TW202329768A - Wiring circuit board - Google Patents

Abstract

To provide a wiring circuit board excellent in reliability. A wiring circuit board 1 includes a base insulation layer 2, a metal support layer 3, and a conductor layer 4. The base insulation layer 2 continuously extends in a first direction and a second direction. The metal support layer 3 is arranged on one surface 21 in a thickness direction of the base insulation layer 2. The metal support layer 3 is provided with a first metal part 31, a second metal part 32, and a plurality of third metal parts 33. The second metal part 32 is separated from the first metal part 31 in a first direction. The plurality of third metal parts 33 are separated from each other in a second direction. The conductor layer 4 is arranged on another surface 22 in the thickness direction of a base insulation layer 2. The conductor layer 4 is provided with a plurality of first terminals 41, a second terminal 42, and a plurality of wirings 43. The base insulation layer 2 is provided with the slit 6. When projected in the thickness direction, the slit 6 is arranged between the plurality of third metal parts 33, and goes along the first direction between the first metal part 31 and the second metal part 32.

Description

Wiring circuit board

The present invention relates to a printed circuit board.

A printed circuit board is known that includes a plurality of wiring portions spaced apart from each other in the width direction (see, for example, Patent Document 1 below). Each of the plurality of wiring portions of the printed circuit board described in Patent Document 1 includes a metal layer, an insulating layer, and a wiring layer toward one side in the thickness direction. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Application No. 2019-212656

[Problem to be solved by the invention]

However, in the wiring portion of the printed circuit board described in Patent Document 1, when stress is applied to the insulating layer, the metal layers adjacent in the width direction tend to contact each other, and/or the wiring layers adjacent to the width direction tend to contact each other. . In this way, there is a problem that the reliability of electrical signal transmission is reduced due to the generation of metal powder and/or conductor powder due to contact.

The present invention provides a wiring circuit board excellent in reliability. [Technical means to solve the problem]

The present invention (1) includes a printed circuit board comprising: an insulating layer extending continuously in a first direction perpendicular to the thickness direction and in a second direction perpendicular to the thickness direction and the first direction; a metal support a layer disposed on one surface of the insulating layer in the thickness direction, and comprising a first metal portion, a second metal portion spaced apart from the first metal portion in the first direction, and a plurality of third metal portions, The third metal parts connect the first metal part and the second metal part, and are spaced from each other in the second direction; and a conductor layer, which is arranged on the other side of the insulating layer in the thickness direction, and A plurality of first terminals included in the first metal part when projected in the thickness direction, a plurality of second terminals included in the second metal part, and a plurality of wirings included in the third metal part Connecting each of the plurality of first terminals and each of the plurality of second terminals; and the insulating layer has a slit arranged in the plurality of third metal parts when projected in the thickness direction between the first metal part and the second metal part along the first direction.

In this printed circuit board, even if stress is applied to the insulating layer between the first metal part and the second metal part, the stress can be relieved by the slit, and it is possible to suppress the occurrence of damage caused by the contact between the plurality of third metal parts. The generation of metal powder, and the generation of conductor powder caused by the contact between adjacent wirings.

The present invention (2) includes the printed circuit board of (1), wherein the ratio of the length of the slit in the second direction to the length of the adjacent third metal parts in the second direction is 0.3 or less.

In this printed circuit board, since the above-mentioned ratio is 0.3 or less, the short circuit between the metal supporting layer and the conductor layer between adjacent third metal parts can be effectively suppressed.

The present invention (3) includes the printed circuit board of (1) or (2), wherein the length of the insulating layer from the third metal part to the slit in the second direction is longer than the length of the above-mentioned slit in the second direction. The length ratio of the slits is 3 or more.

In this printed circuit board, since the above-mentioned ratio is 3 or more, the short circuit between the metal support layer and the conductor layer via the slit can be effectively suppressed.

The present invention (4) includes the printed circuit board according to any one of (1) to (3), wherein the slit spans from the first metal portion or its vicinity to the second metal portion or its vicinity.

