WO2019230334A1 - Wiring circuit board - Google Patents

Wiring circuit board Download PDF

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Publication number
WO2019230334A1
WO2019230334A1 PCT/JP2019/018713 JP2019018713W WO2019230334A1 WO 2019230334 A1 WO2019230334 A1 WO 2019230334A1 JP 2019018713 W JP2019018713 W JP 2019018713W WO 2019230334 A1 WO2019230334 A1 WO 2019230334A1
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WO
WIPO (PCT)
Prior art keywords
metal
wiring
circuit board
thickness direction
base
Prior art date
Application number
PCT/JP2019/018713
Other languages
French (fr)
Japanese (ja)
Inventor
柴田　直樹
良介 笹岡
恭也 大薮
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020207033984A priority Critical patent/KR20210015809A/en
Priority to CN201980036057.8A priority patent/CN112219455A/en
Publication of WO2019230334A1 publication Critical patent/WO2019230334A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Definitions

  • the present invention relates to a printed circuit board.
  • a heat sink having a flat base portion and comb-like fins extending downward from the lower surface of the base portion is installed on the lower surface of the substrate on which the heating element is mounted on the upper surface, and heat generated from the heating element is transferred to the heat sink.
  • a heat dissipation structure that discharges from a fin is known (for example, see Patent Document 1 below).
  • the present invention provides a printed circuit board excellent in heat dissipation.
  • the present invention (1) includes a plurality of wiring bodies that are arranged in parallel at intervals, and each of the plurality of wiring bodies includes an insulating portion and a wiring portion that is disposed on one surface in the thickness direction of the insulating portion. And the ratio (T / W) of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies is 2 or more.
  • a printed circuit board including a support portion.
  • the heat generated in the wiring portion can be convected through the air between the plurality of wiring bodies to achieve efficient heat dissipation. it can.
  • the support portion increases the contact area with the air. Can do. Therefore, the heat dissipation efficiency based on the above convection is excellent.
  • T / W the support portion is made of a metal-based material
  • the heat conducted from the wiring portion to the insulating portion is efficiently directed toward the other side in the thickness direction. Can be released.
  • this wired circuit board is excellent in heat dissipation in the wiring body.
  • the one support portion has a side surface facing the one support portion and the other support portion adjacent in the parallel direction, and the area of the side surface is equal to the side surface.
  • the printed circuit board according to (1) which is larger than a projected area when projected in a direction, is included.
  • the present invention (3) includes the printed circuit board according to (1) or (2), wherein a material of the support portion is a metal.
  • the material of the support portion is a metal, the heat dissipation from the support portion is excellent.
  • connection body which connects the orthogonal
  • the said connection body is at the orthogonal
  • connection support portion when the connection support portion is projected in the thickness direction, the connection support portion continues in the parallel direction so as to include the plurality of terminal portions, so that the connection support portion can reliably support the plurality of terminal portions. it can.
  • the heat dissipation in the wiring body is excellent, and the mechanical strength of the terminal portion in the coupling body is also excellent.
  • the wired circuit board of the present invention is excellent in heat dissipation in the wiring body.
  • FIG. 1 shows a plan view of an embodiment of a printed circuit board according to the present invention.
  • 2A and 2B are cross-sectional views of the printed circuit board shown in FIG. 1.
  • FIG. 2A is a cross-sectional view taken along the line AA
  • FIG. 2B is a cross-sectional view taken along the line BB.
  • FIG. 1 An embodiment of the printed circuit board of the present invention will be described with reference to FIGS. 1, 2A, and 2B.
  • the base insulating layer 7 and the cover insulating layer 9 described later are omitted to clearly show the relative arrangement of the metal-based support layer 6 and the conductor layer 8 described later.
  • the printed circuit board 1 has one surface in the thickness direction and the other surface, and has a shape extending in the longitudinal direction perpendicular to the thickness direction. As shown in FIG. 1, the printed circuit board 1 integrally includes a first connection body 2 as an example of a connection body, a second connection body 3 as an example of a connection body, and a wiring body 4. Preferably, the printed circuit board 1 includes only the first connection body 2, the second connection body 3, and the wiring body 4.
  • the first connecting body 2 forms one end of the printed circuit board 1 in the longitudinal direction.
  • the first connector 2 has a substantially rectangular flat plate shape in plan view.
  • the dimension in the planar view of the 1st coupling body 2 is not specifically limited.
  • the second connection body 3 forms the other end portion in the longitudinal direction of the printed circuit board 1 and is disposed opposite to the first connection body 2 on the other side in the longitudinal direction with the wiring body 4 interposed therebetween.
  • the second connector 3 has a substantially rectangular flat plate shape in plan view. The dimension in planar view of the 2nd coupling body 3 is not specifically limited.
  • the wiring body 4 forms an intermediate portion (or central portion) in the longitudinal direction of the printed circuit board 1.
  • the wiring body 4 is disposed between the first connecting body 2 and the second connecting body 3 in plan view.
  • the wiring body 4 has a shape extending in the longitudinal direction.
  • the wiring body 4 bridges the first connecting body 2 and the second connecting body 3 in the longitudinal direction.
  • a plurality of wiring bodies 4 are arranged in parallel at intervals in the short direction (direction perpendicular to the longitudinal direction and the thickness direction) of the printed circuit board 1 (an example of the parallel direction of the wiring bodies 4). Yes.
  • An opening 5 is formed between adjacent wiring bodies 4.
  • the opening 5 divides the wiring body 4 in the short direction of the printed circuit board 1, for example.
  • the opening 5 has a slit shape extending in the longitudinal direction and penetrates the printed circuit board 1 in the thickness direction.
  • the longitudinal ends of the plurality of wiring bodies 4 are connected in the short direction by one first connecting body 2. Thereby, the longitudinal direction one end part of the some wiring body 4 is bundled by the one 1st connection body 2.
  • the length in the longitudinal direction of the wiring body 4 is an interval in the longitudinal direction of the first connecting body 2 and the second connecting body 3, and is appropriately set according to the use and purpose.
  • the length in the short-side direction of each of the plurality of wiring bodies 4 is, for example, 500 ⁇ m or less, preferably 300 ⁇ m or less, more preferably 100 ⁇ m or less, and for example, 10 ⁇ m or more.
  • the length in the short direction of the opening 5 is, for example, 10 ⁇ m or more, preferably 50 ⁇ m or more, more preferably 100 ⁇ m or more, and for example, 1000 ⁇ m or less.
  • the ratio of the length in the short direction of the wiring body 4 to the length in the short direction of the opening 5 is, for example, 40 or less, preferably 10 or less, for example, 0.1 or more, preferably 0. .5 or more.
  • this wired circuit board 1 includes a metal-based support layer 6, a base insulating layer 7 disposed on one surface in the thickness direction of the metal-based support layer 6, A conductor layer 8 disposed on one surface in the thickness direction of the base insulating layer 7 and a cover insulating layer 9 disposed on the one surface in the thickness direction of the base insulating layer 7 so as to partially cover the conductor layer 8 are provided.
  • the printed circuit board 1 preferably includes only the metal-based support layer 6, the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9.
  • the metal-based support layer 6 forms the other surface in the thickness direction of the printed circuit board 1. As shown in FIGS. 1, 2 ⁇ / b> A, and 2 ⁇ / b> B, the metal-based support layer 6 has the same outer shape as the printed circuit board 1. Specifically, the metal-based support layer 6 has an outer shape corresponding to the first connection body 2, the second connection body 3, and the wiring body 4.
  • the part forming the first connection body 2 is a first connection metal part 13 as an example of a connection support part
  • the part forming the second connection body 3 is an example of a connection support part.
  • the second connecting metal part 14 as a part, and the part forming the wiring body 4 is a wiring body metal part 15 as an example of a support part.
  • the first connecting metal portion 13 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of first terminal portions 11 to be described later in plan view.
  • the second connecting metal portion 14 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of second terminal portions 12 described later in plan view.
  • the wiring body metal portion 15 defines the other side portion of the opening 5 in the thickness direction.
  • the wiring body metal part 15 has a substantially rectangular shape that is long in the thickness direction on a cut surface (synonymous with a sectional view) cut along the thickness direction and the short direction.
  • the metal-based support layer 6 is a metal that is a first metal surface 21 that is one surface in the thickness direction, a second metal surface 22 that is the other surface in the thickness direction, and a side surface that connects the peripheral edges in the thickness direction.
  • a side surface 23 is integrally provided.
  • the first metal surface 21 and the second metal surface 22 are opposed to each other in the thickness direction and are parallel flat surfaces.
  • the metal side surface 23 is a flat surface that extends straight along the thickness direction. Further, the metal side surface 23 of the wiring body metal portion 15 is also a flat surface extending straight along the longitudinal direction.
  • the metal side surface 23 in the wiring body metal portion 15 includes a metal inner side surface 31 facing the opening 5 and a metal outer surface 32 facing the outer side in the lateral direction.
  • the metal inner side surface 31 is an example of a side surface facing one wiring body metal portion 15 and another wiring body metal portion 15 adjacent in the short direction.
  • the two metal inner side surfaces 31 facing (facing) across the opening 5 are parallel to each other, and are also parallel to a conductor side surface 29 of the main wiring portion 10 described later in plan view.
  • the area S0 of the metal inner side surface 31 is the same as the projected area S1 when the metal inner side surface 31 is projected in the lateral direction because the wiring body metal part 15 has a substantially rectangular shape in cross section.
  • the area S0 of the metal inner side surface 31 is a value obtained by multiplying the thickness T of the metal-based support layer 6 described below by the length in the longitudinal direction.
  • the thickness T of the metal-based support layer 6 is the opposing length of the first metal surface 21 and the second metal surface 22 and the length of the metal side surface 23 in the thickness direction. Specifically, the thickness T of the metal-based support layer 6 is, for example, 30 ⁇ m or more, preferably 50 ⁇ m or more, preferably 100 ⁇ m or more, preferably 250 ⁇ m or more, preferably 500 ⁇ m or more, preferably 1000 ⁇ m or more. Yes, for example, 10 mm or less.
  • the length W in the short direction of the wiring body metal portion 15 is appropriately selected from the range exemplified by the length in the short direction of the wiring body 4 described above, and specifically, the length in the short direction of the wiring body metal portion 15. W is the same as the length of the wiring body 4 in the short direction. Note that, in the plurality of wiring bodies 4, the short direction length W of the wiring body metal portion 15 is a distance (length) between two adjacent metal inner side surfaces 31.
  • the ratio (T / W) of the thickness T of the wiring body metal portion 15 to the length W in the short direction of the wiring body metal portion 15 is 2 or more.
  • the ratio (T / W) corresponds to the aspect ratio of the cut surface obtained by cutting the wiring body metal portion 15 along the thickness direction and the short side direction. If the aspect ratio (T / W) is less than 2, the heat generated in the main wiring portion 10 (described later) in the wiring body 4 cannot be efficiently released using the air in the opening 5.
  • the aspect ratio (T / W) is preferably 2.5 or more, more preferably 3 or more, still more preferably 3.5 or more, and 1000 or less, and further 100 or less. If the ratio (T / W) is equal to or greater than the lower limit described above, the heat generated in the main wiring portion 10 in the wiring body 4 can be efficiently released using the air in the opening 5.
  • the material for the metal-based support layer 6 can be appropriately selected from, for example, known or commonly used metal-based materials (specifically, metal materials).
  • the metal-based material include metal elements classified into Group 1 to Group 16 in the periodic table, and alloys containing two or more of these metal elements.
  • the metal-based material may be either a transition metal or a typical metal. More specifically, examples of the metal-based material include a Group 2 metal element such as calcium, a Group 4 metal element such as titanium and zirconium, a Group 5 metal element such as vanadium, chromium, molybdenum, and tungsten.
  • Group 6 metal elements Group 7 metal elements such as manganese, Group 8 metal elements such as iron, Group 9 metal elements such as cobalt, Group 10 metal elements such as nickel and platinum, Copper, Silver, Gold, etc.
  • Group 11 metal elements such as zinc, Group 12 metal elements such as zinc, Group 13 metal elements such as aluminum and gallium, and Group 14 metal elements such as germanium and tin. These can be used alone or in combination.
  • the material of the 1st connection support part 13, the 2nd connection support part 14, and the wiring body metal part 15 is the same.
  • the metal-based support layer 6 includes a metal support layer 6 whose material is a metal.
  • the thermal conductivity of the metal-based support layer 6 is, for example, 5 W / m ⁇ K or more, preferably 10 W / m ⁇ K or more, more preferably 15 W / m ⁇ K or more, 20 W / m ⁇ K or more, 25 W / m.
  • the thermal conductivity of the metal-based support layer 6 is equal to or greater than the lower limit described above, the heat conducted from the main wiring portion 10 to the wiring body base portion 18 can be efficiently released toward the other side in the thickness direction.
  • the thermal conductivity of the metal-based support layer 6 is obtained by JIS H 7903: 2008 (effective thermal conductivity measurement method).
  • the base insulating layer 7 is disposed, for example, on the entire first metal surface 21 of the metal-based support layer 6. Specifically, the base insulating layer 7 has an outer shape corresponding to the first connecting body 2, the second connecting body 3, and the wiring body 4.
  • the part forming the first connection body 2 is the first connection base part 16
  • the part forming the second connection body 3 is the second connection base part 17
  • the wiring body 4 A portion to be formed is a wiring body base portion 18 as an example of an insulating portion.
  • the first connection base portion 16 is disposed on the entire first metal surface 21 of the first connection metal portion 13.
  • the second connection base portion 17 is disposed on the entire first metal surface 21 of the second connection metal portion 14.
  • the wiring body base portion 18 is disposed on the entire first metal surface 21 of the wiring body metal portion 15.
  • the wiring body metal portion 15 is disposed on the other surface in the thickness direction of the wiring body base portion 18 (second base surface 25 described later). Further, the wiring body base portion 18 defines the opening 5 together with the wiring body metal portion 15 and the wiring body cover portion 33 described later.
  • the base insulating layer 7 includes a first base surface 24 that is one surface in the thickness direction, a second base surface 25 that is the other surface in the thickness direction, and a base side surface that is a side surface connecting the peripheral edges in the thickness direction. 26 are integrally provided.
  • the first base surface 24 is a flat surface parallel to the first metal surface 21.
  • the second base surface 25 is a flat surface that contacts the first metal surface 21.
  • the base side surface 26 is a flat surface that extends straight along the thickness direction. Further, the base side surface 26 is formed flush with the metal side surface 23 in the thickness direction in the wiring body base portion 18.
