CN112219455A - Wired circuit board - Google Patents
Wired circuit board Download PDFInfo
- Publication number
- CN112219455A CN112219455A CN201980036057.8A CN201980036057A CN112219455A CN 112219455 A CN112219455 A CN 112219455A CN 201980036057 A CN201980036057 A CN 201980036057A CN 112219455 A CN112219455 A CN 112219455A
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- Prior art keywords
- metal
- wiring
- circuit board
- thickness direction
- wired circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
The wired circuit board includes a plurality of wiring bodies arranged in parallel with a space therebetween. The plurality of wiring bodies each have: an insulating section; a wiring section disposed on one surface of the insulating section in the thickness direction; and a support portion which is arranged on the other surface of the insulating portion in the thickness direction and is made of a metal-based material, wherein the ratio (T/W) of the length T of the support portion in the thickness direction to the length W of the plurality of wiring bodies in the parallel direction is 2 or more.
Description
Technical Field
The present invention relates to a wired circuit board.
Background
The following heat dissipation structures are known in the past: a heat sink having a flat base portion and comb-teeth-shaped fins extending downward from the lower surface of the base portion is provided on the lower surface of a substrate having a heating element mounted on the upper surface thereof, and heat generated from the heating element is released from the fins of the heat sink (see, for example, patent document 1 below).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 55-140255
Disclosure of Invention
Problems to be solved by the invention
However, a heat dissipation structure is required to have higher heat dissipation performance.
The invention provides a printed circuit board with excellent heat dissipation.
Means for solving the problems
The present invention (1) includes a wired circuit board having a plurality of wiring bodies arranged in parallel with a space therebetween, each of the plurality of wiring bodies having: an insulating section; a wiring section disposed on one surface of the insulating section in the thickness direction; and a support portion that is disposed on the other surface of the insulating portion in the thickness direction and is formed of a metal-based material, wherein a ratio (T/W) of a length T of the support portion in the thickness direction to a length W of the plurality of wiring bodies in the parallel direction is 2 or more.
In this wired circuit board, since the wiring bodies are arranged in parallel with a space therebetween, heat generated in the wiring portions can be convected by air between the plurality of wiring bodies, and efficient heat dissipation can be achieved.
Further, since the ratio (T/W) of the length T of the support portion in the thickness direction to the length W of the plurality of wiring bodies in the parallel direction is 2 or more, the contact area with the air can be increased. Therefore, the heat dissipation efficiency by the convection described above is excellent.
Further, since the above-described ratio (T/W) of the support portion is high, 2 or more, and is made of a metal-based material, heat transmitted from the wiring portion to the insulating portion can be efficiently released toward the other side in the thickness direction.
Therefore, the printed circuit board has excellent heat dissipation properties of the wiring body.
The invention (2) includes the wired circuit board according to (1), wherein one of the support portions has a side surface facing the other support portion adjacent to the one support portion in the parallel direction, and an area of the side surface is larger than or equal to a projection area when the side surface is projected in the parallel direction.
In this wired circuit board, since the area of the side surface is larger than or equal to the projected area when the side surfaces are projected in the parallel direction, the contact area between the side surface of the support portion and the air can be reliably increased. Therefore, the heat radiation efficiency by convection from the support portion is more excellent.
The invention (3) includes the wired circuit board according to (1) or (2), wherein the supporting portion is made of a metal.
In this wired circuit board, since the material of the support portion is metal, the heat dissipation property of the heat radiated from the support portion is excellent.
The present invention (4) is a wired circuit board according to any one of (1) to (3), wherein the wired circuit board includes a connecting member that connects end portions of the plurality of wiring bodies in a direction orthogonal to the parallel direction and the thickness direction, the connecting member including: a terminal portion continuous with an end portion in an orthogonal direction of the wiring portion; and a coupling support portion that is continuous with an end portion in a direction orthogonal to the support portion, the coupling support portion being continuous in the parallel direction so as to include the plurality of terminal portions when projected in a thickness direction.
In this wired circuit board, the connection support portion is continuous in the parallel direction so as to include the plurality of terminal portions when projected in the thickness direction, and therefore, the connection support portion can reliably support the plurality of terminal portions.
Therefore, in the wired circuit board, the wiring body has excellent heat dissipation properties, and the terminal portion of the connecting body has excellent mechanical strength.
ADVANTAGEOUS EFFECTS OF INVENTION
In the wired circuit board of the present invention, the wiring body has excellent heat dissipation properties.
Drawings
Fig. 1 is a plan view of a wired circuit board according to an embodiment of the present invention.
Fig. 2A and 2B are sectional views of the wired circuit board shown in fig. 1, fig. 2A showing a sectional view taken along a line a-a, and fig. 2B showing a sectional view taken along a line B-B.
Detailed Description
Integrated structure of wired circuit board
An embodiment of a wired circuit board according to the present invention will be described with reference to fig. 1, 2A, and 2B. In fig. 1, the insulating base layer 7 and the insulating cover layer 9, which will be described later, are omitted in order to clearly show the relative arrangement of the metal supporting layer 6 and the conductive layer 8, which will be described later.
The wired circuit board 1 has a surface on one side in the thickness direction and a surface on the other side in the thickness direction, and has a shape extending in the longitudinal direction orthogonal to the thickness direction. As shown in fig. 1, the wired circuit board 1 integrally includes a 1 st connected body 2 as an example of a connected body, a 2 nd connected body 3 as an example of a connected body, and a wiring body 4. Preferably, the wired circuit board 1 includes only the 1 st connection member 2, the 2 nd connection member 3, and the wiring member 4.
The 1 st connecting member 2 forms one end portion in the longitudinal direction of the wired circuit board 1. The 1 st connected body 2 has a substantially rectangular flat plate shape in plan view. The size of the 1 st connected body 2 in a plan view is not particularly limited.
The 2 nd connecting member 3 forms the other end portion in the longitudinal direction of the wired circuit board 1, and is disposed opposite to the 1 st connecting member 2 with the wiring member 4 interposed therebetween on the other side in the longitudinal direction. The 2 nd connecting body 3 has a substantially rectangular flat plate shape in plan view. The size of the 2 nd connecting member 3 in a plan view is not particularly limited.