In this printed circuit board, the stress applied to the insulating layer from the first metal portion or its vicinity to the second metal portion or its vicinity can be sufficiently relaxed by the slit.

The present invention (5) includes the printed circuit board according to any one of (1) to (3), wherein a plurality of the slits are arranged at intervals in the first direction.

The present invention (6) includes the printed circuit board according to any one of (1) to (5), wherein the above-mentioned slit is a cutout.

In this printed circuit board, since the slits are cutouts, the configuration is simple.

The present invention (7) includes the printed circuit board according to any one of (1) to (6), wherein the insulating layer is further provided with a second slit, and the second slit is disposed on the closest one in the second direction. The side and/or the outer side of the third metal part arranged on the other side, and arranged between the first metal part and the second metal part, along the first direction.

In this printed circuit board, even if stress is applied to the insulating layer disposed on the outer side of the third metal part disposed on the most one side and/or the other side in the second direction, it can be relieved by the second slit. The stress.

Also, the slit and the second slit can relax the stress applied to the insulating layer across the second direction.

The present invention (8) includes the printed circuit board according to (7), wherein the second slit is a slit.

In this printed circuit board, since the second slit is a cutout, the configuration is simple. [Effect of Invention]

The printed circuit board of the present invention is excellent in reliability.

1. One embodiment of a printed circuit board One embodiment of the printed circuit board of the present invention will be described with reference to FIGS. 1 to 3 . As shown in FIG. 1 , the printed circuit board 1 extends in a first direction and a second direction. The first direction is perpendicular to the thickness direction. The second direction is perpendicular to the thickness direction and the first direction. The printed circuit board 1 has a generally rectangular shape in plan view that is long in the first direction. The printed circuit board 1 has one end portion 11 in the first direction, the other end portion 12 in the first direction, and an intermediate portion 13 . The other end portion 12 is spaced apart from the one end portion 11 in the first direction. The intermediate portion 13 is arranged between the one end portion 11 and the other end portion 12 in the first direction.

1.1 Layer composition of printed circuit board 1 As shown in FIGS. 2 and 3 , printed circuit board 1 includes insulating base layer 2 , metal support layer 3 , conductor layer 4 , and insulating cover layer 5 .

1.2 Base insulating layer 2 The insulating base layer 2 extends continuously in the first direction and the second direction. The insulating base layer 2 has the same planar shape as that of the printed circuit board 1 . The insulating base layer 2 has a substantially rectangular shape that is long in the first direction. The insulating base layer 2 is disposed across one end portion 11 , the other end portion 12 , and the middle portion 13 of the printed circuit board 1 . The insulating base layer 2 has one surface 21 and the other surface 22 in the thickness direction. The other surface 22 is spaced apart from the one surface 21 in the thickness direction.

The thickness of the insulating base layer 2 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 100 μm or less, preferably 50 μm or less. As a material of the insulating base layer 2, an insulating resin is mentioned, for example. Examples of the insulating resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

1.3 Metal support layer 3 The metal supporting layer 3 is disposed on one surface 21 of the insulating base layer 2 in the thickness direction. As shown in FIG. 1 , the metal support layer 3 is included in the base insulating layer 2 in plan view. The metal supporting layer 3 includes a first metal part 31 , a second metal part 32 , and a plurality of third metal parts 33 .

1.3.1 The first metal part 31 As shown in FIGS. 1 and 3 , the first metal portion 31 is arranged at one end of the metal support layer 3 in the first direction. The first metal portion 31 is arranged at one end portion 11 of the printed circuit board 1 . The first metal portion 31 is included in the insulating base layer 2 of the one end portion 11 . The first metal portion 31 extends in the second direction. In the present embodiment, the first metal portion 31 has a substantially rectangular shape in plan view. When projected in the thickness direction, the first metal portion 31 does not overlap both ends of the insulating base layer 2 in the second direction and one end in the first direction of the one end portion 11 .