  • the base side surface 26 has a base inner side surface 37 that is formed flush with the metal inner side surface 31 in the wiring body base portion 18. The base inner side surface 37 partially defines the opening 5.
  • the thickness of the base insulating layer 7 is the length of the first base surface 24 and the first metal surface 21 facing each other, and the length of the base side surface 26 in the thickness direction, specifically, for example, 1 ⁇ m or more, Preferably, it is 5 ⁇ m or more, for example, 100 ⁇ m or less, preferably 50 ⁇ m or less.
  • the ratio of the thickness of the base insulating layer 7 to the thickness T of the metal-based support layer 6 is, for example, 10 or less, preferably 1 or less, more preferably 0.1 or less, and for example, 0.005 or more. It is.
  • Examples of the material of the base insulating layer 7 include an insulating resin such as polyimide.
  • the thermal conductivity of the base insulating layer 7 is lower than the thermal conductivity of the metal-based support layer 6, specifically, for example, 1 W / m ⁇ K or less, and further 0.5 W / m ⁇ K. For example, it is 0.01 W / m ⁇ K or more, preferably 0.1 W / m ⁇ K or more.
  • the thermal conductivity of the base insulating layer 7 is determined by JIS A 1412 (Method for measuring the thermal conductivity of a thermal insulating material).
  • the conductor layer 8 is disposed on the first base surface 24 of the base insulating layer 7. Specifically, the conductor layer 8 is disposed on the first base surface 24 of the first connection base portion 16, the second connection base portion 17, and the wiring body base portion 18.
  • the portions included in the first connection body 2 are the first terminal portion 11 and the first auxiliary wiring portion 19, and the portions included in the second connection body 3 are the second terminal portion 12 and the second auxiliary wiring.
  • the part 20 included in the wiring body 4 is a main wiring part 10 as an example of the wiring part.
  • a plurality of first terminal portions 11 are arranged in the first connecting body 2 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10).
  • the plurality of first terminal portions 11 are aligned and spaced apart in the lateral direction so as to be included in the first connecting metal portion 13 when projected in the thickness direction.
  • the first terminal portion 11 is disposed on the first base surface 24 of the first connection base portion 16.
  • the first terminal portion 11 has one end portion and a central portion in the longitudinal direction on the first base surface 24 so that a region where the first auxiliary wiring portion 19 is formed on the other longitudinal end portion in the first base surface 24 is secured. Is arranged.
  • the first terminal portion 11 has a substantially rectangular shape (corner land shape) in plan view.
  • the first auxiliary wiring portion 19 is disposed on the first base surface 24 of the first connection base portion 16 in the first connection body 2 so as to be continuous with the first terminal portion 11.
  • the first auxiliary wiring 19 has a substantially linear shape in a plan view extending from the other end in the longitudinal direction of the first terminal portion 11 toward the other side in the longitudinal direction.
  • the 1st auxiliary wiring part 19 connects the longitudinal direction other end edge of the 1st terminal part 11, and the longitudinal direction one end edge of the main wiring part 10 demonstrated below.
  • the length of the first auxiliary wiring 19 in the short direction is shorter than the length of the first terminal portion 11 in the short direction.
  • the ratio of the length in the short direction of the first auxiliary wiring 19 to the length in the short direction of the first terminal portion 11 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more.
  • the length of the first auxiliary wiring 19 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
  • a plurality of second terminal portions 12 are arranged in the second connecting body 3 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10).
  • the plurality of second terminal portions 12 are arranged in the short direction so as to be included in the second connecting metal portion 14 when projected in the thickness direction.
  • the second terminal portion 12 is disposed on the first base surface 24 of the second connection base portion 17.
  • the second terminal portion 12 has a longitudinal direction on the first base surface 24 such that a region where the second auxiliary wiring portion 20 is formed is secured at one longitudinal end portion of the first base surface 24. It is arrange
  • the second terminal portion 12 has a substantially rectangular shape (square land shape) in plan view.
  • the second auxiliary wiring part 20 is arranged on the first base surface 24 of the second connection base part 17 in the second connection body 3 so as to be continuous with the second terminal part 12.
  • the second auxiliary wiring 20 has a substantially linear shape in plan view extending from one longitudinal edge of the second terminal portion 12 toward one longitudinal side.
  • the 2nd auxiliary wiring part 20 connects the longitudinal direction one end edge of the 2nd terminal part 12, and the longitudinal direction other end edge of the main wiring part 10 demonstrated below.
  • the short direction length of the second auxiliary wiring part 20 is shorter than the short direction length of the second terminal part 12.
  • the ratio of the length in the short direction of the second auxiliary wiring portion 20 to the length in the short direction of the second terminal portion 12 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more.
  • the length of the second auxiliary wiring portion 20 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
  • the main wiring portion 10 is disposed on the first base surface 24 of the wiring body base portion 18. Specifically, each of the plurality of main wiring portions 10 is disposed at a substantially central portion in the short-side direction of the first base surface 24 of the plurality of wiring body base portions 18. The main wiring portion 10 is included in the wiring body base portion 18 when projected in the thickness direction. Specifically, each of the plurality of main wiring portions 10 secures a region where a cover insulating layer 9 described below is formed at both ends in the short direction of the first base surface 24 of the plurality of wiring body base portions 18. Are arranged to be.
  • the main wiring portion 10 is provided in one-to-one correspondence with the wiring body base portion 18 (or the wiring body metal portion 15).
  • one end edge in the longitudinal direction of the main wiring portion 10 is continuous with the other edge in the longitudinal direction of the first auxiliary wiring 19 in the first connector 2.
  • the other end edge in the longitudinal direction of the main wiring portion 10 is continuous with the one end edge in the longitudinal direction of the second auxiliary wiring portion 20 in the second connector 3.
  • the main wiring part 10 forms a substantially straight line shape in plan view extending in the longitudinal direction together with the first auxiliary wiring 19 and the second auxiliary wiring part 20, and the first terminal part 11 and the second terminal part 12 are arranged in the longitudinal direction. Wiring to be connected to is formed.
  • the length in the short direction of the main wiring portion 10 is the same as the length in the short direction of the first auxiliary wiring 19 and the second auxiliary wiring portion 20, for example.
  • the conductor layer 8 includes a first conductor surface 27 that is one surface in the thickness direction, a second conductor surface 28 that is the other surface in the thickness direction, and a conductor side surface 29 that is a side surface connecting the peripheral edges in the thickness direction. Provide one.
  • the first conductor surface 27 is a flat surface parallel to the first base surface 24.
  • the second conductor surface 28 is a flat surface that contacts the first base surface 24.
  • the conductor side surface 29 is disposed inside the base side surface 26 in plan view.
  • the conductor side surface 29 is disposed on the inner side in the lateral direction with respect to the base side surface 26.
  • Examples of the material of the conductor layer 8 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof.
  • copper is used from the viewpoint of obtaining good electrical characteristics.
  • the thickness of the conductor layer 8 is the opposing length of the first conductor surface 27 and the first base surface 24, and the length in the thickness direction of the conductor side surface 29. Specifically, for example, 1 ⁇ m or more is preferable. Is 5 ⁇ m or more, and is, for example, 50 ⁇ m or less, preferably 3 ⁇ m or less.
  • the length in the short direction of the main wiring portion 10 is, for example, 200 ⁇ m or less, preferably 100 ⁇ m or less, and for example, 1 ⁇ m or more, preferably 5 ⁇ m or more. Further, the ratio of the length in the short direction of the main wiring portion 10 to the length W in the short direction of the wiring body metal portion 15 is, for example, 2 or less, preferably 1 or less, for example, 0.01 As mentioned above, Preferably, it is 0.1 or more.
  • the insulating cover layer 9 is disposed on the first base surface 24 so as to cover the first conductor surface 27 and the conductor side surface 29 of the first auxiliary wiring 19, the second auxiliary wiring portion 20, and the main wiring portion 10. Yes. On the other hand, the insulating cover layer 9 exposes at least the first conductor surface 27 of the first terminal portion 11 and the second terminal portion 12.
  • the portion included in the first connecting body 2 is a first connecting cover portion (not shown in FIGS. 1 and 2), and the portion included in the second connecting body 3 is the second connecting cover portion 9.
  • a connecting cover portion (not shown in FIGS. 1 and 2), and a portion included in the wiring body 4 is a wiring body cover portion 33.
  • a first connection cover portion (not shown) exposes the first terminal portion 11 but covers the first auxiliary wiring 19.
  • the second connection cover portion exposes the second terminal portion 12 but covers the second auxiliary wiring portion 20.
  • the wiring body cover portion 33 covers the first conductor surface 27 and the conductor side surface 29 of the main wiring portion 10 and the portion of the first base surface 24 near the outer side in the short direction of the main wiring portion 10.
  • the insulating cover layer 9 includes a first cover surface 34 that is one surface in the thickness direction, a second cover surface 35 that is the other surface in the thickness direction, and a cover side surface 36 that is a side surface connecting these peripheral edges in the thickness direction. Is integrally provided.
  • the first cover surface 34 is a flat surface parallel to the first conductor surface 27.
  • the second cover surface 35 is in contact with the first conductor surface 27 and the conductor side surface 29 and the first base surface 24.
  • the cover side surface 36 is formed flush with the base side surface 26 in the thickness direction in the wiring body base portion 18.
  • the cover side surface 36 has a cover inner side surface 38 that is formed flush with the base inner side surface 37 in the wiring body cover portion 33.
  • each of the plurality of wiring bodies 4 has two wiring body side surfaces 50.
  • the wiring body side surface 50 is formed (configured) from the metal side surface 23, the base side surface 26, and the cover side surface 36, and is continuous in the thickness direction. Therefore, the wiring body 4 has a substantially linear shape that extends long in the thickness direction in a cross-sectional view.
  • the wiring body side surface 50 has a wiring body side surface 51 formed by the metal inner side surface 31, the base inner side surface 37, and the cover inner side surface 38 in a cross-sectional view. Is partitioned.
  • the thickness of the cover insulating layer 9 is the length of the first cover surface 34 and the first conductor surface 27 facing each other, specifically, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, and, for example, 100 ⁇ m or less. Preferably, it is 50 ⁇ m or less.
  • Examples of the material of the cover insulating layer 9 include an insulating resin such as polyimide.
  • the thickness of the printed circuit board 1 is, for example, 10 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 10 mm or less, preferably 1 mm or less.
  • the printed circuit board 1 In order to manufacture the printed circuit board 1, for example, first, a flat metal sheet is prepared, and then the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9 having the above-described shapes are sequentially formed. Thereafter, the metal sheet is externally processed to form the first connection metal part 13, the second connection metal part 14, and the wiring body metal part 15, thereby forming the metal-based support layer 6.
  • the outer shape processing is not particularly limited, and examples thereof include etching, laser processing, water jet (water cutter), and press punching.
  • the base insulating layer 7, the conductor layer 8, and the cover insulating layer are previously formed on the first metal surface 21 of the metal-based support layer 6 including the first connecting metal portion 13, the second connecting metal portion 14, and the wiring body metal portion 15. 9 can also be formed sequentially.
  • the first element 41 is then mounted on the first connector 2 and the second element 42 is mounted on the second connector 3 as indicated by the phantom line in FIG. 2B.
  • the first element 41 and / or the second element 42 are configured to be able to input / output a current having a high current value (for example, 1 A or more, and further, a large current of 10 A or more).
  • the first element 41 includes a first electrode 43 disposed on the other surface in the thickness direction.
  • the second element 42 includes a second electrode 44 disposed on the other surface in the thickness direction.
  • the first electrode 43 is electrically connected to the first terminal portion 11.
  • the second electrode 44 is electrically connected to the second terminal portion 12.
  • the wiring bodies 4 are arranged in parallel with a space therebetween, and thus are generated in the main wiring portion 10 based on the input of a large current from the first element 41 and / or the second element 42. Heat can be convected through the air between the plurality of wiring bodies 4 (openings 5), and in particular, convection in the thickness direction can be efficiently radiated.
  • the aspect ratio (T / W) of the wiring body metal part 15 is as high as 2 or more, the contact area with the air can be increased. Therefore, the heat dissipation efficiency based on the above convection is excellent.
  • the wiring body metal portion 15 has a high aspect ratio (T / W) of 2 or more and is made of a metal-based material
  • the heat conducted from the main wiring portion 10 to the wiring body base portion 18 is To the other side in the thickness direction of the wiring body base 18, specifically, from the first metal surface 21 of the wiring body metal portion 15 to the second metal surface 22, and further in the thickness direction of the second metal surface 22. It can discharge efficiently toward the side.
  • the printed circuit board 1 is excellent in heat dissipation in the wiring body 4.
  • the material of the wiring body metal part 15 is a metal, the heat dissipation from the wiring body metal part 15 is excellent.
  • the 1st connection metal part 13 since the 1st connection metal part 13 continues in a transversal direction so that the some 1st terminal part 11 may be included, when projected in the thickness direction, the 1st connection metal part 13 is included. Can reliably support the plurality of first terminal portions 11.
  • the 2nd connection metal part 14 continues in a transversal direction so that a plurality of 2nd terminal parts 12 may be included when projected in the thickness direction, the 2nd connection metal part 14 has a plurality of 2nd terminal parts 12 Can be reliably supported.
  • the mechanical strength of the first terminal portion 11 in the first connection body 2 and the mechanical strength of the second terminal portion 12 in the second connection body 3 are excellent while the heat dissipation in the wiring body 4 is excellent. Also excellent. Therefore, the connection reliability in the 1st terminal part 11 and the 2nd terminal part 12 is excellent.
  • the use of such a printed circuit board 1 is not particularly limited and is used in various fields.
  • the printed circuit board 1 is used in various applications such as a printed circuit board for electronic equipment (wired circuit board for electronic parts) and a wired circuit board for electrical equipment (wired circuit board for electrical parts).
  • Examples of the wiring circuit board for electronic equipment and the wiring circuit board for electric equipment include wiring circuit boards for sensors used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors, such as automobiles, trains, airplanes, and machine tools.
  • Wiring circuit boards for transportation vehicles used in transportation vehicles such as vehicles, for example, wiring circuit boards for video equipment used in video equipment such as flat panel displays, flexible displays, projection type video equipment, such as network equipment, large communication equipment
  • Wiring circuit boards for communication relay equipment used in communication relay equipment such as, for example, wiring circuit boards for information processing terminals used in information processing terminals such as computers, tablets, smartphones, home games, etc., such as drones, robots, etc.