The wiring body 4 forms a longitudinal intermediate portion (or a central portion) of the wired circuit board 1. The wiring member 4 is disposed between the 1 st connecting member 2 and the 2 nd connecting member 3 in a plan view. The wiring body 4 has a shape extending in the longitudinal direction. The wiring body 4 connects the 1 st connected body 2 and the 2 nd connected body 3 in the longitudinal direction. The wiring bodies 4 are arranged in parallel with each other with a slight length in the short side direction (the direction orthogonal to the longitudinal direction and the thickness direction) of the printed circuit board 1 (an example of the parallel direction of the wiring bodies 4) and with a space therebetween. Openings 5 are formed between adjacent wiring bodies 4.
The opening 5 partitions the wiring body 4 in, for example, the short side direction of the wired circuit board 1. The opening 5 has a slit shape extending in the longitudinal direction and penetrates the printed circuit board 1 in the thickness direction.
One end portions in the longitudinal direction of the plurality of wiring bodies 4 are connected in the short side direction by 1 st connecting body 2. Thereby, one end portions in the longitudinal direction of the plurality of wiring bodies 4 are bundled by the 1 st connecting body 2.
Further, the other end portions in the longitudinal direction of the plurality of wiring bodies 4 are connected in the short side direction by 1 of the 2 nd connecting bodies 3. Thereby, the other end portions in the longitudinal direction of the plurality of wiring bodies 4 are bundled by the 1 nd 2 nd connecting body 3.
The longitudinal length of the wiring body 4 is the distance in the longitudinal direction between the 1 st coupled body 2 and the 2 nd coupled body 3, and the longitudinal length of the wiring body 4 is appropriately set according to the purpose and the application.
The length of each of the plurality of wiring bodies 4 in the short side direction is, for example, 500 μm or less, preferably 300 μm or less, more preferably 100 μm or less, and, for example, 10 μm or more. The length of the opening 5 in the short side direction is, for example, 10 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and for example 1000 μm or less. The ratio of the length of the wiring body 4 in the short side direction to the length of the opening 5 in the short side direction is, for example, 40 or less, preferably 10 or less, and is, for example, 0.1 or more, preferably 0.5 or more.
Layer structure of wired circuit board
As shown in fig. 2A and 2B, the wired circuit board 1 includes a metal supporting layer 6, an insulating base layer 7 disposed on one surface of the metal supporting layer 6 in the thickness direction, a conductive layer 8 disposed on one surface of the insulating base layer 7 in the thickness direction, and an insulating cover layer 9 disposed on one surface of the insulating base layer 7 in the thickness direction so as to partially cover the conductive layer 8. The wired circuit board 1 preferably includes only the metal supporting layer 6, the insulating base layer 7, the conductor layer 8, and the insulating cover layer 9.
The metal supporting layer 6 forms the other surface of the wired circuit board 1 in the thickness direction. As shown in fig. 1, 2A, and 2B, the metal supporting layer 6 has the same outer shape as the wired circuit board 1. Specifically, the metal supporting layer 6 has an outer shape corresponding to the 1 st connected member 2, the 2 nd connected member 3, and the wiring member 4. In the metal supporting layer 6, the portion where the 1 st connecting member 2 is formed is the 1 st connecting metal portion 13 as an example of a connecting support portion, the portion where the 2 nd connecting member 3 is formed is the 2 nd connecting metal portion 14 as an example of a connecting support portion, and the portion where the wiring member 4 is formed is the wiring member metal portion 15 as an example of a support portion.
The 1 st connecting metal portion 13 has a substantially flat plate shape continuous in the short side direction so as to include a plurality of 1 st terminal portions 11 described later in a plan view.
The 2 nd connecting metal portion 14 has a substantially flat plate shape continuous in the short side direction so as to include a plurality of 2 nd terminal portions 12 described later in a plan view.
The wiring body metal part 15 defines the other side in the thickness direction of the opening 5. The wiring body metal part 15 has a substantially rectangular shape that is long in the thickness direction on a cross section (synonymous with cross section) cut along the thickness direction and the short side direction.
The metal supporting layer 6 integrally has a 1 st metal surface 21 which is one surface in the thickness direction, a 2 nd metal surface 22 which is the other surface in the thickness direction, and a metal side surface 23 which is a side surface connecting peripheral edges thereof in the thickness direction.
The 1 st metal face 21 and the 2 nd metal face 22 are flat faces that are opposed and parallel in the thickness direction.
The metal side surface 23 is a flat surface extending straight in the thickness direction. The metal side surface 23 of the wiring body metal part 15 is also a flat surface extending straight in the longitudinal direction. The metal side surface 23 of the wiring body metal part 15 has a metal inner surface 31 facing the opening 5 and a metal outer surface 32 facing the outside in the short side direction.
The metal inner surface 31 is an example of a side surface facing the other wiring body metal part 15 adjacent to the one wiring body metal part 15 in the short side direction. The two metal inner side surfaces 31 facing each other (facing the opening 5) across the opening 5 are parallel to each other and also parallel to a conductor side surface 29 of a main wiring portion 10 described later in a plan view. Since the wiring body metal part 15 has a substantially rectangular shape in cross section, the area S0 of the metal inner side surface 31 is the same as the projected area S1 when the metal inner side surface 31 is projected in the short side direction. The area S0 of the metal inner surface 31 is a value obtained by multiplying the thickness T of the metal supporting layer 6 to be described later by the longitudinal length.
The thickness T of the metal supporting layer 6 is the distance length in the direction in which the 1 st metal surface 21 and the 2 nd metal surface 22 face each other, and is the thickness direction length of the metal side surface 23. Specifically, the thickness T of the metal supporting layer 6 is, for example, 30 μm or more, preferably 50 μm or more, preferably 100 μm or more, preferably 250 μm or more, preferably 500 μm or more, preferably 1000 μm or more, and, for example, 10mm or less.