1.3.2 Second metal part 32 The second metal portion 32 is arranged at the other end portion of the metal support layer 3 in the first direction. The second metal portion 32 is disposed on the other end portion 12 of the printed circuit board 1 . The second metal portion 32 is included in the insulating base layer 2 of the other end portion 12 . The second metal part 32 is spaced apart from the first metal part 31 in the first direction. The second metal portion 32 extends in the second direction. In the present embodiment, the second metal portion 32 has a substantially rectangular shape in plan view. When projected in the thickness direction, the second metal portion 32 does not overlap both ends of the insulating base layer 2 in the second direction and the other end edge in the first direction of the other end portion 12 .

1.3.3 A plurality of third metal parts 33 As shown in FIGS. 1 and 2 , the plurality of third metal portions 33 are arranged between the first metal portion 31 and the second metal portion 32 in the first direction. The plurality of third metal parts 33 are arranged in the middle part 13 of the printed circuit board 1 . The plurality of third metal portions 33 are included in the insulating base layer 2 of the intermediate portion 13 when projected in the thickness direction. The plurality of third metal parts 33 are spaced apart from each other in the second direction. Each of the plurality of third metal portions 33 extends along the first direction.

Each of the plurality of third metal parts 33 connects the first metal part 31 and the second metal part 32 . The plurality of (two in this embodiment) third metal portions 33 do not overlap with both end portions (both end regions) and the central portion of the insulating base layer 2 in the second direction of the intermediate portion 13 .

The length L4 in the second direction of each of the plurality of third metal portions 33 is shorter than the length L5 in the second direction of each of the first metal portion 31 and the second metal portion 32 . Specifically, the ratio (L4/L5) of the length L4 in the second direction of each of the plurality of third metal parts 33 to the length L5 in the second direction of each of the first metal part 31 and the second metal part 32 is, for example, It is 0.7 or less, preferably 0.5 or less, more preferably 0.2 or less, still more preferably 0.1 or less, and, for example, 0.001 or more.

The length L1 between the third metal portions 33 adjacent in the second direction is, for example, 10 μm or more, preferably 30 μm or more, more preferably 50 μm or more, and, for example, 1000 μm or less.

The ratio (L1/L4) of the length L1 between the adjacent third metal portions 33 in the second direction to the length L4 in the second direction of each of the plurality of third metal portions 33 is, for example, 0.1 or more, preferably 0.5 or more , and, for example, 100 or less, preferably 50 or less.

The length L6 of each of the plurality of third metal parts 33 in the first direction is longer than the length L7 of each of the first metal part 31 and the second metal part 32 . Specifically, the ratio (L6/L7) of the length L6 in the first direction of each of the plurality of third metal portions 33 to the length L7 in the first direction of each of the first metal portion 31 and the second metal portion 32 is, for example, It is 2 or more, preferably 5 or more, more preferably 10 or more, still more preferably 100 or more, particularly preferably 1,000 or more, and, for example, 100,000 or less.

The thickness of the metal support layer 3 is, for example, 30 μm or more, preferably 50 μm or more, preferably 75 μm or more, more preferably 100 μm or more. In addition, the thickness of the metal support layer 3 is, for example, less than 1000 μm, preferably less than 500 μm.

The material of the metal support layer 3 is metal. Examples of metals include metal elements classified into Groups 1 to 16 in the Periodic Table (IUPAC, 2018), and alloys containing two or more of these metal elements. Furthermore, the metal may be any one of transition metals and typical metals. More specifically, the metals include Group 2 metal elements, Group 4 metal elements, Group 5 metal elements, Group 6 metal elements, Group 7 metal elements, Group 8 metal elements, and Group 9 metal elements. elements, group 10 metal elements, group 11 metal elements, group 12 metal elements, group 13 metal elements, and group 14 metal elements. Calcium is mentioned as a Group 2 metal element, for example. Examples of the Group 4 metal elements include titanium and zirconium. Examples of the Group 5 metal element include vanadium. Examples of Group 6 metal elements include chromium, molybdenum, and tungsten. As a Group 7 metal element, manganese is mentioned, for example. As a group 8 metal element, iron is mentioned, for example. Cobalt is mentioned as a Group 9 metal element, for example. Examples of Group 10 metal elements include nickel and platinum. Examples of Group 11 metal elements include copper, silver, and gold. As a group 12 metal element, zinc is mentioned, for example. Examples of Group 13 metal elements include aluminum and gallium. Examples of Group 14 metal elements include germanium and tin. These can be used alone or in combination. As the metal, preferably Group 11 metal elements are used, and copper and copper alloys are more preferably used.

