JP5881521B2 - Microwave circuit connection structure and microwave module - Google Patents

Description

  One embodiment relates to a connection structure of a microwave circuit and a microwave module.

  Microwave components such as isolators, circulators, and microwave amplifiers are used by being connected to a microstrip line in a subunit such as a transmission / reception module (see, for example, Patent Document 1). Conventionally, a drop-in type microwave integrated circuit module is known (see, for example, Patent Document 2). A lead frame with a narrowed lead is known (see, for example, Patent Document 3).

JP 2004-153424 A Japanese Patent Laid-Open No. 06-29704 Japanese Patent Laid-Open No. 06-350003

  However, in the above-described prior art, the lead width of the lead extending from the microwave component to the microstrip line is equal to the width of the microstrip line, so that the fillet having sufficient bonding strength on the side surface of the lead when fixed by soldering Can not form. If the lead width is configured to be narrower than the width of the microstrip line, the lead width of the lead at the root of the microwave component is also reduced, and the high frequency performance of the microwave module is degraded.

  In order to solve such a problem, according to one embodiment, a ground conductor, a dielectric on the ground conductor, a microstrip line having a line conductor on the dielectric, and a lead soldered to the line conductor A lead having a lead base portion having a lead width equal to or wider than the conductor width of the piece and the line conductor, a fillet formed on the line conductor along the planar peripheral edge of the lead piece of the lead, and There is provided a microwave circuit connection structure comprising: a microwave component having a microwave circuit electrically connected to the lead base of the lead bonded and fixed by a fillet.

  According to another embodiment, a ground strip, a microstrip line having a dielectric on the ground conductor and a line conductor on the dielectric, a lead piece soldered to the line conductor, and the lead piece A lead having a lead base portion having a planar shape different from the planar shape of the lead, a fillet formed on the line conductor along a planar peripheral edge of the lead piece of the lead, and the lead joined and fixed by the fillet And a microwave component having a microwave circuit electrically connected to the lead base.

  According to another embodiment, the input side substrate having a ground conductor, a dielectric on the ground conductor, and a line conductor that forms a microstrip line together with the ground conductor and the dielectric, and the input side substrate An output-side board having another ground conductor, a dielectric on the ground conductor, and a line conductor that forms another microstrip line together with the ground conductor and the dielectric, and the output-side board and the input side A lead piece soldered to the line conductor on at least one side of the substrate, a lead having a lead base having a lead width equal to or wider than the conductor width of the line conductor, and the lead piece of the lead The fillet formed on the line conductor along the planar peripheral edge of the lead, and the lead of the lead bonded and fixed by the fillet A microwave component having a microwave circuit electrically connected to the part, the microwave modules with are provided.

  According to another embodiment, the input side substrate having a ground conductor, a dielectric on the ground conductor, and a line conductor that forms a microstrip line together with the ground conductor and the dielectric, and the input side substrate An output-side board having another ground conductor, a dielectric on the ground conductor, and a line conductor that forms another microstrip line together with the ground conductor and the dielectric, and the output-side board and the input side A lead piece soldered to the line conductor on at least one side of the substrate, a lead having a planar shape different from the planar shape of the lead piece, and a planar shape of the lead piece of the lead A fillet formed on the line conductor along the periphery of the lead and the lead base of the lead joined and fixed by the fillet A microwave component having a microwave circuit that is gas-connected, microwave modules with are provided.

(A) is a top view of the connection structure of the microwave circuit which concerns on 1st Embodiment, (b) is a longitudinal cross-sectional view of the connection structure. It is a figure which shows the example of a connection structure of the conventional microwave component. It is a figure which shows the example of a connection structure of the other conventional microwave components. It is a top view of the connection structure of the microwave circuit concerning the 1st modification of a 1st embodiment. It is a top view of the connection structure of the microwave circuit concerning the 2nd modification of a 1st embodiment. It is a plurality of top views showing a connection structure of a microwave circuit according to a second embodiment. It is a top view which shows the connection structure of the other microwave circuit which concerns on 2nd Embodiment. It is a top view which shows the connection structure of the microwave circuit which concerns on the modification of 2nd Embodiment.

