JP2011142158A - Electronic component device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component device which prevents thermal diffusion when soldering, with a simple configuration, and at the same time, improves the high frequency characteristics of a high frequency device. <P>SOLUTION: The electronic component device is equipped with: a high frequency electronic component 4 having a ground terminal 4a; a dielectric substrate 1 in the front surface of which a high frequency electronic component 4 is mounted in a predetermined position, while having a ground pattern 5 in the rear surface thereof; a strip line 2 installed in the dielectric substrate 1; a surface ground conductor 3 installed along the strip line 2; a slit portion formed removing a part of the surface ground conductor 3 so as to surround the ground terminal 4a, while being provided in the direction of the surface ground conductor 3 from the predetermined position; a through hole portion 6 which electrically connects the surface ground conductor 3 and the ground pattern 5, being installed in a region surrounded by the slit portion; and an electrical connection means 7 which electrically connects the ground terminal 4a with the region surrounded by the slit portion. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to an electronic component device in which an electronic component is mounted on a substrate to form a high frequency circuit.

In a high-frequency printed wiring board that mounts a high-frequency package or the like in a small space, a ground conductor (GND) terminal of an electronic component mounted on the surface and a wide ground pattern are provided on the back surface or the inner layer through a through-hole portion, etc. It is necessary to connect over a short distance. In addition, the ground (GND) terminal of the component mounted on the front side and the wide ground pattern are electrically connected by hot melt solder or the like, but provided on the ground terminal of the package component or the component surface (C surface) of the printed wiring board. In addition, since the heat capacity of the wide pattern is large, a temperature drop may occur due to insufficient rise in the heat melting temperature due to the influence of thermal diffusion during soldering. For this reason, various ideas have been made to increase thermal resistance.

For example, in FIG. 1 of Japanese Patent Laid-Open No. 5-327225 (refer to Patent Document 1), in order to prevent the heat on the surface of the pad 2 from escaping to the inner layer side through the non-through hole 3 at the time of component mounting, the pad 2 A multilayer printed wiring board in which the connection between the non-through-hole 3 and the pad 2 is connected by a thermal land pattern 6 is disclosed.

In FIG. 1 (refer to Patent Document 2), a through hole 2 is formed on the solid pattern 1 in order to suppress heat dissipation to the solid pattern 1 and improve solderability. There is disclosed a printed circuit board in which lands 3 are provided on the periphery of the through hole 2, a thermal land 4 is provided on a part of the outer periphery of the land 3, and a through hole 5 is formed at a joint between the thermal land 4 and the solid pattern 1.

JP-A-5-327225 (FIG. 1) JP 2008-130141 A (FIG. 1)

However, although the thing of patent document 1 and patent document 2 is providing the thermal land pattern and preventing heat dissipation, since there is no detailed description about the position of a high frequency grounding circuit, etc., the function with respect to a high frequency is required. There is a problem that it is difficult to apply to an electronic component device using a high-frequency printed wiring board.

The present invention has been made to solve the above-described problems, and provides an electronic component device capable of preventing thermal diffusion during soldering and improving high-frequency characteristics of a high-frequency device with a simple configuration. The purpose is to do.

The electronic component device of the invention according to claim 1 is a high-frequency electronic component having an input terminal and an output terminal extending outside the package, and a ground terminal extending in a direction different from the input terminal and the output terminal, A dielectric substrate having a ground pattern on the back surface or inside and mounting the high-frequency electronic component at a predetermined position on the surface, and being placed on the surface of the dielectric substrate close to the predetermined position of the dielectric substrate A strip line having one and the other of the two lines, a wide surface ground conductor spaced apart from the strip line and continuously installed along the strip line, and from the predetermined position toward the surface ground conductor A slit portion formed by removing a part of the surface ground conductor so as to surround the ground terminal of the high-frequency electronic component, and installed in a region surrounded by the slit portion, The through-hole portion for electrically connecting the surface ground conductor and the ground pattern, the input terminal and the output terminal of the high-frequency electronic component are electrically connected to one and the other strip line, respectively, and the ground terminal of the high-frequency electronic component is And an electrical connection means by heat for electrical connection in a region surrounded by the slit portion.