1.4 Conductor layer 4 As shown in FIGS. 2 and 3 , the conductive layer 4 is arranged on the other surface 22 in the thickness direction of the insulating base layer 2 . As shown in FIG. 1 , the conductor layer 4 includes a plurality of first terminals 41 , a plurality of second terminals 42 , and a plurality of wirings 43 .

1.4.1 Multiple first terminals 41 As shown in FIGS. 1 and 3 , the plurality of first terminals 41 are included in the first metal portion 31 when projected in the thickness direction. The plurality of first terminals 41 are included in one end portion 11 of the printed circuit board 1 . In this embodiment, the plurality of first terminals 41 are spaced apart from each other in the second direction. The plurality of first terminals 41 have, for example, a substantially rectangular shape (square disk shape) in plan view.

1.4.2 A plurality of second terminals 42 The plurality of second terminals 42 are included in the second metal portion 32 when projected in the thickness direction. A plurality of second terminals 42 are included in the other end portion 12 of the printed circuit board 1 . In this embodiment, the plurality of second terminals 42 are spaced apart from each other in the second direction. Each of the plurality of second terminals 42 has, for example, a substantially rectangular shape (square disk shape) in plan view.

1.4.3 Plural wiring 43 As shown in FIGS. 1 and 2 , each of the plurality of wirings 43 is included in each of the plurality of third metal portions 33 in plan view. A plurality of wires 43 are arranged in the middle portion 13 of the printed circuit board 1 . Each of the plurality of wiring lines 43 connects each of the plurality of first terminals 41 and each of the plurality of second terminals 42 . The plurality of wirings 43 are spaced apart in the second direction. Each of the plurality of wirings 43 extends in the first direction.

The thickness of the conductive layer 4 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

As a material of the conductor layer 4, a conductor is mentioned. Examples of the conductor include alloys of copper, silver, gold, iron, aluminum, chromium, and the like. Copper is preferable from the viewpoint of obtaining favorable electrical characteristics.

1.5 Covering insulating layer 5 As shown in FIG. 2 , the insulating cover layer 5 is disposed on the other surface 22 in the thickness direction of the insulating base layer 2 . The insulating cover layer 5 covers the wiring 43 . In the present embodiment, a plurality of insulating cover layers 5 are provided corresponding to a plurality of wiring lines 43 . A plurality of first terminals 41 and a plurality of second terminals 42 are exposed in the insulating cover layer 5 . The thickness of the insulating cover layer 5 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 100 μm or less, preferably 50 μm or less. As a material of the covering insulating layer 5, an insulating resin is mentioned, for example. Examples of the insulating resin include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Moreover, the insulating resin contains a solder resist.

1.6 slit 6 As shown in FIGS. 1 and 2 , the insulating base layer 2 includes slits 6 . The slit 6 is disposed in the middle portion 13 of the printed circuit board 1 . Furthermore, the slit 6 is arranged between the plurality of third metal portions 33 when projected in the thickness direction. The slit 6 is along the first direction between the first metal part 31 and the second metal part 32 . In this embodiment, the slit 6 spans from the first metal part 31 to the second metal part 32 . The slit 6 is continuous in the first direction. In this embodiment, the slit 6 is a cutout. The slit 6 penetrates the insulating base layer 2 in the thickness direction.