  A microwave circuit connection structure and a microwave module according to an embodiment will be described below with reference to FIGS. In the drawings, the same portions are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
FIG. 1A is a top view of the connection structure of the microwave circuit according to the first embodiment. FIG.1 (b) is a longitudinal cross-sectional view along AB of the connection structure. In these drawings, the same reference numerals denote the same elements.

  The connection structure of the microwave circuit according to this embodiment includes a ground strip 11, a microstrip line 14 having a dielectric layer 12 (dielectric) on the ground conductor 11 and a line conductor 13 on the dielectric layer 12, and the microstrip line 14. A lead piece 15 soldered onto the line conductor 13 of the strip line 14 and a lead 17 having a lead base portion 16 having a lead width equivalent to the conductor width of the line conductor 13, and a planar shape of the lead piece 15 of the lead 17 are shown. A fillet 18 formed on the line conductor 13 along the periphery, and a microwave component 20 incorporating a microwave circuit 19 electrically connected to the lead base 16 of the lead 17 joined and fixed by the fillet 18. I have. The conductor width refers to the conductor width when the conductor pattern of the line conductor 13 is viewed in plan. In this connection structure, the lead 17 has a lead piece 15 and a lead base portion 16 having different planar shapes.

  The microwave module according to the present embodiment is a microwave amplifier module in which an input / output substrate is connected to the input / output terminal side of the amplifying element. The microwave module is provided on the plate 21 that is a conductive base. And an input side substrate 10 (substrate) having a line conductor 13 constituting the microstrip line 14. Further, the microwave module is disposed on the plate 21 so as to face the input side substrate 10, the component substrate 22 provided adjacent to the input side substrate 10, the ground conductor 23, and the dielectric on the ground conductor 23. An output-side substrate 27 (substrate) having a layer 24 (dielectric) and a line conductor 25 constituting another microstrip line 26 together with the ground conductor 23 and the dielectric layer 24 is provided. The ground conductor 23, the dielectric layer 24, and the line conductor 25 are disposed from the bottom to the top in this order.

  The microwave module has a lead 17 having a lead piece 15 and a lead base 16 and a lead width equivalent to the conductor width of the lead piece 28 and the line conductor 23 soldered to the line conductor 23 on the output side substrate 27 side. And a lead 30 having a lead base 29. Furthermore, the microwave module was electrically connected to the fillet 18, another fillet 31 formed on the line conductor 23 along the planar peripheral edge of the lead piece 28, and the lead base 16 and the lead base 29, respectively. And a microwave component 20 including a microwave circuit 19.

  The plate 21 is a part of a metal case. The ground conductor 11 of the microstrip line 14 and the ground conductor 23 of the microstrip line 26 are grounded on the plate 21. The plate 21 provides a common high-frequency ground on the input / output side for the microwave signal.

  The input side substrate 10 and the output side substrate 27 are dielectric substrates. The input side substrate 10 and the output side substrate 27 are stacked on the plate 21.

  The component substrate 22 is a derivative substrate. The component substrate 22 has a plurality of notches penetrating vertically through the dielectric base material, and fastening members such as screws 32 fasten the component substrate 22 on the plate 21 from these notches. Each screw 32 tightens the substrate surface at a symmetrical position across the microwave component 20 in the substrate width direction, and tightly contacts the back surface of the component substrate 22 and the main surface of the plate 21.

  In addition, the component substrate 22 has a recess 33 that is counterbored over the length of the substrate at the center in the substrate width direction. The substrate width direction refers to a direction orthogonal to the substrate length direction, which is the propagation direction of signal power, on the main surface. The recess 33 has a bottom that is lower than the height of the main surface of the component substrate 22. The dielectric base material is dug down to a predetermined depth, leaving the bottom portion by the bottom portion and opposing side walls standing from a pair of sides of the bottom portion, and the component substrate 22 forms a recess 33 in which the microwave component 20 is accommodated. . The height of the main surface of the component substrate 22 is the same as the height of each main surface of the input side substrate 10 and the output side substrate 27.