  • Mobile equipment distribution used in mobile equipment Circuit boards for example, medical equipment wiring circuit boards used in medical equipment such as wearable medical devices and medical diagnostic equipment, for example, electrical equipment used in electric equipment such as refrigerators, washing machines, vacuum cleaners, and air conditioners
  • Wiring circuit boards for recording for example, wiring circuit boards for recording electronic equipment used in recording electronic equipment such as digital cameras and DVD recording devices.
  • the metal side surface 23, the base side surface 26, and the cover side surface 36 are flush, but not shown, but they may not be flush, that is, discontinuous.
  • the base side surface 26 and / or the cover side surface 36 do not overlap with the metal side surface 23 when projected in the thickness direction, and shift to either the short side outward or the inner side with respect to the metal side surface 23. May be located.
  • the metal side surface 23 of the wiring body metal portion 15 is a flat surface, but may be a curved surface, for example, although not shown.
  • the metal side surface that is a curved surface includes a concave surface that is recessed toward the inner side in the lateral direction as viewed from the both ends in the thickness direction toward the central portion in the thickness direction.
  • the metal side surface comprises only a concave surface. That is, the metal side surface is recessed toward the inner side in the lateral direction as it goes from the both end portions in the thickness direction to the central portion in the thickness direction when viewed in cross section.
  • the short direction length of a wiring body metal part becomes short as it goes to a thickness direction center part from the thickness direction both ends.
  • Each of the plurality of wiring body metal portions has a substantially drum (hourglass) cross section with a constricted central portion in the thickness direction.
  • Each of the plurality of wiring body metal portions is provided with two concave surfaces on both side surfaces in the short direction.
  • the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction. Therefore, the present invention includes an aspect in which the area S0 of the metal side surface is greater than or equal to the projected area S1 when the metal side surface is projected in the short direction. Specifically, the area S0 of the metal side surface 23 is This includes both an embodiment that is identical to the projected area S1 and a variation in which the metal side area S0 is greater than the metal side projected area S1.
  • the area ratio (S0 / S1) of the area S0 of the metal side surface to the projected area S1 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1. 2 or more, more preferably 1.3 or more, and for example, 2 or less.
  • the longitudinal length of the metal side surface and the longitudinal direction length of the projection surface of the metal side surface are the same. (Specifically, the length in the thickness direction from one end edge to the other end edge of the metal side surface in relation to the total length L along the curved surface (concave surface) from the one end edge to the other end edge in the thickness direction of the metal side surface) It is the same as the ratio (thickness T / total length L). Accordingly, the area ratio (S0 / S1) is obtained as the above-described length ratio (thickness T / total length L).
  • the length W in the short direction of the metal part of the wiring body is obtained as an average value of the lengths between the two metal side surfaces.
  • the metal side surface can have a bent surface.
  • one metal side surface is integrally provided with two concave surfaces adjacent in the thickness direction and a ridge line connecting them in the thickness direction.
  • a metal side surface is formed in a bending surface.
  • one metal side surface has a substantially W shape having a ridge line in the central portion in the thickness direction and concave surfaces on both sides in a cross-sectional view. Therefore, each of the plurality of wiring body metal portions has a cross-sectional shape in which two drums (hourglasses) are connected in the thickness direction.
  • the manufacturing method of the printed circuit board in the above modification will be specifically described.
  • the metal-based support layer 6 is formed by etching (subtractive method).
  • a laminate including a metal sheet and a base insulating layer, a conductor layer, and a cover insulating layer formed on the first metal surface is prepared.
  • an etching resist is disposed on the second metal surface of the metal sheet.
  • the plan view shape of the etching resist is, for example, the same shape as the plan view shape of the metal-based support layer 6 to be formed, and substantially the same as the plan view shapes of the base insulating layer and the cover insulating layer.
  • the resist laminate is immersed in an etching solution. Specifically, in the metal sheet, the etching solution is brought into contact with the first metal surface exposed from the base insulating layer and the cover insulating layer and the second metal surface exposed from the etching resist.
  • the etching rate at the center portion in the short direction is the etching rate at both ends in the short direction (however, outside in the short direction from the second metal surface).
  • it is expensive. This is because the etching solution tends to stay (stagnate) at both ends in the short direction of the exposed portion as compared with the peripheral portion in the short direction.
  • both the first metal surface and the second metal surface in the middle of etching are curved surfaces in which the central portion in the short direction is recessed toward the inside in the thickness direction.
  • the etching of the central portion in the short direction in the exposed portions of the first metal surface and the second metal surface is completed earlier than the etching of both ends in the short direction.
  • the first metal surface and the second metal surface disappear earlier at the center portion in the short direction than at both ends in the short direction. That is, first, an opening is formed at the center in the short direction, and then the opening widens toward both outer sides (both ends) in the short direction.
  • a metal side surface including two concave surfaces and a ridgeline is formed.
  • a metal side surface including two concave surfaces and a ridgeline is formed.
  • the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction.
  • the included printed circuit board that is, the printed circuit board in which the area S0 of the metal side surface 23 is equal to or larger than the projected area S1 of the metal side surface 23
  • the contact area between the metal side surface and the air can be further reliably increased as compared with the embodiment shown in FIG. 2A. Therefore, it is more excellent in the heat dissipation efficiency based on the convection from a wiring body metal part.
  • one metal side surface integrally includes a concave surface and a convex surface.
  • the concave surface and the convex surface are arranged in order in the thickness direction.
  • the concave surface on one side in the short direction is opposed to the convex surface on the other side in the short direction, and the convex surface on one side in the short direction is It faces the concave surface on the other side in the short direction in the short direction. Therefore, the wiring body metal part has a substantially S-shaped cross section.
  • the two concave surfaces on both sides on one side and the other side in the short side face each other in the short side direction.
  • Two convex surfaces on both sides on one side and the other side in the short direction face each other in the short direction.
  • the wiring body metal part 15 is cited as an example of the support part, and the wiring body metal part 15 is included in the metal-based support layer 6 whose material is metal.
  • a support layer is used, and the material of the support layer is, for example, a particle resin composition including particles having high thermal conductivity and a resin, for example, a fired composition such as ceramics. Also good.
  • the first connector 2 and the second connector 3 are both continuous in the short direction so as to include the first terminal portion 11 and the second terminal portion 12 in plan view.
  • either one may be continuous in the short direction and the other may be discontinuous in the short direction.
  • the other is divided into a plurality of parts at intervals in the short direction.
  • both the first connector 2 and the second connector 3 may be divided into a plurality at intervals in the lateral direction.
  • one main wiring portion 10 is provided in the wiring body base portion 18, but, for example, although not illustrated, a plurality of main wiring portions 10 may be provided in one wiring body base portion 18.
  • a plurality of main wiring portions 10 may be provided in one wiring body base portion 18.
  • the printed circuit board is used in various applications such as a printed circuit board for electronic equipment and a wired circuit board for electric equipment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)

Abstract

This wiring circuit board is provided with a plurality of wiring lines which are arranged in parallel to each other, while being at a distance from each other. Each one of the plurality of wiring lines is provided with: an insulating part; a wiring part which is arranged on one surface of the insulating part in the thickness direction; and a support part which is arranged on the other surface of the insulating part in the thickness direction, while being formed of a metal material, and which is configured such that the ratio of the length T in the thickness direction to the length W of the plurality of wiring lines in the parallel arrangement direction, namely T/W is 2 or more.

Description

配線回路基板Printed circuit board
　本発明は、配線回路基板に関する。 The present invention relates to a printed circuit board.
　従来、平坦形状のベース部およびベース部の下面から下方に延びる櫛歯状のフィンを備えるヒートシンクを、上面に発熱素子が実装された基板の下面に設置し、発熱素子から発生する熱をヒートシンクのフィンから放出する放熱構造が知られている（例えば、下記特許文献１参照。）。 Conventionally, a heat sink having a flat base portion and comb-like fins extending downward from the lower surface of the base portion is installed on the lower surface of the substrate on which the heating element is mounted on the upper surface, and heat generated from the heating element is transferred to the heat sink. A heat dissipation structure that discharges from a fin is known (for example, see Patent Document 1 below).
特開昭５５－１４０２５５号公報Japanese Patent Laid-Open No. 55-140255
　しかるに、放熱構造において、より高い放熱性が求められる。 However, higher heat dissipation is required in the heat dissipation structure.
　本発明は、放熱性に優れる配線回路基板を提供する。 The present invention provides a printed circuit board excellent in heat dissipation.
　本発明（１）は、互いに間隔を隔てて並列配置される複数の配線体を備え、前記複数の配線体のそれぞれは、絶縁部と、前記絶縁部の厚み方向一方面に配置される配線部と、前記絶縁部の厚み方向他方面に配置され、金属系材料からなり、厚み方向長さＴの、前記複数の配線体の並列方向における長さＷに対する比（Ｔ／Ｗ）が、２以上である支持部とを備える、配線回路基板を含む。 The present invention (1) includes a plurality of wiring bodies that are arranged in parallel at intervals, and each of the plurality of wiring bodies includes an insulating portion and a wiring portion that is disposed on one surface in the thickness direction of the insulating portion. And the ratio (T / W) of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies is 2 or more. A printed circuit board including a support portion.
　この配線回路基板では、配線体が互いに間隔を隔てて並列配置されることから、配線部で生じる熱を、複数の配線体間の空気を介して、対流させ、効率的な放熱を図ることができる。 In this wired circuit board, since the wiring bodies are arranged in parallel at a distance from each other, the heat generated in the wiring portion can be convected through the air between the plurality of wiring bodies to achieve efficient heat dissipation. it can.
　また、支持部は、厚み方向長さＴの、複数の配線体の並列方向における長さＷに対する比（Ｔ／Ｗ）が、２以上と高いため、上記した空気との接触面積を大きくすることができる。そのため、上記した対流に基づく放熱効率に優れる。 Further, since the ratio of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies (T / W) is as high as 2 or more, the support portion increases the contact area with the air. Can do. Therefore, the heat dissipation efficiency based on the above convection is excellent.
　さらに、支持部は、上記した比（Ｔ／Ｗ）が２以上と高く、かつ、金属系材料からなることから、配線部から絶縁部に伝導した熱を、厚み方向他方側に向かって効率的に放出することができる。 Furthermore, since the above-described ratio (T / W) is as high as 2 or more and the support portion is made of a metal-based material, the heat conducted from the wiring portion to the insulating portion is efficiently directed toward the other side in the thickness direction. Can be released.
　そのため、この配線回路基板は、配線体における放熱性に優れる。 Therefore, this wired circuit board is excellent in heat dissipation in the wiring body.
　本発明（２）は、一の前記支持部は、一の前記支持部と前記並列方向に隣接する他の前記支持部に面する側面を有し、前記側面の面積は、前記側面を前記並列方向に投影したときの投影面積以上である、（１）に記載の配線回路基板を含む。 In the present invention (2), the one support portion has a side surface facing the one support portion and the other support portion adjacent in the parallel direction, and the area of the side surface is equal to the side surface. The printed circuit board according to (1), which is larger than a projected area when projected in a direction, is included.
　この配線回路基板では、側面の面積が、側面を並列方向に投影したときの投影面積以上ので、支持部の側面と空気との接触面積を確実に大きくすることができる。そのため、支持部からの対流に基づく放熱効率により一層優れる。 In this printed circuit board, since the area of the side surface is equal to or larger than the projected area when the side surfaces are projected in the parallel direction, the contact area between the side surface of the support portion and the air can be reliably increased. Therefore, it is more excellent in the heat dissipation efficiency based on the convection from a support part.
　本発明（３）は、前記支持部の材料が、金属である、（１）または（２）に記載の配線回路基板を含む。 The present invention (3) includes the printed circuit board according to (1) or (2), wherein a material of the support portion is a metal.
　この配線回路基板では、支持部の材料が、金属であるので、支持部からの放熱性に優れる。 In this wired circuit board, since the material of the support portion is a metal, the heat dissipation from the support portion is excellent.
　本発明（４）は、前記複数の配線体の、前記並列方向および前記厚み方向に直交する直交方向端部を連結する連結体を備え、前記連結体は、前記配線部の直交方向端部に連続する端子部と、前記支持部の直交方向端部に連続する連結支持部とを備え、前記連結支持部は、厚み方向に投影したときに、複数の前記端子部を含むように前記並列方向に連続する、（１）～（３）のいずれか一項に記載の配線回路基板を含む。 This invention (4) is provided with the connection body which connects the orthogonal | vertical direction edge part orthogonal to the said parallel direction and the said thickness direction of the said several wiring body, The said connection body is at the orthogonal | vertical direction edge part of the said wiring part. A continuous terminal portion; and a connecting support portion that is continuous with an end portion in the orthogonal direction of the supporting portion, and the connecting support portion includes the plurality of terminal portions when projected in the thickness direction. Including the printed circuit board according to any one of (1) to (3).
　この配線回路基板では、連結支持部が、厚み方向に投影したときに、複数の端子部を含むように並列方向に連続するので、連結支持部は、複数の端子部を確実に支持することができる。 In this printed circuit board, when the connection support portion is projected in the thickness direction, the connection support portion continues in the parallel direction so as to include the plurality of terminal portions, so that the connection support portion can reliably support the plurality of terminal portions. it can.
　そのため、この配線回路基板では、配線体における放熱性に優れながら、連結体における端子部の機械強度にも優れる。 Therefore, in this wired circuit board, the heat dissipation in the wiring body is excellent, and the mechanical strength of the terminal portion in the coupling body is also excellent.
　本発明の配線回路基板は、配線体における放熱性に優れる。 The wired circuit board of the present invention is excellent in heat dissipation in the wiring body.
図１は、本発明の配線回路基板の一実施形態の平面図を示す。FIG. 1 shows a plan view of an embodiment of a printed circuit board according to the present invention. 図２Ａおよび図２Ｂは、図１に示す配線回路基板の断面図であり、図２Ａが、Ａ－Ａ線に沿う断面図、図２Ｂが、Ｂ－Ｂ線に沿う断面図を示す。2A and 2B are cross-sectional views of the printed circuit board shown in FIG. 1. FIG. 2A is a cross-sectional view taken along the line AA, and FIG. 2B is a cross-sectional view taken along the line BB.
　　配線回路基板の全体構成
　本発明の配線回路基板の一実施形態を、図１、図２Ａおよび図２Ｂを参照して、説明する。なお、図１において、後述するベース絶縁層７およびカバー絶縁層９は、後述する金属系支持層６および導体層８の相対配置を明確に示すために、省略している。 Overall Configuration of Printed Circuit Board An embodiment of the printed circuit board of the present invention will be described with reference to FIGS. 1, 2A, and 2B. In FIG. 1, the base insulating layer 7 and the cover insulating layer 9 described later are omitted to clearly show the relative arrangement of the metal-based support layer 6 and the conductor layer 8 described later.
