adjacent to the recess.

特開2001−118701JP 2001-118701 A

しかしながら、特許文献1では金属製抵抗体の裏面中央部を切削して断面積を調整することにより抵抗値を調節するため、製造工程が煩雑になるという問題点があった。   However, in Patent Document 1, there is a problem that the manufacturing process becomes complicated because the resistance value is adjusted by cutting the back center portion of the metal resistor and adjusting the cross-sectional area.

上記事情に鑑み、本発明は製造工程が簡素でかつ部品点数が少なくて製造コストを低減できると共に、放熱性に優れた電流検出用の金属板低抵抗チップ抵抗器およびその製造方法を提供するものである。   In view of the above circumstances, the present invention provides a metal plate low-resistance chip resistor for current detection that has a simple manufacturing process and has a small number of parts and can reduce manufacturing costs, and is excellent in heat dissipation, and a method for manufacturing the same. It is.

本発明の第一構成における金属板低抵抗チップ抵抗器は、略矩形状に形成された金属抵抗板の両端側を一対の端子電極とし、前記一対の端子電極間の両側辺に切り欠きを形成すると共に、プレス成型により下面側に凹段部を形成して固定抵抗部とし、前記固定抵抗部を内包して絶縁被覆する保護膜と、前記一対の端子電極の少なくとも下面側を導電被覆した電極膜とを備えたことを特徴とする。
金属抵抗体は、銅・ニッケル合金、ニッケル・クロム合金又は鉄・クロム合金等のように低い抵抗を有する基材の金属に対してこの基材の金属よりも高い抵抗を有する金属を添加して成る合金製である。
本願発明において用いる絶縁被覆における絶縁とは電気的な絶縁性を有することを意味し、保護膜としては例えば熱硬化性樹脂が挙げられる。導電被覆における導電とは電気的な導電性を有することを意味し、導電被覆としては例えば金属メッキが挙げられる。
電極膜は端子電極の下面側だけでなく上面側を導電被覆するようにしても良い。
The metal plate low resistance chip resistor in the first configuration of the present invention has a pair of terminal electrodes at both ends of the metal resistor plate formed in a substantially rectangular shape, and has notches formed on both sides between the pair of terminal electrodes. In addition, a concave step portion is formed on the lower surface side by press molding to form a fixed resistance portion, a protective film including the fixed resistance portion and insulatingly coated, and an electrode in which at least the lower surface side of the pair of terminal electrodes is conductively coated And a membrane.
The metal resistor is made by adding a metal having a resistance higher than that of the base metal to a base metal having a low resistance such as a copper / nickel alloy, a nickel / chromium alloy or an iron / chromium alloy. Made of alloy.
Insulation in the insulating coating used in the present invention means having electrical insulation, and examples of the protective film include thermosetting resins. Conductivity in the conductive coating means having electrical conductivity, and examples of the conductive coating include metal plating.
The electrode film may be conductively coated not only on the lower surface side but also on the upper surface side of the terminal electrode.

本発明の第二構成では第一構成における前記固定抵抗部を、前記一対の端子電極間の両側辺を切り欠き、かつ、プレス成型により下面側に凹段部を形成すると共に上面側に凸段部を形成して固定抵抗部としたことを特徴とする。
金属抵抗板の上面側に凸段部を形成するかどうかは、必要とされる抵抗値、金属抵抗板の材質や厚さ、プレス成型の押圧力などの諸条件により選択される。
In the second configuration of the present invention, the fixed resistance portion in the first configuration is formed by notching both sides between the pair of terminal electrodes and forming a concave step portion on the lower surface side by press molding and a convex step on the upper surface side. A fixed resistance portion is formed by forming a portion.
Whether to form the convex step on the upper surface side of the metal resistor plate is selected depending on various conditions such as a required resistance value, a material and thickness of the metal resistor plate, and a pressing force of press molding.