The ratio (L2/L1) of the length L2 of the slit 6 in the second direction to the length L1 of the adjacent third metal portions 33 in the second direction is, for example, 0.3 or less, preferably 0.2 or less, more preferably 0.1 or less, more preferably 0.05 or less, and, for example, 0.0001 or more, preferably 0.001 or more. When the above ratio (L2/L1) is not more than the above upper limit, the short circuit between the metal support layer 3 and the conductor layer 4 between the adjacent third metal parts 33 can be effectively suppressed. The stress applied to the insulating base layer 2 can be relaxed as the said ratio (L2/L1) is more than the said minimum. Specifically, the length L2 of the slit 6 in the second direction is, for example, 1000 μm or less, preferably 500 μm or less, more preferably 100 μm or less, further preferably 30 μm or less, most preferably 10 μm or less, and , for example, not less than 0.1 μm, preferably not less than 1 μm.

The ratio (L2/L3) of the length L2 of the slit 6 in the second direction to the length L3 of the insulating base layer 2 from the third metal portion 33 to the slit 6 in the second direction is, for example, 0.3 or less, preferably 0.3 or less. 0.2 or less, more preferably 0.1 or less, still more preferably 0.05 or less, and, for example, 0.0001 or more, preferably 0.001 or more.

When the above-mentioned ratio is below the above-mentioned upper limit, the short circuit between the metal support layer 3 and the conductor layer 4 through the slit 6 can be effectively suppressed. The stress applied to the insulating base layer 2 can be relaxed as the said ratio is more than the said minimum. The length L3 of the base insulating layer 2 from the third metal portion 33 to the slit 6 in the second direction is, for example, 5000 μm or less, preferably 1000 μm or less, more preferably 500 μm or less, and even more preferably 200 μm or less , particularly preferably 100 μm or less, and, for example, 1 μm or more, preferably 10 μm or more.

2. Manufacturing method of printed circuit board 1 A method of manufacturing the printed circuit board 1 will be described with reference to FIGS. 4A to 4D . The method of manufacturing the printed circuit board 1 includes a first step, a second step, a third step, and a fourth step.

2.1 Step 1 As shown in FIG. 4A, in the first step, the circuit build-up material 20 is prepared. The circuit build-up material 20 includes an insulating base layer 2 , a conductive layer 4 , and an insulating cover layer 5 in this order toward the other side in the thickness direction.

In order to prepare the circuit build-up material 20, first, for example, a two-layer base material (not shown) having the insulating base layer 2 and the conductor plate (not shown) sequentially in the thickness direction is prepared. Next, for example, a subtractive method is used to form a double-layer conductor plate on the conductor layer 4 , and then, a covering insulating layer 5 is formed.

2.2 Step 2 As shown in FIG. 4B , a metal plate 23 is disposed on one surface 21 of the insulating base layer 2 of the circuit build-up material 20 . The metal plate 23 is the metal support layer 3 before the shape processing. The metal plate 23 extends continuously in the first direction and the second direction. For example, the metal plate 23 is attached to one side 21 through an adhesive layer not shown. Also, the metal plate 23 may be laminated on one surface 21 without using an adhesive layer.

2.3 Step 3 As shown in FIG. 4C , the metal plate 23 is contoured. As the outer shape processing, etching is mentioned, for example. Thereby, the metal support layer 3 provided with the 1st metal part 31 (refer FIG. 1), the 2nd metal part 32 (refer to FIG. 1), and the several 3rd metal part 33 was formed. One surface 21 of the base insulating layer 2 in the thickness direction between the plurality of third metal parts 33, and the base insulating layer outside the third metal part 33 arranged on the most one side and the other side in the second direction One surface 21 in the thickness direction of 2 is exposed on one side in the thickness direction. Furthermore, in this embodiment, the other surface 22 of the insulating base layer 2 in the thickness direction between the plurality of third metal parts 33 and the third metal parts arranged on the most one side and the other side in the second direction The other side 22 of the insulating base layer 2 in the thickness direction outside the metal portion 33 is exposed on the other side in the thickness direction.

