JP4903738B2 - Electronic component storage package and electronic device - Google Patents

Electronic component storage package and electronic device Download PDF

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Publication number
JP4903738B2
JP4903738B2 JP2008082350A JP2008082350A JP4903738B2 JP 4903738 B2 JP4903738 B2 JP 4903738B2 JP 2008082350 A JP2008082350 A JP 2008082350A JP 2008082350 A JP2008082350 A JP 2008082350A JP 4903738 B2 JP4903738 B2 JP 4903738B2
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conductor
electronic component
circuit board
main surface
storage package
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JP2009099934A (en
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真広 辻野
信幸 田中
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

<P>PROBLEM TO BE SOLVED: To constitute a thin circuit substrate for effectively transmitting a high-frequency signal, and to eliminate damage to the circuit substrate. <P>SOLUTION: The electronic component housing package has a metallic container 1 having an opening 2e of a housing 2d with an electronic component 5 stored at an upper main side, a connecting conductor 3b inserted through an insulator 3c into a through-hole 2b formed at a side wall 2 around the housing 2d of the container 1, one main surface, and the other main surface opposite to one main surface. Further, the package is provided with a circuit substrate 6 with a line conductor 6a electrically connected to the connecting conductor 3b at its one end at one main side; and the mounting unit 1b of the circuit substrate 6 with a recess 2c formed at a position opposite to the center of the other main side of the circuit substrate 6 brought into contact with the other main side of the circuit substrate 6 at the periphery of the recess, and electrically connected to the container 1. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

本発明は、電子部品を収容するための電子部品収納用パッケージおよび電子装置に関するものである。   The present invention relates to an electronic component storage package for storing an electronic component and an electronic device.

従来、光通信分野で用いられる半導体素子や、マイクロ波帯，ミリ波帯等の高周波信号で駆動される各種半導体素子等の高周波用途の電子部品または高周波回路基板上にこれら各種半導体素子等を搭載した電子部品を収納する電子部品収納用パッケージ（以下、単にパッケージともいう）には、電子部品と外部電気回路基板とを電気的に接続するための入出力端子として同軸コネクタが用いられている。この同軸コネクタのように絶縁体を介して嵌挿された接続導体を有する入出力端子を具備したパッケージは、パッケージ側部に貫通孔が設けられるとともに該貫通孔に絶縁体を介して接続導体が嵌挿されている。そして、同軸コネクタの中心導体，すなわち接続導体がパッケージの内側および外側にそれぞれ突出していることによって、パッケージ内部の電子部品とパッケージ外部の外部電気回路基板との間で電気信号の送受信ができるものである。   Conventionally, semiconductor devices used in the field of optical communications and various semiconductor devices driven by high-frequency signals such as microwave bands and millimeter-wave bands are mounted on high-frequency electronic components or high-frequency circuit boards. A coaxial connector is used as an input / output terminal for electrically connecting an electronic component and an external electric circuit board to an electronic component storage package (hereinafter also simply referred to as a package) for storing the electronic component. A package having an input / output terminal having a connection conductor inserted through an insulator, such as this coaxial connector, has a through hole provided in the side of the package, and the connection conductor is provided in the through hole via the insulator. It is inserted. The central conductor of the coaxial connector, i.e., the connection conductor, protrudes inside and outside the package, respectively, so that electrical signals can be transmitted and received between the electronic components inside the package and the external electric circuit board outside the package. is there.

パッケージの内側に突出した接続導体はパッケージ内部に載置された回路基板の線路導体に接続される。この線路導体は一端が接続導体に接続され、他端がボンディングワイヤ等の電気的接続手段を介して電子部品に接続される。   The connection conductor protruding inside the package is connected to the line conductor of the circuit board placed inside the package. One end of the line conductor is connected to the connection conductor, and the other end is connected to the electronic component via an electrical connection means such as a bonding wire.

この回路基板は、パッケージの内側には下方の部位に設けられた金属製の棚部の上面か、金属パッケージの底面に半田等の接着剤を介して載置されている（例えば、特許文献１参照）。
特開２００５−１０１２０６号公報 The circuit board is placed inside the package on the upper surface of a metal shelf provided in a lower portion or on the bottom surface of the metal package via an adhesive such as solder (for example, Patent Document 1). reference).
JP 2005-101206 A

しかしながら、回路基板を半田等の接着剤を介して棚部の上面またはパッケージの底面に接合すると、金属と回路基板との熱膨張差によって回路基板に大きな熱応力が作用する。一方、近時の回路基板は線路導体を伝送する電気信号の高周波化に伴って薄型化する傾向にあり、回路基板に熱応力が作用すると回路基板がクラック等によって破損し高周波信号が回路基板を伝送できなくなるという問題点があった。   However, when the circuit board is bonded to the top surface of the shelf or the bottom surface of the package via an adhesive such as solder, a large thermal stress acts on the circuit board due to a difference in thermal expansion between the metal and the circuit board. On the other hand, recent circuit boards tend to become thinner as the electrical signal transmitted through the line conductor becomes higher in frequency. When thermal stress acts on the circuit board, the circuit board is damaged by cracks and the like, and the high-frequency signal passes through the circuit board. There was a problem that transmission could not be performed.

そこで、回路基板を薄型化して高周波信号を効率よく伝送させることができ、かつ回路基板の破損を低減することができる電子部品収納用パッケージおよび電子装置が望まれていた。   Therefore, there has been a demand for an electronic component storage package and an electronic device that can reduce the thickness of the circuit board, efficiently transmit high-frequency signals, and reduce damage to the circuit board.

本発明の電子部品収納用パッケージは、上側主面に電子部品を収納する収納部の開口を有するとともに、前記収納部を囲繞する側壁部に前記収納部に通じる貫通孔を有する金属製の容器と、前記貫通孔の内周に沿って設けられた絶縁体を介して、前記貫通孔に挿通された接続導体と、前記収納部に配されるとともに、前記接続導体と電気的に接続する線路導体が設けられた一方主面と、他方主面とを有する回路基板と、前記回路基板を前記他方主面で支持するとともに、前記他方主面の周囲よりも内側の領域に凹部が設けられ、且つ、前記容器と電気的に接続された載置部と、を備える。   An electronic component storage package according to the present invention includes a metal container having an opening of a storage portion for storing an electronic component on an upper main surface, and a through hole communicating with the storage portion in a side wall surrounding the storage portion. The connection conductor inserted through the through hole via an insulator provided along the inner periphery of the through hole, and the line conductor that is disposed in the storage portion and electrically connected to the connection conductor A circuit board having one main surface provided with the other main surface, and the circuit board is supported by the other main surface, and a recess is provided in a region inside the periphery of the other main surface, and And a mounting portion electrically connected to the container.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記収納部に収容されるとともに前記線路導体の他端に電気的に接続された電子部品と、前記容器の上面の前記開口の周囲に前記開口を塞ぐように接合された蓋体とを具備する。   An electronic device according to the present invention includes an electronic component storage package configured as described above, an electronic component that is stored in the storage portion and is electrically connected to the other end of the line conductor, and the opening on the upper surface of the container. And a lid joined so as to close the opening.

本発明の電子部品収納用パッケージは、上側主面に電子部品を収納する収納部の開口を有するとともに、前記収納部を囲繞する側壁部に前記収納部に通じる貫通孔を有する金属製の容器と、前記貫通孔の内周に沿って設けられた絶縁体を介して、前記貫通孔に挿通された接続導体と、前記収納部に配されるとともに、前記接続導体と電気的に接続する線路導体が設けられた一方主面と、他方主面とを有する回路基板と、前記回路基板を前記他方主面で支持するとともに、前記他方主面の周囲よりも内側の領域に凹部が設けられ、且つ、前記容器と電気的に接続された載置部と、を具備していることから、回路基板が載置部に半田等の接着剤を介して接合されても、凹部が設けられていることによって、他方主面の中央部は載置部と接合されることがない。従って、回路基板の中央部がたわんで、載置部との熱膨張差によって回路基板に作用する熱応力の集中を緩和させることができる。その結果、回路基板がクラック等によって破損しにくくなる。   An electronic component storage package according to the present invention includes a metal container having an opening of a storage portion for storing an electronic component on an upper main surface, and a through hole communicating with the storage portion in a side wall surrounding the storage portion. The connection conductor inserted through the through hole via an insulator provided along the inner periphery of the through hole, and the line conductor that is disposed in the storage portion and electrically connected to the connection conductor A circuit board having one main surface provided with the other main surface, and the circuit board is supported by the other main surface, and a recess is provided in a region inside the periphery of the other main surface, and And a mounting portion electrically connected to the container, so that a recess is provided even if the circuit board is bonded to the mounting portion via an adhesive such as solder. Thus, the central part of the other main surface is joined to the mounting part. Theft is not. Therefore, the central portion of the circuit board is bent, and the concentration of thermal stress acting on the circuit board due to the difference in thermal expansion from the mounting portion can be reduced. As a result, the circuit board is not easily damaged by cracks or the like.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記収納部に収容されるとともに前記線路導体の他端に電気的に接続された電子部品と、前記容器の上面の前記開口の周囲に前記開口を塞ぐように接合された蓋体とを具備していることから、上記本発明の電子部品収納用パッケージを用いた高周波信号の伝送特性の優れたものとなる。   An electronic device according to the present invention includes an electronic component storage package configured as described above, an electronic component that is stored in the storage portion and is electrically connected to the other end of the line conductor, and the opening on the upper surface of the container. Since the cover body joined so as to close the opening is provided around, the high frequency signal transmission characteristics using the electronic component storage package of the present invention are excellent.