  The microstrip line 14 is generated by laminating a metal foil, a dielectric layer and another metal plating on the main surface of the input side substrate 10. The ground conductor 11 is a metal. The dielectric layer 12 is made of PTFE (polytetrafluoroethylene). The line conductor 13 is a strip conductor and is generated by etching using a photoresist. A line conductor 13 is patterned on the main surface of the dielectric layer 12 so as to propagate the signal power of the microwave signal.

  The microwave component 20 is a drop-in type high-frequency component housed in the recess 33 of the component substrate 22. The microwave component 20 includes a microwave circuit 19, an input / output terminal (not shown) of the microwave circuit 19, and an enclosure that covers the microwave circuit 19 and has an input / output terminal port. The microwave circuit 19 includes, for example, a field effect transistor (FET) as an amplifying element, a bias circuit that applies a bias voltage to the gate terminal of the FET, a matching circuit that matches the impedance of the input / output terminal to the input / output impedance of the FET, and a plurality of components. Have The envelope of the microwave component 20 forms an input terminal port and an output terminal port symmetrically with respect to the substrate length direction, and the input / output terminals of the microwave circuit 19 are the lead base portion 16 of the lead 17 and the lead base portion of the lead 30, respectively. 29 is fixedly connected.

  In a state where the microwave component 20 is housed in the recess 33, the height of the lead back surface of the lead 17 and the height of the conductor pattern surface of the line conductor 13 of the microstrip line 14 are the same. The height position is determined. The height refers to the height from the main surface of the plate 21. Similarly, in the case of the lead 30 side, the height of the concave portion 33 and the lead 30 is set so that the height of the lead back surface of the lead 30 is the same as the height of the conductor pattern surface of the line conductor 25 of the microstrip line 26 in the housed state. The position is decided.

  The lead 17 on the input side and the lead 30 on the output side are lead terminals or lead electrodes extending from the microwave component 20 to the outside of the component, and both have a plate-like or pad-like outer shape.

  The lead base 16 corresponds to a lead root portion close to the microwave component 20 or a lead-out portion from the microwave component 20. The lead base 16 is adjusted in length so that the dimension in the board length direction is longer than the gap (first gap) between the input board 10 and the component board 22. The lead base portion 16 is secured to such an extent that the portion of the lead 17 where the planar shape of the lead pattern changes projects to the microstrip line 14 side. The conductor width of the lead piece 15 is narrower than the conductor width of the line conductor 13. The term “narrow” means that the surface area on which the fillet 18 is formed on the line conductor 13 is narrow enough to be secured.

  The fillet 18 is a solder fillet, and has a cross section shaped like a mountain skirt when viewed in a plane orthogonal to the lead length direction. As shown in FIG. 1B, the fillet 18 includes a conductor pattern surface of the line conductor 13, a surface inclined downward from the soldering surface 34 along the lead length of the lead 17, and each side surface of the lead 17. Or the area | region enclosed by a front end surface is said. Each side surface of the lead 17 refers to one side surface of the lead piece 15 continuous to the back surface of the lead and the top surface of the lead, and the other side surface of the lead piece 15 facing the side surface. In the example shown in the figure, the fillet 18 is formed from the both side surfaces and the front end surface of the lead 17 in three directions facing each other. A soldering portion 35 composed of the fillet 18 and the soldering surface 34 fixes the lead 17 on the line conductor 13.

  The angle formed between the inclined surface of the fillet 18 and the soldering surface 34 and the angle formed between the inclined surface and the conductor pattern surface of the line conductor 13 are elements that determine the strength of soldering. It can be changed. These angles are determined by the solder material, the surface tension, the fillet height measured from the conductor pattern surface, the fillet length which is the distance from one side surface of the lead 17 to the inclined end point, and the like. Values such as angle and solder material can be determined by experiment, simulation or test, and various values can be selected.

  The lead base portion 29 of the output-side lead 30 corresponds to a lead root portion near the microwave component 20 or a lead-out portion from the microwave component 20. The length of the lead base 29 is adjusted so that the dimension in the board length direction is longer than the gap (second gap) between the output side board 27 and the component board 22. The dimensions of the lead base 29 are ensured to such an extent that the change portion of the lead pattern of the lead 30 in the planar shape projects to the microstrip line 26 side. The lead piece 28 has a planar shape different from the planar shape of the lead base 29. The lead piece 28 may have a conductor width narrower than the conductor width of the line conductor 25.