2.4 Step 4 As shown in FIG. 4D , in the fourth step, slits 6 are formed in the insulating base layer 2 . As a method of forming the slit 6 , for example, laser processing and cutting processing with a knife are mentioned. Thereby, the printed circuit board 1 is manufactured.

3. Effects of an implementation mode In this printed circuit board 1, even if stress is applied to the insulating base layer 2 between the plurality of third metal portions 33, the stress can be relieved by the slit 6, and the damage caused by the contact between the plurality of third metal portions 33 can be suppressed. The resulting generation of metal powder, and the generation of conductor powder due to the contact of adjacent wirings 43 with each other.

In this printed circuit board 1 , the stress applied to the base insulating layer 2 from the first metal portion 31 to the second metal portion 32 can be sufficiently relieved by the slit 6 .

In this printed circuit board 1, since the slit 6 is a cutout, the configuration is simple.

4. Variation example In each of the following variations, the same components and steps as those in the above-mentioned first embodiment are assigned the same reference numerals, and detailed descriptions thereof are omitted. In addition, each modified example can exhibit the same operation and effect as that of the first embodiment, unless otherwise specified. Furthermore, an appropriate combination of one embodiment and modified examples is possible.

As shown in FIG. 5 , in this modification example, the slit 6 spans from the vicinity of the first metal portion 31 (the first vicinity portion 311 ) to the vicinity of the second metal portion 32 (the second vicinity portion 321 ).

The first vicinity portion 311 includes 10%, preferably 5%, and more preferably 1% of the distance towards the other side (and one side, the shape of one side is not shown).

The second near portion 321 includes 10%, preferably 5%, and more preferably 1% of the distance towards one side (and the other side, the shape of the other side is not shown).

Although not shown, the slit 6 may span from the first near portion 311 to the second metal portion 32 . The slit 6 can also span from the first metal part 31 to the second nearby part 321 .

As shown in FIG. 6 , a plurality of slits 6 are arranged at intervals in the first direction. The interval L8 between the adjacent slits 6 in the first direction is, for example, 10000 μm or less, preferably 1000 μm or less, more preferably 500 μm or less, and, for example, 10 μm or more.

The length L9 of each of the plurality of slits 6 in the first direction is, for example, 10000 μm or less, preferably 1000 μm or less, more preferably 500 μm or less, and, for example, 10 μm or more. The ratio (L9/L8) of the length L9 in the first direction of each of the plurality of slits 6 to the interval L8 between the adjacent slits 6 in the first direction is, for example, 1 or more, preferably 2 or more, and, for example, 100 or less, preferably 10 or less.

As shown in FIG. 7 , the insulating base layer 2 further includes a second slit 7 in addition to the above-mentioned slit 6 . The second slit 7 is a cutout. In the present embodiment, the second slit 7 includes the one-side second slit 7A and the other-side second slit 7B.

The one-side second slit 7A is arranged on one side (outer side) of the third metal portion 33 arranged on the most side in the second direction.

The second slit 7B on the other side is arranged on the other side (outer side) of the third metal portion 33 arranged on the other side most in the second direction. The other second slit 7B is arranged on the opposite side to the one second slit 7A with respect to the slit 6 .

According to this modified example, even if stress is applied to the base insulating layer 2 arranged outside the third metal portion 33 arranged on the most one side and/or the other side in the second direction, the second slit can 7A, 7B to ease the stress.

Also, the slit 6 and the second slits 7A and 7B can relax the stress applied to the insulating base layer 2 across the second direction.

Also, in this modified example, since the second slit 7 is a cutout, the configuration is simple.

As shown in FIG. 8 , the insulating cover layer 5 may also have a slit 6 . The insulating cover layer 5 collectively covers the plurality of wirings 43 . The insulating cover layer 5 is in contact with the other surface 22 of the insulating base layer 2 between the plurality of wirings 43 .

In addition, the above-mentioned invention is provided as an exemplary embodiment of the present invention, but it is only an illustration and should not be interpreted limitedly. Variations of the present invention that are clear to those in the technical field are included in the scope of the following claims.