本発明の一実施形態にかかる電子部品収納用パッケージ及び電子装置について、以下に詳細に説明する。   An electronic component storage package and an electronic device according to an embodiment of the present invention will be described in detail below.

以下、絶縁体を介して嵌挿された接続導体の一例として、同軸コネクタを用いて説明する。   Hereinafter, a coaxial connector will be described as an example of a connection conductor inserted through an insulator.

図１（ａ）は本発明の電子部品収納用パッケージについて実施の形態の一例を示す断面図、図１（ｂ）は図１（ａ）に示す電子部品収納用パッケージにおける回路基板の載置部および回路基板の拡大正面図、図１（ｃ）は図１（ｂ）に示す電子部品収納用パッケージにおける回路基板およびその載置部の拡大平面図である。また、図２は本発明の電子部品収納用パッケージについて実施の形態の他の例を示す断面図であり、図３は本発明の電子部品収納用パッケージについて実施の形態の他の例を示し載置部の拡大正面図である。   1A is a cross-sectional view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a circuit board placement portion in the electronic component storage package shown in FIG. FIG. 1C is an enlarged plan view of the circuit board and its mounting portion in the electronic component storage package shown in FIG. 1B. 2 is a cross-sectional view showing another example of the embodiment of the electronic component storage package of the present invention, and FIG. 3 shows another example of the embodiment of the electronic component storage package of the present invention. It is an enlarged front view of a mounting part.

これらの図において、１は容器、１ｂは載置部、２は側壁部、２ｂは貫通孔、２ｃは凹部、２ｄは収納部、３ｂは接続導体、５は電子部品、６は回路基板である。なお、図１（ｂ），図１（ｃ），図３において、判りやすくするために、回路基板の導体形成部分にはクロスハッチを付している。   In these drawings, 1 is a container, 1b is a placement portion, 2 is a side wall portion, 2b is a through hole, 2c is a recess, 2d is a storage portion, 3b is a connection conductor, 5 is an electronic component, and 6 is a circuit board. . In FIG. 1B, FIG. 1C, and FIG. 3, the conductor formation portion of the circuit board is cross-hatched for easy understanding.

本発明の電子部品収納用パッケージは、上側主面に電子部品５を収納する収納部２ｄの開口２ｅを有する金属製の容器１と、容器１の収納部２ｄを囲繞する側壁部２に形成された収納部２ｄと容器１の外側との間を貫通する貫通孔２ｂに、絶縁体３ｃを介して嵌挿された接続導体３ｂと、収納部２ｄ内に収納され、一方主面および一方主面に対向する他方主面を有し、一方主面に、一端が接続導体３ｂに電気的に接続された線路導体６ａが設けられた回路基板６と、回路基板６の他方主面の周辺より内側に対面する位置に凹部２ｃが設けられて周縁部において回路基板６の他方主面と接し、容器１と電気的に接続された回路基板６の載置部１ｂとを具備している。   The electronic component storage package of the present invention is formed on a metal container 1 having an opening 2e of a storage portion 2d for storing an electronic component 5 on the upper main surface, and a side wall portion 2 surrounding the storage portion 2d of the container 1. The connecting conductor 3b inserted and inserted through the insulator 3c into the through hole 2b penetrating between the storage portion 2d and the outside of the container 1, and stored in the storage portion 2d, one main surface and one main surface A circuit board 6 provided with a line conductor 6a, one end of which is electrically connected to the connection conductor 3b, and an inner side of the periphery of the other main surface of the circuit board 6. A concave portion 2 c is provided at a position facing to the substrate 1, and a mounting portion 1 b of the circuit board 6 that is in contact with the other main surface of the circuit board 6 at the periphery and is electrically connected to the container 1 is provided.

図１および図２において、貫通孔２ｂに絶縁体３ｃを介して嵌挿された接続導体３ｂとして、筒状の外周導体３ａおよびその中心軸に設置された中心導体３ｂならびにそれらの間に介在する絶縁体３ｃから成る同軸コネクタ３を用いた例を示す。同軸コネクタ３を用いることで、中心導体３ｂを伝送する高周波信号のインピーダンス値を所望の値に設定し易くでき、貫通孔２ｂの所定位置に中心導体３ｂを作業効率よく取り付けることができるという作用効果がある。   In FIG. 1 and FIG. 2, as the connection conductor 3b inserted and inserted into the through hole 2b via the insulator 3c, the cylindrical outer conductor 3a, the central conductor 3b installed on the central axis thereof, and interposed therebetween The example using the coaxial connector 3 which consists of the insulator 3c is shown. By using the coaxial connector 3, the impedance value of the high-frequency signal transmitted through the center conductor 3b can be easily set to a desired value, and the center conductor 3b can be efficiently attached to a predetermined position of the through hole 2b. There is.

容器１は鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金，Ｆｅ−Ｎｉ合金や銅（Ｃｕ）−タングステン（Ｗ），Ｃｕ−モリブデン（Ｍｏ）の焼結材等の金属から成り、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法、または射出成形と切削加工等を施すことによって、所定の形状に製作される。容器１は、図１（ａ），図２に示すように底板部１ａと側壁部２とが別体として形成された後、底板部１ａの上側主面外周部または側面に、側壁部２が銀（Ａｇ）−Ｃｕロウ等を用いたロウ付け法やシーム溶接法等の溶接法等によって接合されてもよい。底板部１ａと側壁部２とが別体として形成される場合、底板部１ａが熱伝導率の高い材料から形成されることで、電子部品５から発生する熱を効率よく外部に放散させ、側壁部２が切削加工性に優れた材料から形成されることで、貫通孔２ｂの形成が容易となる。そのような構成として、例えば、底板部１ａがＣｕ−Ｗの焼結材から成り、側壁部２がＦｅ−Ｎｉ−Ｃｏ合金から成る場合があげられる。   The container 1 is made of a metal such as a sintered material of iron (Fe) -nickel (Ni) -cobalt (Co) alloy, Fe-Ni alloy, copper (Cu) -tungsten (W), Cu-molybdenum (Mo), The ingot is manufactured into a predetermined shape by applying a conventionally known metal processing method such as rolling or punching, or injection molding and cutting. As shown in FIG. 1 (a) and FIG. 2, the container 1 is formed such that the bottom plate portion 1a and the side wall portion 2 are formed as separate bodies. They may be joined by a brazing method using silver (Ag) -Cu brazing or the like, a welding method such as a seam welding method, or the like. When the bottom plate portion 1a and the side wall portion 2 are formed as separate bodies, the bottom plate portion 1a is formed of a material having high thermal conductivity, so that the heat generated from the electronic component 5 can be efficiently dissipated to the outside. By forming the part 2 from a material excellent in machinability, the through hole 2b can be easily formed. As such a configuration, for example, there is a case where the bottom plate portion 1a is made of a sintered material of Cu—W and the side wall portion 2 is made of an Fe—Ni—Co alloy.

