CN205452049U - Low ceramic capacitor of ESR value multicore group - Google Patents
Low ceramic capacitor of ESR value multicore group Download PDFInfo
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- CN205452049U CN205452049U CN201521123070.2U CN201521123070U CN205452049U CN 205452049 U CN205452049 U CN 205452049U CN 201521123070 U CN201521123070 U CN 201521123070U CN 205452049 U CN205452049 U CN 205452049U
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Abstract
The utility model discloses a low ceramic capacitor of ESR value multicore group. Low ceramic capacitor of ESR value multicore group include by the monomer pile up the multicore assembly that forms, connect the multicore assembly the lead wire, seal the epoxy encapsulated layer on multicore assembly surface, the multicore assembly includes the inner electrode, the multicore assembly adopts with the lead wire and takes graetz connection, the inner electrode of assembly and the last surface parallel of lead wire. The multicore assembly adopts with the lead wire and takes graetz connection, and the one side and the multicore assembly of lead wire are connected in the back wraps with epoxy, and the another side of lead wire exposes outside so that be connected with pad on the circuit board. The effectual distance of positive pole to the electric return circuit of negative pole that has shortened of this kind of connected mode to greatly reduced the ceramic capacitor's of multicore group ESR value and ESL value.
Description
Technical field
This utility model relates to capacitor manufacturing technology field.
Background technology
Although current existing multicore compound ceramic capacitor increases capacity, but ESR value is higher makes this ceramic capacitor with multiple core assemblies be very restricted in application, it is impossible in the circuit of upper frequency.Existing ceramic capacitor with multiple core assemblies is the most multiple without encapsulating multiple-layer sheet ceramic capacitor increase capacity.Existing technology is long due to lead-in wire, the ESR value of the narrow and thin ceramic capacitor with multiple core assemblies that prior art is developed that goes between is higher.
In prior art, the Chinese invention patent application of Application No. 201310304871.8 discloses a kind of ceramic capacitor with multiple core assemblies and preparation method thereof, ceramic capacitor with multiple core assemblies includes multicore assembly, lead frame, multicore assembly is connected with lead frame, periphery is enclosed with epoxy resin enclosed layer, multicore assembly is formed by connecting as the multiple-layer sheet ceramic capacitor parallel stack of monomer by two or more than two, elargol is used to be connected between the metal end of adjacent monomer, insulation silica gel is used to be connected between the ceramic body of adjacent monomer, in multicore assembly, electrode plane is mutually perpendicular to the pin plane of lead frame.The manufacture method of ceramic capacitor with multiple core assemblies includes that the stacked combination of multiple single body, assembly are connected with lead frame, die forming encapsulates.Above prior art, in terms of effectively reducing the ESR value of ceramic capacitor with multiple core assemblies, is further improved.
Utility model content
For the defect that the equivalent series resistance ESR value of existing multicore compound ceramic capacitor is higher, this utility model provides the low ESR value ceramic capacitor with multiple core assemblies of a kind of ESR value that can effectively reduce ceramic capacitor with multiple core assemblies.
This utility model is by the following technical solutions: a kind of low ESR value ceramic capacitor with multiple core assemblies, the lead-in wire that including the multicore assembly stacked by monomer, connects multicore assembly, the epoxy resin enclosed layer being encapsulated on multicore assembly outer surface；Multicore assembly includes that interior electrode, described multicore assembly use bridging type to be connected with lead-in wire, and the interior electrode of assembly is parallel with the upper surface of lead-in wire.
Described multicore assembly includes that metal terminal, lead-in wire connect metal terminal, and the one side of lead-in wire is wrapped up by epoxy resin after being connected with the metal terminal of multicore assembly, and the another side of lead-in wire is exposed outside.
Described monomer is multiple-layer sheet ceramic capacitor.
Described monomer includes metal terminal, and the metal terminal of adjacent monomer is connected by high temperature resistant high conductivity leypewter.
Described lead-in wire is two, two lead-in wire composition lead frames；Multicore assembly is connected with lead frame by silver paste, multicore assembly with the connected mode of lead frame is: one end of multicore assembly is connected with a piece of lead-in wire of lead frame, the other end of multicore assembly goes between with another sheet of lead frame and is connected, and the two ends of multicore assembly are in same level with two junction points of the two panels lead-in wire of lead frame.