The electronic component device according to a second aspect of the present invention is the electronic component device according to the first aspect, wherein the slit portion is configured by combining a linear slit and an L-shaped slit.

The electronic component device of the invention according to claim 3 is a high-frequency electronic component having an input terminal extending to the outside of the package, an output terminal, and a ground terminal extending in a direction different from the input terminal and the output terminal; A dielectric substrate having a ground pattern on the back surface or inside and mounting the high-frequency electronic component at a predetermined position on the surface, and being placed on the surface of the dielectric substrate close to the predetermined position of the dielectric substrate A strip line having one and the other of the two lines, a wide surface ground conductor spaced apart from the strip line and continuously installed along the strip line, and from the predetermined position toward the surface ground conductor A slit portion formed by removing a part of the surface ground conductor so as to surround the ground terminal of the high-frequency electronic component except for an end portion on the strip line side; A through-hole portion that is installed outside the end portion of the strip line side in a region surrounded by a grid portion and electrically connects the surface ground conductor and the ground pattern; and an input terminal and an output terminal of the high-frequency electronic component Electrical connection means is provided which is electrically connected to one and the other of the strip lines and electrically connects a ground terminal of the high-frequency electronic component in a region surrounded by the slit portion.

The electronic component device according to a fourth aspect of the present invention is the electronic component device according to the third aspect, wherein the slit portion is configured by combining L-shaped slits.

According to the first and second aspects of the invention, by electrically connecting the ground terminal of the high-frequency electronic component in the region surrounded by the slit portion, heat is cut off at the slit portion, and the dissipation of the thermal melting temperature is reduced. Therefore, heat diffusion at the time of soldering is prevented, and a through hole portion for electrically connecting the surface ground conductor and the ground pattern is provided in the area surrounded by the slit portion, so that high frequency grounding (RF short) of the high frequency electronic component is provided. Is reliable and has the effect of improving the high frequency characteristics.

According to the third and fourth aspects of the invention, by electrically connecting the ground terminal of the high-frequency electronic component in the region surrounded by the slit portion, heat is cut off at the slit portion, and the dissipation of the thermal melting temperature is reduced. As a result, heat diffusion during soldering is prevented, and the surface ground conductor and the ground pattern are electrically connected by the through-hole part installed outside the end of the strip line side in the area surrounded by the slit part. The high frequency grounding (RF short) of the electronic component is ensured, and the high frequency characteristics are improved.

1 is a perspective view of an electronic component device according to Embodiment 1 of the present invention. 1 is a plan view of an electronic component device according to Embodiment 1 of the present invention. It is sectional drawing explaining the slit part of the electronic component apparatus by Embodiment 1 of this invention. It is a perspective view of the electronic component apparatus by Embodiment 2 of this invention. It is a top view of the electronic component apparatus by Embodiment 2 of this invention. It is a top view at the time of adding the through-hole part of the electronic component apparatus by Embodiment 2 of this invention. 2 is a plan view of a sample 1. FIG. 3 is a plan view of a sample 2. FIG. It is a figure explaining comparative description of a high frequency characteristic. It is a top view of the electronic component apparatus by Embodiment 3 of this invention. It is sectional drawing which provided the high frequency grounding pattern in the inner layer of the dielectric substrate of an electronic component apparatus.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described with reference to FIG. FIG. 1 is a perspective view of an electronic component device according to Embodiment 1 of the present invention. In FIG. 1, 1 is a dielectric substrate using a BT resin material and the like, 2 is a strip line (high frequency transmission line) composed of a strip line composed of a metal conductor on the surface of the dielectric substrate 1, and 2a is an input. Lines 2b indicate output lines.