容器１の上側主面には電子部品５を収納する収納部２ｄの開口２ｅを有しており、収納部２ｄには半導体レーザ（ＬＤ），フォトダイオード（ＰＤ），トランジスタ，ＩＣ，ＬＳＩ等の電子部品５または回路基板上にこれら半導体素子やコンデンサ等の受動部品を搭載した電子部品５が収納される。図１（ａ），図２に示す例では、枠状の側壁部２と底板部１ａによって取り囲まれた領域に収納部２ｄが形成され、収納部２ｄの底面と成る底板部１ａ上に電子部品５が搭載される。   The upper main surface of the container 1 has an opening 2e of a storage portion 2d for storing the electronic component 5, and the storage portion 2d includes a semiconductor laser (LD), a photodiode (PD), a transistor, an IC, an LSI, and the like. On the electronic component 5 or the circuit board, the electronic component 5 on which these passive components such as semiconductor elements and capacitors are mounted is accommodated. In the example shown in FIG. 1A and FIG. 2, a storage portion 2d is formed in a region surrounded by the frame-shaped side wall portion 2 and the bottom plate portion 1a, and an electronic component is formed on the bottom plate portion 1a serving as the bottom surface of the storage portion 2d. 5 is mounted.

電子部品５は、その電極が、回路基板６の上面（一方主面）に被着形成されている線路導体６ａにボンディングワイヤ９等を介して電気的に接続される。   The electrode of the electronic component 5 is electrically connected to the line conductor 6a formed on the upper surface (one main surface) of the circuit board 6 via a bonding wire 9 or the like.

つまり、線路導体６ａは、その一端が接続導体３ｂに、他端が電子部品５にそれぞれ電気的に接続される。   That is, one end of the line conductor 6 a is electrically connected to the connection conductor 3 b and the other end is electrically connected to the electronic component 5.

側壁部２の側部には接続導体３ｂが嵌挿される貫通孔２ｂが形成されている。この貫通孔２ｂにガラス等の絶縁体３ｃを介して接続導体３ｂを嵌挿させる。   A through hole 2 b into which the connection conductor 3 b is inserted is formed in the side portion of the side wall portion 2. The connecting conductor 3b is inserted into the through hole 2b via an insulator 3c such as glass.

貫通孔２ｂに同軸コネクタ３を嵌着する場合、貫通孔２ｂの大きさを同軸コネクタ３が嵌着される大きさとし、同軸コネクタ３を嵌め込むとともにＡｕ−Ｓｎ半田、Ｐｂ−Ｓｎ半田等の封着材を貫通孔２ｂとの隙間に挿入する。   When the coaxial connector 3 is fitted into the through-hole 2b, the size of the through-hole 2b is set so that the coaxial connector 3 is fitted, and the coaxial connector 3 is fitted and sealed with Au-Sn solder, Pb-Sn solder, or the like. The dressing is inserted into the gap with the through hole 2b.

しかる後、加熱して封着材を溶融させ、溶融した封着材８は毛細管現象により同軸コネクタ３と貫通孔２ｂの内面との隙間に充填されることによって、同軸コネクタ３が貫通孔２ｂに封着材を介して嵌着接合される。   Thereafter, the sealing material is heated to melt, and the melted sealing material 8 is filled in the gap between the coaxial connector 3 and the inner surface of the through hole 2b by a capillary phenomenon, so that the coaxial connector 3 enters the through hole 2b. It is fitted and joined via a sealing material.

同軸コネクタ３は、内部に収容する電子部品５を外部の同軸ケーブルに電気的に接続するものであり、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属から成る円筒状の外周導体３ａの中心軸に同じくＦｅ−Ｎｉ−Ｃｏ合金等の金属から成る中心導体３ｂがガラス等の絶縁体から成る絶縁体３ｃを介して固定された構造をしている。   The coaxial connector 3 is for electrically connecting the electronic component 5 accommodated therein to an external coaxial cable. Similarly, the coaxial connector 3 has a central axis of a cylindrical outer conductor 3a made of a metal such as an Fe-Ni-Co alloy. A central conductor 3b made of a metal such as a Ni—Co alloy is fixed via an insulator 3c made of an insulator such as glass.

また、図１（ａ）において、側壁部２の内面の貫通孔２ｂの下方の部位に棚部２ａが設けられ、棚部２ａ上面が、回路基板６が載置される載置部１ｂとされる。   Further, in FIG. 1A, a shelf 2a is provided in a portion of the inner surface of the side wall 2 below the through hole 2b, and the upper surface of the shelf 2a is a placement portion 1b on which the circuit board 6 is placed. The

または、図２に示すように、容器１の底板部１ａの上側主面において、電子部品５が搭載される位置と側壁部２の貫通孔２ｂが形成された一側部との間に回路基板６が載置される載置部１ｂが設けられる。   Alternatively, as shown in FIG. 2, on the upper main surface of the bottom plate portion 1 a of the container 1, a circuit board is provided between a position where the electronic component 5 is mounted and one side portion where the through hole 2 b of the side wall portion 2 is formed. A mounting portion 1b on which 6 is mounted is provided.

載置部１ｂには、回路基板６の他方主面（線路導体６が形成されている面と反対側の面）の周辺より内側、すなわち他方主面の中央部に対面する位置に載置部１ｂを抉るようにして設けられた座繰り状の凹部２ｃが設けられている。そして、回路基板６は、他方主面の外周部が、凹部２ｃの周囲となる載置部１の周縁部において載置部１ｂと接している。   The placement portion 1b is placed on the inner side of the periphery of the other main surface of the circuit board 6 (the surface opposite to the surface on which the line conductor 6 is formed), that is, at a position facing the central portion of the other main surface. A countersink-shaped recess 2c is provided so as to crawl 1b. And as for the circuit board 6, the outer peripheral part of the other main surface is contacting the mounting part 1b in the peripheral part of the mounting part 1 used as the circumference | surroundings of the recessed part 2c.

凹部２ｃが設けられる構成により、回路基板６が載置部１ｂに半田等の接着剤を介して接合されても、凹部２ｃが存在する部分では回路基板６の他方主面と載置部１ｂとが接合されることがない。従って、凹部２ｃが設けられている回路基板６の中央部分で回路基板６をたわませて熱応力の集中を緩和させることが可能となり、線路導体６ａを伝送する電気信号の高周波化に伴って薄型化した回路基板６であっても、回路基板６にクラック等を生じ難いものとし、安定的に回路基板６に高周波信号を伝送させることができる。   With the configuration in which the recess 2c is provided, even if the circuit board 6 is joined to the mounting portion 1b via an adhesive such as solder, the other main surface of the circuit board 6 and the mounting portion 1b Will not be joined. Accordingly, the circuit board 6 can be bent at the central portion of the circuit board 6 provided with the recess 2c to reduce the concentration of thermal stress, and the electrical signal transmitted through the line conductor 6a becomes higher in frequency. Even if the circuit board 6 is thinned, it is difficult for cracks and the like to occur in the circuit board 6, and a high-frequency signal can be stably transmitted to the circuit board 6.

また好ましくは、凹部２ｃの平面視形状は、図１（ｃ）に示すように、回路基板６の接続導体３ｂが接続される一端側で円弧状の曲面とされているのがよい。この構成により、載置部１ｂの円弧状の曲面の上面を、回路基板６の接続導体３ｂが接続される側の他方主面と強固に接合でき、接続導体３ｂと線路導体６ａとの位置合わせを良好なものとすることができる。この場合、凹部２ｃを形成する際にエンドミル等の切削工具を用いて切削加工を施す。工具の形状が円柱状であり、この円柱状の工具を回転させ工具の先端で切削加工を行うことによって、平面視おいて角部が円弧状の曲面を形成できる。   Preferably, the shape of the recess 2c in plan view is an arcuate curved surface at one end to which the connection conductor 3b of the circuit board 6 is connected, as shown in FIG. With this configuration, the upper surface of the arcuate curved surface of the mounting portion 1b can be firmly joined to the other main surface of the circuit board 6 on the side to which the connection conductor 3b is connected, and the alignment between the connection conductor 3b and the line conductor 6a is achieved. Can be made good. In this case, when forming the recessed part 2c, it cuts using cutting tools, such as an end mill. The shape of the tool is cylindrical, and by rotating this cylindrical tool and performing cutting at the tip of the tool, a curved surface having a circular arc shape in a plan view can be formed.

また好ましくは、載置部１ｂは、図１（ｃ）に示すように、回路基板６の接続導体３ｂが接続される側の縁と線路導体６ａが延設される方向と平行な縁、すなわち図１（ｃ）においては回路基板の右側の辺および上下の辺の側において回路基板６と接しているのがよい。つまり、接続導体３ｂが接続される側と反対側の縁、すなわち回路基板６の左側の辺側においては凹部２ｃが載置部１ｂの端まで形成されていることによって、回路基板６と接していないのがよい。この構成により、回路基板６を３方で安定に支持することができる。   Further, preferably, as shown in FIG. 1C, the mounting portion 1b has an edge parallel to the edge of the circuit board 6 to which the connection conductor 3b is connected and the direction in which the line conductor 6a extends, that is, In FIG. 1C, the circuit board 6 is preferably in contact with the right side and the upper and lower sides of the circuit board. That is, the recess 2c is formed up to the end of the mounting portion 1b on the edge opposite to the side to which the connection conductor 3b is connected, that is, on the left side of the circuit board 6, so that it contacts the circuit board 6. It is better not to. With this configuration, the circuit board 6 can be stably supported in three directions.