　この配線回路基板１は、厚み方向一方面および他方面を有しており、厚み方向に直交する長手方向に延びる形状を有する。図１に示すように、配線回路基板１は、連結体の一例としての第１連結体２と、連結体の一例としての第２連結体３と、配線体４とを一体的に備える。好ましくは、配線回路基板１は、第１連結体２と、第２連結体３と、配線体４とのみを備える。 The printed circuit board 1 has one surface in the thickness direction and the other surface, and has a shape extending in the longitudinal direction perpendicular to the thickness direction. As shown in FIG. 1, the printed circuit board 1 integrally includes a first connection body 2 as an example of a connection body, a second connection body 3 as an example of a connection body, and a wiring body 4. Preferably, the printed circuit board 1 includes only the first connection body 2, the second connection body 3, and the wiring body 4.
　第１連結体２は、配線回路基板１の長手方向一端部を形成する。第１連結体２は、平面視略矩形平板形状を有する。第１連結体２の平面視における寸法は、特に限定されない。 The first connecting body 2 forms one end of the printed circuit board 1 in the longitudinal direction. The first connector 2 has a substantially rectangular flat plate shape in plan view. The dimension in the planar view of the 1st coupling body 2 is not specifically limited.
　第２連結体３は、配線回路基板１の長手方向他端部を形成しており、第１連結体２に対して、長手方向他方側に配線体４を隔てて対向配置されている。第２連結体３は、平面視略矩形平板形状を有する。第２連結体３の平面視における寸法は、特に限定されない。 The second connection body 3 forms the other end portion in the longitudinal direction of the printed circuit board 1 and is disposed opposite to the first connection body 2 on the other side in the longitudinal direction with the wiring body 4 interposed therebetween. The second connector 3 has a substantially rectangular flat plate shape in plan view. The dimension in planar view of the 2nd coupling body 3 is not specifically limited.
　配線体４は、配線回路基板１の長手方向中間部（あるいは中央部）を形成する。配線体４は、平面視において、第１連結体２および第２連結体３の間に配置されている。配線体４は、長手方向に延びる形状を有する。配線体４は、第１連結体２および第２連結体３を長手方向に架橋している。また、配線体４は、配線回路基板１の短手方向（長手方向および厚み方向に直交する方向）（配線体４の並列方向の一例）にやや長いにおいて互いに間隔を隔てて複数並列配置されている。隣接する配線体４間には、開口部５が形成されている。 The wiring body 4 forms an intermediate portion (or central portion) in the longitudinal direction of the printed circuit board 1. The wiring body 4 is disposed between the first connecting body 2 and the second connecting body 3 in plan view. The wiring body 4 has a shape extending in the longitudinal direction. The wiring body 4 bridges the first connecting body 2 and the second connecting body 3 in the longitudinal direction. A plurality of wiring bodies 4 are arranged in parallel at intervals in the short direction (direction perpendicular to the longitudinal direction and the thickness direction) of the printed circuit board 1 (an example of the parallel direction of the wiring bodies 4). Yes. An opening 5 is formed between adjacent wiring bodies 4.
　開口部５は、例えば、配線回路基板１の短手方向に配線体４を隔てている。開口部５は、長手方向に延びるスリット形状を有し、配線回路基板１を厚み方向に貫通している。 The opening 5 divides the wiring body 4 in the short direction of the printed circuit board 1, for example. The opening 5 has a slit shape extending in the longitudinal direction and penetrates the printed circuit board 1 in the thickness direction.
　複数の配線体４の長手方向一端部は、１つの第１連結体２によって短手方向に連結されている。これにより、複数の配線体４の長手方向一端部は、１つの第１連結体２によって束ねられている。 The longitudinal ends of the plurality of wiring bodies 4 are connected in the short direction by one first connecting body 2. Thereby, the longitudinal direction one end part of the some wiring body 4 is bundled by the one 1st connection body 2. FIG.
　また、複数の配線体４の長手方向他端部は、１つの第２連結体３によって短手方向に連結されている。これにより、複数の配線体４の長手方向他端部は、１つの第２連結体３によって束ねられている。 Further, the other ends in the longitudinal direction of the plurality of wiring bodies 4 are connected in the short direction by one second connecting body 3. Thereby, the other end part of the some wiring body 4 in the longitudinal direction is bundled by one 2nd connection body 3. FIG.
　配線体４の長手方向長さは、第１連結体２および第２連結体３の長手方向における間隔であって、用途および目的に応じて、適宜設定される。 The length in the longitudinal direction of the wiring body 4 is an interval in the longitudinal direction of the first connecting body 2 and the second connecting body 3, and is appropriately set according to the use and purpose.
　複数の配線体４のそれぞれの短手方向長さは、例えば、５００μｍ以下、好ましくは、３００μｍ以下、より好ましくは、１００μｍ以下であり、また、例えば、１０μｍ以上である。開口部５の短手方向長さは、例えば、１０μｍ以上、好ましくは、５０μｍ以上、より好ましくは、１００μｍ以上であり、また、例えば、１０００μｍ以下である。配線体４の短手方向長さの、開口部５の短手方向長さに対する比は、例えば、４０以下、好ましくは、１０以下であり、また、例えば、０．１以上、好ましくは、０．５以上である。 The length in the short-side direction of each of the plurality of wiring bodies 4 is, for example, 500 μm or less, preferably 300 μm or less, more preferably 100 μm or less, and for example, 10 μm or more. The length in the short direction of the opening 5 is, for example, 10 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and for example, 1000 μm or less. The ratio of the length in the short direction of the wiring body 4 to the length in the short direction of the opening 5 is, for example, 40 or less, preferably 10 or less, for example, 0.1 or more, preferably 0. .5 or more.
　　配線回路基板の層構成
　図２Ａおよび図２Ｂに示すように、この配線回路基板１は、金属系支持層６と、金属系支持層６の厚み方向一方面に配置されるベース絶縁層７と、ベース絶縁層７の厚み方向一方面に配置される導体層８と、ベース絶縁層７の厚み方向一方面に、導体層８を部分的に被覆するように配置されるカバー絶縁層９とを備える。配線回路基板１は、好ましくは、金属系支持層６と、ベース絶縁層７と、導体層８と、カバー絶縁層９とのみを備える。 2A and 2B, this wired circuit board 1 includes a metal-based support layer 6, a base insulating layer 7 disposed on one surface in the thickness direction of the metal-based support layer 6, A conductor layer 8 disposed on one surface in the thickness direction of the base insulating layer 7 and a cover insulating layer 9 disposed on the one surface in the thickness direction of the base insulating layer 7 so as to partially cover the conductor layer 8 are provided. . The printed circuit board 1 preferably includes only the metal-based support layer 6, the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9.
　金属系支持層６は、配線回路基板１の厚み方向他方面を形成する。図１、図２Ａおよび図２Ｂに示すように、金属系支持層６は、配線回路基板１と同様の外形形状を有する。具体的には、金属系支持層６は、第１連結体２、第２連結体３および配線体４に対応する外形形状を有する。金属系支持層６において、第１連結体２を形成する部分が、連結支持部の一例としての第１連結金属部１３であり、第２連結体３を形成する部分が、連結支持部の一例としての第２連結金属部１４であり、配線体４を形成する部分が、支持部の一例としての配線体金属部１５である。 The metal-based support layer 6 forms the other surface in the thickness direction of the printed circuit board 1. As shown in FIGS. 1, 2 </ b> A, and 2 </ b> B, the metal-based support layer 6 has the same outer shape as the printed circuit board 1. Specifically, the metal-based support layer 6 has an outer shape corresponding to the first connection body 2, the second connection body 3, and the wiring body 4. In the metal-based support layer 6, the part forming the first connection body 2 is a first connection metal part 13 as an example of a connection support part, and the part forming the second connection body 3 is an example of a connection support part. The second connecting metal part 14 as a part, and the part forming the wiring body 4 is a wiring body metal part 15 as an example of a support part.
　第１連結金属部１３は、平面視において、後述する複数の第１端子部１１を含むように、短手方向に連続する略平板形状を有する。 The first connecting metal portion 13 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of first terminal portions 11 to be described later in plan view.
　第２連結金属部１４は、平面視において、後述する複数の第２端子部１２を含むように、短手方向に連続する略平板形状を有する。 The second connecting metal portion 14 has a substantially flat plate shape that is continuous in the lateral direction so as to include a plurality of second terminal portions 12 described later in plan view.
　配線体金属部１５は、開口部５の厚み方向他方側部分を区画している。配線体金属部１５は、厚み方向および短手方向に沿って切断した切断面（断面視と同義）において、厚み方向に長い略矩形状を有する。 The wiring body metal portion 15 defines the other side portion of the opening 5 in the thickness direction. The wiring body metal part 15 has a substantially rectangular shape that is long in the thickness direction on a cut surface (synonymous with a sectional view) cut along the thickness direction and the short direction.
　また、金属系支持層６は、厚み方向一方面である第１金属面２１と、厚み方向他方面である第２金属面２２と、それらの周端縁を厚み方向に連結する側面である金属側面２３とを一体的に備える。 In addition, the metal-based support layer 6 is a metal that is a first metal surface 21 that is one surface in the thickness direction, a second metal surface 22 that is the other surface in the thickness direction, and a side surface that connects the peripheral edges in the thickness direction. A side surface 23 is integrally provided.
　第１金属面２１および第２金属面２２は、厚み方向に対向しており、平行する平坦面である。 The first metal surface 21 and the second metal surface 22 are opposed to each other in the thickness direction and are parallel flat surfaces.
　金属側面２３は、厚み方向に沿って真っ直ぐに延びる平坦面である。また、配線体金属部１５の金属側面２３は、長手方向に沿って真っ直ぐに延びる平坦面でもある。配線体金属部１５における金属側面２３は、開口部５に臨む金属内側面３１と、短手方向外側に臨む金属外側面３２とを備える。 The metal side surface 23 is a flat surface that extends straight along the thickness direction. Further, the metal side surface 23 of the wiring body metal portion 15 is also a flat surface extending straight along the longitudinal direction. The metal side surface 23 in the wiring body metal portion 15 includes a metal inner side surface 31 facing the opening 5 and a metal outer surface 32 facing the outer side in the lateral direction.
　金属内側面３１は、一の配線体金属部１５と短手方向に隣接する他の配線体金属部１５に面する側面の一例である。開口部５を挟んで対向する（面する）２つの金属内側面３１は、平行しており、平面視において、後述する主配線部１０の導体側面２９にも平行する。なお、金属内側面３１の面積Ｓ０は、配線体金属部１５が断面視略矩形状であることから、金属内側面３１を短手方向に投影したときの投影面積Ｓ１と同一である。金属内側面３１の面積Ｓ０は、次に説明する金属系支持層６の厚みＴを、長手方向長さで乗じた値である。 The metal inner side surface 31 is an example of a side surface facing one wiring body metal portion 15 and another wiring body metal portion 15 adjacent in the short direction. The two metal inner side surfaces 31 facing (facing) across the opening 5 are parallel to each other, and are also parallel to a conductor side surface 29 of the main wiring portion 10 described later in plan view. The area S0 of the metal inner side surface 31 is the same as the projected area S1 when the metal inner side surface 31 is projected in the lateral direction because the wiring body metal part 15 has a substantially rectangular shape in cross section. The area S0 of the metal inner side surface 31 is a value obtained by multiplying the thickness T of the metal-based support layer 6 described below by the length in the longitudinal direction.
　金属系支持層６の厚みＴは、第１金属面２１および第２金属面２２の対向長さであって、また、金属側面２３の厚み方向長さである。具体的には、金属系支持層６の厚みＴは、例えば、３０μｍ以上、好ましくは、５０μｍ以上、好ましくは、１００μｍ以上、好ましくは、２５０μｍ以上、好ましくは、５００μｍ以上、好ましくは、１０００μｍ以上であり、また、例えば、１０ｍｍ以下である。 The thickness T of the metal-based support layer 6 is the opposing length of the first metal surface 21 and the second metal surface 22 and the length of the metal side surface 23 in the thickness direction. Specifically, the thickness T of the metal-based support layer 6 is, for example, 30 μm or more, preferably 50 μm or more, preferably 100 μm or more, preferably 250 μm or more, preferably 500 μm or more, preferably 1000 μm or more. Yes, for example, 10 mm or less.
　配線体金属部１５の短手方向長さＷは、上記した配線体４の短手方向長さで例示した範囲から適宜選択され、具体的には、配線体金属部１５の短手方向長さＷは、配線体４の短手方向長さと同一である。なお、複数の配線体４において、配線体金属部１５の短手方向長さＷが、隣接する２つの金属内側面３１間の距離（長さ）である。 The length W in the short direction of the wiring body metal portion 15 is appropriately selected from the range exemplified by the length in the short direction of the wiring body 4 described above, and specifically, the length in the short direction of the wiring body metal portion 15. W is the same as the length of the wiring body 4 in the short direction. Note that, in the plurality of wiring bodies 4, the short direction length W of the wiring body metal portion 15 is a distance (length) between two adjacent metal inner side surfaces 31.
　また、配線体金属部１５の厚みＴの、配線体金属部１５の短手方向長さＷに対する比（Ｔ／Ｗ）は、２以上である。なお、比（Ｔ／Ｗ）は、配線体金属部１５を厚み方向および短手方向に沿って切断した切断面におけるアスペクト比に相当する。アスペクト比（Ｔ／Ｗ）が２未満であれば、配線体４における主配線部１０（後述）で生じる熱を、開口部５における空気を利用して、効率的に放出することができない。 Further, the ratio (T / W) of the thickness T of the wiring body metal portion 15 to the length W in the short direction of the wiring body metal portion 15 is 2 or more. The ratio (T / W) corresponds to the aspect ratio of the cut surface obtained by cutting the wiring body metal portion 15 along the thickness direction and the short side direction. If the aspect ratio (T / W) is less than 2, the heat generated in the main wiring portion 10 (described later) in the wiring body 4 cannot be efficiently released using the air in the opening 5.
　また、アスペクト比（Ｔ／Ｗ）は、好ましくは、２．５以上、より好ましくは、３以上、さらに好ましくは、３．５以上であり、また、１０００以下、さらには、１００以下である。比（Ｔ／Ｗ）が上記した下限以上であれば、配線体４における主配線部１０で生じる熱を、開口部５における空気を利用して、効率的に放出することができる。 Further, the aspect ratio (T / W) is preferably 2.5 or more, more preferably 3 or more, still more preferably 3.5 or more, and 1000 or less, and further 100 or less. If the ratio (T / W) is equal to or greater than the lower limit described above, the heat generated in the main wiring portion 10 in the wiring body 4 can be efficiently released using the air in the opening 5.