1: Wiring circuit board 2: base insulating layer 3: Metal support layer 4: Conductor layer 6: Slit 7: The second slit 11: One end 12: the other end 13: middle part 21: one side 22: The other side 31: 1st metal department 32: The second metal part 33: 3rd metal part 41: 1st terminal 42: 2nd terminal 43: Wiring 311: Part 1 around 321: Part 2 Nearby L1: Length between adjacent third metal parts in the second direction L2: The length of the slit in the second direction L3: The length of the base insulating layer from the third metal part to the slit in the second direction L4: The length of each of the third metal parts in the second direction L5: The length of each of the second metal parts in the second direction L6: The length of each of the third metal parts in the first direction L7: The length of each of the second metal parts in the first direction

Fig. 1 is a bottom view of an embodiment of a printed circuit board of the present invention. Fig. 2 is a cross-sectional view along line A-A of the wiring circuit board shown in Fig. 1 . Fig. 3 is a B-B sectional view of the wiring circuit board shown in Fig. 1 . 4A to 4D are diagrams of manufacturing steps of the wiring circuit board shown in FIG. 2 . Figure 4A is the first step. Figure 4B is the second step. Figure 4C is the third step. Figure 4D is the fourth step. Fig. 5 is a bottom view of a wiring circuit board according to a modification. Fig. 6 is a bottom view of a wiring circuit board according to a modification. Fig. 7 is a bottom view of a wiring circuit board according to a modification. Fig. 8 is a cross-sectional view of a wiring circuit board according to a modification.

1: Wiring circuit board

2: base insulating layer

3: Metal support layer

4: Conductor layer

6: Slit

11: One end

12: the other end

13: middle part

31: 1st metal department

32: The second metal part

33: 3rd metal department

41: 1st terminal

42: 2nd terminal

43: Wiring

L1: Length between adjacent third metal parts in the second direction

L2: The length of the slit in the second direction

L3: The length of the base insulating layer from the third metal part to the slit in the second direction

L4: The length of each of the third metal parts in the second direction

L5: The length of each of the second metal parts in the second direction

L6: The length of each of the third metal parts in the first direction

L7: The length of each of the second metal parts in the first direction

Claims (8)

A wiring circuit board comprising: an insulating layer extending continuously in a first direction perpendicular to the thickness direction and in a second direction perpendicular to the thickness direction and the first direction; A metal support layer disposed on one surface of the insulating layer in the thickness direction, and comprising a first metal portion, a second metal portion spaced apart from the first metal portion in the first direction, and a plurality of third metal portions , the third metal parts connect the first metal part and the second metal part, and are separated from each other in the second direction; and A conductor layer disposed on the other surface of the insulating layer in the thickness direction, and having a plurality of first terminals included in the first metal part and a plurality of terminals included in the second metal part when projected along the thickness direction. a second terminal, and a plurality of wirings, which are included in the third metal part and connect each of the plurality of the first terminals and each of the plurality of the second terminals; and The insulating layer includes a slit disposed between the plurality of third metal parts when projected in the thickness direction, and extending along the first direction between the first metal part and the second metal part. . The printed circuit board according to claim 1, wherein the ratio of the length of the slit in the second direction to the length of the adjacent third metal parts in the second direction is 0.3 or less. The printed circuit board according to claim 1 or 2, wherein the ratio of the length of the insulating layer from the third metal portion to the slit in the second direction to the length of the slit in the second direction is: 3 or more. The printed circuit board according to claim 3, wherein the slit spans from the first metal portion or its vicinity to the second metal portion or its vicinity. The printed circuit board according to claim 3, wherein a plurality of said slits are spaced apart from each other in said first direction. The printed circuit board according to claim 3, wherein the above-mentioned slits are cutouts. The printed circuit board according to claim 3, wherein the insulating layer is further provided with a second slit, and the second slit is arranged on the first side arranged on the most side and/or on the other side in the second direction. 3 outside the metal part, and disposed between the first metal part and the second metal part, along the first direction. The printed circuit board according to claim 7, wherein the second slit is a cutout.