また、回路基板６の上面にコプレーナ伝送線路が設けられている場合、接続導体３ｂが接続される側と反対側の縁では回路基板６の下側が凹部２ｃとなっていることから、回路基板６の他方主面側の接地導体となる金属導体が遠く離れて位置する状態となり、回路基板６に設けられたコプレーナ伝送線路がグランデッドコプレーナ伝送線路として動作してしまうのを避けることができる。そして、線路導体６ａの接続導体３ｂが接続される側と反対側の端に電子部品５の電極を電気的に接続した際に、線路導体６ａの電子部品５との接続部の伝送モードを電子部品５の電極部に多く採用されているコプレーナ伝送線路モードと同様とすることができ、高周波信号を効率よく伝送させることができる。   When a coplanar transmission line is provided on the upper surface of the circuit board 6, the lower side of the circuit board 6 is a recess 2c at the edge opposite to the side to which the connection conductor 3b is connected. It is possible to prevent the metal conductor serving as the ground conductor on the other main surface side from being located far away and the coplanar transmission line provided on the circuit board 6 from operating as a grounded coplanar transmission line. When the electrode of the electronic component 5 is electrically connected to the end of the line conductor 6a opposite to the side to which the connection conductor 3b is connected, the transmission mode of the connection portion of the line conductor 6a with the electronic component 5 is changed to the electronic mode. This can be the same as the coplanar transmission line mode that is often used for the electrode portion of the component 5, and a high-frequency signal can be transmitted efficiently.

凹部２ｃが底板部１ａに形成される場合、図２に示すように、凹部２ｃの電子部品５側の端と回路基板６の電子部品５側の端とがほぼ同じ位置となるように回路基板６を載置し、回路基板６の接続導体３ｂが接続される側の縁と線路導体６ａが延設される方向と平行な縁とで回路基板６が載置部１ｂに接して固定されるのがよい。この構成により、凹部２ｃが回路基板６を底板部１ａに対して位置合わせさせる際の目印となり、底板部１ａの所定位置に回路基板６を搭載固定できるようになる。   When the recess 2c is formed in the bottom plate 1a, as shown in FIG. 2, the end of the recess 2c on the electronic component 5 side and the end of the circuit board 6 on the electronic component 5 side are located at substantially the same position. 6 is mounted, and the circuit board 6 is fixed in contact with the mounting portion 1b at the edge of the circuit board 6 to which the connection conductor 3b is connected and the edge parallel to the direction in which the line conductor 6a extends. It is good. With this configuration, the recess 2c serves as a mark when the circuit board 6 is aligned with the bottom plate portion 1a, and the circuit board 6 can be mounted and fixed at a predetermined position of the bottom plate portion 1a.

また好ましくは、図１（ａ），図１（ｃ），図２に示すように、回路基板６の接続導体３ｂが接続される側の側面と側壁部２の内面との間に空隙７が設けられているのがよい。空隙７が設けられていることによって、回路基板６が側壁部２の内面に接合されるのを防ぎ、回路基板６に側壁部２との熱膨張差による熱応力が作用し難くすることができ、回路基板６がクラック等によって破損し難いものとできる。空隙７は、半田等の接合材の表面張力によって浸漬されない程度の隙間として設けられる。   Preferably, as shown in FIGS. 1 (a), 1 (c), and 2, a gap 7 is formed between the side surface of the circuit board 6 to which the connection conductor 3b is connected and the inner surface of the side wall 2. It is good to be provided. By providing the gap 7, it is possible to prevent the circuit board 6 from being bonded to the inner surface of the side wall portion 2, and to make it difficult for the thermal stress due to the difference in thermal expansion from the side wall portion 2 to act on the circuit board 6. The circuit board 6 can be hardly damaged by cracks or the like. The gap 7 is provided as a gap that is not immersed by the surface tension of a bonding material such as solder.

回路基板６は一方主面（上面）および一方主面に対向する一方主面と平行な他方主面（下面）を有し、一方主面に、一端が接続導体３ｂに電気的に接続され、他端が電子部品５と電気的に接続される線路導体６ａが形成されている。例えば、回路基板６は、厚さ０．２５４ｍｍという薄いものであり、その一方主面に幅０．１ｍｍの線路導体６ａが形成される。なお、線路導体６ａの接続導体３ａとの接続部、ボンディングワイヤ等の接続部等では幅が広く形成される場合がある。   The circuit board 6 has one main surface (upper surface) and the other main surface (lower surface) parallel to the one main surface facing the one main surface, and one end is electrically connected to the connection conductor 3b on the one main surface, A line conductor 6 a whose other end is electrically connected to the electronic component 5 is formed. For example, the circuit board 6 is as thin as 0.254 mm in thickness, and a line conductor 6a having a width of 0.1 mm is formed on one main surface thereof. In some cases, the connecting portion of the line conductor 6a with the connecting conductor 3a, the connecting portion of a bonding wire, or the like is formed wide.

載置部１ｂには回路基板６と接合される位置に半田等の接合材を置き、接合材の上に回路基板６を他方主面が接合材側になるようにして載せる。しかる後、加熱して接合材を溶融させ、載置部１ｂ上面に回路基板６が固定される。   On the mounting portion 1b, a bonding material such as solder is placed at a position to be bonded to the circuit board 6, and the circuit board 6 is placed on the bonding material so that the other main surface is on the bonding material side. Thereafter, the bonding material is melted by heating, and the circuit board 6 is fixed to the upper surface of the placement portion 1b.

接続導体３ｂを伝送する高周波信号は、貫通孔２ｂ部において貫通孔２ｂの中心軸を通る同軸線路のモードで伝送し、接続導体３ｂの特性インピーダンスは、外部電気回路の特性インピーダンス値に整合されている。   The high-frequency signal transmitted through the connection conductor 3b is transmitted in the mode of a coaxial line passing through the central axis of the through hole 2b in the through hole 2b, and the characteristic impedance of the connection conductor 3b is matched with the characteristic impedance value of the external electric circuit. Yes.

接続導体３ｂが側壁部２の内面から突出して線路導体６ａと半田等の導電性接着材８により接続された部分より電子部品５側では、高周波信号は回路基板６の上面に被着形成された線路導体６ａ上を伝送する。   On the electronic component 5 side from the portion where the connecting conductor 3b protrudes from the inner surface of the side wall portion 2 and is connected to the line conductor 6a by the conductive adhesive material 8 such as solder, the high frequency signal is deposited on the upper surface of the circuit board 6. It transmits on the line conductor 6a.

回路基板６は、アルミナ（Ａｌ２Ｏ３）質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体、ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質焼結体等の絶縁基板の上面に、一端が接続導体３ｂに接続され、他端が電子部品５にそれぞれ電気的に接続される線路導体６ａが設けられている。そして、線路導体６ａの一端は、導電性接着材８を介して接続導体３ｂに接続され、線路導体６ａの他端は、電子部品５の電極にボンディングワイヤ９等を介して電気的に接続される。 The circuit board 6 has one end on an upper surface of an insulating substrate such as an alumina (Al 2 O 3 ) sintered body, an aluminum nitride (AlN) sintered body, a mullite (3Al 2 O 3 · 2SiO 2 ) sintered body, and the like. Is connected to the connection conductor 3b, and a line conductor 6a is provided, the other end of which is electrically connected to the electronic component 5. One end of the line conductor 6a is connected to the connection conductor 3b via the conductive adhesive 8, and the other end of the line conductor 6a is electrically connected to the electrode of the electronic component 5 via the bonding wire 9 or the like. The

導電性接着材８は、表面張力によって接続導体３ｂと線路導体６ａとの接続部に留まる。回路基板６の上面の接続導体３ｂ側の端面まで流れて端面に半田溜まりができてしまうことはない。   The conductive adhesive 8 stays at the connection portion between the connection conductor 3b and the line conductor 6a due to surface tension. It does not flow up to the end surface on the side of the connection conductor 3b on the upper surface of the circuit board 6 to cause a solder pool on the end surface.