The length W in the short side direction of the wiring body metal part 15 is appropriately selected from the ranges exemplified above for the length in the short side direction of the wiring body 4, and specifically, the length W in the short side direction of the wiring body metal part 15 is the same as the length W in the short side direction of the wiring body 4. In the plurality of wiring bodies 4, the short-side direction length W of the wiring body metal portion 15 is the distance (length) between the two adjacent metal inner side surfaces 31.
The ratio (T/W) of the thickness T of the wiring body metal part 15 to the length W of the wiring body metal part 15 in the short side direction is 2 or more. The ratio (T/W) corresponds to the aspect ratio of the cross section obtained by cutting the wiring body metal part 15 in the thickness direction and the short side direction. If the aspect ratio (T/W) is less than 2, heat generated in the main wiring portion 10 (described later) of the wiring body 4 cannot be efficiently released by the air in the opening 5.
The aspect ratio (T/W) is preferably 2.5 or more, more preferably 3 or more, and further preferably 3.5 or more, and the aspect ratio (T/W) is 1000 or less, and further preferably 100 or less. When the ratio (T/W) is equal to or higher than the lower limit, the heat generated in the main wiring portions 10 of the wiring bodies 4 can be efficiently released by the air in the openings 5.
The material of the metal-based support layer 6 can be appropriately selected from known or conventional metal-based materials (specifically, metal materials) and used. Specifically, examples of the metal-based material include metal elements classified into groups 1 to 16 in the periodic table, and alloys containing two or more of these metal elements. The metal material may be any of transition metals and typical metals. More specifically, examples of the metal-based material include a 2 nd main group metal element such as calcium, a 4 th sub group metal element such as titanium or zirconium, a 5 th sub group metal element such as vanadium, a 6 th sub group metal element such as chromium, molybdenum or tungsten, a 7 th sub group metal element such as manganese, an 8 th sub group (column 8) metal element such as iron, an 8 th sub group (column 9) metal element such as cobalt, a 8 th sub group (column 10) metal element such as nickel or platinum, a 1 st sub group metal element such as copper, silver or gold, a 2 nd sub group metal element such as zinc, a 3 rd main group metal element such as aluminum or gallium, and a 4 th main group metal element such as germanium or tin. They can be used alone or in combination.
The 1 st and 2 nd coupling support portions 13 and 14 and the wiring body metal portion 15 are made of the same material.
Further, the metal species supporting layer 6 includes the metal species supporting layer 6 whose material is metal.
The thermal conductivity of the metal supporting layer 6 is, for example, 5W/mK or more, preferably 10W/mK or more, and more preferably 15W/mK or more, 20W/mK or more, 25W/mK or more, 30W/mK or more, 35W/mK or more, 40W/mK or more, 50W/mK or more, 60W/mK or more, 75W/mK or more, 100W/mK or more, 200W/mK or more, 300W/mK or more, and 350W/mK or more. When the thermal conductivity of the metal supporting layer 6 is equal to or higher than the above-described lower limit, the heat transmitted from the main wiring portion 10 to the wiring body base portion 18 can be efficiently released toward the other side in the thickness direction.
Thermal conductivity of the metal supporting layer 6 was measured by JIS H7903: 2008 (effective thermal conductivity measurement).
The insulating base layer 7 is disposed on the entire surface of the 1 st metal surface 21 of the metal-based supporting layer 6, for example. Specifically, the insulating base layer 7 has an outer shape corresponding to the 1 st connected member 2, the 2 nd connected member 3, and the wiring member 4. In the insulating base layer 7, the portion where the 1 st connection body 2 is formed is a 1 st connection base portion 16, the portion where the 2 nd connection body 3 is formed is a 2 nd connection base portion 17, and the portion where the wiring body 4 is formed is a wiring body base portion 18 as an example of an insulating portion.
The 1 st connecting base portion 16 is disposed on the entire 1 st metal surface 21 of the 1 st connecting metal portion 13. The 2 nd connecting base portion 17 is disposed on the entire 1 st metal surface 21 of the 2 nd connecting metal portion 14.
The wiring body base portion 18 is disposed on the entire 1 st metal surface 21 of the wiring body metal portion 15. In other words, the wiring body metal portion 15 is disposed on the other surface (the 2 nd basal surface 25 described later) in the thickness direction of the wiring body base portion 18. The opening 5 is defined by the wiring body base portion 18, together with the wiring body metal portion 15 and a wiring body covering portion 33 described later.
The insulating base layer 7 integrally has a 1 st base surface 24 which is one surface in the thickness direction, a 2 nd base surface 25 which is the other surface in the thickness direction, and a base side surface 26 which is a side surface connecting the peripheral edges in the thickness direction.
The 1 st base surface 24 is a flat surface parallel to the 1 st metal surface 21.
The 2 nd base surface 25 is a flat surface in contact with the 1 st metal surface 21.
The base side surface 26 is a flat surface extending straight in the thickness direction. In addition, the base side surface 26 is formed in the wiring body base portion 18 in the thickness direction flush with the metal side surface 23. The base side surface 26 has a base inner surface 37 formed flush with the metal inner surface 31 in the wiring body base portion 18. The base inner surface 37 partially defines the opening 5.
The thickness of the insulating base layer 7 is a distance length in a direction in which the 1 st base surface 24 and the 1 st metal surface 21 face each other, and is a thickness direction length of the base side surface 26, and specifically, is, for example, 1 μm or more, preferably 5 μm or more, and is, for example, 100 μm or less, preferably 50 μm or less. The ratio of the thickness of the insulating base layer 7 to the thickness T of the metal supporting layer 6 is 10 or less, preferably 1 or less, more preferably 0.1 or less, and for example, 0.005 or more.
Examples of the material of the insulating base layer 7 include insulating resins such as polyimide.
The thermal conductivity of the insulating base layer 7 is lower than that of the metal supporting layer 6, and specifically is, for example, 1W/m · K or less, further 0.5W/m · K or less, and is, for example, 0.01W/m · K or more, and preferably 0.1W/m · K or more.
The thermal conductivity of the insulating base layer 7 was determined in accordance with JIS a 1412 (thermal conductivity measurement method for thermal insulating materials).