  The fillet 31 indicates a region surrounded by the conductor pattern surface of the line conductor 25, a surface inclined downward from the soldering surface along the lead length of the lead 30, and each side surface or tip surface of the lead 30. . As in the example of FIG. 1B, the fillet 31 is formed from the both side surfaces and the front end surface of the lead 30 in three directions facing each other. A soldering portion including the fillet 31 and a corresponding soldering surface fixes the lead 30 on the line conductor 25.

  The microstrip line 26 is generated by laminating a metal layer and a dielectric layer on the main surface of the output side substrate 27. The ground conductor 25 is a metal. PTFE is used for the dielectric layer 24. The line conductor 25 is generated by an etching process or the like. A line conductor 25 is patterned on the main surface of the dielectric layer 24 to propagate the signal power of the signal amplified by the microwave component 20.

  The microwave circuit connection structure and the microwave module according to the present embodiment having such a configuration are operated by being supplied with power. A measuring instrument such as a network analyzer is connected to the input / output side of the microwave module alone via a high-frequency cable. After the calibration correction of the high-frequency cable is performed, the measuring device inputs a test microwave signal, measures a signal amplified by the microwave module, and measures a high-frequency parameter.

  When the microwave module operates as an amplifier module, the microwave module is connected to a plurality of multistages via a plurality of other subunits and a microstrip line. The microwave module is connected to a subunit equipped with an antenna switch, a subunit equipped with a circulator, and the like to constitute a transmission / reception module. When the microwave module receives the microwave signal output from the preceding subunit from the input side substrate 10, the microwave component 20 amplifies the microwave signal and outputs it from the output side substrate 27.

  As described above, in the microwave module according to the present embodiment, the lead widths of the lead base portion 16 and the lead base portion 29 are formed to be equal to the line widths of the microstrip lines 14 and 26. The lead width of the lead 17 soldered onto the line conductor 13 is made thinner than the lead width at the lead base 16. The lead width of the lead 30 soldered onto the line conductor 25 is narrower than the lead width at the lead base 29. Thereby, a space on the conductor pattern surface is created between the conductor pattern surface of the line conductor 13 and the side surface of the lead 17, and a good fillet 18 having sufficient bonding strength can be formed. Since the lead width of the lead base portion 16 of the microwave component 20 can be increased, impedance mismatch between the microstrip line 14 and the lead 17 is reduced. The fillet 31 on the line conductor 25 side is the same as the fillet 18 example. The microwave module can improve high frequency performance.

  Further, the microwave module according to the present embodiment may increase the cross-sectional area of the lead 17, thereby increasing the maximum value of the allowable current of the lead 17 when the high power element is used. Increasing the cross-sectional area means that the lead 17 has a lead thickness upward from the conductor pattern surface of the corresponding line conductor 13, and the lead 30 has a lead thickness upward from the conductor pattern surface of the line conductor 25. . By using the leads 17 and 30 whose cross-sectional area on the surface perpendicular to the lead length direction is larger than the cross-sectional area of the lead 17 in the example of FIG. 1B, for example, the fillets 18 and 31 having sufficient joint strength are used. The formation area increases. For this reason, the bonding strength in the soldering portion 35 and the like is also increased. The reliability of the connection portion between the microstrip line 14 and the lead 17 can be improved. The cross-sectional area of the lead 30 may also be increased in the same manner as the lead 17 example.

  In general, when a thin wire or the like is used as a lead for connection between the microwave component 20 and the microstrip lines 14 and 30, the impedance at the connection portion increases, and the high-frequency performance is deteriorated due to impedance mismatch. In order to prevent this impedance mismatch, a lead having a lead width compared to the width of the microstrip line is used as a lead for connecting the microwave component. This is because the characteristic impedance of the microwave component viewed from the connection point is matched with the characteristic impedance of the microstrip line. An example of a conventional microwave component connection structure is shown in FIG.