本発明の第三構成における金属板低抵抗チップ抵抗器の製造方法は、帯状金属抵抗板の長辺方向に沿って帯状金属抵抗板の短辺方向の略中央部に所定間隔で一列に並ぶ複数の穴を形成する開口工程と、帯状金属抵抗板の長辺方向に沿って帯状金属抵抗板の短辺方向の略中央部の下面側にプレス成型による連続した凹段部を形成する成型工程と、前記帯状金属抵抗板の前記凹段部および前記凹段部に対向する上面側を内包して絶縁被覆する保護膜を形成する保護膜形成工程と、前記帯状金属抵抗板の短辺方向における両端側の下面側を導電被覆して電極膜を形成する電極膜形成工程と、前記帯状金属抵抗板を前記穴が設けられた部分で短辺方向に切断する切断工程と、を備えることを特徴とする。   The manufacturing method of the metal plate low resistance chip resistor according to the third configuration of the present invention includes a plurality of lines arranged in a line at a predetermined interval at a substantially central portion in the short side direction of the strip metal resistor plate along the long side direction of the strip metal resistor plate. An opening step for forming a hole in the metal strip, and a molding step for forming a continuous concave step portion by press molding on the lower surface side of the substantially central portion in the short side direction of the strip metal resistor plate along the long side direction of the strip metal resistor plate A protective film forming step of forming a protective film including the concave step portion of the strip-shaped metal resistor plate and an upper surface side facing the concave step portion to insulate and covering both ends of the strip-shaped metal resistor plate in the short side direction; An electrode film forming step of forming an electrode film by conductively coating the lower surface side of the side, and a cutting step of cutting the strip-shaped metal resistance plate in a short side direction at a portion where the hole is provided, To do.

本発明の第四構成では第三構成における前記成型工程を、帯状金属抵抗板の短辺方向における略中央部の下面側にプレス成型による凹段部を形成すると共に、帯状金属抵抗板の上面側に前記凹段部に対向する凸段部を形成する成型工程としたことを特徴とする。
金属抵抗板の下面側に設けた凹段部に対向する凸段部を上面側に形成するかどうかは、必要とされる抵抗値、金属抵抗板の材質や厚さ、プレス成型の押圧力などの諸条件により選択される。
In the fourth configuration of the present invention, the molding step in the third configuration is formed by forming a concave step portion by press molding on the lower surface side of the substantially central portion in the short side direction of the strip-shaped metal resistor plate, and on the upper surface side of the strip-shaped metal resistor plate. The molding step is to form a convex step portion facing the concave step portion.
Whether or not to form a convex step on the upper surface side opposite to the concave step provided on the lower surface side of the metal resistance plate depends on the required resistance value, the material and thickness of the metal resistance plate, the pressing force of the press molding, etc. It is selected according to various conditions.

本発明によれば、帯状金属抵抗板をプレス成型により変形加工して裏面側に凹段部を形成し、必要により上面側に凸段部を形成することで固定抵抗部とし、固定抵抗部の両端側を一対の接続用電極とした金属板低抵抗チップ抵抗器とすることができ、製造工程の大幅な簡素化と部品点数の低減による製造コストの低減が可能である。
また本発明の金属板低抵抗チップ抵抗器では、帯状金属抵抗板の穴位置で短辺方向に切断して端子電極間に幅が狭い固定抵抗部を設けることができ、高い精度で所定の特定抵抗値範囲内とすることが可能になる。
さらに、固定抵抗部は端子電極と比較して固定抵抗部の両側の切り欠き分だけ幅が狭くなり、幅よりも長さを大きく形成できるため、従来の金属板低抵抗チップ抵抗器のように、孔、溝又はスリットを設けた従来技術と異なりホットスポットの発生を防止でき、高い信頼性を有すると共に物理的にも十分な強度が確保することができる。
According to the present invention, the belt-shaped metal resistor plate is deformed by press molding to form a concave step portion on the back surface side, and if necessary, a convex step portion is formed on the upper surface side to form a fixed resistance portion. A metal plate low resistance chip resistor having both ends as a pair of connection electrodes can be obtained, and the manufacturing process can be greatly simplified and the manufacturing cost can be reduced by reducing the number of components.
Further, in the metal plate low resistance chip resistor of the present invention, a fixed resistor portion having a narrow width can be provided between the terminal electrodes by cutting in the short side direction at the hole position of the belt-like metal resistor plate, and a predetermined specified with high accuracy. It becomes possible to be within the resistance value range.
Furthermore, the fixed resistor portion is narrower by notches on both sides of the fixed resistor portion than the terminal electrode, and can be formed longer than the width, so that it can be formed like a conventional metal plate low resistance chip resistor. Unlike the prior art in which holes, grooves or slits are provided, the occurrence of hot spots can be prevented, and high reliability and a sufficient physical strength can be ensured.