3 is a wide surface ground conductor made of a metal conductor provided along the strip line 2 on the surface of the dielectric substrate 1, 3 a is an L-shaped slit portion provided on the surface ground conductor 3, and 3 b is surface ground A linear slit portion 4 provided on the conductor 3 is a high-frequency electronic component such as a semiconductor element (active element) housed in a package connected to the strip line 2, and has a high-frequency input terminal and a high-frequency output terminal. 4a is a ground (GND) terminal (lead) of the high-frequency electronic component 4, 5 is a ground pattern (back ground conductor) provided on the back surface of the dielectric substrate 1, and 6 is an electrical connection between the surface ground conductor 3 and the ground pattern 5. It is a through hole part (through through hole part). Reference numeral 7 denotes an electric connecting means that is made of a hot-melt solder material or the like and electrically connects the GND terminal 4 a and the input / output terminal of the high-frequency electronic component 4 to the strip line 2 and the surface ground conductor 3. In the drawings, the same reference numerals are the same or corresponding parts.

FIG. 2 is a plan view of the electronic component device according to Embodiment 1 of the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. In FIG. 2, the broken line portion indicates the connection area of the electrical connection means 7.

Next, the operation will be described with reference to FIGS. The surface of the dielectric substrate 1 is provided with a strip line 2 made of a copper-clad plate and a surface ground conductor 3 as an etching pattern. A gate electrode of an active element 4 is connected to an input line 2a of the strip line 2, A drain electrode of the active element 4 is connected to the output line 2b. A wide surface ground conductor 3 is disposed with a gap along the strip line 2 to form a coplanar line.

A high frequency signal is transmitted to the input line 2a while being superimposed on the bias voltage. The high frequency signal is amplified by the active element 4 and transmitted to the outside via the output line 2b. The active element 4 is housed inside the package, and has an input terminal, an output terminal, and a ground (GND) terminal 4a that extend (project) to the outside of the package as connection terminals. The GND terminal 4a extends in different directions from the input terminal and the output terminal. The position of the dielectric substrate 1 on which the active element 4 is placed is called a predetermined position.

In the first embodiment, the ground terminal 4a extends to the surface ground conductor 3 side in a direction orthogonal to the strip line 2. The active element 4 is provided at a predetermined position between the separated input line 2a and output line 2b. The surface ground conductor 3 is continuously arranged along the strip line 2. The GND terminal 4 a protruding from the predetermined position in the direction of the surface ground conductor 3 is electrically connected to the surface ground conductor 3 by the solder material 7. Around the surface ground conductor 3 to which the GND terminal 4a is connected, a part of the surface ground conductor 3 is etched or lasered so as to surround the GND terminal 4a by combining a linear slit and an L-shaped slit. A linear slit portion 3b and an L-shaped slit portion 3a formed by performing pattern removal by the above are provided.

In the first embodiment, a notch is provided at the end portion of the surface ground conductor 3 on the strip line 2 side to form a slit portion 3b, and an L-shaped slit portion 3a is provided on the tip end side of the GND terminal 4a to protrude GND. Although the GND terminal 4a is discontinuously surrounded with line symmetry with respect to the terminal 4a, the slit portion 3a may be a U-shaped slit portion 3a by bringing the slit portions 3a into contact with each other.

In addition, the through-hole part 6 is installed in the area | region enclosed by slit part 3a, 3b, and the surface ground conductor 3 and the ground pattern 5 are electrically connected.

In the first embodiment, the coplanar line is used as the wide surface ground conductor 3 that is continuously installed along the strip line 2 while being separated from the strip line 2. The surface ground conductor 3 may be around the active element 4, and a circuit converter may be provided in the strip line 2, for example, a microstrip line transmission line or a triplate type transmission line.

As described above, according to the electronic component device according to the first embodiment, the ground terminal 4a of the high-frequency electronic component such as the active element 4 is electrically connected by the electrical connection means such as the solder material 7 in the region surrounded by the slit portions 3a and 3b. Through this, heat is cut off at the slit portions 3a and 3b, the dissipation of the heat melting temperature is reduced, and the surface ground conductor 3 and the ground pattern 5 are electrically connected within the region surrounded by the slit portions 3a and 3b. Since the hole portion 6 is provided, high-frequency grounding of the high-frequency electronic component 4 is ensured, and high-frequency characteristics such as high-frequency phase shift and reflection loss can be improved over a wide band.