  FIG. 2A is a top view of a conventional connection structure for microwave components, and FIG. 2B is a longitudinal sectional view taken along CDs of the connection structure. The above-described symbols represent the same or equivalent elements. The microwave components 20 are each provided with leads 52 on the input / output side. One lead 52 has a width equal to the line width of the microstrip line 14 or its line conductor 13 in order to reduce impedance mismatch. When the lead 52 is fixed by soldering, the fillet 53 is formed only at the end of the lead. The fillet 53 does not have a sufficient amount of solder. The lead end means a lead piece tip end portion on the side opposite to the lead base portion on the base side close to the microwave component 20 or an end face of the tip end portion. The fillet 53 having sufficient bonding strength is not formed on the lead side surface on either side. Conventionally, since a good fillet 53 cannot be formed, the soldering work at the time of assembling is made difficult, and there is a problem that the bonding strength at the soldering point is lowered and the reliability of the connection structure of the microwave circuit is deteriorated. Existing.

  On the other hand, if the lead width is narrower than the line width of the microstrip line 14, the lead width of the lead on the base side close to the microwave component 20 is also narrowed. Due to the impedance mismatch, the impedance at the connection point increases, and the high frequency performance of the microwave module deteriorates. FIG. 3 shows a connection structure example of another microwave component according to the conventional example.

  FIG. 3A is a top view of the connection structure, and FIG. 3B is a longitudinal sectional view along the CD of the connection structure. The above-described symbols represent the same or equivalent elements. FIG. 3 shows a lead 55 with a narrow lead width to form a soldered fillet 53. The term “thin” means that it is thinner than the lead width of the lead 52 in FIG. In the lead width of the thin lead 55 as shown in FIG. 3, as shown in the region 57, the lead base portion on the base side close to the microwave component 20 becomes thin. If the lead width is narrow, impedance mismatch occurs and high-frequency performance deteriorates. The impedance of the connection portion increases. Impedance mismatch results in reflection or loss of signal power. For example, high-frequency performance such as S parameters deteriorates. When the microwave module of the example of FIG. 3 includes a circuit for passing a large current such as a high-power element, there is a problem that the lead may be blown because the maximum allowable current of the circuit is insufficient.

  In the prior art, since the lead extending from the microwave component to the microstrip line has a width equivalent to the width of the microstrip line, when the lead is joined by soldering and fixed on the microstrip line, The soldering fillet is formed only at the end of the lead. A fillet having sufficient bonding strength is not formed on the side surface of the lead.

  In contrast, in the microwave circuit connection structure and the microwave module according to the first embodiment, the lead width of the lead base portion 16 on the microwave circuit 19 side can be provided to ensure high-frequency performance, and the lead on the opposite side. Since the lead width of the piece 15 is relatively narrower than the lead width of the lead base portion 16, the fillet 18 is easily formed. In the lead 17, the planar shape of the lead piece 15 is different from the planar shape of the lead base 16, and the lead width is widened at the boundary between the lead 17 and the microwave circuit 19, while the fillet 18 is formed in the soldered portion on the opposite side. It was easy to stick. Since the dimension in the substrate length direction of the lead base 16 has a dimension across the gap between the substrates, the high frequency performance of the signal propagating through the microstrip line 14 can be ensured. Since the lead pattern becomes narrower from the position where the lead base portion 16 straddles the gap to the tip of the lead, the soldering is good, a large allowable current can be flowed, and the strength can be provided. The lead 30 is the same as the lead 17 example.

  As described above, according to the microwave circuit connection structure and the microwave module according to the first embodiment, the connection portion between the microwave component 20 and the microstrip line 14 and the microwave component 20 and the microstrip line 29 are connected. The reliability and workability of the soldered portion can be improved without deteriorating the high-frequency performance at each of the connection locations. The performance of the microwave circuit can be improved.

(Modification of the first embodiment)
In the first embodiment, the lead width is equal to the line width of the line conductor 13 of the microstrip line 14, but the connection structure of the microwave circuit according to the embodiment uses the lead width of the lead base as a line. The conductor 13 may be wider than the line width.

  FIG. 4 is a top view of the connection structure of the microwave circuit according to the first modification of the first embodiment, and shows an enlarged portion of the lead 38 on the input side. The above described symbols represent the same elements. Hereinafter, unless otherwise specified, the connection structure and the microwave module according to this modification have the same configuration as the connection structure of the microwave circuit and the microwave module of FIG.