　金属系支持層６の材料は、例えば、公知ないし慣用の金属系材料（具体的には、金属材料）から適宜選択して用いることができる。具体的には、金属系材料としては、周期表で、第１族～第１６族に分類されている金属元素や、これらの金属元素を２種類以上含む合金などが挙げられる。なお、金属系材料としては、遷移金属、典型金属のいずれであってもよい。より具体的には、金属系材料としては、例えば、カルシウムなどの第２族金属元素、チタン、ジルコニウムなどの第４族金属元素、バナジウムなどの第５族金属元素、クロム、モリブデン、タングステンなどの第６族金属元素、マンガンなどの第７族金属元素、鉄などの第８族金属元素、コバルトなどの第９族金属元素、ニッケル、白金などの第１０族金属元素、銅、銀、金などの第１１族金属元素、亜鉛などの第１２族金属元素、アルミニウム、ガリウムなどの第１３族金属元素、ゲルマニウム、錫などの第１４族金属元素が挙げられる。これらは、単独使用または併用することができる。 The material for the metal-based support layer 6 can be appropriately selected from, for example, known or commonly used metal-based materials (specifically, metal materials). Specifically, examples of the metal-based material include metal elements classified into Group 1 to Group 16 in the periodic table, and alloys containing two or more of these metal elements. The metal-based material may be either a transition metal or a typical metal. More specifically, examples of the metal-based material include a Group 2 metal element such as calcium, a Group 4 metal element such as titanium and zirconium, a Group 5 metal element such as vanadium, chromium, molybdenum, and tungsten. Group 6 metal elements, Group 7 metal elements such as manganese, Group 8 metal elements such as iron, Group 9 metal elements such as cobalt, Group 10 metal elements such as nickel and platinum, Copper, Silver, Gold, etc. Group 11 metal elements, such as zinc, Group 12 metal elements such as zinc, Group 13 metal elements such as aluminum and gallium, and Group 14 metal elements such as germanium and tin. These can be used alone or in combination.
　なお、第１連結支持部１３、第２連結支持部１４および配線体金属部１５の材料は、同一である。 In addition, the material of the 1st connection support part 13, the 2nd connection support part 14, and the wiring body metal part 15 is the same.
　なお、金属系支持層６は、材料が金属である金属支持層６を含む。 The metal-based support layer 6 includes a metal support layer 6 whose material is a metal.
　金属系支持層６の熱伝導率は、例えば、５Ｗ／ｍ・Ｋ以上、好ましくは、１０Ｗ／ｍ・Ｋ以上、さらには、１５Ｗ／ｍ・Ｋ以上、２０Ｗ／ｍ・Ｋ以上、２５Ｗ／ｍ・Ｋ以上、３０Ｗ／ｍ・Ｋ以上、３５Ｗ／ｍ・Ｋ以上、４０Ｗ／ｍ・Ｋ以上、５０Ｗ／ｍ・Ｋ以上、６０Ｗ／ｍ・Ｋ以上、７５Ｗ／ｍ・Ｋ以上、１００Ｗ／ｍ・Ｋ以上、２００Ｗ／ｍ・Ｋ以上、３００Ｗ／ｍ・Ｋ以上、３５０Ｗ／ｍ・Ｋ以上が好適である。金属系支持層６の熱伝導率が上記した下限以上であれば、主配線部１０から配線体ベース部１８に伝導した熱を、厚み方向他方側に向かって効率的に放出することができる。 The thermal conductivity of the metal-based support layer 6 is, for example, 5 W / m · K or more, preferably 10 W / m · K or more, more preferably 15 W / m · K or more, 20 W / m · K or more, 25 W / m. · K or higher, 30 W / m · K or higher, 35 W / m · K or higher, 40 W / m · K or higher, 50 W / m · K or higher, 60 W / m · K or higher, 75 W / m · K or higher, 100 W / m · K or more, 200 W / m · K or more, 300 W / m · K or more, 350 W / m · K or more are suitable. If the thermal conductivity of the metal-based support layer 6 is equal to or greater than the lower limit described above, the heat conducted from the main wiring portion 10 to the wiring body base portion 18 can be efficiently released toward the other side in the thickness direction.
　金属系支持層６の熱伝導率は、ＪＩＳ　Ｈ　７９０３：２００８（有効熱伝導率測定法）によって求められる。 The thermal conductivity of the metal-based support layer 6 is obtained by JIS H 7903: 2008 (effective thermal conductivity measurement method).
　ベース絶縁層７は、例えば、金属系支持層６の第１金属面２１全面に配置されている。具体的には、ベース絶縁層７は、第１連結体２、第２連結体３および配線体４に対応する外形形状を有する。ベース絶縁層７において、第１連結体２を形成する部分が、第１連結ベース部１６であり、第２連結体３を形成する部分が、第２連結ベース部１７であり、配線体４を形成する部分が、絶縁部の一例としての配線体ベース部１８である。 The base insulating layer 7 is disposed, for example, on the entire first metal surface 21 of the metal-based support layer 6. Specifically, the base insulating layer 7 has an outer shape corresponding to the first connecting body 2, the second connecting body 3, and the wiring body 4. In the base insulating layer 7, the part forming the first connection body 2 is the first connection base part 16, the part forming the second connection body 3 is the second connection base part 17, and the wiring body 4 A portion to be formed is a wiring body base portion 18 as an example of an insulating portion.
　第１連結ベース部１６は、第１連結金属部１３の第１金属面２１全面に配置されている。第２連結ベース部１７は、第２連結金属部１４の第１金属面２１全面に配置されている。 The first connection base portion 16 is disposed on the entire first metal surface 21 of the first connection metal portion 13. The second connection base portion 17 is disposed on the entire first metal surface 21 of the second connection metal portion 14.
　配線体ベース部１８は、配線体金属部１５の第１金属面２１全面に配置されている。換言すれば、配線体金属部１５は、配線体ベース部１８の厚み方向他方面（後述する第２ベース面２５）に配置されている。また、配線体ベース部１８は、上記した配線体金属部１５と、後述する配線体カバー部３３とともに、開口部５を区画している。 The wiring body base portion 18 is disposed on the entire first metal surface 21 of the wiring body metal portion 15. In other words, the wiring body metal portion 15 is disposed on the other surface in the thickness direction of the wiring body base portion 18 (second base surface 25 described later). Further, the wiring body base portion 18 defines the opening 5 together with the wiring body metal portion 15 and the wiring body cover portion 33 described later.
　また、ベース絶縁層７は、厚み方向一方面である第１ベース面２４と、厚み方向他方面である第２ベース面２５と、それらの周端縁を厚み方向に連結する側面であるベース側面２６とを一体的に備える。 The base insulating layer 7 includes a first base surface 24 that is one surface in the thickness direction, a second base surface 25 that is the other surface in the thickness direction, and a base side surface that is a side surface connecting the peripheral edges in the thickness direction. 26 are integrally provided.
　第１ベース面２４は、第１金属面２１に平行する平坦面である。 The first base surface 24 is a flat surface parallel to the first metal surface 21.
　第２ベース面２５は、第１金属面２１に接触する平坦面である。 The second base surface 25 is a flat surface that contacts the first metal surface 21.
　ベース側面２６は、厚み方向に沿って真っ直ぐに延びる平坦面である。また、ベース側面２６は、配線体ベース部１８においては、金属側面２３と厚み方向に面一に形成されている。なお、ベース側面２６は、配線体ベース部１８において、金属内側面３１と面一に形成されるベース内側面３７を有する。ベース内側面３７は、開口部５を部分的に区画している。 The base side surface 26 is a flat surface that extends straight along the thickness direction. Further, the base side surface 26 is formed flush with the metal side surface 23 in the thickness direction in the wiring body base portion 18. The base side surface 26 has a base inner side surface 37 that is formed flush with the metal inner side surface 31 in the wiring body base portion 18. The base inner side surface 37 partially defines the opening 5.
　ベース絶縁層７の厚みは、第１ベース面２４および第１金属面２１の対向長さであって、また、ベース側面２６の厚み方向長さであり、具体的には、例えば、１μｍ以上、好ましくは、５μｍ以上であり、また、例えば、１００μｍ以下、好ましくは、５０μｍ以下である。ベース絶縁層７の厚みの、金属系支持層６の厚みＴに対する比は、例えば、１０以下、好ましくは、１以下、より好ましくは、０．１以下であり、また、例えば、０．００５以上である。 The thickness of the base insulating layer 7 is the length of the first base surface 24 and the first metal surface 21 facing each other, and the length of the base side surface 26 in the thickness direction, specifically, for example, 1 μm or more, Preferably, it is 5 μm or more, for example, 100 μm or less, preferably 50 μm or less. The ratio of the thickness of the base insulating layer 7 to the thickness T of the metal-based support layer 6 is, for example, 10 or less, preferably 1 or less, more preferably 0.1 or less, and for example, 0.005 or more. It is.
　ベース絶縁層７の材料としては、例えば、ポリイミドなどの絶縁性樹脂が挙げられる。 Examples of the material of the base insulating layer 7 include an insulating resin such as polyimide.
　なお、ベース絶縁層７の熱伝導率は、金属系支持層６の熱伝導率に比べて低く、具体的には、例えば、１Ｗ／ｍ・Ｋ以下、さらには、０．５Ｗ／ｍ・Ｋ以下であり、また、例えば、０．０１　Ｗ／ｍ・Ｋ以上、好ましくは、０．１Ｗ／ｍ・Ｋ以上である。
ベース絶縁層７の熱伝導率は、ＪＩＳ　Ａ　１４１２（熱絶縁材の熱伝導率測定法）によって求められる。 Note that the thermal conductivity of the base insulating layer 7 is lower than the thermal conductivity of the metal-based support layer 6, specifically, for example, 1 W / m · K or less, and further 0.5 W / m · K. For example, it is 0.01 W / m · K or more, preferably 0.1 W / m · K or more.
The thermal conductivity of the base insulating layer 7 is determined by JIS A 1412 (Method for measuring the thermal conductivity of a thermal insulating material).
　導体層８は、ベース絶縁層７の第１ベース面２４に配置されている。具体的には、導体層８は、第１連結ベース部１６、第２連結ベース部１７および配線体ベース部１８の第１ベース面２４に配置されている。 The conductor layer 8 is disposed on the first base surface 24 of the base insulating layer 7. Specifically, the conductor layer 8 is disposed on the first base surface 24 of the first connection base portion 16, the second connection base portion 17, and the wiring body base portion 18.
　導体層８において、第１連結体２に含まれる部分が第１端子部１１および第１補助配線部１９であり、第２連結体３に含まれる部分が第２端子部１２および第２補助配線部２０であり、配線体４に含まれる部分が配線部の一例としての主配線部１０である。 In the conductor layer 8, the portions included in the first connection body 2 are the first terminal portion 11 and the first auxiliary wiring portion 19, and the portions included in the second connection body 3 are the second terminal portion 12 and the second auxiliary wiring. The part 20 included in the wiring body 4 is a main wiring part 10 as an example of the wiring part.
　第１端子部１１は、第１連結体２内において、複数の配線体４（主配線部１０）に対応して、配線回路基板１の短手方向に間隔を隔てて複数配置されている。複数の第１端子部１１は、厚み方向に投影したときに、第１連結金属部１３に含まれるように、短手方向に間隔を隔てて整列配置されている。 A plurality of first terminal portions 11 are arranged in the first connecting body 2 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10). The plurality of first terminal portions 11 are aligned and spaced apart in the lateral direction so as to be included in the first connecting metal portion 13 when projected in the thickness direction.
　第１端子部１１は、第１連結ベース部１６の第１ベース面２４に配置されている。第１端子部１１は、第１ベース面２４における長手方向他端部に第１補助配線部１９が形成される領域が確保されるように、第１ベース面２４における長手方向一端部および中央部に配置されている。第１端子部１１は、平面視略矩形状（角ランド形状）を有する。 The first terminal portion 11 is disposed on the first base surface 24 of the first connection base portion 16. The first terminal portion 11 has one end portion and a central portion in the longitudinal direction on the first base surface 24 so that a region where the first auxiliary wiring portion 19 is formed on the other longitudinal end portion in the first base surface 24 is secured. Is arranged. The first terminal portion 11 has a substantially rectangular shape (corner land shape) in plan view.
　第１補助配線部１９は、第１連結体２内の第１連結ベース部１６の第１ベース面２４に、第１端子部１１に連続するように配置されている。第１補助配線１９は、第１端子部１１の長手方向他端縁から長手方向他方側に向かって延びる平面視略直線形状を有する。第１補助配線部１９は、第１端子部１１の長手方向他端縁および次に説明する主配線部１０の長手方向一端縁を連結する。第１補助配線１９の短手方向長さは、第１端子部１１の短手方向長さに対して、短い。第１補助配線１９の短手方向長さの、第１端子部１１の短手方向長さに対する比は、例えば、０．８以下、好ましくは、０．５以下であり、また、例えば、０．００１以上、好ましくは、０．０１以上である。第１補助配線１９の短手方向長さは、主配線部１０の短手方向長さと同一である。 The first auxiliary wiring portion 19 is disposed on the first base surface 24 of the first connection base portion 16 in the first connection body 2 so as to be continuous with the first terminal portion 11. The first auxiliary wiring 19 has a substantially linear shape in a plan view extending from the other end in the longitudinal direction of the first terminal portion 11 toward the other side in the longitudinal direction. The 1st auxiliary wiring part 19 connects the longitudinal direction other end edge of the 1st terminal part 11, and the longitudinal direction one end edge of the main wiring part 10 demonstrated below. The length of the first auxiliary wiring 19 in the short direction is shorter than the length of the first terminal portion 11 in the short direction. The ratio of the length in the short direction of the first auxiliary wiring 19 to the length in the short direction of the first terminal portion 11 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more. The length of the first auxiliary wiring 19 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
　第２端子部１２は、第２連結体３内において、複数の配線体４（主配線部１０）に対応して、配線回路基板１の短手方向に間隔を隔てて複数配置されている。複数の第２端子部１２は、厚み方向に投影したときに、第２連結金属部１４に含まれるように、短手方向に整列配置されている。第２端子部１２は、第２連結ベース部１７の第１ベース面２４に配置されている。第２端子部１２は、第１ベース面２４における長手方向一端部に第２補助配線部２０が形成される領域が形成される領域が確保されるように、第１ベース面２４における長手方向他端部および中央部に配置されている。第２端子部１２は、平面視略矩形状（角ランド形状）を有する。 A plurality of second terminal portions 12 are arranged in the second connecting body 3 at intervals in the short direction of the printed circuit board 1 corresponding to the plurality of wiring bodies 4 (main wiring portions 10). The plurality of second terminal portions 12 are arranged in the short direction so as to be included in the second connecting metal portion 14 when projected in the thickness direction. The second terminal portion 12 is disposed on the first base surface 24 of the second connection base portion 17. The second terminal portion 12 has a longitudinal direction on the first base surface 24 such that a region where the second auxiliary wiring portion 20 is formed is secured at one longitudinal end portion of the first base surface 24. It is arrange | positioned at the edge part and the center part. The second terminal portion 12 has a substantially rectangular shape (square land shape) in plan view.