3 is a cross-sectional view of the electronic component device according to the first embodiment, taken along line AA shown in FIG. In the figure, the same reference numerals as those in FIG. 2 denote the same or corresponding parts. In FIG. 3, the slit portion 3b has an effect of further reducing thermal diffusion by making a cut in the dielectric substrate 1 to deepen the slit portions 3a and 3b. In addition, by forming a groove by continuous irradiation of a carbon dioxide laser or the like having an effective irradiation spot diameter of about 30 μm, slits 3a and 3b having a narrow width can be formed compared to slit formation by a chemical treatment method using hydrofluoric acid or the like. In that case, the present invention can be applied to a very small GND terminal 4a.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIG. 4 is a perspective view of an electronic component device according to Embodiment 2 of the present invention. In FIG. 4, 30 is a wide surface ground conductor made of a metal conductor provided along the strip line 2 on the surface of the dielectric substrate 1, 30a is an L-shaped slit portion provided on the surface ground conductor 30, 30b is provided at the end of the surface ground conductor 30 on the strip line 2 side, and is a joint portion (connecting portion) of the surface ground conductor 30 provided on the end extension line of the slit portion 30a, and 60 is a strip line of the surface ground conductor 30. This is a through-hole portion that is provided outside the slit portion 30a at the two side ends, is located at the end portion of the joint portion 30b, and electrically connects the surface ground conductor 30 and the ground pattern 5. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. In addition, the joint part 30b is the length between the GND terminal 4a and the through-hole part 60, and is below 1/4 wavelength of use frequency wavelength ((lambda) g).

FIG. 5 is a plan view of an electronic component device according to Embodiment 2 of the present invention. In the figure, the same reference numerals as those in FIG. 4 denote the same or corresponding parts. In FIG. 5, the wavy line indicates the connection area of the electrical connection means 7.

Next, the operation will be described with reference to FIGS. The surface of the dielectric substrate 1 is provided with a strip line 2 made of a copper-clad plate and a surface ground conductor 3 as an etching pattern. A gate electrode of an active element 4 is connected to an input line 2a of the strip line 2, A drain electrode of the active element 4 is connected to the output line 2b. A wide surface ground conductor 30 is disposed with a gap along the strip line 2 to form a coplanar line.

A high frequency signal is transmitted to the input line 2a while being superimposed on the bias voltage. The high frequency signal is amplified by the active element 4 and transmitted to the outside via the output line 2b. The active element 4 is housed inside the package, and has an input terminal, an output terminal, and a ground (GND) terminal 4a that extend (project) to the outside of the package as connection terminals. The GND terminal 4a extends in different directions from the input terminal and the output terminal.

In the second embodiment, the ground terminal 4a extends to the surface ground conductor 30 side in a direction orthogonal to the strip line 2. The active element 4 is provided at a predetermined position between the input line 2a and the output line 2b. The surface ground conductor 30 is continuously arranged along the strip line 2. The GND terminal 4 a protruding from the predetermined position toward the surface ground conductor 30 is electrically connected to the surface ground conductor 30 by the solder material 7. Around the surface ground conductor to which the GND terminal 4a is connected, a part of the surface ground conductor 30 is provided to surround the GND terminal 4a by combining L-shaped slits except for the end on the strip line 2 side. An L-shaped slit portion 30a formed by performing pattern removal by etching or laser is provided.

In the second embodiment, a joint region that leaves the pattern of the surface ground conductor 30 is provided at the end portion on the strip line 2 side to form a joint portion 30b, and an L-shaped slit portion 30a is provided on the tip end side of the GND terminal 4a. Thus, the GND terminal 4a is discontinuously surrounded with respect to the projecting GND terminal 4a, but the slit portion 30a is also formed as a U-shaped slit portion 30a by bringing the slit portions 30a into contact with each other. good.

The through-hole portion 60 is installed outside the end portion on the strip line 2 side of the surface ground conductor 30 region surrounded by the slit portion 30a, and the surface ground conductor 30 and the ground pattern 5 are electrically connected, and the active element 4 When the source is grounded, a source (ground) current flows.