  The lead 38 in FIG. 4 is a lead for connecting the input side substrate 10 and the microwave component 20, and has a lead base 36 and a lead piece 37. The lead width W2 of the lead base portion 36 is wider than the line width W1 of the line conductor 13. The lead on the output side may have the same shape as the example of FIG. Only the lead width of one lead base on the output side on the input / output side may be wider than the line width of the line conductor.

  Also with the connection structure according to this modification, a space for soldering is created on the line pattern, and the fillet 18 having sufficient bonding strength can be formed. By increasing the lead width of the lead base 36, the maximum allowable current can be increased. The lead 38 may increase the lead cross-sectional area.

  FIG. 5 is a top view of a microwave circuit connection structure according to a second modification of the first embodiment, and shows an example of a microwave module in which an isolator 39 is mounted as a microwave component. The reference numerals described above represent the same elements, and unless otherwise specified, the connection structure and microwave module according to this modification have the same configuration as the connection structure and microwave module of the microwave circuit of FIG.

  The isolator 39 is a drop-in type microwave component, and includes a circuit board on which a conductive pattern (not shown) is formed, a magnetized ferrite element provided on the circuit board, and an input / output side 2 attached to the conductive pattern. And leads 40 and 41 of the book. The lead 40 has a lead base 42 and a lead piece 43. The lead base 42 of the lead 40 has a lead width equivalent to the conductor width of the line conductor 13, and the fillet 18 is formed on the line conductor 13 along the planar peripheral edge of the lead piece 43. The lead width of the lead base portion 42 may be formed wider than the conductor width of the line conductor 13. The lead 41 is the same as the lead 40 example.

  A circulator from which the terminating resistor of the isolator 39 is removed may be used as the microwave component.

(Second Embodiment)
FIGS. 6A to 6D and 7 are respectively a plurality of top views showing the connection structure of the microwave circuit according to the second embodiment. The above described symbols represent the same elements. Hereinafter, unless otherwise specified, the connection structure and the microwave module according to the second embodiment have the same configuration as the connection structure and the microwave module of the microwave circuit of FIG.

  Each of the leads 17A to 17E is a lead in which the planar shape of the lead base is different from the planar shape of the lead piece. In these figures, hatched portions represent good fillets 18 having sufficient joint strength. The lead 17A shown in FIG. 6A and the lead 17B shown in FIG. 6B have a planar shape in which a notch is formed in a part of the lead piece. A fillet 18 is formed at the periphery of each notch when either one side is notched as shown in FIG. 6A or when it is notched like a comb as shown in FIG. 6B. Has been. A fillet 18 having sufficient bonding strength is obtained.

  In the lead 17C shown in FIG. 6C, through holes 45 and 46 are formed in a region of the lead piece in plan view. Fillets 18 are formed on the peripheral edges of the through holes 45 and 46. In the lead 17D shown in FIG. 6D, an elliptical through hole 47 is formed in a region of the lead piece in plan view. A fillet 18 is also formed on the periphery of the through hole 47. The lead 17E shown in FIG. 7 has a notch 48 formed of a pair of rectangular cutouts along the substrate length direction and a cutout formed of a pair of rectangular cutouts along the substrate length direction in the area of the lead piece in plan view. Part 49 is formed, and the notches 48 and 49 are arranged symmetrically in the substrate width direction. Fillets 18 are also formed on the inner periphery of these four notches. A fillet 18 having sufficient bonding strength is obtained.

  A modification will be described. FIG. 8 is a top view showing a connection structure of a microwave circuit according to a modification of the second embodiment. In the lead 17F, the planar shape of the lead base is different from the planar shape of the lead piece. The lead base 16 of the lead 17 in FIG. 1 has the same lead width as the line width, whereas the lead base of the lead 17F in FIG. 7B is narrower than the line width of the line conductor 13.

  According to the connection structure according to the second embodiment and the modification thereof, the space for forming the fillet is provided in the soldering portion, and the same effect as in FIG. 1 can be obtained.