The conductor layer 8 is disposed on the 1 st base surface 24 of the insulating base layer 7. Specifically, the conductor layer 8 is disposed on the 1 st base surface 24 of the 1 st coupling base portion 16, the 2 nd coupling base portion 17, and the wiring body base portion 18.
In the conductor layer 8, the 1 st connecting body 2 includes the 1 st terminal portion 11 and the 1 st auxiliary wiring portion 19, the 2 nd connecting body 3 includes the 2 nd terminal portion 12 and the 2 nd auxiliary wiring portion 20, and the wiring body 4 includes the main wiring portion 10 as an example of the wiring portion.
The 1 st terminal portions 11 are arranged in the 1 st coupling body 2 so as to correspond to the plurality of wiring bodies 4 (main wiring portions 10) and at intervals in the short side direction of the wired circuit board 1. The 1 st terminal portions 11 are arranged at intervals in the short-side direction so as to be included in the 1 st connecting metal portion 13 when projected in the thickness direction.
The 1 st terminal portion 11 is disposed on the 1 st ground surface 24 of the 1 st coupling base portion 16. The 1 st terminal portions 11 are arranged at one end portion and a central portion in the longitudinal direction of the 1 st base surface 24 so as to secure a region where the 1 st auxiliary wiring portion 19 is formed at the other end portion in the longitudinal direction of the 1 st base surface 24. The 1 st terminal portion 11 has a substantially rectangular shape (square land shape) in a plan view.
The 1 st auxiliary wiring portion 19 is disposed in the 1 st coupled body 2 so as to be continuous with the 1 st terminal portion 11 on the 1 st base surface 24 of the 1 st coupled base portion 16. The 1 st auxiliary wiring portion 19 has a substantially linear shape in plan view extending from the other end edge of the 1 st terminal portion 11 in the longitudinal direction toward the other end in the longitudinal direction. The 1 st auxiliary wiring portion 19 connects the other end edge in the longitudinal direction of the 1 st terminal portion 11 and the one end edge in the longitudinal direction of the main wiring portion 10 described below. The 1 st auxiliary wiring portion 19 has a shorter length in the short side direction than the 1 st terminal portion 11. The ratio of the length of the 1 st auxiliary wiring portion 19 in the short side direction to the length of the 1 st terminal portion 11 in the short side direction is, for example, 0.8 or less, preferably 0.5 or less, and, for example, 0.001 or more, preferably 0.01 or more. The 1 st auxiliary wiring portion 19 has the same length in the short side direction as the main wiring portion 10.
The 2 nd terminal portions 12 are arranged in the 2 nd coupling body 3 so as to correspond to the plurality of wiring bodies 4 (main wiring portions 10) and at intervals in the short side direction of the wired circuit board 1. The plurality of 2 nd terminal portions 12 are arranged in the short side direction so as to be included in the 2 nd connecting metal portion 14 when projected in the thickness direction. The 2 nd terminal portion 12 is disposed on the 1 st base surface 24 of the 2 nd coupling base portion 17. The 2 nd terminal portions 12 are arranged at the other end portion and the central portion in the longitudinal direction of the 1 st base surface 24 so as to secure a region in which the 2 nd auxiliary wiring portion 20 is formed at one end portion in the longitudinal direction of the 1 st base surface 24. The 2 nd terminal portion 12 has a substantially rectangular shape (square land shape) in a plan view.
The 2 nd auxiliary wiring portion 20 is disposed continuously with the 2 nd terminal portion 12 on the 1 st base surface 24 of the 2 nd coupling base portion 17 in the 2 nd coupling body 3. The 2 nd auxiliary wiring portion 20 has a substantially linear shape in plan view extending from one longitudinal end edge of the 2 nd terminal portion 12 toward one longitudinal side. The 2 nd auxiliary wiring portion 20 connects one longitudinal end edge of the 2 nd terminal portion 12 and the other longitudinal end edge of the main wiring portion 10 described below. The short-side direction length of the 2 nd auxiliary wiring portion 20 is shorter than the short-side direction length of the 2 nd terminal portion 12. The ratio of the length of the 2 nd auxiliary wiring portion 20 in the short side direction to the length of the 2 nd terminal portion 12 in the short side direction is, for example, 0.8 or less, preferably 0.5 or less, and, for example, 0.001 or more, preferably 0.01 or more. The short-side direction length of the 2 nd auxiliary wiring portion 20 is the same as the short-side direction length of the main wiring portion 10.
The main wiring portion 10 is disposed on the 1 st base surface 24 of the wiring body base portion 18. Specifically, each of the plurality of main wiring portions 10 is disposed substantially at the center in the lateral direction of the 1 st base surface 24 of the plurality of wiring body base portions 18. The main wiring portion 10 is included in the wiring body base portion 18 when projected in the thickness direction. Specifically, the plurality of main wiring portions 10 are respectively arranged so as to secure regions for forming the insulating cover layer 9 described below at both ends in the short side direction of the 1 st base surface 24 of the plurality of wiring body base portions 18.
The main wiring portion 10 and the wiring body base portion 18 (or the wiring body metal portion 15) are provided so as to correspond to each other 1 to 1.
Further, one longitudinal end edge of the main wiring portion 10 is continuous with the other longitudinal end edge of the 1 st auxiliary wiring portion 19 of the 1 st connected body 2. The other longitudinal end edge of the main wiring portion 10 is continuous with one longitudinal end edge of the 2 nd auxiliary wiring portion 20 of the 2 nd connecting body 3. Thus, the main wiring portion 10 forms a substantially linear shape in plan view extending in the longitudinal direction together with the 1 st auxiliary wiring portion 19 and the 2 nd auxiliary wiring portion 20, and forms a wiring connecting the 1 st terminal portion 11 and the 2 nd terminal portion 12 in the longitudinal direction.
The short-side direction length of the main wiring portion 10 is, for example, the same as the short-side direction lengths of the 1 st auxiliary wiring portion 19 and the 2 nd auxiliary wiring portion 20.
The conductor layer 8 integrally has a 1 st conductor surface 27 which is one surface in the thickness direction, a 2 nd conductor surface 28 which is the other surface in the thickness direction, and a conductor side surface 29 which is a side surface connecting the peripheral end edges in the thickness direction.