本実施例1の金属板低抵抗チップ抵抗器の概観図(a)、金属抵抗板(b)である。It is a general-view figure (a) of the metal plate low resistance chip resistor of the present Example 1, and a metal resistance plate (b). 本実施例1の金属板低抵抗チップ抵抗器の平面図(a)、A−A線断面図(b)、B−B線断面図(c)である。It is the top view (a) of the metal plate low resistance chip resistor of the present Example 1, AA sectional view (b), BB sectional drawing (c). 本実施例1の金属板低抵抗チップ抵抗器の製造工程における帯状金属抵抗板の説明図(a)、C−C線断面図(b)である。It is explanatory drawing (a) of a strip | belt-shaped metal resistance board in the manufacturing process of the metal plate low resistance chip resistor of the present Example 1, and CC sectional view (b). 本実施例2の金属板低抵抗チップ抵抗器の概観図(a)、金属抵抗板(b)である。They are a general-view figure (a) of the metal plate low resistance chip resistor of the present Example 2, and a metal resistance plate (b). 本実施例2の金属板低抵抗チップ抵抗器の平面図(a)、A−A線断面図(b)、B−B線断面図(c)である。It is the top view (a) of the metal plate low resistance chip resistor of the present Example 2, AA sectional view (b), BB sectional drawing (c). 本実施例2の金属板低抵抗チップ抵抗器の製造工程における帯状金属抵抗板の説明図(a)、C−C線断面図(b)である。It is explanatory drawing (a) of a strip | belt-shaped metal resistance board in the manufacturing process of the metal plate low resistance chip resistor of the present Example 2, and CC sectional view (b).

以下、図面を参照して本願発明の実施の形態について説明するが、本発明はこれに限定されるものではない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

図1は本実施例1の金属板低抵抗チップ抵抗器の概観図(a)、金属抵抗板(b)であり、図2は本実施例1の金属板低抵抗チップ抵抗器の平面図(a)、A−A線断面図(b)、B−B線断面図(c)である。   FIG. 1 is a schematic view (a) and a metal resistor plate (b) of the metal plate low resistance chip resistor of the first embodiment, and FIG. 2 is a plan view of the metal plate low resistance chip resistor of the first embodiment ( They are a), AA sectional view (b), BB sectional drawing (c).

本実施例1の金属板低抵抗チップ抵抗器10は、略矩形状に形成された金属抵抗板10aの両端側を一対の端子電極11としている。端子電極11間の両側辺には切り欠き12aを形成すると共に、プレス成型により下面側に凹段部12bを形成し、凹段部12bに対向する上面側の平面部12cとから区画される厚さD1r、長さL1r、幅W1rの固定抵抗部12としている。金属板低抵抗チップ抵抗器10の上面側、および固定抵抗部12の切り欠き12aと凹段部12bは保護膜13で絶縁被覆している。保護膜13の上面は平坦に形成しており、切り欠き12a、凹段部12bと平面部12cからなる固定抵抗部12は金属抵抗板10aと同程度の幅を有する保護膜13に内包している。また、端子電極11の下面側は電極膜14により導電被覆している。   In the metal plate low resistance chip resistor 10 according to the first embodiment, both end sides of the metal resistor plate 10a formed in a substantially rectangular shape are used as a pair of terminal electrodes 11. Notches 12a are formed on both sides between the terminal electrodes 11, and a concave step portion 12b is formed on the lower surface side by press molding, and the thickness is defined by the upper surface side flat portion 12c facing the concave step portion 12b. The fixed resistance portion 12 has a length D1r, a length L1r, and a width W1r. The upper surface side of the metal plate low resistance chip resistor 10, and the notch 12 a and the recessed step portion 12 b of the fixed resistance portion 12 are covered with an insulating film 13. The upper surface of the protective film 13 is formed flat, and the fixed resistance portion 12 including the notch 12a, the concave step portion 12b, and the flat surface portion 12c is included in the protective film 13 having the same width as the metal resistance plate 10a. Yes. Further, the lower surface side of the terminal electrode 11 is conductively covered with an electrode film 14.