回路基板６において、好ましくは、図１（ｂ），図１（ｃ）に示すように、一方主面の線路導体６ａの両側に等間隔を隔てて同一面接地導体６ｂが設けられたコプレーナ線路が形成されているのがよい。この構成により、より高い高周波信号にも対応し易くなり、線路導体６ａの他端を電子部品５の信号用電極にボンディングワイヤ９を介して接続するとともに、線路導体６ａの両側に設けられた同一面接地導体６ｂの他端を電子部品５の接地用電極にボンディングワイヤ９を介して接続する（図１（ｃ）参照）ことにより、回路基板６の線路導体６ａを伝送する高周波信号の伝送モードを電子部品５の電極部の伝送モードとマッチングさせやすくできる。   In the circuit board 6, preferably, as shown in FIGS. 1 (b) and 1 (c), a coplanar line in which the same-surface ground conductor 6b is provided at equal intervals on both sides of the line conductor 6a on one main surface. Is good to be formed. With this configuration, it becomes easy to cope with higher frequency signals, and the other end of the line conductor 6a is connected to the signal electrode of the electronic component 5 through the bonding wire 9, and the same provided on both sides of the line conductor 6a. A high-frequency signal transmission mode for transmitting the line conductor 6a of the circuit board 6 by connecting the other end of the surface ground conductor 6b to the grounding electrode of the electronic component 5 via the bonding wire 9 (see FIG. 1C). Can be easily matched with the transmission mode of the electrode portion of the electronic component 5.

図１（ｂ），図１（ｃ）に示すように、一方主面の線路導体６ａの両側に等間隔を隔てて同一面接地導体６ｂが設けられたコプレーナ線路が形成されている構成において、好ましくは、図１（ｂ），図１（ｃ），図３に示すように、凹部２ｃは回路基板６の線路導体６ａに沿って、線路導体６ａと対向する位置に設けられているのがよい。例えば、線路導体６ａの幅０．１ｍｍに対して線路導体６ａに沿って、幅が１ｍｍ，深さが０．５ｍｍの凹部２ｃが設けられる。この構成により、凹部２ｃの上側に位置する回路基板６の他方主面に接地導体を形成しなければ、容器１の凹部２ｃが線路導体６ａに対する接地導体として機能するようになる。接地導体が凹形状であることによって線路導体６ａから遠ざかるので、線路導体６ａを伝送する高周波信号の伝送モードをグランデッドコプレーナ線路の伝送モードではなく、コプレーナ線路のモードとすることができ、電子部品５の回路基板上の電極部として多く使用されているコプレーナ線路の伝送モードとマッチングさせ易くすることができる。その結果、回路基板６と電子部品５との間で反射損失等の伝送損失が発生するのを防止でき、高周波信号を効率よく伝送できるようになる。   As shown in FIGS. 1 (b) and 1 (c), in the configuration in which a coplanar line is formed in which the same-surface ground conductor 6b is provided at equal intervals on both sides of the line conductor 6a on one main surface. Preferably, as shown in FIG. 1B, FIG. 1C, and FIG. 3, the recess 2c is provided along the line conductor 6a of the circuit board 6 at a position facing the line conductor 6a. Good. For example, a recess 2c having a width of 1 mm and a depth of 0.5 mm is provided along the line conductor 6a with respect to a width of 0.1 mm of the line conductor 6a. With this configuration, if no ground conductor is formed on the other main surface of the circuit board 6 positioned above the recess 2c, the recess 2c of the container 1 functions as a ground conductor for the line conductor 6a. Since the ground conductor is away from the line conductor 6a due to the concave shape, the transmission mode of the high-frequency signal transmitted through the line conductor 6a can be set to the mode of the coplanar line instead of the transmission mode of the grounded coplanar line. 5 can be easily matched with a transmission mode of a coplanar line that is often used as an electrode portion on the circuit board. As a result, it is possible to prevent a transmission loss such as a reflection loss between the circuit board 6 and the electronic component 5 and to transmit a high-frequency signal efficiently.

また、図１（ｂ），図１（ｃ）に示すように、一方主面の線路導体６ａの両側に等間隔を隔てて同一面接地導体６ｂが設けられたコプレーナ線路が形成されている構成において、好ましくは、載置部１ｂは、図１（ｃ）に示すように、回路基板６の接続導体３ｂが接続される側の縁と線路導体６ａが延設される方向と平行な縁、すなわち図１（ｃ）においては回路基板の右側の辺および上下の辺の側において回路基板６と接しているのがよく、接続導体３ｂが接続される側と反対側の縁では回路基板６の下側が凹部２ｃとなっていることから、線路導体６ａの接続導体３ｂが接続される側と反対側の端に電子部品５の電極を電気的に接続した際に、線路導体６ａの電子部品５との接続部の伝送モードを電子部品５上の電極部に多く採用されている伝送モードと同様とすることができ、高周波信号を効率よく伝送させることができる。   Also, as shown in FIGS. 1B and 1C, a coplanar line is formed in which the same-surface ground conductor 6b is provided at equal intervals on both sides of the line conductor 6a on one main surface. Preferably, the mounting portion 1b includes, as shown in FIG. 1 (c), an edge parallel to the side where the connection conductor 3b of the circuit board 6 is connected and the direction in which the line conductor 6a extends, That is, in FIG. 1C, the circuit board 6 is preferably in contact with the right side and upper and lower sides of the circuit board, and the edge of the circuit board 6 is opposite to the side to which the connection conductor 3b is connected. Since the lower side is the recess 2c, when the electrode of the electronic component 5 is electrically connected to the end of the line conductor 6a opposite to the side to which the connection conductor 3b is connected, the electronic component 5 of the line conductor 6a. The transmission mode of the connection part is often adopted for the electrode part on the electronic component 5 Transmission mode and can be the same that can be transmitting a high frequency signal efficiently.

以上により、線路導体６ａに高周波信号を良好に伝送させることができるパッケージとすることができ、内部に収容する電子部品５を安定に作動させることができるパッケージとすることができる。   As described above, a package capable of satisfactorily transmitting a high-frequency signal to the line conductor 6a can be obtained, and a package capable of stably operating the electronic component 5 accommodated therein can be obtained.

また好ましくは、図１（ｂ）に示すように、回路基板６の他方主面に、同一面接地導体６ｂと対向させて形成された下面接地導体６ｃが設けられるとともに、同一面接地導体６ｂと下面接地導体６ｃとを電気的に接続する接地用接続導体６ｄが設けられているのがよい。この構成により、下面接地導体６ｃが金属製の容器１と電気的に接続されケースグランドとなるとともに、同一面接地導体６ｂが下面接地導体６ｃと同一の電位となり、線路導体６ａに対して同一面接地導体６ｂをケースグランドとすることができる。ケースグランドとは金属製の容器１の接地電位のことであり、同一面接地導体６ｂをこの金属製容器１の接地電位と同じ電位に保持することにより、接地電位の値を安定なものとできる。その結果、線路導体６ａに安定した高周波信号を流すことができる。   Preferably, as shown in FIG. 1B, the other main surface of the circuit board 6 is provided with a lower surface ground conductor 6c formed to face the same surface ground conductor 6b, and the same surface ground conductor 6b. It is preferable to provide a ground connection conductor 6d that electrically connects the lower surface ground conductor 6c. With this configuration, the lower surface ground conductor 6c is electrically connected to the metal container 1 to form a case ground, and the same surface ground conductor 6b has the same potential as the lower surface ground conductor 6c, so that the same surface contact with the line conductor 6a is achieved. The ground conductor 6b can be a case ground. The case ground is a ground potential of the metal container 1. By holding the same-surface ground conductor 6 b at the same potential as the ground potential of the metal container 1, the value of the ground potential can be stabilized. . As a result, a stable high frequency signal can be passed through the line conductor 6a.

また好ましくは、図１（ｂ）に示すように、接地用接続導体６ｄは、回路基板６の線路導体６ａが延設される方向と平行な側面に設けられた側面導体６ｄであるのがよい。この構成により、同一面接地導体６ｂと下面接地導体６ｃとの電気的接続をより強固なものとすることができ、線路導体６ａを伝送する高周波信号を同一面接地導体６ｂで安定に接地させることができる。   Preferably, as shown in FIG. 1B, the ground connection conductor 6d is a side conductor 6d provided on a side surface parallel to the direction in which the line conductor 6a of the circuit board 6 extends. . With this configuration, the electrical connection between the same-surface ground conductor 6b and the lower-surface ground conductor 6c can be made stronger, and the high-frequency signal transmitted through the line conductor 6a can be stably grounded by the same-surface ground conductor 6b. Can do.