The 1 st conductor surface 27 is a flat surface parallel to the 1 st base surface 24.
The 2 nd conductor surface 28 is a flat surface that is in contact with the 1 st base surface 24.
The conductor side surface 29 is disposed inside the base side surface 26 in plan view. In particular, in each of the plurality of wiring bodies 4, the conductor side surface 29 is arranged inward in the short-side direction with respect to the base side surface 26.
Examples of the material of the conductor layer 8 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Copper is preferably used from the viewpoint of obtaining good electrical characteristics.
The thickness of the conductor layer 8 is a distance length in a direction in which the 1 st conductor surface 27 and the 1 st base surface 24 face each other, and is a thickness direction length of the conductor side surface 29, and specifically, is, for example, 1 μm or more, preferably 5 μm or more, and is, for example, 50 μm or less, preferably 3 μm or less.
The main wiring portion 10 has a length in the short side direction of, for example, 200 μm or less, preferably 100 μm or less, and is, for example, 1 μm or more, preferably 5 μm or more. The ratio of the length of the main wiring portion 10 in the short side direction to the length W of the wiring body metal portion 15 in the short side direction is 2 or less, preferably 1 or less, and is, for example, 0.01 or more, preferably 0.1 or more.
The insulating cover layer 9 is disposed on the 1 st base surface 24 so as to cover the 1 st conductor surface 27 and the conductor side surface 29 of the 1 st auxiliary wiring portion 19, the 2 nd auxiliary wiring portion 20, and the main wiring portion 10. On the other hand, the insulating cover layer 9 exposes at least the 1 st conductor surface 27 of the 1 st terminal portion 11 and the 2 nd terminal portion 12.
In the insulating cover layer 9, a portion included in the 1 st connection body 2 is a 1 st connection cover portion (not shown in fig. 1 and 2), a portion included in the 2 nd connection body 3 is a 2 nd connection cover portion (not shown in fig. 1 and 2), and a portion included in the wiring body 4 is a wiring body cover portion 33.
The 1 st coupling covering portion, not shown, exposes the 1 st terminal portion 11, but covers the 1 st auxiliary wiring portion 19. The 2 nd coupling covering portion exposes the 2 nd terminal portion 12, but covers the 2 nd auxiliary wiring portion 20, which is not shown.
The wiring body covering portion 33 covers the 1 st conductor surface 27 and the conductor side surface 29 of the main wiring portion 10, and the portion of the 1 st base surface 24 in the vicinity of the outer side of the main wiring portion 10 in the short side direction.
The insulating cover layer 9 integrally has a 1 st cover surface 34 as one surface in the thickness direction, a 2 nd cover surface 35 as the other surface in the thickness direction, and a cover side surface 36 as a side surface connecting the peripheral edges in the thickness direction.
The 1 st covering surface 34 is a flat surface parallel to the 1 st conductor surface 27.
The 2 nd covering surface 35 is in contact with the 1 st conductor surface 27 and the conductor side surface 29, and is in contact with the 1 st base surface 24.
The cover side surface 36 is formed flush with the wiring body base portion 18 and the base side surface 26 in the thickness direction. Further, the cover side surface 36 has a cover inner side surface 38 formed flush with the base inner side surface 37 in the wiring body cover 33.
Therefore, each of the plurality of wiring bodies 4 has two wiring body side surfaces 50. The wiring body side surface 50 is formed (constituted) by the metal side surface 23, the base side surface 26, and the cover side surface 36, and is continuous in the thickness direction. Therefore, the wiring body 4 has a substantially linear shape extending long in the thickness direction in cross section. The wiring member side surface 50 has a wiring member inner surface 51 formed by the metal inner surface 31, the base inner surface 37, and the cover inner surface 38 in a cross-sectional view, and the opening 5 is defined by the wiring member inner surface 51.
The thickness of the insulating cover layer 9 is a distance length in a direction in which the 1 st cover surface 34 and the 1 st conductor surface 27 face each other, and specifically, is, for example, 1 μm or more, preferably 5 μm or more, and is, for example, 100 μm or less, preferably 50 μm or less.
Examples of the material of the insulating cover layer 9 include insulating resins such as polyimide.
The thickness of the wired circuit board 1 is, for example, 10 μm or more, preferably 100 μm or more, and is, for example, 10mm or less, preferably 1mm or less.
In order to manufacture the wired circuit board 1, for example, a flat metal sheet is prepared, and then the insulating base layer 7, the conductive layer 8, and the insulating cover layer 9 having the above-described shapes are formed in this order. Then, the metal sheet is subjected to an outer shape working to form the 1 st connecting metal part 13, the 2 nd connecting metal part 14, and the wiring body metal part 15, thereby forming the metal supporting layer 6. The outline processing is not particularly limited, and examples thereof include etching, laser processing, water jet (water jet cutter), and punching.
Alternatively, insulating base layer 7, conductive layer 8, and insulating cover layer 9 may be formed in this order on metal-based support layer 6 including 1 st connecting metal portion 13, 2 nd connecting metal portion 14, and wiring body metal portion 15 on metal-based surface 1 21.
Then, as shown by the imaginary line in fig. 2B, the 1 st element 41 is attached to the 1 st connected body 2, and the 2 nd element 42 is attached to the 2 nd connected body 3.
The 1 st element 41 and/or the 2 nd element 42 are configured to be capable of inputting and outputting a current having a high current value (for example, a large current of 1A or more, or even 10A or more). The 1 st element 41 has a 1 st electrode 43 disposed on the other surface in the thickness direction. The 2 nd element 42 has a 2 nd electrode 44 disposed on the other surface in the thickness direction.
In order to mount the 1 st element 41 on the 1 st terminal portion 11, the 1 st electrode 43 is electrically connected to the 1 st terminal portion 11. In order to mount the 2 nd element 42 on the 2 nd terminal portion 12, the 2 nd electrode 44 is electrically connected to the 2 nd terminal portion 12.