次に、本実施例1の金属板低抵抗チップ抵抗器の製造方法について説明する。図3は本実施例1の金属板低抵抗チップ抵抗器の製造工程における帯状金属抵抗板(a)、C−C線断面図(b)の説明図である。金属板低抵抗チップ抵抗器10は、開口工程、成型工程、保護膜形成工程、電極膜形成工程、切断工程とから製造している。   Next, a manufacturing method of the metal plate low resistance chip resistor of the first embodiment will be described. FIG. 3 is an explanatory view of a strip-shaped metal resistor plate (a) and a CC line sectional view (b) in the manufacturing process of the metal plate low resistance chip resistor of the first embodiment. The metal plate low resistance chip resistor 10 is manufactured from an opening process, a molding process, a protective film forming process, an electrode film forming process, and a cutting process.

開口工程では、帯状金属抵抗板1の長辺方向Yに沿って帯状金属抵抗板1の短辺方向Xの略中央部に所定間隔で一列に並ぶ複数の穴1aを形成する。
成型工程では、帯状金属抵抗板1の長辺方向Yに沿って帯状金属抵抗板1の短辺方向Xの略中央部の下面側にプレス成型による連続した凹段部1bを形成する。
保護膜形成工程では、帯状金属抵抗板1の凹段部1bおよび凹段部1bに対向する上面側の平面部1cを絶縁被覆する保護膜1dを形成する。
電極膜形成工程では、帯状金属抵抗板1の短辺方向Xにおける両端側の端子部1eの下面側を導電被覆して電極膜1fを形成する。
切断工程では、帯状金属抵抗板1を穴1aが設けられた部分で短辺方向Xに切断幅W1で切断する。
上記工程により、帯状金属抵抗板1からは保護膜13(1d)で絶縁被覆した凹段部12b(1b)および凹段部12b(1b)に対向する上面側の平面部12c(1c)を固定抵抗部12とし、電極膜14(1f)で導電被覆した端子電極11(1e)を有する金属板低抵抗チップ抵抗器10が形成される。
In the opening process, a plurality of holes 1 a arranged in a line at a predetermined interval are formed at a substantially central portion in the short-side direction X of the strip-shaped metal resistor plate 1 along the long-side direction Y of the strip-shaped metal resistor plate 1.
In the molding step, a continuous concave step portion 1b is formed by press molding on the lower surface side of the substantially central portion in the short side direction X of the strip metal resistance plate 1 along the long side direction Y of the strip metal resistance plate 1.
In the protective film forming step, the protective film 1d for insulatingly covering the concave step portion 1b of the belt-shaped metal resistance plate 1 and the flat surface portion 1c on the upper surface side facing the concave step portion 1b is formed.
In the electrode film forming step, the electrode film 1f is formed by conductively coating the lower surfaces of the terminal portions 1e on both ends in the short side direction X of the strip-shaped metal resistor plate 1.
In the cutting process, the strip-shaped metal resistance plate 1 is cut in the short side direction X with the cutting width W1 at the portion where the hole 1a is provided.
Through the above steps, the strip-shaped metal resistor plate 1 is fixed with the concave step portion 12b (1b) covered with the protective film 13 (1d) and the flat portion 12c (1c) on the upper surface side facing the concave step portion 12b (1b). A metal plate low-resistance chip resistor 10 having a terminal electrode 11 (1e) that is conductively covered with the electrode film 14 (1f) is formed as the resistor 12.