また、図４（ａ）〜（ｃ）は、本発明の電子部品収納用パッケージの実施の形態の他の例を示す拡大平面図である。図５（ａ）〜（ｄ）は本発明の電子部品収納用パッケージの実施の形態の他の例を示す拡大断面図である。   FIGS. 4A to 4C are enlarged plan views showing other examples of the embodiment of the electronic component storage package of the present invention. 5A to 5D are enlarged sectional views showing other examples of the embodiment of the electronic component storage package of the present invention.

図４、図５に示すように、回路基板６の一方主面であって、線路導体６ａと接続導体３ｂとが重なる部位の周囲に切欠部１６が設けられていることが好ましい。   As shown in FIGS. 4 and 5, it is preferable that a notch 16 is provided around a portion of one main surface of the circuit board 6 where the line conductor 6 a and the connection conductor 3 b overlap.

すなわち、線路導体６ａに接続導体３ｂが接続させることにより容量成分が増大し、接続部においてインピーダンス値が低下することとなるが、この切欠部１６によって回路基板６を形成する誘電体が取り除かれ空気が存在することとなる。空気の誘電率は回路基板６を形成する誘電体の誘電率よりも小さく、線路導体６ａの接続導体３ｂとの接続部と同一面接地導体６ｂの間に生じる容量成分を減らすことができる。例えば、回路基板６を形成する誘電体がＡｌ２Ｏ３質焼結体である場合の誘電率が９、ＡｌＮ質焼結体である場合の誘電率が１０、３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体である場合の誘電率が６．４であるのに対し、空気の誘電率は１である。従って、切欠部１６を設けることにより、線路導体６ａの接続導体３ｂとの接続部と同一面接地導体６ｂの間の誘電率を大幅に低下させて、線路導体６ａの接続導体３ｂとの接続部と同一面接地導体６ｂの間に生じる容量成分を減らすことができる。 That is, when the connection conductor 3b is connected to the line conductor 6a, the capacitance component is increased and the impedance value is reduced at the connection portion. However, the dielectric forming the circuit board 6 is removed by the notch 16 and the air is removed. Will exist. The dielectric constant of air is smaller than the dielectric constant of the dielectric forming the circuit board 6, and the capacitance component generated between the connection portion of the line conductor 6a and the connection conductor 3b and the same plane ground conductor 6b can be reduced. For example, the dielectric constant is 10,3Al 2 O 3 · 2SiO 2 Quality of when the dielectric constant when the dielectric that forms the circuit board 6 is Al 2 O 3 quality sintered body is 9, AlN sintered body The dielectric constant of the sintered body is 6.4, whereas the dielectric constant of air is 1. Therefore, by providing the notch 16, the dielectric constant between the connecting portion of the line conductor 6a and the connecting conductor 3b and the ground conductor 6b on the same plane is greatly reduced, and the connecting portion of the line conductor 6a to the connecting conductor 3b. And the capacitive component generated between the same-surface ground conductors 6b can be reduced.

その結果、線路導体６ａの接続導体３ｂとの接続部を伝送する電気信号のインピーダンス値を低下させることなく、所定のインピーダンス値に整合させることができ、電気信号に反射損失等の伝送損失が発生するのを防止して電気信号を効率良く伝送することができる。特に、近時の小型化した電子部品収納用パッケージにおいては、線路導体６ａと同一面接地導体６ｂとの間の距離が近接しており、容量成分の低減の効果が大きくなる。   As a result, the electrical signal transmitted through the connection portion of the line conductor 6a with the connection conductor 3b can be matched to a predetermined impedance value without lowering, and transmission loss such as reflection loss occurs in the electrical signal. Thus, the electrical signal can be transmitted efficiently. In particular, in the recent miniaturized electronic component storage package, the distance between the line conductor 6a and the same-surface ground conductor 6b is close, and the effect of reducing the capacitance component is increased.

なお、切欠部１６の平面視形状は、図４（ａ）に示す長方形であったり、図４（ｂ）に示す円形を連続的に複数個配置した形状であったり、図４（ｃ）に示す長方形と半円とを組み合わせた形状であったり、その他、楕円形等としてもよく、種々の形状とすることができる。また、線路導体６ａの接続導体３ｂとの接続部は図４（ｃ）に示すように、接続部を除く残部よりも幅広な幅広部１６ａとしてもよい。この構成により、線路導体６ａの幅を狭くした場合においても、接続導体３ｂとの接続部となる幅広部１６ａで線路導体６ａとの接合面積を確保でき、線路導体６ａと接続導体３ｂとの電気的な接続を確実に行うことができるとともに、線路導体６ａと接続導体３ｂとの接合強度を強固なものとすることができる。   In addition, the planar view shape of the notch 16 is a rectangle shown in FIG. 4A, a shape in which a plurality of circles shown in FIG. 4B are continuously arranged, or a shape shown in FIG. The shape may be a combination of a rectangle and a semicircle, or may be an ellipse or the like. Moreover, as shown in FIG.4 (c), the connection part with the connection conductor 3b of the line conductor 6a is good also as the wide part 16a wider than the remainder except a connection part. With this configuration, even when the width of the line conductor 6a is narrowed, it is possible to secure a junction area with the line conductor 6a by the wide portion 16a serving as a connection portion with the connection conductor 3b, and the electrical connection between the line conductor 6a and the connection conductor 3b. In addition to reliable connection, the bonding strength between the line conductor 6a and the connection conductor 3b can be strengthened.

また、切欠部１６は図５（ａ）に示すように、回路基板６を座繰るようにして設けてもよいし、図５（ｂ）に示すように、回路基板６を貫通するようにして設けてもよい。図５（ａ）に示すように、回路基板６を座繰るようにして設ける場合、座繰りの深さは線路導体６ａの接続導体３ｂとの接続部を伝送する電気信号のインピーダンス値が所定値になるように適宜決定する。切欠部１６を図５（ａ）に示すように座繰るようにして設けるか、回路基板６を貫通するようにして設けるかは、線路導体６ａの接続導体３ｂとの接続部を伝送する電気信号のインピーダンス値が所定値になるように適宜決定すればよい。好ましくは、切欠部１６は図５（ａ）に示すように座繰るようにして設けるのがよく、図５（ｂ）に示すように貫通するようにして設ける場合に比べ、回路基板６の強度が高く、回路基板６に力が加わった場合において、回路基板６を破損し難くすることができる。   Further, the notch portion 16 may be provided so as to counter the circuit board 6 as shown in FIG. 5 (a), or may be provided so as to penetrate the circuit board 6 as shown in FIG. 5 (b). It may be provided. As shown in FIG. 5A, when the circuit board 6 is provided so as to be countersunk, the depth of the countersink is determined by the impedance value of an electric signal transmitted through the connection portion of the line conductor 6a with the connection conductor 3b being a predetermined value. It decides suitably so that it may become. Whether the notch portion 16 is provided so as to be staggered as shown in FIG. 5A or whether it is provided so as to penetrate the circuit board 6 is an electric signal transmitted through the connection portion of the line conductor 6a with the connection conductor 3b. What is necessary is just to determine suitably so that the impedance value of may become predetermined value. Preferably, the notch portion 16 is provided so as to be staggered as shown in FIG. 5 (a), and the strength of the circuit board 6 is higher than the case where it is provided so as to penetrate as shown in FIG. 5 (b). When the force is applied to the circuit board 6, the circuit board 6 can be hardly damaged.

なお、線路導体６ａの接続導体３ｂとの接続部と同一面接地導体６ｂの間に生じる容量成分を極力減らしたい場合は、図５（ｃ）に示すように、切欠部１６は、回路基板６の一方主面から他方主面にかけて広くなるように形成してもよいし、図５（ｄ）に示すように、切欠部１６は、回路基板６の他方主面から一主面にかけて広くなるように形成してなってもよい。これら切欠部１６を形成するには、従来周知のレーザー加工やブラスト処理等を行えばよい。    When it is desired to reduce the capacitance component generated between the connection portion of the line conductor 6a and the connection conductor 3b and the same-surface ground conductor 6b as much as possible, as shown in FIG. 5 may be formed so as to be widened from one main surface to the other main surface, and as shown in FIG. 5 (d), the notch portion 16 is widened from the other main surface to one main surface of the circuit board 6. It may be formed. In order to form these notches 16, conventional laser processing, blasting, or the like may be performed.