In addition, in the wired circuit board 1, since the wiring bodies 4 are arranged in parallel with a space therebetween, heat convection generated in the main wiring portion 10 by input of a large current from the 1 st element 41 and/or the 2 nd element 42, particularly, convection in the thickness direction can be caused by air between the plurality of wiring bodies 4 (openings 5), and efficient heat dissipation can be achieved.
Further, since the aspect ratio (T/W) of the wiring body metal portion 15 is high and 2 or more, the contact area with the air can be increased. Therefore, the heat dissipation efficiency by the convection described above is excellent.
Further, since the wiring body metal portion 15 has a high aspect ratio (T/W) of 2 or more and is made of a metal material, the heat transferred from the main wiring portion 10 to the wiring body base portion 18 can be efficiently released toward the other side in the thickness direction of the wiring body base portion 18, specifically, from the 1 st metal surface 21 of the wiring body metal portion 15 toward the 2 nd metal surface 22 and toward the other side in the thickness direction of the 2 nd metal surface 22.
Therefore, the wiring body 4 of the wired circuit board 1 has excellent heat dissipation properties.
In addition, in the wired circuit board 1, since the wiring body metal portion 15 is made of metal, heat dissipation from the wiring body metal portion 15 is excellent.
In addition, in the wired circuit board 1, the 1 st connecting metal parts 13 are continuous in the short-side direction so as to include the plurality of 1 st terminal parts 11 when projected in the thickness direction, and therefore, the 1 st connecting metal parts 13 can reliably support the plurality of 1 st terminal parts 11.
Since the 2 nd connecting metal portion 14 is continuous in the short-side direction so as to include the plurality of 2 nd terminal portions 12 when projected in the thickness direction, the 2 nd connecting metal portion 14 can reliably support the plurality of 2 nd terminal portions 12.
Therefore, in the wired circuit board 1, the heat dissipation property of the wiring body 4 is excellent, and the mechanical strength of the 1 st terminal portion 11 of the 1 st connecting body 2 and the mechanical strength of the 2 nd terminal portion 12 of the 2 nd connecting body 3 are both excellent. Therefore, the 1 st terminal portion 11 and the 2 nd terminal portion 12 are excellent in connection reliability.
The use of such a wired circuit board 1 is not particularly limited, and the wired circuit board can be applied to various fields. The wired circuit board 1 is used in various applications such as a wired circuit board for electronic equipment (a wired circuit board for electronic components), a wired circuit board for electrical equipment (a wired circuit board for electrical components), and the like. Examples of the wired circuit board for electronic devices and the wired circuit board for electric devices include a wired circuit board for sensors used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors, a wired circuit board for transport vehicles such as automobiles, trains, airplanes, and work vehicles, a wired circuit board for video devices used in video devices such as flat panel displays, flexible displays, and projection-type video devices, a wired circuit board for communication relay devices used in communication relay devices such as network devices and large-scale communication devices, a wired circuit board for information processing terminals used in information processing terminals such as computers, tablet computers, smart phones, and home-use game machines, a wired circuit board for mobile devices used in mobile devices such as unmanned planes and robots, a wired circuit board for mobile devices used in mobile devices such as mobile planes and robots, a wired circuit board for sensor used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors, and a wired circuit board for transport vehicles used in transportation vehicles such as automobiles, a, For example, a wiring circuit board for medical equipment used in medical equipment such as wearable medical equipment and medical diagnostic equipment, a wiring circuit board for electrical equipment used in electrical equipment such as refrigerators, washing machines, vacuum cleaners and air conditioners, a wiring circuit board for video electronics used in video electronics such as digital cameras and DVD video recorders, and the like.
Modification example
In the following modifications, the same members and steps as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Each modification can achieve the same operational effects as those of the first embodiment except for the contents specifically described. Further, the embodiment and the modification can be appropriately combined.
As shown in fig. 2A, in one embodiment, the metal side 23, the base side 26, and the cover side 36 are flush, but may not be flush, that is, may not be continuous, which is not shown. For example, the base side surface 26 and/or the cover side surface 36 may be present so as not to overlap the metal side surface 23 when projected in the thickness direction, but to be offset to either the outer side or the inner side in the short side direction with respect to the metal side surface 23, which is not shown.
As shown in fig. 2A, in one embodiment, the metal side surface 23 of the wiring body metal portion 15 is a flat surface, but may be a curved surface, for example, and is not shown.
In this modification, the metal side surface that is the curved surface has a concave surface that is recessed inward in the short-side direction as it goes from both the thickness direction end portions toward the thickness direction center portion in cross section, and this is not shown.
Preferably, the metal side has only a concave surface. That is, the metal side surface is recessed inward in the short-side direction from both the thickness direction end portions toward the thickness direction center portion in cross section. Thus, the length of the wiring body metal portion in the short side direction becomes shorter from both the ends in the thickness direction toward the center in the thickness direction. Each of the plurality of wiring body metal parts has a substantially drum (hourglass) shape in cross section having a thickness direction center part tapered. In each of the plurality of wiring body metal parts, two concave surfaces are provided on both side surfaces in the short side direction.
The area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short side direction. Accordingly, the present invention includes the following modes: the area S0 of the metal side surface is equal to or larger than the projected area S1 when the metal side surface is projected in the short side direction, and specifically includes both an embodiment in which the area S0 of the metal side surface 23 is the same as the projected area S1 of the metal side surface 23 and a modification in which the area S0 of the metal side surface is larger than the projected area S1 of the metal side surface.
In this modification, specifically, the area ratio (S0/S1) of the area S0 of the metal side surface to the projected area S1 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1.2 or more, further preferably 1.3 or more, and, for example, 2 or less.
Further, since the longitudinal length of the metal side surface is the same as the longitudinal length of the projection surface of the metal side surface, the area ratio (S0/S1) is the same as the length ratio (thickness T/total length L) of the thickness T of the metal supporting layer 6 (specifically, the distance in the thickness direction from one end edge to the other end edge in the thickness direction of the metal side surface) to the total length L along the curved surface (concave surface) from the one end edge to the other end edge in the thickness direction of the metal side surface in cross section. Therefore, the area ratio (S0/S1) can be obtained as the above-described length ratio (thickness T/total length L).