図4は本実施例1の金属板低抵抗チップ抵抗器の概観図(a)、金属抵抗板(b)であり、図5は本実施例1の金属板低抵抗チップ抵抗器の平面図(a)、A−A線断面図(b)、B−B線断面図(c)である。   4A and 4B are a schematic diagram (a) and a metal resistor plate (b) of the metal plate low resistance chip resistor of the first embodiment, and FIG. 5 is a plan view of the metal plate low resistance chip resistor of the first embodiment (FIG. They are a), AA sectional view (b), BB sectional drawing (c).

本実施例2の金属板低抵抗チップ抵抗器20は、略矩形状に形成された金属抵抗板20aの両端側を一対の端子電極21としている。端子電極21間の両側辺には切り欠き22aを形成すると共に、プレス成型により下面側に凹段部22bを形成し、凹段部22bに対向する凸段部22cを上面側に形成して厚さD2r、長さL2r、幅W2rの固定抵抗部22を形成している。金属板低抵抗チップ抵抗器20の上面側、および固定抵抗部22の切り欠き22aと凹段部22bは保護膜23で絶縁被覆している。保護膜23の上面は平坦に形成しており、切り欠き22a、凹段部22bと凸段部22cからなる固定抵抗部22は金属抵抗板20aと同程度の幅を有する保護膜23に内包している。また、端子電極21の下面側は電極膜24により導電被覆している。   In the metal plate low resistance chip resistor 20 of the second embodiment, both end sides of the metal resistor plate 20a formed in a substantially rectangular shape are used as a pair of terminal electrodes 21. Notches 22a are formed on both sides between the terminal electrodes 21, a concave step portion 22b is formed on the lower surface side by press molding, and a convex step portion 22c opposite to the concave step portion 22b is formed on the upper surface side. A fixed resistance portion 22 having a length D2r, a length L2r, and a width W2r is formed. The upper surface side of the metal plate low resistance chip resistor 20, and the notch 22 a and the recessed step portion 22 b of the fixed resistance portion 22 are covered with a protective film 23. The upper surface of the protective film 23 is formed flat, and the fixed resistance portion 22 including the notch 22a, the concave step portion 22b, and the convex step portion 22c is included in the protective film 23 having the same width as that of the metal resistance plate 20a. ing. The lower surface side of the terminal electrode 21 is conductively covered with an electrode film 24.

次に、本実施例2の金属板低抵抗チップ抵抗器の製造方法について説明する。図6は本実施例2の金属板低抵抗チップ抵抗器の製造工程における帯状金属抵抗板の説明図(a)、C−C線断面図(b)である。金属板低抵抗チップ抵抗器20は、開口工程、成型工程、保護膜形成工程、電極膜形成工程、切断工程とから製造している。   Next, the manufacturing method of the metal plate low resistance chip resistor of the second embodiment will be described. 6A and 6B are an explanatory view (a) and a cross-sectional view (b) taken along the line CC of the strip-shaped metal resistor plate in the manufacturing process of the metal plate low resistance chip resistor of the second embodiment. The metal plate low resistance chip resistor 20 is manufactured from an opening process, a molding process, a protective film forming process, an electrode film forming process, and a cutting process.