　第２補助配線部２０は、第２連結体３内の第２連結ベース部１７の第１ベース面２４において、第２端子部１２に連続するように配置されている。第２補助配線２０は、第２端子部１２の長手方向一端縁から長手方向一方側に向かって延びる平面視略直線形状を有する。第２補助配線部２０は、第２端子部１２の長手方向一端縁および次に説明する主配線部１０の長手方向他端縁を連結する。第２補助配線部２０の短手方向長さは、第２端子部１２の短手方向長さに対して、短い。第２補助配線部２０の短手方向長さの、第２端子部１２の短手方向長さに対する比は、例えば、０．８以下、好ましくは、０．５以下であり、また、例えば、０．００１以上、好ましくは、０．０１以上である。第２補助配線部２０の短手方向長さは、主配線部１０の短手方向長さと同一である。 The second auxiliary wiring part 20 is arranged on the first base surface 24 of the second connection base part 17 in the second connection body 3 so as to be continuous with the second terminal part 12. The second auxiliary wiring 20 has a substantially linear shape in plan view extending from one longitudinal edge of the second terminal portion 12 toward one longitudinal side. The 2nd auxiliary wiring part 20 connects the longitudinal direction one end edge of the 2nd terminal part 12, and the longitudinal direction other end edge of the main wiring part 10 demonstrated below. The short direction length of the second auxiliary wiring part 20 is shorter than the short direction length of the second terminal part 12. The ratio of the length in the short direction of the second auxiliary wiring portion 20 to the length in the short direction of the second terminal portion 12 is, for example, 0.8 or less, preferably 0.5 or less. 0.001 or more, preferably 0.01 or more. The length of the second auxiliary wiring portion 20 in the short direction is the same as the length of the main wiring portion 10 in the short direction.
　主配線部１０は、配線体ベース部１８の第１ベース面２４に配置されている。具体的には、複数の主配線部１０のそれぞれは、複数の配線体ベース部１８の第１ベース面２４の短手方向略中央部に配置されている。また、主配線部１０は、厚み方向に投影したときに、配線体ベース部１８に包含されている。具体的には、複数の主配線部１０のそれぞれは、複数の配線体ベース部１８の第１ベース面２４の短手方向両端部に次に説明するカバー絶縁層９が形成される領域が確保されるように配置されている。 The main wiring portion 10 is disposed on the first base surface 24 of the wiring body base portion 18. Specifically, each of the plurality of main wiring portions 10 is disposed at a substantially central portion in the short-side direction of the first base surface 24 of the plurality of wiring body base portions 18. The main wiring portion 10 is included in the wiring body base portion 18 when projected in the thickness direction. Specifically, each of the plurality of main wiring portions 10 secures a region where a cover insulating layer 9 described below is formed at both ends in the short direction of the first base surface 24 of the plurality of wiring body base portions 18. Are arranged to be.
　主配線部１０は、配線体ベース部１８（あるいは、配線体金属部１５）と１対１対応で設けられている。 The main wiring portion 10 is provided in one-to-one correspondence with the wiring body base portion 18 (or the wiring body metal portion 15).
　また、主配線部１０の長手方向一端縁は、第１連結体２における第１補助配線１９の長手方向他端縁に連続している。主配線部１０の長手方向他端縁は、第２連結体３における第２補助配線部２０の長手方向一端縁に連続している。これにより、主配線部１０は、第１補助配線１９および第２補助配線部２０とともに、長手方向に延びる平面視略直線形状を形成し、第１端子部１１および第２端子部１２を長手方向に接続する配線を形成している。 Further, one end edge in the longitudinal direction of the main wiring portion 10 is continuous with the other edge in the longitudinal direction of the first auxiliary wiring 19 in the first connector 2. The other end edge in the longitudinal direction of the main wiring portion 10 is continuous with the one end edge in the longitudinal direction of the second auxiliary wiring portion 20 in the second connector 3. Thereby, the main wiring part 10 forms a substantially straight line shape in plan view extending in the longitudinal direction together with the first auxiliary wiring 19 and the second auxiliary wiring part 20, and the first terminal part 11 and the second terminal part 12 are arranged in the longitudinal direction. Wiring to be connected to is formed.
　主配線部１０の短手方向長さは、例えば、第１補助配線１９および第２補助配線部２０の短手方向長さと同一である。 The length in the short direction of the main wiring portion 10 is the same as the length in the short direction of the first auxiliary wiring 19 and the second auxiliary wiring portion 20, for example.
　導体層８は、厚み方向一方面である第１導体面２７と、厚み方向他方面である第２導体面２８と、それらの周端縁を厚み方向に連結する側面である導体側面２９とを一体的に備える。 The conductor layer 8 includes a first conductor surface 27 that is one surface in the thickness direction, a second conductor surface 28 that is the other surface in the thickness direction, and a conductor side surface 29 that is a side surface connecting the peripheral edges in the thickness direction. Provide one.
　第１導体面２７は、第１ベース面２４に平行する平坦面である。 The first conductor surface 27 is a flat surface parallel to the first base surface 24.
　第２導体面２８は、第１ベース面２４に接触する平坦面である。 The second conductor surface 28 is a flat surface that contacts the first base surface 24.
　導体側面２９は、平面視で、ベース側面２６の内側に配置されている。とりわけ、複数の配線体４のそれぞれにおいては、導体側面２９は、ベース側面２６に対して短手方向内側に配置されている。 The conductor side surface 29 is disposed inside the base side surface 26 in plan view. In particular, in each of the plurality of wiring bodies 4, the conductor side surface 29 is disposed on the inner side in the lateral direction with respect to the base side surface 26.
　導体層８の材料としては、例えば、銅、銀、金、鉄、アルミニウム、クロム、それらの合金などが挙げられる。好ましくは、良好な電気特性を得る観点から、銅が挙げられる。 Examples of the material of the conductor layer 8 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Preferably, copper is used from the viewpoint of obtaining good electrical characteristics.
　導体層８の厚みは、第１導体面２７および第１ベース面２４の対向長さであって、また、導体側面２９の厚み方向長さであり、具体的には、例えば、１μｍ以上、好ましくは、５μｍ以上であり、また、例えば、５０μｍ以下、好ましくは、３μｍ以下である。 The thickness of the conductor layer 8 is the opposing length of the first conductor surface 27 and the first base surface 24, and the length in the thickness direction of the conductor side surface 29. Specifically, for example, 1 μm or more is preferable. Is 5 μm or more, and is, for example, 50 μm or less, preferably 3 μm or less.
　また、主配線部１０の短手方向長さは、例えば、２００μｍ以下、好ましくは、１００μｍ以下であり、また、例えば、１μｍ以上、好ましくは、５μｍ以上である。また、主配線部１０の短手方向長さの、配線体金属部１５の短手方向長さＷに対する比は、例えば、２以下、好ましくは、１以下であり、また、例えば、０．０１以上、好ましくは、０．１以上である。 The length in the short direction of the main wiring portion 10 is, for example, 200 μm or less, preferably 100 μm or less, and for example, 1 μm or more, preferably 5 μm or more. Further, the ratio of the length in the short direction of the main wiring portion 10 to the length W in the short direction of the wiring body metal portion 15 is, for example, 2 or less, preferably 1 or less, for example, 0.01 As mentioned above, Preferably, it is 0.1 or more.
　カバー絶縁層９は、第１ベース面２４に、第１補助配線１９、第２補助配線部２０および主配線部１０の、第１導体面２７および導体側面２９を被覆するように、配置されている。一方、カバー絶縁層９は、第１端子部１１および第２端子部１２の少なくとも第１導体面２７を露出している。 The insulating cover layer 9 is disposed on the first base surface 24 so as to cover the first conductor surface 27 and the conductor side surface 29 of the first auxiliary wiring 19, the second auxiliary wiring portion 20, and the main wiring portion 10. Yes. On the other hand, the insulating cover layer 9 exposes at least the first conductor surface 27 of the first terminal portion 11 and the second terminal portion 12.
　カバー絶縁層９において、第１連結体２に含まれる部分が、第１連結カバー部（図１および図２には図示されず）であり、第２連結体３に含まれる部分が、第２連結カバー部（図１および図２には図示されず）であり、配線体４に含まれる部分が、配線体カバー部３３である。 In the insulating cover layer 9, the portion included in the first connecting body 2 is a first connecting cover portion (not shown in FIGS. 1 and 2), and the portion included in the second connecting body 3 is the second connecting cover portion 9. A connecting cover portion (not shown in FIGS. 1 and 2), and a portion included in the wiring body 4 is a wiring body cover portion 33.
　図示しない第１連結カバー部は、第１端子部１１を露出するが、第１補助配線１９を被覆している。図示しないが第２連結カバー部は、第２端子部１２を露出するが、第２補助配線部２０を被覆している。 A first connection cover portion (not shown) exposes the first terminal portion 11 but covers the first auxiliary wiring 19. Although not shown, the second connection cover portion exposes the second terminal portion 12 but covers the second auxiliary wiring portion 20.
　配線体カバー部３３は、主配線部１０の第１導体面２７および導体側面２９と、第１ベース面２４における主配線部１０の短手方向外側近傍部分とを被覆している。 The wiring body cover portion 33 covers the first conductor surface 27 and the conductor side surface 29 of the main wiring portion 10 and the portion of the first base surface 24 near the outer side in the short direction of the main wiring portion 10.
　カバー絶縁層９は、厚み方向一方面である第１カバー面３４と、厚み方向他方面である第２カバー面３５と、それらの周端縁を厚み方向に連結する側面であるカバー側面３６とを一体的に備える。 The insulating cover layer 9 includes a first cover surface 34 that is one surface in the thickness direction, a second cover surface 35 that is the other surface in the thickness direction, and a cover side surface 36 that is a side surface connecting these peripheral edges in the thickness direction. Is integrally provided.
　第１カバー面３４は、第１導体面２７に平行する平坦面である。 The first cover surface 34 is a flat surface parallel to the first conductor surface 27.
　第２カバー面３５は、第１導体面２７および導体側面２９と、第１ベース面２４とに接触する。 The second cover surface 35 is in contact with the first conductor surface 27 and the conductor side surface 29 and the first base surface 24.
　カバー側面３６は、配線体ベース部１８においては、ベース側面２６と厚み方向に面一に形成されている。なお、カバー側面３６は、配線体カバー部３３においては、ベース内側面３７と面一に形成されるカバー内側面３８を有する。 The cover side surface 36 is formed flush with the base side surface 26 in the thickness direction in the wiring body base portion 18. The cover side surface 36 has a cover inner side surface 38 that is formed flush with the base inner side surface 37 in the wiring body cover portion 33.
　そのため、複数の配線体４のそれぞれは、２つの配線体側面５０を有する。配線体側面５０は、金属側面２３、ベース側面２６およびカバー側面３６から形成（構成）されており、厚み方向に連続している。そのため、配線体４は、断面視において、厚み方向に長く延びる形状略直線形状を有する。なお、配線体側面５０は、断面視において、金属内側面３１、ベース内側面３７およびカバー内側面３８によって形成される配線体内側面５１を有しており、この配線体内側面５１は、開口部５を区画している。 Therefore, each of the plurality of wiring bodies 4 has two wiring body side surfaces 50. The wiring body side surface 50 is formed (configured) from the metal side surface 23, the base side surface 26, and the cover side surface 36, and is continuous in the thickness direction. Therefore, the wiring body 4 has a substantially linear shape that extends long in the thickness direction in a cross-sectional view. The wiring body side surface 50 has a wiring body side surface 51 formed by the metal inner side surface 31, the base inner side surface 37, and the cover inner side surface 38 in a cross-sectional view. Is partitioned.
　カバー絶縁層９の厚みは、第１カバー面３４および第１導体面２７の対向長さであって具体的には、例えば、１μｍ以上、好ましくは、５μｍ以上であり、また、例えば、１００μｍ以下、好ましくは、５０μｍ以下である。 The thickness of the cover insulating layer 9 is the length of the first cover surface 34 and the first conductor surface 27 facing each other, specifically, for example, 1 μm or more, preferably 5 μm or more, and, for example, 100 μm or less. Preferably, it is 50 μm or less.
　カバー絶縁層９の材料としては、例えば、ポリイミドなどの絶縁性樹脂が挙げられる。 Examples of the material of the cover insulating layer 9 include an insulating resin such as polyimide.
　配線回路基板１の厚みは、例えば、１０μｍ以上、好ましくは、１００μｍ以上であり、また、例えば、１０ｍｍ以下、好ましくは、１ｍｍ以下である。 The thickness of the printed circuit board 1 is, for example, 10 μm or more, preferably 100 μm or more, and for example, 10 mm or less, preferably 1 mm or less.
　この配線回路基板１を製造するには、例えば、まず、平板形状の金属シートを準備し、その後、上記した形状を有するベース絶縁層７、導体層８およびカバー絶縁層９を順次形成する。その後、金属シートを外形加工して、第１連結金属部１３、第２連結金属部１４および配線体金属部１５を形成することによって、金属系支持層６を形成する。外形加工は、特に限定されず、例えば、エッチング、レーザー加工、ウォータージェット（ウォーターカッター）、プレス打ち抜きなどが挙げられる。 In order to manufacture the printed circuit board 1, for example, first, a flat metal sheet is prepared, and then the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9 having the above-described shapes are sequentially formed. Thereafter, the metal sheet is externally processed to form the first connection metal part 13, the second connection metal part 14, and the wiring body metal part 15, thereby forming the metal-based support layer 6. The outer shape processing is not particularly limited, and examples thereof include etching, laser processing, water jet (water cutter), and press punching.