As described above, according to the electronic component device according to the second embodiment, the ground terminal 4a of the high frequency electronic component 4 such as the active element 4 is electrically connected by the electrical connection means such as the solder material 7 in the region surrounded by the slit portion 30a. Thus, heat is cut off at the slit portion 30a, the dissipation of the heat melting temperature is reduced, and the surface ground conductor is formed by the through-hole portion 60 installed outside the end portion on the strip line 2 side in the region surrounded by the slit portion 30a. 30 and the ground pattern 5 are electrically connected, so that high-frequency grounding of the high-frequency electronic component is ensured, and high-frequency characteristics such as high-frequency phase shift and reflection loss can be improved over a wide band.

FIG. 6 is a plan view of the electronic component device according to the second embodiment when a through hole portion is added. In the figure, the same reference numerals as those in FIG. 5 denote the same or corresponding parts. In FIG. 5, the ground terminal 4a is surrounded by the L-shaped slit portion 30a except for the end portion on the stripline 2 side, and the through-hole portion 60 is provided outside the end portion on the stripline 2 side in the enclosed region. In FIG. 6, a through hole portion 60 is added to the tip of the ground terminal 4a via a joint portion 30b, and heat is cut off by slit portions 30a1 and 30a2 that are formed in an L shape by combining rectangular slits. What reduced the dissipation of the thermal melting temperature equivalent to the character-shaped slit part 30a is demonstrated.

In the configuration as described above, the surface ground conductor 30 and the ground pattern 5 are electrically connected by the through-hole portion 60 installed outside the end portion on the strip line 2 side in the region surrounded by the slit portions 30a1 and 30a2. In addition, by adding the through-hole portion 60 from the tip portion of the ground terminal 4a via the joint portion 30b, it becomes possible to process a high-power ground current even if the joint portion 30b is narrow.

Next, the high frequency characteristics will be described. FIG. 7 shows an electronic component device (referred to as a “sample 1”) in which a through hole is electrically connected to a back surface ground pattern or the like through a through hole portion 60 in the vicinity of the ground terminal 4a without providing a slit portion. It is an example.

FIG. 8 shows an electronic component device (sample 2 and the specimen 2) in which the surface ground conductor 3 and the ground pattern are electrically connected by the through-hole portion 60 installed outside the surface ground conductor 3 in the region surrounded by the slit portions 3a and 3b. This is an example. In the specimen 2, the through hole portion 60 is not provided at the end portion of the surface ground conductor 3 on the strip line 2 side in the region surrounded by the slit portion 3a.

FIG. 9 is a diagram for explaining a difference in high-frequency characteristics in the sample 1, the sample 2, and the electronic component device (referred to as the sample 3) described in FIG. Although the sample 1 shows a good phase characteristic because there is no slit portion, the heat dissipation at the time of soldering cannot be reduced, which is different from the gist of the present invention. Although the sample 2 is provided with a slit portion, the position of the through hole portion is separated from the ground terminal on the strip line side, and high-frequency grounding is insufficient, and a large deviation occurs particularly in the phase characteristics in the microwave frequency region.

On the other hand, in the sample 3, although the through hole portion 60 is provided outside the slit portion, the through hole portion 60 is provided at the end of the surface ground conductor 3 on the strip line 2 side so as to be close to the ground terminal 4a. 2 shows better phase characteristics. Moreover, since the electronic component device shown in the first embodiment has the through-hole portion 6 in the region surrounded by the slit portions 3a and 3b immediately below the ground terminal 4a, the phase characteristic equivalent to that of the sample 1 or 3 is obtained.

Embodiment 3 FIG.
In the first and second embodiments, the strip line 2 is installed in a straight line from one side to the other. In the third embodiment, the case where the strip line 2 is bent will be described. FIG. 10 is a plan view of an electronic component device according to Embodiment 3 of the present invention. In FIG. 10, the active element 40 is bent in a different direction with respect to one input line 20 a and the other output line 20 b depending on the terminal configuration of the active element 40. Since the surface ground conductor 30 is continuously installed along the output line 20b apart from the output line 20b, in the third embodiment, some of the through-hole parts 61 are more distal than the other through-hole parts 60. Since some of the slit portions 30c are shorter than the other slit portions 30a because they are shifted to the side, the opposed slit portions 30a and 30c are not line symmetric with respect to the protruding GND terminal 40a.