開口工程では、帯状金属抵抗板2の長辺方向Yに沿って帯状金属抵抗板2の短辺方向Xの略中央部に所定間隔で一列に並ぶ複数の穴2aを形成する。
成型工程では、帯状金属抵抗板2の長辺方向Yに沿って帯状金属抵抗板2の短辺方向Xの略中央部の下面側にプレス成型による連続した凹段部2bを形成すると共に、凹段部2bに対向する凸段部2cを上面側に形成する。
保護膜形成工程では、帯状金属抵抗板2の凹段部2bおよび凸段部2cを絶縁被覆する保護膜2dを形成する。
電極膜形成工程では、帯状金属抵抗板2の短辺方向Xにおける両端側の端子部2eの下面側を導電被覆して電極膜2fを形成する。
切断工程では、帯状金属抵抗板2を穴2aが設けられた部分で短辺方向Xに切断幅W2で切断する。
上記工程により、帯状金属抵抗板2からは凹段部22b(2b)および凸段部22c(2c)を保護膜23(2d)で絶縁被覆した固定抵抗部22とし、電極膜24(2f)で導電被覆した端子電極21(2e)を有する金属板低抵抗チップ抵抗器20が形成される。
In the opening process, a plurality of holes 2 a arranged in a line at a predetermined interval are formed at a substantially central portion in the short-side direction X of the strip-shaped metal resistor plate 2 along the long-side direction Y of the strip-shaped metal resistor plate 2.
In the molding step, a continuous concave step portion 2b is formed by press molding on the lower surface side of the substantially central portion in the short side direction X of the strip-shaped metal resistor plate 2 along the long-side direction Y of the strip-shaped metal resistor plate 2, and A convex step portion 2c facing the step portion 2b is formed on the upper surface side.
In the protective film forming step, a protective film 2d that insulates the concave step 2b and the convex step 2c of the strip-shaped metal resistance plate 2 is formed.
In the electrode film forming step, the electrode film 2f is formed by conductively coating the lower surface sides of the terminal portions 2e on both ends in the short side direction X of the strip-shaped metal resistor plate 2.
In the cutting step, the strip-shaped metal resistance plate 2 is cut in the short side direction X with the cutting width W2 at the portion where the hole 2a is provided.
Through the above process, the band-shaped metal resistor plate 2 is formed into the fixed resistance portion 22 in which the concave step portion 22b (2b) and the convex step portion 22c (2c) are insulated with the protective film 23 (2d), and the electrode film 24 (2f). A metal plate low resistance chip resistor 20 having a terminal electrode 21 (2e) coated with a conductive material is formed.

1 帯状金属抵抗板(実施例1)
1a 穴
1b 凹段部
1c 平面部
1d 保護膜
1e 端子部
1f 電極膜
2 帯状金属抵抗板(実施例2)
2a 穴
2b 凹段部
2c 凸段部
2d 保護膜
2e 端子部
2f 電極膜
10 金属板低抵抗チップ抵抗器(実施例1)
10a 金属抵抗板
11 端子電極
12 固定抵抗部
12a 切り欠き
12b 凹段部
12c 平面部
13 保護膜
14 電極膜
D1r 厚さ(固定抵抗部)
L1r 長さ(固定抵抗部)
W1r 幅(固定抵抗部)
W1 切断幅(金属抵抗板)
20 金属板低抵抗チップ抵抗器(実施例2)
20a 金属抵抗板
21 端子電極
22 固定抵抗部
22a 切り欠き
22b 凹段部
22c 凸段部
23 保護膜
24 電極膜
D2r 厚さ(固定抵抗部)
L2r 長さ(固定抵抗部)
W2r 幅(固定抵抗部)
W2 切断幅(金属抵抗板)
1 Strip metal resistance plate (Example 1)
DESCRIPTION OF SYMBOLS 1a Hole 1b Concave step part 1c Plane part 1d Protective film 1e Terminal part 1f Electrode film 2 Strip | belt-shaped metal resistance board (Example 2)
2a hole 2b concave step 2c convex step 2d protective film 2e terminal 2f electrode film 10 metal plate low resistance chip resistor (Example 1)
10a Metal resistance plate 11 Terminal electrode 12 Fixed resistance portion 12a Notch 12b Concave step portion 12c Planar portion 13 Protective film 14 Electrode film D1r Thickness (fixed resistance portion)
L1r length (fixed resistance part)
W1r width (fixed resistance part)
W1 Cutting width (metal resistance plate)
20 Metal plate low resistance chip resistor (Example 2)
20a Metal resistance plate 21 Terminal electrode 22 Fixed resistance part 22a Notch 22b Concave step part 22c Convex step part 23 Protective film 24 Electrode film D2r Thickness (fixed resistance part)
L2r length (fixed resistor)
W2r width (fixed resistance part)
W2 Cutting width (metal resistance plate)