(Other)
In the above description, the input side substrate 10 is arranged on the signal input side, but needless to say, the input side substrate 10 may be on the signal output side. In the first embodiment, the microwave component 20 is an amplification element, but other high-frequency components such as a mixer, a phase shifter, or an antenna switch may be used.

  Although several embodiments have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... Input side board | substrate (board | substrate), 11 ... Ground conductor, 12 ... Dielectric layer (dielectric), 13 ... Line conductor, 14 ... Microstrip line, 15 ... Lead piece, 16 ... Lead base, 17, 17A-17F DESCRIPTION OF SYMBOLS ... Lead, 18 ... Fillet, 19 ... Microwave circuit, 20 ... Microwave component, 21 ... Plate, 22 ... Component substrate, 23 ... Ground conductor, 24 ... Dielectric layer (dielectric), 25 ... Line conductor, 26 ... Other microstrip line, 27 ... output side substrate, 28 ... lead piece, 29 ... lead base, 30 ... lead, 31 ... fillet, 32 ... screw, 33 ... concave, 34 ... soldering surface, 35 ... soldering portion, 36 ... Lead base, 37 ... Lead piece, 38 ... Lead, 39 ... Isolator (microwave component), 40, 41 ... Lead, 42 ... Lead base, 43 ... Lead piece, 45, 46, 47 ... Hole.

Claims (6)

A microstrip line having a ground conductor, a dielectric on the ground conductor and a line conductor on the dielectric; and
A lead piece soldered to the line conductor and a lead base having a lead width equal to or wider than the conductor width of the line conductor;
A fillet formed on the line conductor along the planar periphery of the lead piece of the lead;
A microwave component having a microwave circuit electrically connected to the lead base of the lead bonded and fixed by the fillet;
Microwave circuit connection structure with A microstrip line having a ground conductor, a dielectric on the ground conductor and a line conductor on the dielectric; and
A lead piece soldered to the line conductor, and a lead having a lead base having a planar shape different from the planar shape of the lead piece;
A fillet formed on the line conductor along the planar periphery of the lead piece of the lead;
A microwave component having a microwave circuit electrically connected to the lead base of the lead bonded and fixed by the fillet;
Microwave circuit connection structure with An input side substrate having a ground conductor, a dielectric on the ground conductor, and a line conductor that forms a microstrip line together with the ground conductor and the dielectric;
An output side substrate disposed opposite to the input side substrate and having another ground conductor, a dielectric on the ground conductor, and a line conductor constituting the other microstrip line together with the ground conductor and the dielectric;
A lead piece soldered to the line conductor on at least one of the output side substrate and the input side substrate, and a lead base having a lead width equal to or wider than the conductor width of the line conductor. When,
A fillet formed on the line conductor along a planar peripheral edge of the lead piece of the lead;
A microwave component having a microwave circuit electrically connected to the lead base of the lead bonded and fixed by the fillet;
Microwave module with An input side substrate having a ground conductor, a dielectric on the ground conductor, and a line conductor that forms a microstrip line together with the ground conductor and the dielectric;
An output side substrate disposed opposite to the input side substrate and having another ground conductor, a dielectric on the ground conductor, and a line conductor constituting the other microstrip line together with the ground conductor and the dielectric;
A lead piece soldered to the line conductor on at least one of the output side substrate and the input side substrate, and a lead having a planar shape different from the planar shape of the lead piece; and
A fillet formed on the line conductor along a planar peripheral edge of the lead piece of the lead;
A microwave component having a microwave circuit electrically connected to the lead base of the lead bonded and fixed by the fillet;
Microwave module with   The lead on at least one of the output side substrate and the input side substrate has a lead thickness upward from the conductor pattern surface of the corresponding line conductor on the input / output side, and the lead length direction of the lead The microwave module according to claim 3 or claim 4, wherein a cross-sectional area on a plane intersecting with each other is increased. Providing a first gap between the microwave component and the input-side substrate; providing a second gap between the microwave component and the output-side substrate;
The dimension of the lead base portion in the substrate length direction of the lead on at least one of the output side substrate and the input side substrate is made longer than the corresponding first gap or second gap. The microwave module according to claim 3 or 4.

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