In the third embodiment, the slit portion 30c is arranged wider than the opposing slit portion 30a or closer to the GND terminal 40a, thereby reducing a decrease in melting temperature during soldering.

From the above, even if the strip line is not linear, it is possible to reduce the decrease in melting temperature by forming the through-hole portion by changing the position and width of the slit portion according to the respective bends. Since other functions are the same as those in the first and second embodiments, description thereof will be omitted.

In the first to third embodiments, the ground pattern 5 is provided on the back surface of the dielectric substrate 1. However, as shown in FIG. 11, the ground pattern 50 is provided on the inner layer of the dielectric substrate 1, and the surface ground conductor and the ground pattern 50 are provided. May be electrically connected through the through-hole portion 62. Further, since the purpose of the through-hole portion is to connect the surface ground conductor and the ground pattern, BVH may be appropriately used.

Moreover, although the copper clad laminated board was used for the dielectric substrate 1, a plating material etc. may be laminated | stacked on the upper part, and even if it uses inorganic dielectric materials, such as a ceramic, as a board | substrate material, the same effect is obtained.

1 .. Dielectric substrate 2 .. Strip line 2a .. Input line 2b .. Output line 3 .... Surface grounding conductor 3a .. Slit part (U-shaped slit)
3b..Slit part (straight slit)
4. ・ Electronic parts (high frequency electronic parts) 4a ・ ・ Ground terminal (lead)
5. Backside grounding conductor (grounding pattern)
6 ・ ・ Through hole 7 ・ ・ Electrical connection means (hot melted solder material)
20. · Strip line 20a ·· Input line 20b ·· Output line 30 ·· Surface grounding conductor 30a ·· Slit part (U-shaped slit)
30a1..Slit part 30a2..Slit part 30b..Joint part (connection part) 30c..Slit part (U-shaped slit)
50 .. Inner layer ground conductor (ground pattern)
60. ・ Through hole part 61 ・ ・ Through hole part 62 ・ ・ Through hole part

Claims (4)

A high-frequency electronic component having an input terminal and an output terminal extending outside the package, and a ground terminal extending in a different direction from the input terminal and the output terminal, and having a ground pattern on the back surface or inside, A dielectric substrate on which the high-frequency electronic component is placed at a predetermined position; and a strip line having one and the other lines placed on the surface of the dielectric substrate close to the predetermined position of the dielectric substrate; A wide surface ground conductor continuously provided along the strip line apart from the strip line, and provided in the direction of the surface ground conductor from the predetermined position, surrounding the ground terminal of the high-frequency electronic component A slit portion formed by removing a part of the surface ground conductor, and is installed in a region surrounded by the slit portion, the surface ground conductor and the ground pattern The through-hole portion to be electrically connected, the input terminal and the output terminal of the high-frequency electronic component are electrically connected to one and the other strip line, respectively, and the ground terminal of the high-frequency electronic component is electrically connected in the region surrounded by the slit portion. An electronic component device comprising electrical connection means using heat to be connected. The electronic component device according to claim 1, wherein the slit portion is configured by combining a linear slit and an L-shaped slit. A high-frequency electronic component having an input terminal extending to the outside of the package, an output terminal, and a ground terminal extending in a direction different from the input terminal and the output terminal, and a ground pattern on the back surface or inside, and on the surface A dielectric substrate on which the high-frequency electronic component is placed at a predetermined position; and a strip line having one and the other lines placed on the surface of the dielectric substrate close to the predetermined position of the dielectric substrate; A wide surface ground conductor continuously provided along the strip line apart from the strip line, and provided in the direction of the surface ground conductor from the predetermined position, excluding the end on the strip line side A slit portion formed by removing a part of the surface ground conductor so as to surround the ground terminal of the high-frequency electronic component, and the strip in the region surrounded by the slit portion. A through-hole portion that is installed outside the end portion on the line side and electrically connects the surface ground conductor and the ground pattern, and electrically connects the input terminal and the output terminal of the high-frequency electronic component to one and the other strip lines, respectively. And an electrical connection means by heat for electrically connecting the ground terminal of the high-frequency electronic component in a region surrounded by the slit portion. The electronic component device according to claim 3, wherein the slit portion is configured by combining L-shaped slits.

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