Claims (4)

略矩形状に形成された金属抵抗板の両端側を一対の端子電極とし、前記一対の端子電極間の両側辺に切り欠きを形成すると共に、プレス成型により下面側に凹段部を形成して固定抵抗部とし、前記固定抵抗部を内包して絶縁被覆する保護膜と、前記一対の端子電極の少なくとも下面側を導電被覆した電極膜とを備えたことを特徴とする金属板低抵抗チップ抵抗器。   Both ends of the metal resistor plate formed in a substantially rectangular shape are used as a pair of terminal electrodes, notches are formed on both sides between the pair of terminal electrodes, and a concave step is formed on the lower surface side by press molding. A metal plate low-resistance chip resistor comprising a fixed resistance portion, a protective film including the fixed resistance portion and insulatingly coated, and an electrode film conductively coated on at least the lower surfaces of the pair of terminal electrodes vessel. 前記固定抵抗部を、前記一対の端子電極間の両側辺を切り欠き、かつ、プレス成型により下面側に凹段部を形成すると共に、帯状金属抵抗板の上面側に前記凹段部に対向する凸段部を形成した固定抵抗部としたことを特徴とする請求項1記載の金属板低抵抗チップ抵抗器。   The fixed resistance portion is formed by notching both sides between the pair of terminal electrodes, forming a concave step portion on the lower surface side by press molding, and facing the concave step portion on the upper surface side of the strip-shaped metal resistance plate. 2. The metal plate low resistance chip resistor according to claim 1, wherein the fixed resistance portion is formed with a protruding step portion. 帯状金属抵抗板の長辺方向に沿って帯状金属抵抗板の短辺方向の略中央部に所定間隔で一列に並ぶ複数の穴を形成する開口工程と、
帯状金属抵抗板の短辺方向における略中央部の下面側にプレス成型による凹段部を形成する成型工程と、
前記帯状金属抵抗板の前記凹段部および前記凹段部に対向する上面側を内包して絶縁被覆する保護膜を形成する保護膜形成工程と、
前記帯状金属抵抗板の短辺方向における両端側の下面側を導電被覆して電極膜を形成する電極膜形成工程と、
前記帯状金属抵抗板を前記穴が設けられた部分で短辺方向に切断する切断工程と、を備えることを特徴とする金属板低抵抗チップ抵抗器の製造方法。
An opening step of forming a plurality of holes arranged in a line at a predetermined interval in a substantially central portion in the short side direction of the strip-shaped metal resistor plate along the long side direction of the strip-shaped metal resistor plate;
A molding step of forming a concave step portion by press molding on the lower surface side of the substantially central portion in the short side direction of the strip-shaped metal resistance plate;
A protective film forming step of forming a protective film including the concave step portion of the strip-shaped metal resistance plate and an upper surface side facing the concave step portion to insulate and cover;
An electrode film forming step of forming an electrode film by conductively coating the lower surfaces of both ends in the short side direction of the strip-shaped metal resistor plate;
And a cutting step of cutting the strip-shaped metal resistor plate in the short side direction at the portion where the hole is provided.
前記成型工程を、帯状金属抵抗板の短辺方向における略中央部の下面側にプレス成型による凹段部を形成すると共に、帯状金属抵抗板の上面側に前記凹段部に対向する凸段部を形成する成型工程としたことを特徴とする請求項3記載の金属板低抵抗チップ抵抗器の製造方法。   In the molding step, a concave step portion is formed by press molding on the lower surface side of a substantially central portion in the short side direction of the strip-shaped metal resistor plate, and a convex step portion facing the concave step portion on the upper surface side of the strip-shaped metal resistor plate 4. The method of manufacturing a metal plate low resistance chip resistor according to claim 3, wherein the forming step is a forming step.
JP2010247973A 2010-11-05 2010-11-05 Metal plate low resistance chip resistor and method of manufacturing the same Withdrawn JP2012099744A (en)

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