例えば、回路基板６の他方主面から一方主面に向かって、上記レーザーを出射すれば、切欠部１６は、回路基板６の一方主面から他方主面にかけて広くなるように形成される。この場合、線路導体６ａと同一面接地導体６ｂとの間隔による制限を受けにくいため、作業性良く他方主面の不要な容量成分を除去できる。   For example, if the laser is emitted from the other main surface of the circuit board 6 toward the one main surface, the notch 16 is formed so as to become wider from the one main surface to the other main surface of the circuit board 6. In this case, since it is difficult to be restricted by the distance between the line conductor 6a and the same-surface ground conductor 6b, an unnecessary capacitance component on the other main surface can be removed with good workability.

反対に、回路基板６の一方主面から他方主面に向かって、上記レーザーを出射すれば、切欠部１６は、回路基板６の他方主面から一主面にかけて広くなるように形成される。この場合、一方主面の上側から線路導体６ａと同一面接地導体６ｂの位置を目視によって加工位置を確認しながら、加工を行うことができるため、切欠部１６を所定の位置に精度良く形成することができる。   On the other hand, if the laser is emitted from one main surface of the circuit board 6 toward the other main surface, the notch 16 is formed so as to widen from the other main surface of the circuit board 6 to one main surface. In this case, since the processing can be performed while visually confirming the processing position of the same-surface ground conductor 6b as the line conductor 6a from the upper side of the one main surface, the notch portion 16 is accurately formed at a predetermined position. be able to.

このような回路基板６は以下のようにして作製される。例えば、セラミックグリーンシートに、ＷやＭｏ等の高融点金属粉末に適当な有機バインダ、可塑剤、溶剤等を添加混合して得た金属ペーストを、スクリーン印刷法等の厚膜形成技術により印刷塗布して、線路導体６ａ，同一面接地導体６ｂ，下面接地導体６ｃおよび接地用接続導体６ｄとなるメタライズ層を所定パターンに形成する。   Such a circuit board 6 is manufactured as follows. For example, a metal paste obtained by adding and mixing a suitable organic binder, plasticizer, solvent, etc. to a high melting point metal powder such as W or Mo to a ceramic green sheet is printed by a thick film forming technique such as screen printing. Then, a metallized layer to be the line conductor 6a, the same surface ground conductor 6b, the lower surface ground conductor 6c, and the ground connection conductor 6d is formed in a predetermined pattern.

しかる後、セラミックグリーンシートを複数枚積層し、これを還元雰囲気中、約1600℃の温度で焼成することにより製作される。   Thereafter, a plurality of ceramic green sheets are laminated and fired at a temperature of about 1600 ° C. in a reducing atmosphere.

また線路導体６ａは薄膜形成法によって形成されていてもよく、その場合、線路導体６ａは窒化タンタル（Ｔａ２Ｎ）、ニクロム（Ｎｉ−Ｃｒ合金）、チタン（Ｔｉ）、パラジウム（Ｐｄ）、白金（Ｐｔ）等から形成され、セラミックグリーンシートを焼成した後に形成される。 Further, the line conductor 6a may be formed by a thin film forming method. In this case, the line conductor 6a is made of tantalum nitride (Ta 2 N), nichrome (Ni—Cr alloy), titanium (Ti), palladium (Pd), platinum. It is formed from (Pt) or the like and is formed after firing the ceramic green sheet.

なお、線路導体６ａは、その露出表面にＮｉやＡｕから成るメッキ金属層を１〜20μｍ程度の厚みに被着させておくのが好ましい。   The line conductor 6a is preferably coated with a plated metal layer made of Ni or Au on its exposed surface to a thickness of about 1 to 20 μm.

これにより、線路導体６ａの酸化腐食を有効に防止することができるとともに線路導体６ａとボンディングワイヤ９や接続導体３ｂとの接続性を良好なものとすることができる。   Thereby, the oxidative corrosion of the line conductor 6a can be effectively prevented, and the connectivity between the line conductor 6a and the bonding wire 9 or the connection conductor 3b can be improved.

このような本発明のパッケージの収納部２ｄに、電子部品５を載置固定するとともにその電極を線路導体６ａにボンディングワイヤ９等を介して電気的に接続し、しかる後、回路基板６の線路導体６ａと接続導体３ｂとを半田等の導電性接着材８を介して電気的に接続、または回路基板６の線路導体６ａと接続導体３ｂとを半田等の導電性接着材８を介して電気的に接続した後、電子部品５を載置固定するとともに電子部品５の電極を線路導体６ａにボンディングワイヤ９等を介して電気的に接続し、最後に側壁部２の上面にＦｅ−Ｎｉ−Ｃｏ合金等の金属等から成る蓋体４を半田付け法やシームウエルド法等により取着することにより製品としての電子装置となる。   The electronic component 5 is placed and fixed in the housing portion 2d of the package of the present invention, and the electrode is electrically connected to the line conductor 6a via the bonding wire 9 or the like. The conductor 6a and the connection conductor 3b are electrically connected via a conductive adhesive material 8 such as solder, or the line conductor 6a and the connection conductor 3b of the circuit board 6 are electrically connected via a conductive adhesive material 8 such as solder. After the connection, the electronic component 5 is placed and fixed, and the electrode of the electronic component 5 is electrically connected to the line conductor 6a via the bonding wire 9 or the like. Finally, the Fe-Ni- A lid 4 made of a metal such as a Co alloy is attached by a soldering method, a seam weld method, or the like, thereby obtaining an electronic device as a product.

このような電子装置は、パッケージ外側の接続導体３ｂに外部電気回路に接続される同軸ケーブルを接続することにより内部に収容する電子部品５が外部電気回路に電気的に接続されることとなる。
また、図１乃至図５においては、同軸コネクタ３が１個設けられた例を示したが、図６のように、同軸コネクタ３が複数設けられた形態であってもよい。 In such an electronic device, by connecting a coaxial cable connected to the external electric circuit to the connection conductor 3b outside the package, the electronic component 5 housed inside is electrically connected to the external electric circuit.
1 to 5 show an example in which one coaxial connector 3 is provided, but a configuration in which a plurality of coaxial connectors 3 are provided as shown in FIG. 6 may be used.

すなわち、貫通孔２ｂは側壁部２に複数備えてなり、各貫通孔２ｂに同軸コネクタ３がそれぞれ挿通固定されている。この構成によれば、パッケージの多端子化が可能となる。   That is, a plurality of through holes 2b are provided in the side wall portion 2, and the coaxial connectors 3 are inserted and fixed in the respective through holes 2b. According to this configuration, the number of terminals of the package can be increased.

例えば、２個のコネクタで１組の差動線路を形成すれば、差動信号の入出力が可能となる。
２本の線路導体６ａを１組の差動線路と為す場合、２本の線路導体６ａの長さを同一とすることが好ましい。この場合、２本の線路導体６ａを伝送する電気信号に位相差が生ずるのを防止することができる。 For example, if a pair of differential lines is formed by two connectors, differential signals can be input and output.
When the two line conductors 6a are used as a set of differential lines, the lengths of the two line conductors 6a are preferably the same. In this case, it is possible to prevent a phase difference from occurring in the electric signal transmitted through the two line conductors 6a.

また、線路導体６ａは線路導体６ａの両側に等間隔をあけて同一面に設けられた同一面接地導体６ｂとともにコプレーナ線路を形成してもよい。この場合、Ｇ（接地導体）−Ｓ（線路導体）−Ｇ（接地導体）、またはＧ−Ｓ−Ｓ−Ｇとなるように、線路導体６ａおよび同一面接地導体６ｂを配置する。この構成により、線路導体６ａに高周波信号を伝送させても、高周波信号を同一面接地導体６ｂによって安定に接地させ、所定のインピーダンス値に整合させることができる。その結果、線路導体６ａを伝送する高周波信号に反射損失や透過損失等の伝送損失が発生するのを抑制し、線路導体６ａを伝送する高周波信号を効率良く伝送させることができる。   Further, the line conductor 6a may form a coplanar line together with the same-surface ground conductor 6b provided on the same surface at equal intervals on both sides of the line conductor 6a. In this case, the line conductor 6a and the same-surface ground conductor 6b are arranged so as to be G (ground conductor) -S (line conductor) -G (ground conductor) or GSSS. With this configuration, even when a high-frequency signal is transmitted to the line conductor 6a, the high-frequency signal can be stably grounded by the same-surface ground conductor 6b and matched to a predetermined impedance value. As a result, it is possible to suppress the occurrence of transmission loss such as reflection loss and transmission loss in the high-frequency signal transmitted through the line conductor 6a, and to efficiently transmit the high-frequency signal transmitted through the line conductor 6a.