　あるいは、予め、第１連結金属部１３、第２連結金属部１４および配線体金属部１５を備える金属系支持層６の第１金属面２１に、ベース絶縁層７、導体層８およびカバー絶縁層９を順次形成することもできる。 Alternatively, the base insulating layer 7, the conductor layer 8, and the cover insulating layer are previously formed on the first metal surface 21 of the metal-based support layer 6 including the first connecting metal portion 13, the second connecting metal portion 14, and the wiring body metal portion 15. 9 can also be formed sequentially.
　図２Ｂの仮想線で示すように、その後、第１素子４１を第１連結体２に実装するとともに、第２素子４２を第２連結体３に実装する。 2B, the first element 41 is then mounted on the first connector 2 and the second element 42 is mounted on the second connector 3 as indicated by the phantom line in FIG. 2B.
　第１素子４１および／または第２素子４２としては、電流値が高い電流（例えば、１Ａ以上、さらには、１０Ａ以上の大電流）を入出力可能に構成されている。なお、第１素子４１は、厚み方向他方面に配置される第１電極４３を有する。第２素子４２は、厚み方向他方面に配置される第２電極４４を有する。 The first element 41 and / or the second element 42 are configured to be able to input / output a current having a high current value (for example, 1 A or more, and further, a large current of 10 A or more). The first element 41 includes a first electrode 43 disposed on the other surface in the thickness direction. The second element 42 includes a second electrode 44 disposed on the other surface in the thickness direction.
　第１素子４１を第１端子部１１に実装するには、第１電極４３を第１端子部１１と電気的に接続する。第２素子４２を第２端子部１２に実装するには、第２電極４４を第２端子部１２と電気的に接続する。 In order to mount the first element 41 on the first terminal portion 11, the first electrode 43 is electrically connected to the first terminal portion 11. In order to mount the second element 42 on the second terminal portion 12, the second electrode 44 is electrically connected to the second terminal portion 12.
　そして、この配線回路基板１では、配線体４が互いに間隔を隔てて並列配置されることから、第１素子４１および／または第２素子４２からの大電流の入力に基づく主配線部１０で生じる熱を、複数の配線体４間（開口部５）の空気を介して、対流させ、とりわけ、厚み方向に対流させて、効率的な放熱を図ることができる。 In the wired circuit board 1, the wiring bodies 4 are arranged in parallel with a space therebetween, and thus are generated in the main wiring portion 10 based on the input of a large current from the first element 41 and / or the second element 42. Heat can be convected through the air between the plurality of wiring bodies 4 (openings 5), and in particular, convection in the thickness direction can be efficiently radiated.
　また、配線体金属部１５のアスペクト比（Ｔ／Ｗ）が、２以上と高いため、上記した空気との接触面積を大きくすることができる。そのため、上記した対流に基づく放熱効率に優れる。 Moreover, since the aspect ratio (T / W) of the wiring body metal part 15 is as high as 2 or more, the contact area with the air can be increased. Therefore, the heat dissipation efficiency based on the above convection is excellent.
　さらに、配線体金属部１５は、上記したアスペクト比（Ｔ／Ｗ）が２以上と高く、かつ、金属系材料からなることから、主配線部１０から配線体ベース部１８に伝導した熱を、配線体ベース部１８の厚み方向他方側に向かって、具体的には、配線体金属部１５の第１金属面２１から第２金属面２２に、さらには、第２金属面２２の厚み方向他方側に向けて効率的に放出することができる。 Furthermore, since the wiring body metal portion 15 has a high aspect ratio (T / W) of 2 or more and is made of a metal-based material, the heat conducted from the main wiring portion 10 to the wiring body base portion 18 is To the other side in the thickness direction of the wiring body base 18, specifically, from the first metal surface 21 of the wiring body metal portion 15 to the second metal surface 22, and further in the thickness direction of the second metal surface 22. It can discharge efficiently toward the side.
　そのため、この配線回路基板１は、配線体４における放熱性に優れる。 Therefore, the printed circuit board 1 is excellent in heat dissipation in the wiring body 4.
　また、この配線回路基板１では、配線体金属部１５の材料が、金属であるので、配線体金属部１５からの放熱性に優れる。 Moreover, in this wired circuit board 1, since the material of the wiring body metal part 15 is a metal, the heat dissipation from the wiring body metal part 15 is excellent.
　また、この配線回路基板１では、第１連結金属部１３は、厚み方向に投影したときに、複数の第１端子部１１を含むように短手方向に連続するので、第１連結金属部１３は、複数の第１端子部１１を確実に支持することができる。 Moreover, in this wired circuit board 1, since the 1st connection metal part 13 continues in a transversal direction so that the some 1st terminal part 11 may be included, when projected in the thickness direction, the 1st connection metal part 13 is included. Can reliably support the plurality of first terminal portions 11.
　第２連結金属部１４は、厚み方向に投影したときに、複数の第２端子部１２を含むように短手方向に連続するので、第２連結金属部１４は、複数の第２端子部１２を確実に支持することができる。 Since the 2nd connection metal part 14 continues in a transversal direction so that a plurality of 2nd terminal parts 12 may be included when projected in the thickness direction, the 2nd connection metal part 14 has a plurality of 2nd terminal parts 12 Can be reliably supported.
　従って、この配線回路基板１では、配線体４における放熱性に優れながら、第１連結体２における第１端子部１１の機械強度、および、第２連結体３における第２端子部１２の機械強度にも優れる。そのため、第１端子部１１および第２端子部１２における接続信頼性に優れる。 Therefore, in this wired circuit board 1, the mechanical strength of the first terminal portion 11 in the first connection body 2 and the mechanical strength of the second terminal portion 12 in the second connection body 3 are excellent while the heat dissipation in the wiring body 4 is excellent. Also excellent. Therefore, the connection reliability in the 1st terminal part 11 and the 2nd terminal part 12 is excellent.
　このような配線回路基板１の用途は、特に限定されず、各種分野に用いられる。配線回路基板１は、例えば、電子機器用配線回路基板（電子部品用配線回路基板）、電気機器用配線回路基板（電気部品用配線回路基板）などの各種用途で用いられる。電子機器用配線回路基板および電気機器用配線回路基板としては、例えば、位置情報センサー、障害物検知センサー、温度センサーなどのセンサーで用いられるセンサー用配線回路基板、例えば、自動車、電車、航空機、工作車両などの輸送車両で用いられる輸送車両用配線回路基板、例えば、フラットパネルディスプレイ、フレキシブルディスプレイ、投影型映像機器などの映像機器で用いられる映像機器用配線回路基板、例えば、ネットワーク機器、大型通信機器などの通信中継機器で用いられる通信中継機器用配線回路基板、例えば、コンピュータ、タブレット、スマートフォン、家庭用ゲームなどの情報処理端末で用いられる情報処理端末用配線回路基板、例えば、ドローン、ロボットなどの可動型機器で用いられる可動型機器用配線回路基板、例えば、ウェアラブル型医療用装置、医療診断用装置などの医療機器で用いられる医療機器用配線回路基板、例えば、冷蔵庫、洗濯機、掃除機、空調機器などの電気機器で用いられる電気機器用配線回路基板、例えば、デジタルカメラ、ＤＶＤ録画装置などの録画電子機器で用いられる録画電子機器用配線回路基板などが挙げられる。 The use of such a printed circuit board 1 is not particularly limited and is used in various fields. The printed circuit board 1 is used in various applications such as a printed circuit board for electronic equipment (wired circuit board for electronic parts) and a wired circuit board for electrical equipment (wired circuit board for electrical parts). Examples of the wiring circuit board for electronic equipment and the wiring circuit board for electric equipment include wiring circuit boards for sensors used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors, such as automobiles, trains, airplanes, and machine tools. Wiring circuit boards for transportation vehicles used in transportation vehicles such as vehicles, for example, wiring circuit boards for video equipment used in video equipment such as flat panel displays, flexible displays, projection type video equipment, such as network equipment, large communication equipment Wiring circuit boards for communication relay equipment used in communication relay equipment such as, for example, wiring circuit boards for information processing terminals used in information processing terminals such as computers, tablets, smartphones, home games, etc., such as drones, robots, etc. Mobile equipment distribution used in mobile equipment Circuit boards, for example, medical equipment wiring circuit boards used in medical equipment such as wearable medical devices and medical diagnostic equipment, for example, electrical equipment used in electric equipment such as refrigerators, washing machines, vacuum cleaners, and air conditioners Wiring circuit boards for recording, for example, wiring circuit boards for recording electronic equipment used in recording electronic equipment such as digital cameras and DVD recording devices.
　　変形例
　以下の各変形例において、上記した一実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。また、各変形例は、特記する以外、一実施形態と同様の作用効果を奏することができる。さらに、一実施形態および変形例を適宜組み合わせることができる。 Modified Examples In the following modified examples, members and processes similar to those of the above-described embodiment are given the same reference numerals, and detailed descriptions thereof are omitted. Moreover, each modification can have the same operational effects as those of the embodiment, unless otherwise specified. Furthermore, one embodiment and modifications can be combined as appropriate.
　図２Ａに示すように、一実施形態では、金属側面２３、ベース側面２６およびカバー側面３６が面一であるが、図示しないが、面一でなく、つまり、不連続であってもよい。図示しないが、例えば、ベース側面２６および／またはカバー側面３６は、厚み方向に投影したときに金属側面２３と重複せず、金属側面２３に対して、短手方向外側および内側のいずれかにずれて位置してもよい。 As shown in FIG. 2A, in one embodiment, the metal side surface 23, the base side surface 26, and the cover side surface 36 are flush, but not shown, but they may not be flush, that is, discontinuous. Although not shown, for example, the base side surface 26 and / or the cover side surface 36 do not overlap with the metal side surface 23 when projected in the thickness direction, and shift to either the short side outward or the inner side with respect to the metal side surface 23. May be located.
　図２Ａに示すように、一実施形態では、配線体金属部１５における金属側面２３は、平坦面であるが、例えば、図示しないが、曲面であってもよい。 As shown in FIG. 2A, in one embodiment, the metal side surface 23 of the wiring body metal portion 15 is a flat surface, but may be a curved surface, for example, although not shown.
　図示しないが、この変形例では、曲面である金属側面は、断面視において、厚み方向両端部から厚み方向中央部に向かうに従って、短手方向内側に向かって凹む凹面を備える。
好ましくは、金属側面は、凹面のみを備える。つまり、金属側面は、断面視において、厚み方向両端部から厚み方向中央部に向かうに従って、短手方向内側に向かって凹む。これにより、配線体金属部の短手方向長さは、厚み方向両端部から厚み方向中央部に向かうに従って、短くなる。複数の配線体金属部のそれぞれは、厚み方向中央部がくびれる断面略鼓（砂時計）形状を有する。複数の配線体金属部のそれぞれには、短手方向両側面において、２つの凹面が設けられている。 Although not illustrated, in this modification, the metal side surface that is a curved surface includes a concave surface that is recessed toward the inner side in the lateral direction as viewed from the both ends in the thickness direction toward the central portion in the thickness direction.
Preferably, the metal side surface comprises only a concave surface. That is, the metal side surface is recessed toward the inner side in the lateral direction as it goes from the both end portions in the thickness direction to the central portion in the thickness direction when viewed in cross section. Thereby, the short direction length of a wiring body metal part becomes short as it goes to a thickness direction center part from the thickness direction both ends. Each of the plurality of wiring body metal portions has a substantially drum (hourglass) cross section with a constricted central portion in the thickness direction. Each of the plurality of wiring body metal portions is provided with two concave surfaces on both side surfaces in the short direction.
　金属側面の面積Ｓ０は、金属側面を短手方向に投影したときの投影面積Ｓ１に対して、大きい。そのため、本発明は、金属側面の面積Ｓ０は、金属側面を短手方向に投影したときの投影面積Ｓ１以上である態様を含み、具体的には、金属側面２３の面積Ｓ０が金属側面２３の投影面積Ｓ１と同一である一実施形態、および、金属側面の面積Ｓ０が金属側面の投影面積Ｓ１より大きい変形例の両方を含む。 The area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction. Therefore, the present invention includes an aspect in which the area S0 of the metal side surface is greater than or equal to the projected area S1 when the metal side surface is projected in the short direction. Specifically, the area S0 of the metal side surface 23 is This includes both an embodiment that is identical to the projected area S1 and a variation in which the metal side area S0 is greater than the metal side projected area S1.
　この変形例では、具体的には、金属側面の面積Ｓ０の投影面積Ｓ１に対する面積比（Ｓ０／Ｓ１）が、例えば、１．０１以上、好ましくは、１．１以上、より好ましくは、１．２以上、さらに好ましくは、１．３以上であり、また、例えば、２以下である。 In this modification, specifically, the area ratio (S0 / S1) of the area S0 of the metal side surface to the projected area S1 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1. 2 or more, more preferably 1.3 or more, and for example, 2 or less.
　なお、上記した面積比（Ｓ０／Ｓ１）は、金属側面の長手方向長さと、金属側面の投影面の長手方向長さとが同一であることから、断面視において、金属系支持層６の厚みＴ（具体的には、金属側面の厚み方向一端縁から他端縁まで厚み方向距離）の、金属側面の厚み方向一端縁から他端縁までにおいて曲面（凹面）に沿う延べ長さＬに対する長さ比（厚みＴ／延べ長さＬ）と同一である。従って、面積比（Ｓ０／Ｓ１）は、上記した長さ比（厚みＴ／延べ長さＬ）として求められる。 In the above-described area ratio (S0 / S1), the longitudinal length of the metal side surface and the longitudinal direction length of the projection surface of the metal side surface are the same. (Specifically, the length in the thickness direction from one end edge to the other end edge of the metal side surface in relation to the total length L along the curved surface (concave surface) from the one end edge to the other end edge in the thickness direction of the metal side surface) It is the same as the ratio (thickness T / total length L). Accordingly, the area ratio (S0 / S1) is obtained as the above-described length ratio (thickness T / total length L).
　なお、上記の変形例において、配線体金属部の短手方向長さＷは、２つの金属側面間長さの平均値として求められる。 In the above modification, the length W in the short direction of the metal part of the wiring body is obtained as an average value of the lengths between the two metal side surfaces.