In the above-described modification, the length W in the short side direction of the metal portion of the wiring body is obtained as an average value of the lengths between the two metal side surfaces.
In this modification, the metal side surface may have a curved surface, which is not shown. In this case, 1 metal side surface integrally includes two concave surfaces adjacent in the thickness direction and a ridge line connecting the two concave surfaces in the thickness direction. Thereby, the metal side surface is formed as a curved surface. Specifically, the 1 metal side has a substantially letter W shape in cross section as follows: the center portion in the thickness direction has a ridge line, and both sides of the ridge line have concave surfaces. Therefore, each of the plurality of wiring body metal portions has a cross-sectional shape in which two drums (hour and sand) are connected in the thickness direction.
The method for manufacturing the wired circuit board according to the above-described modification will be specifically described. In this manufacturing method, the metal-based support layer 6 is formed by, for example, etching (subtractive method).
Specifically, a laminate including a metal sheet, and a base insulating layer, a conductor layer, and a cover insulating layer formed on the 1 st metal surface (see fig. 2A and 2B) of the metal sheet is prepared.
Next, a resist is disposed on the 2 nd metal surface of the metal sheet. The shape of the resist in plan view is, for example, the same as the shape of the metal supporting layer 6 to be formed in plan view, and is substantially the same as the shapes of the insulating base layer and the insulating cover layer in plan view.
Thus, a resist laminate having a laminate and a resist was produced.
Then, the resist laminate is immersed in an etching solution. Specifically, the etching solution is brought into contact with the 1 st metal surface exposed from the insulating base layer and the insulating cover layer and the 2 nd metal surface exposed from the resist in the metal sheet.
Then, in the exposed portion of the 2 nd metal surface exposed from the resist, the etching rate at the center portion in the short side direction is higher than the etching rates at both end portions in the short side direction (which is, however, the positions outside the 2 nd metal surface in the short side direction). This is because the etching solution is more likely to stay (stagnate) at both ends in the short-side direction of the exposed portion than at the peripheral portion in the short-side direction.
This case is the same for the exposed portion of the 1 st metal face exposed from the base insulating layer. In addition, both the 1 st metal surface and the 2 nd metal surface in the etching process are curved surfaces in which the short-side direction central portion is recessed inward in the thickness direction.
Thus, etching of the short-side direction central portion in the exposed portions of the 1 st metal surface and the 2 nd metal surface is completed earlier than etching of the short-side direction both end portions. Therefore, the 1 st metal surface and the 2 nd metal surface disappear more quickly at the widthwise central portion than at both widthwise end portions. That is, first, an opening is formed in the center portion in the short side direction, and then, the opening is expanded toward both outer sides (both end portions) in the short side direction.
Thus, a metal side having two concave surfaces and a ridge is formed. At this time, when the etching is completed and then the resist is removed, a wired circuit board having a modified example of the ridge line (a wiring body metal portion having a shape in which two drums are connected) is obtained.
On the other hand, when the etching was further continued, the ridge line disappeared, and thus a metal side surface having 1 concave surface instead of the ridge line was formed. Then, the resist was removed, and a wired circuit board according to a modification (including a wiring body metal portion having a substantially drum-shaped cross section) was obtained.
In the wired circuit board according to these modifications, the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short side direction.
Accordingly, the printed circuit board including both the embodiment (see fig. 2A) in which the area S0 of the metal side surface 23 is the same as the projected area S1 of the metal side surface 23 and the modification in which the area S0 of the metal side surface is larger than the projected area S1 of the metal side surface (i.e., the printed circuit board in which the area S0 of the metal side surface 23 is equal to or larger than the projected area S1 of the metal side surface 23) can reliably increase the contact area between the metal side surface and the air. Therefore, the heat radiation efficiency by convection from the metal portion of the wiring body is more excellent.
In particular, in these modifications, the contact area between the metal side surface and the air can be further reliably enlarged as compared with the embodiment shown in fig. 2A. Therefore, the heat radiation efficiency by convection from the metal portion of the wiring body is more excellent.
In addition, in the modification, 1 metal side surface integrally has a concave surface and a convex surface. The concave surface and the convex surface are arranged in this order in the thickness direction.
In this modification, in 1 wiring body metal portion, a concave surface on one side in the short-side direction and a convex surface on the other side in the short-side direction are opposed to each other in the short-side direction, and a convex surface on one side in the short-side direction and a concave surface on the other side in the short-side direction are opposed to each other in the short-side direction, which is not illustrated. Therefore, the wiring body metal part has a shape of substantially letter S in cross section.
In the 1 wiring body metal portion, two concave surfaces on both sides of one side and the other side in the short side direction are opposed to each other in the short side direction. The two convex surfaces on the one side and the other side in the short side direction face each other in the short side direction, and are not shown.
In one embodiment, the wiring body metal part 15 is given as an example of the support part, and the wiring body metal part 15 is included in the metal supporting layer 6 made of metal. However, instead of the metal-based support layer 6, the support layer may be made of a particulate resin composition including particles and resin having high thermal conductivity, for example, a fired composition such as ceramic.
In one embodiment, the 1 st coupled body 2 and the 2 nd coupled body 3 are continuous in the short-side direction so as to include the 1 st terminal portion 11 and the 2 nd terminal portion 12 in a plan view, but for example, one of them may be continuous in the short-side direction and the other may be discontinuous in the short-side direction, which is not illustrated. In this case, the other is divided into a plurality of pieces at intervals in the short side direction. For example, the 1 st connecting member 2 and the 2 nd connecting member 3 may be divided into a plurality of members at intervals in the lateral direction, which is not shown.
In one embodiment, the number of the main wiring portions 10 is 1 in the wiring body base portion 18, but a plurality of the wiring body base portions 18 may be provided in 1, for example, and this is not shown.
The present invention is provided as an exemplary embodiment of the present invention, but this is merely an example and cannot be construed as limiting. Modifications of the present invention that are obvious to those skilled in the art are intended to be covered by the following claims.