図６では、側壁２に２個の同軸コネクタ３を設け１組の差動線路を設けた例を示したが、これに限定されることはなく、側壁２に４個以上の偶数個の同軸コネクタ３を設け、差動線路を２組以上設けても構わない。差動線路を２組以上設けることで、セラミック基板６をより多機能なものとすることができる。   FIG. 6 shows an example in which two coaxial connectors 3 are provided on the side wall 2 and a pair of differential lines is provided. However, the present invention is not limited to this example, and the even number of four or more coaxials is provided on the side wall 2. The connector 3 may be provided and two or more sets of differential lines may be provided. By providing two or more sets of differential lines, the ceramic substrate 6 can be made more multifunctional.

なお、側壁２は金属製であるため、各同軸コネクタ３から発生する電界をシールドすることができる。その結果、各同軸コネクタ３を伝送する電気信号が干渉し合うのを抑制することができる。   Since the side wall 2 is made of metal, the electric field generated from each coaxial connector 3 can be shielded. As a result, it is possible to suppress interference of electrical signals transmitted through the respective coaxial connectors 3.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。例えば、凹部２ｃの断面形状が図３に示すような円弧状とされてもよい。   Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention. For example, the cross-sectional shape of the recess 2c may be an arc shape as shown in FIG.

（ａ）は本発明の電子部品収納用パッケージについて実施の形態の一例を示す断面図、（ｂ）は図１（ａ）に示す電子部品収納用パッケージの要部拡大正面図、（ｃ）は図１（ｂ）に示す電子部品収納用パッケージにおける要部拡大平面図である。(A) is sectional drawing which shows an example of embodiment about the electronic component storage package of this invention, (b) is a principal part enlarged front view of the electronic component storage package shown to Fig.1 (a), (c) is. It is a principal part enlarged plan view in the electronic component storage package shown in FIG.1 (b). 本発明の電子部品収納用パッケージの実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示し要部拡大正面図である。It is a principal part enlarged front view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大平面図である。It is a principal part enlarged plan view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す要部拡大断面図である。It is a principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention. 本発明の電子部品収納用パッケージの実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the electronic component storage package of this invention.

符号の説明Explanation of symbols

１：容器
１ｂ：載置部
２：側壁部
２ｂ：貫通孔
２ｃ：凹部
２ｄ：収納部
２ｅ：（収納部の）開口
３ｂ：接続導体（中心導体）
３ｃ：絶縁体
４：蓋体
５：電子部品
６：回路基板
６ａ：線路導体
６ｂ：同一面接地導体
６ｃ：下面接地導体
６ｄ：接地用接続導体
７：空隙
１６：切欠部 1: Container 1b: Placement part 2: Side wall part 2b: Through hole 2c: Recess 2d: Storage part 2e: Opening (of storage part) 3b: Connection conductor (center conductor)
3c: Insulator 4: Lid 5: Electronic component 6: Circuit board 6a: Line conductor 6b: Same surface ground conductor 6c: Lower surface ground conductor 6d: Ground connection conductor 7: Air gap 16: Notch

Claims (12)

上側主面に電子部品を収納する収納部の開口を有するとともに、前記収納部を囲繞する側壁部に前記収納部に通じる貫通孔を有する金属製の容器と、
前記貫通孔の内周に沿って設けられた絶縁体を介して、前記貫通孔に挿通された接続導体と、
前記収納部に配されるとともに、前記接続導体と電気的に接続する線路導体が設けられた一方主面と、他方主面とを有する回路基板と、
前記回路基板を前記他方主面で支持するとともに、前記他方主面の周囲よりも内側の領域に凹部が設けられ、且つ、前記容器と電気的に接続された載置部と、
を具備していることを特徴とする電子部品収納用パッケージ。 A metal container having an opening of a storage unit for storing an electronic component on the upper main surface, and a through-hole communicating with the storage unit in a side wall surrounding the storage unit;
A connection conductor inserted through the through hole through an insulator provided along the inner periphery of the through hole;
A circuit board having one main surface provided with a line conductor electrically connected to the connection conductor, and the other main surface, disposed in the housing portion,
The circuit board is supported by the other main surface, a recess is provided in a region inside the periphery of the other main surface, and a mounting portion electrically connected to the container;
An electronic component storage package comprising: 前記回路基板の前記接続導体が接続される側の側面と前記側壁部の内面との間に空隙が設けられていることを特徴とする請求項１記載の電子部品収納用パッケージ。   The electronic component storage package according to claim 1, wherein a gap is provided between a side surface of the circuit board to which the connection conductor is connected and an inner surface of the side wall portion. 前記回路基板は、前記一方主面の前記線路導体の両側に等間隔を隔てて同一面接地導体が設けられたコプレーナ線路が形成されていることを特徴とする請求項１または請求項２記載の電子部品収納用パッケージ。   3. The circuit board according to claim 1, wherein a coplanar line is provided on the both sides of the line conductor on the one main surface, the coplanar line having the same surface ground conductor provided at equal intervals. Electronic component storage package. 前記凹部は前記回路基板の前記線路導体に対向する位置に設けられていることを特徴とする請求項３記載の電子部品収納用パッケージ。   4. The electronic component storage package according to claim 3, wherein the recess is provided at a position facing the line conductor of the circuit board. 前記載置部は、前記回路基板の前記接続導体が接続される側の縁と前記線路導体が延設される方向と平行な縁において前記回路基板と接していることを特徴とする請求項３または請求項４記載の電子部品収納用パッケージ。   The said mounting part is in contact with the said circuit board in the edge parallel to the edge where the said connection conductor of the said circuit board is connected, and the said line conductor are extended. Alternatively, the electronic component storage package according to claim 4. 前記回路基板の他方主面に、前記同一面接地導体と対向させて形成された下面接地導体が設けられるとともに、前記同一面接地導体と前記下面接地導体とを電気的に接続する接地用接続導体が設けられていることを特徴とする請求項３乃至請求項５のいずれかに記載の電子部品収納用パッケージ。   On the other main surface of the circuit board, a lower surface ground conductor formed to face the same surface ground conductor is provided, and a ground connection conductor for electrically connecting the same surface ground conductor and the lower surface ground conductor The electronic component storage package according to claim 3, wherein the electronic component storage package is provided. 前記接地用接続導体は、前記回路基板の前記線路導体が延設される方向と平行な側面に設けられた側面導体であることを特徴とする請求項６記載の電子部品収納用パッケージ。   7. The electronic component storage package according to claim 6, wherein the grounding connection conductor is a side conductor provided on a side surface parallel to a direction in which the line conductor of the circuit board extends. 前記回路基板の一方主面であって、前記線路導体と前記接続導体とが重なる部位の周囲に切欠部が設けられていることを特徴とする請求項１乃至請求項７のいずれかに記載の電子部品収納用パッケージ。   8. The cutout portion according to claim 1, wherein a notch portion is provided around one portion of the main surface of the circuit board where the line conductor and the connection conductor overlap each other. Electronic component storage package. 前記切欠部は、前記一方主面から前記他方主面にかけて広くなるように形成してなることを特徴とする請求項８に記載の電子部品収納用パッケージ。   9. The electronic component storage package according to claim 8, wherein the notch is formed so as to increase from the one main surface to the other main surface. 前記切欠部は、前記他方主面から前記一方主面にかけて広くなるように形成してなることを特徴とする請求項８に記載の電子部品収納用パッケージ。   9. The electronic component storage package according to claim 8, wherein the notch is formed so as to increase from the other main surface to the one main surface. 前記貫通孔は、前記側壁部に複数備えてなることを特徴とする請求項１乃至請求項１０に記載の電子部品収納用パッケージ。   11. The electronic component storage package according to claim 1, wherein a plurality of the through holes are provided in the side wall portion. 請求項１乃至請求項１１のいずれかに記載の電子部品収納用パッケージと、前記収納部に収容されるとともに前記線路導体の他端に電気的に接続された電子部品と、前記容器の上面の前記開口の周囲に前記開口を塞ぐように接合された蓋体とを具備していることを特徴とする電子装置。 An electronic component storage package according to any one of claims 1 to 11, an electronic component stored in the storage portion and electrically connected to the other end of the line conductor, and an upper surface of the container An electronic device comprising: a lid joined around the opening so as to close the opening.
JP2008082350A 2007-03-28 2008-03-27 Electronic component storage package and electronic device Expired - Fee Related JP4903738B2 (en)

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