　また、図示しないが、この変形例では、金属側面が、屈曲面を有することができる。この場合には、１つの金属側面は、厚み方向に隣接する２つの凹面と、それらを厚み方向に連結する稜線とを一体的に備える。これにより、金属側面は、屈曲面に形成される。具体的には、１つの金属側面は、断面視において、厚み方向において中央部に稜線を有し、その両側に凹面を有する略Ｗ字形状を有する。そのため、複数の配線体金属部のそれぞれは、厚み方向に鼓（砂時計）が２つ連結されたような断面形状を有する。 Although not shown, in this modification, the metal side surface can have a bent surface. In this case, one metal side surface is integrally provided with two concave surfaces adjacent in the thickness direction and a ridge line connecting them in the thickness direction. Thereby, a metal side surface is formed in a bending surface. Specifically, one metal side surface has a substantially W shape having a ridge line in the central portion in the thickness direction and concave surfaces on both sides in a cross-sectional view. Therefore, each of the plurality of wiring body metal portions has a cross-sectional shape in which two drums (hourglasses) are connected in the thickness direction.
　上記の変形例における配線回路基板の製造方法を具体的に説明する。この製造方法では、例えば、エッチング（サブトラクティブ法）により、金属系支持層６を形成する。 The manufacturing method of the printed circuit board in the above modification will be specifically described. In this manufacturing method, for example, the metal-based support layer 6 is formed by etching (subtractive method).
　具体的には、まず、金属シートと、その第１金属面（図２Ａおよび図２Ｂ参照）に形成されたベース絶縁層、導体層およびカバー絶縁層とを備える積層体を準備する。 Specifically, first, a laminate including a metal sheet and a base insulating layer, a conductor layer, and a cover insulating layer formed on the first metal surface (see FIGS. 2A and 2B) is prepared.
　続いて、エッチングレジストを、金属シートの第２金属面に配置する。エッチングレジストの平面視形状は、例えば、形成したい金属系支持層６の平面視形状と同一形状であって、また、ベース絶縁層およびカバー絶縁層の平面視形状と略同一である。 Subsequently, an etching resist is disposed on the second metal surface of the metal sheet. The plan view shape of the etching resist is, for example, the same shape as the plan view shape of the metal-based support layer 6 to be formed, and substantially the same as the plan view shapes of the base insulating layer and the cover insulating layer.
　これにより、積層体およびエッチングレジストを備えるレジスト積層体を作製する。 Thereby, a resist laminate including the laminate and the etching resist is manufactured.
　その後、レジスト積層体をエッチング液に浸漬する。具体的には、金属シートにおいて、ベース絶縁層およびカバー絶縁層から露出する第１金属面と、エッチングレジストから露出する第２金属面とに、エッチング液を接触させる。 Thereafter, the resist laminate is immersed in an etching solution. Specifically, in the metal sheet, the etching solution is brought into contact with the first metal surface exposed from the base insulating layer and the cover insulating layer and the second metal surface exposed from the etching resist.
　すると、第２金属面においてエッチングレジストから露出する露出部分においては、その短手方向中央部のエッチング速度は、その短手方向両端部（但し、第２金属面より短手方向外側）のエッチング速度に対して、高い。これは、エッチング液が、露出部分の短手方向両端部では、短手方向周辺部に比べて、滞留（停滞）し易いことに起因する。 Then, in the exposed portion exposed from the etching resist on the second metal surface, the etching rate at the center portion in the short direction is the etching rate at both ends in the short direction (however, outside in the short direction from the second metal surface). In contrast, it is expensive. This is because the etching solution tends to stay (stagnate) at both ends in the short direction of the exposed portion as compared with the peripheral portion in the short direction.
　このことは、第１金属面においてベース絶縁層から露出する露出部分についても同様である。なお、エッチング途中の第１金属面および第２金属面は、ともに、短手方向中央部が厚み方向内側に向かって凹む曲面となる。 This also applies to the exposed portion exposed from the base insulating layer on the first metal surface. Note that both the first metal surface and the second metal surface in the middle of etching are curved surfaces in which the central portion in the short direction is recessed toward the inside in the thickness direction.
　すると、第１金属面および第２金属面の露出部分における短手方向中央部のエッチングは、短手方向両端部のエッチングよりも、早く完了する。そのため、短手方向中央部では、短手方向両端部に比べて、早く、第１金属面および第２金属面が消失する。つまり、まず、短手方向中央部において、開口部が形成され、続いて、開口部が短手方向両外側（両端部）に向かって広がる。 Then, the etching of the central portion in the short direction in the exposed portions of the first metal surface and the second metal surface is completed earlier than the etching of both ends in the short direction. For this reason, the first metal surface and the second metal surface disappear earlier at the center portion in the short direction than at both ends in the short direction. That is, first, an opening is formed at the center in the short direction, and then the opening widens toward both outer sides (both ends) in the short direction.
　すると、２つの凹面および稜線を備える金属側面が形成される。このときに、エッチングを終了し、続いて、エッチングレジストを除去すれば、稜線を備える変形例（鼓が２つ連結された形状の配線体金属部を有する）の配線回路基板が得られる。 Then, a metal side surface including two concave surfaces and a ridgeline is formed. At this time, if the etching is completed and then the etching resist is removed, a printed circuit board of a modified example having a ridge line (having a wiring body metal part having a shape in which two drums are connected) is obtained.
　一方、さらに、エッチングを続行すれば、稜線が消失するので、稜線を備えず、１つの凹面を備える金属側面が形成される。続いて、エッチングレジストを除去すれば、変形例（断面略鼓形状の配線体金属部を有する）の配線回路基板が得られる。 On the other hand, if the etching is further continued, the ridgeline disappears, so that the metal side surface having one concave surface without the ridgeline is formed. Subsequently, when the etching resist is removed, a printed circuit board of a modified example (having a wiring body metal part having a substantially drum shape in cross section) is obtained.
　これらの変形例の配線回路基板では、金属側面の面積Ｓ０が、金属側面を短手方向に投影したときの投影面積Ｓ１に対して、大きい。 In the printed circuit boards according to these modified examples, the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short direction.
　すると、金属側面２３の面積Ｓ０が金属側面２３の投影面積Ｓ１と同一である一実施形態（図２Ａ参照）、および、金属側面の面積Ｓ０が金属側面の投影面積Ｓ１より大きい変形例の両方を含む配線回路基板（つまり、金属側面２３の面積Ｓ０が金属側面２３の投影面積Ｓ１以上である配線回路基板）は、金属側面と空気との接触面積を、確実に大きくすることができる。そのため、配線体金属部からの対流に基づく放熱効率により一層優れる。 Then, both the embodiment in which the area S0 of the metal side surface 23 is the same as the projected area S1 of the metal side surface 23 (see FIG. 2A) and the modification in which the area S0 of the metal side surface is larger than the projected area S1 of the metal side surface. The included printed circuit board (that is, the printed circuit board in which the area S0 of the metal side surface 23 is equal to or larger than the projected area S1 of the metal side surface 23) can surely increase the contact area between the metal side surface and air. Therefore, it is more excellent in the heat dissipation efficiency based on the convection from a wiring body metal part.
　とりわけ、これら変形例では、図２Ａに示す一実施形態に比べて、金属側面と空気との接触面積を、より一層確実に大きくすることができる。そのため、配線体金属部からの対流に基づく放熱効率により一層優れる。 In particular, in these modified examples, the contact area between the metal side surface and the air can be further reliably increased as compared with the embodiment shown in FIG. 2A. Therefore, it is more excellent in the heat dissipation efficiency based on the convection from a wiring body metal part.
　また、変形例では、１つの金属側面は、凹面と、凸面とを一体的に備える。凹面と凸面とは、厚み方向において順に配置されている。 Further, in the modification, one metal side surface integrally includes a concave surface and a convex surface. The concave surface and the convex surface are arranged in order in the thickness direction.
　図示しないが、この変形例では、１つの配線体金属部において、短手方向一方側における凹面は、短手方向他方側における凸面と短手方向に対向し、短手方向一方側における凸面は、短手方向他方側における凹面と短手方向に対向する。そのため、配線体金属部は、断面略Ｓ字形状を有する。 Although not shown, in this modification, in one wiring body metal part, the concave surface on one side in the short direction is opposed to the convex surface on the other side in the short direction, and the convex surface on one side in the short direction is It faces the concave surface on the other side in the short direction in the short direction. Therefore, the wiring body metal part has a substantially S-shaped cross section.
　図示しないが、１つの配線体金属部において、短手方向一方側および他方側の両側における２つの凹面は、短手方向に対向する。短手方向一方側および他方側の両側における２つの凸面は、短手方向に対向する。 Although not shown, in one wiring body metal portion, the two concave surfaces on both sides on one side and the other side in the short side face each other in the short side direction. Two convex surfaces on both sides on one side and the other side in the short direction face each other in the short direction.
　一実施形態では、支持部の一例として配線体金属部１５を挙げ、また、配線体金属部１５が、材料が金属である金属系支持層６に含まれている。しかし、金属系支持層６に代え、支持層とし、支持層の材料が、例えば、熱伝導性が高い粒子と、樹脂とを含む粒子樹脂組成物、例えば、セラミックスなどの焼成組成物であってもよい。 In one embodiment, the wiring body metal part 15 is cited as an example of the support part, and the wiring body metal part 15 is included in the metal-based support layer 6 whose material is metal. However, instead of the metal-based support layer 6, a support layer is used, and the material of the support layer is, for example, a particle resin composition including particles having high thermal conductivity and a resin, for example, a fired composition such as ceramics. Also good.
　一実施形態では、第１連結体２および第２連結体３は、ともに、平面視において、第１端子部１１および第２端子部１２を含むように、短手方向に連続しているが、図示しないが、例えば、いずれか一方が、短手方向に連続し、他方が、短手方向に不連続であってもよい。この場合には、他方は、短手方向に間隔を隔てて複数に分割されて配置されている。さらには、図示しないが、例えば、第１連結体２および第２連結体３のいずれもが、短手方向に間隔を隔てて複数に分割されていてもよい。 In one embodiment, the first connector 2 and the second connector 3 are both continuous in the short direction so as to include the first terminal portion 11 and the second terminal portion 12 in plan view. Although not shown, for example, either one may be continuous in the short direction and the other may be discontinuous in the short direction. In this case, the other is divided into a plurality of parts at intervals in the short direction. Furthermore, although not illustrated, for example, both the first connector 2 and the second connector 3 may be divided into a plurality at intervals in the lateral direction.
　一実施形態では、主配線部１０は、配線体ベース部１８に１つ設けているが、例えば、図示しないが、１つの配線体ベース部１８に複数設けることもできる。
なお、上記発明は、本発明の例示の実施形態として提供したが、これは単なる例示に過ぎず、限定的に解釈してはならない。当該当技術分野の当業者によって明らかな本発明の変形例は、後記請求の範囲に含まれる。 In one embodiment, one main wiring portion 10 is provided in the wiring body base portion 18, but, for example, although not illustrated, a plurality of main wiring portions 10 may be provided in one wiring body base portion 18.
In addition, although the said invention was provided as exemplary embodiment of this invention, this is only a mere illustration and should not be interpreted limitedly. Modifications of the present invention apparent to those skilled in the relevant art are within the scope of the following claims.
配線回路基板は、電子機器用配線回路基板、電気機器用配線回路基板などの各種用途で用いられる。 The printed circuit board is used in various applications such as a printed circuit board for electronic equipment and a wired circuit board for electric equipment.
１ 配線回路基板
２ 第１連結体
３ 第２連結体
４ 配線体
１０ 主配線部
１１ 第１端子部
１２ 第２端子部
１３ 第１連結金属部
１４ 第２連結金属部
１５ 配線体金属部
１６ 第１連結ベース部
１７ 第２連結ベース部
１８ 配線体ベース部
２４ 第１ベース面
２５ 第２ベース面
３１ 金属内側面
  DESCRIPTION OF SYMBOLS 1 Wiring circuit board 2 1st connection body 3 2nd connection body 4 Wiring body 10 Main wiring part 11 1st terminal part 12 2nd terminal part 13 1st connection metal part 14 2nd connection metal part 15 Wiring body metal part 16 1st 1 connection base part 17 2nd connection base part 18 wiring body base part 24 1st base surface 25 2nd base surface 31 Metal inner surface

Claims (4)

  1. 　互いに間隔を隔てて並列配置される複数の配線体を備え、
    　前記複数の配線体のそれぞれは、
    　　絶縁部と、
    　　前記絶縁部の厚み方向一方面に配置される配線部と、
    　　前記絶縁部の厚み方向他方面に配置され、金属系材料からなり、厚み方向長さＴの、前記複数の配線体の並列方向における長さＷに対する比（Ｔ／Ｗ）が、２以上である支持部と
    を備えることを特徴とする、配線回路基板。     Provided with a plurality of wiring bodies arranged in parallel at intervals,
    Each of the plurality of wiring bodies is
    An insulating part;
    A wiring portion disposed on one surface in the thickness direction of the insulating portion;
    The insulating portion is disposed on the other surface in the thickness direction and is made of a metal material, and the ratio (T / W) of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies is 2 or more. A printed circuit board comprising a support portion.
  2. 　一の前記支持部は、一の前記支持部と前記並列方向に隣接する他の前記支持部に面する側面を有し、
    　前記側面の面積は、前記側面を前記並列方向に投影したときの投影面積以上であることを特徴とする、請求項１に記載の配線回路基板。     The one support part has a side surface facing the one support part and the other support part adjacent in the parallel direction,
    The printed circuit board according to claim 1, wherein an area of the side surface is equal to or larger than a projected area when the side surface is projected in the parallel direction.
  3. 　前記支持部の材料が、金属であることを特徴とする、請求項１に記載の配線回路基板。 2. The printed circuit board according to claim 1, wherein a material of the support portion is a metal.
  4. 　前記複数の配線体の、前記並列方向および前記厚み方向に直交する直交方向端部を連結する連結体を備え、
    　前記連結体は、
    　　前記配線部の直交方向端部に連続する端子部と、
    　　前記支持部の直交方向端部に連続する連結支持部と
    を備え、
    　前記連結支持部は、厚み方向に投影したときに、複数の前記端子部を含むように前記並列方向に連続することを特徴とする、請求項１に記載の配線回路基板。     A plurality of wiring bodies, each including a connecting body that connects orthogonal end portions orthogonal to the parallel direction and the thickness direction;
    The connector is
    A terminal portion continuous to the end portion in the orthogonal direction of the wiring portion;
    A connection support part continuous to the orthogonal direction end of the support part,
    2. The printed circuit board according to claim 1, wherein the connection support portion is continuous in the parallel direction so as to include a plurality of the terminal portions when projected in the thickness direction.
PCT/JP2019/018713 2018-05-31 2019-05-10 Wiring circuit board WO2019230334A1 (en)

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TW202005483A (en) 2020-01-16

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