Industrial applicability
The wired circuit board can be used for various applications such as a wired circuit board for electronic equipment and a wired circuit board for electrical equipment.
Description of the reference numerals
1. A wired circuit board; 2. 1 st connecting body; 3. the 2 nd connecting body; 4. a wiring body; 10. a main wiring section; 11. 1 st terminal part; 12. a 2 nd terminal section; 13. 1 st connecting metal part; 14. a 2 nd connecting metal part; 15. a wiring body metal part; 16. 1 st connection base part; 17. a 2 nd coupling base portion; 18. a wiring body base portion; 24. 1 st basal surface; 25. a 2 nd basal surface; 31. the metal inner side surface.
Claims (4)
1. A printed circuit board comprising a printed circuit board,
the wired circuit board has a plurality of wiring bodies arranged in parallel with each other with a space therebetween,
the plurality of wiring bodies each have:
an insulating section;
a wiring section disposed on one surface of the insulating section in the thickness direction; and
and a support portion that is disposed on the other surface of the insulating portion in the thickness direction and is formed of a metal-based material, wherein a ratio (T/W) of a length T of the support portion in the thickness direction to a length W of the plurality of wiring bodies in the parallel direction is 2 or more.
2. The wired circuit board according to claim 1,
one of the support portions has a side surface facing the other support portion adjacent to the one support portion in the parallel direction,
the area of the side surface is larger than or equal to the projection area when the side surface is projected in the parallel direction.
3. The wired circuit board according to claim 1,
the support portion is made of metal.
4. The wired circuit board according to claim 1,
the wired circuit board includes a connecting member that connects end portions of the plurality of wiring bodies in a direction orthogonal to the parallel direction and the thickness direction,
the connecting body has:
a terminal portion continuous with an end portion in an orthogonal direction of the wiring portion; and
a connection support part which is continuous with the end part of the support part in the orthogonal direction,
the coupling support portion is continuous in the parallel direction so as to include a plurality of the terminal portions when projected in a thickness direction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018104652A JP6985211B2 (en) | 2018-05-31 | 2018-05-31 | Wiring circuit board |
| JP2018-104652 | 2018-05-31 | ||
| PCT/JP2019/018713 WO2019230334A1 (en) | 2018-05-31 | 2019-05-10 | Wiring circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112219455A true CN112219455A (en) | 2021-01-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980036057.8A Pending CN112219455A (en) | 2018-05-31 | 2019-05-10 | Wired circuit board |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6985211B2 (en) |
| KR (1) | KR20210015809A (en) |
| CN (1) | CN112219455A (en) |
| TW (1) | TWI823937B (en) |
| WO (1) | WO2019230334A1 (en) |
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|---|---|---|---|---|
| JP7211930B2 (en) * | 2019-12-17 | 2023-01-24 | 日東電工株式会社 | Method for manufacturing wired circuit board |
| JP2022147128A (en) * | 2021-03-23 | 2022-10-06 | 日東電工株式会社 | Wiring circuit board manufacturing method |
| JP2023024322A (en) | 2021-08-06 | 2023-02-16 | 日東電工株式会社 | Wiring circuit board and method for manufacturing the same |
| JP2023034728A (en) | 2021-08-31 | 2023-03-13 | 日東電工株式会社 | wiring circuit board |
| JP2023042068A (en) | 2021-09-14 | 2023-03-27 | 日東電工株式会社 | wiring circuit board |
| JP2024046954A (en) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | Method for manufacturing a printed circuit board |
| JP2024046953A (en) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | Method for manufacturing a printed circuit board, and printed circuit board |
| JP2024046956A (en) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | Wiring Circuit Board |
| JP2024046955A (en) | 2022-09-26 | 2024-04-05 | 日東電工株式会社 | Method for manufacturing a printed circuit board, and printed circuit board |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55140255A (en) | 1979-04-18 | 1980-11-01 | Nec Corp | Heat sink structure |
| JP2001110951A (en) * | 1999-10-08 | 2001-04-20 | Hitachi Ltd | Semiconductor device and manufacturing method thereof |
| JP2003321796A (en) * | 2002-04-30 | 2003-11-14 | Nitto Denko Corp | Plating apparatus and method of manufacturing wiring board using the same |
| KR20100095032A (en) * | 2008-07-16 | 2010-08-27 | 이비덴 가부시키가이샤 | Flex-rigid wiring board and electronic device |
| JP2011198402A (en) * | 2010-03-18 | 2011-10-06 | Dainippon Printing Co Ltd | Flexure substrate for suspension, suspension, suspension with head, and hard disk drive |
| TWI426835B (en) * | 2011-05-23 | 2014-02-11 | Sumitomo Electric Industries | Wiring board |
| JP5747764B2 (en) * | 2011-09-26 | 2015-07-15 | 大日本印刷株式会社 | Suspension board, suspension, suspension with head, and hard disk drive |
| JP6152677B2 (en) * | 2013-03-27 | 2017-06-28 | 大日本印刷株式会社 | Suspension board |
| JP6376556B2 (en) * | 2014-06-10 | 2018-08-22 | 日東電工株式会社 | Opto-electric hybrid board |
-
2018
- 2018-05-31 JP JP2018104652A patent/JP6985211B2/en active Active
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2019
- 2019-05-10 KR KR1020207033984A patent/KR20210015809A/en not_active Application Discontinuation
- 2019-05-10 WO PCT/JP2019/018713 patent/WO2019230334A1/en active Application Filing
- 2019-05-10 CN CN201980036057.8A patent/CN112219455A/en active Pending
- 2019-05-17 TW TW108117072A patent/TWI823937B/en active
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2021
- 2021-11-25 JP JP2021191207A patent/JP7411621B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019212656A (en) | 2019-12-12 |
| KR20210015809A (en) | 2021-02-10 |
| TWI823937B (en) | 2023-12-01 |
| JP6985211B2 (en) | 2021-12-22 |
| JP2022020857A (en) | 2022-02-01 |
| JP7411621B2 (en) | 2024-01-11 |
| WO2019230334A1 (en) | 2019-12-05 |
| TW202005483A (en) | 2020-01-16 |
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