Lead frame uses the tin plating lead material of copper, and every a piece of lead-in wire is equipped with one piece of connection sheet being perpendicular to lead-in wire.
The manufacture method of a kind of low ESR value ceramic capacitor with multiple core assemblies, first becomes multicore assembly by monomer parallel stack, then after being connected with lead frame by multicore assembly, uses epoxy encapsulation multicore assembly.
The manufacture method of described low ESR value ceramic capacitor with multiple core assemblies, specifically includes following steps:
A, making multicore assembly: using multiple-layer sheet ceramic capacitor as monomer, according to required capacity requirement, multiple monomers employing insulating cement material is connected, re-uses high temperature resistant high conductivity leypewter and the metal terminal of each monomer is connected, form multicore assembly；
B, connection multicore assembly and lead frame: use high temperature resistant high conductivity leypewter to be connected multicore assembly and lead frame, use bridging type to be connected with lead-in wire multicore assembly；One end of multicore assembly is connected with a piece of lead-in wire, and the other end of multicore assembly is connected with another sheet lead-in wire, and the two ends of multicore assembly are same level with the plane residing for junction point of two panels lead-in wire；Lead-in wire uses the tin plating lead material of copper, and every a piece of lead-in wire is all provided with one piece of connection sheet being perpendicular to lead-in wire；
C, package multi assembly: use injection mold and former, wrap up one layer of epoxy resin in multicore assembly periphery, makes the one side of lead-in wire be positioned at inside the plastic-sealed body of epoxy resin parcel, and another side is exposed.
The leypewter of high temperature resistant high conductivity is used to connect and compose multicore assembly between monomer of the present utility model and monomer, multicore assembly uses bridging type to be connected with lead-in wire, the interior electrode of multicore assembly is parallel with the plane at lead-in wire place, increase the width of lead-in wire and thickness simultaneously and use the copper of tin plating lead to go between, and lead-in wire one side be connected with multicore assembly after use epoxy resin bag, the another side of lead-in wire is exposed outside to be connected with the pad on circuit board.This connected mode effectively shortens the positive pole distance to the electric loop of negative pole, thus greatly reduces ESR value and the ESL value of ceramic capacitor with multiple core assemblies.
Low ESR value ceramic capacitor with multiple core assemblies in this utility model, lead-in wire is possible not only to multiple ceramic capacitor monomer in parallel makes ceramic capacitor with multiple core assemblies capacity increase, and make the ceramic capacitor ESR value after combination lower by improvement material and design innovation, the multicore compound ceramic capacitor of this low ESR high power capacity value can substitute alminium electrolytic condenser and tantalum electrochemical capacitor, can be applicable to more field.The frequency used along with circuit is more and more higher, the capacity required is increasing, the ceramic capacitor with multiple core assemblies usage amount of this low ESR incrementally increases, along with this low ESR ceramic capacitor with multiple core assemblies is progressively pushed to the market, market demand can increase with the growth rate of 50% every year, is greatly improved economic benefit.The multicore compound ceramic capacitor simultaneously producing this low ESR high power capacity value can be that society provides a large amount of jobs, it will creates huge social benefit.
Accompanying drawing explanation
Fig. 1 is the structural representation of assembly after parallel stack.
Fig. 2 is lead frame schematic diagram of the present utility model.
Fig. 3 is the schematic diagram that multicore assembly is connected with lead-in wire.
Fig. 4 is the structural representation of low ESR value ceramic capacitor with multiple core assemblies.
Wherein: 1, multiple-layer sheet ceramic capacitor (monomer)；2, lead-in wire；3, epoxy resin enclosed layer.
Detailed description of the invention
In order to be better understood from the technical program, with specific embodiment, this utility model is further described below in conjunction with the accompanying drawings.
Fig. 1, Fig. 2, Fig. 3 and Fig. 4 give a specific embodiment of the present utility model.As can be seen from Figure 4, involved by this utility model is a kind of low ESR value ceramic capacitor with multiple core assemblies, including the multiple-layer sheet ceramic capacitor (monomer) 1 for stacking, for drawing the lead-in wire 2 of assembly metal terminal, for encapsulating the epoxy resin enclosed layer 3 that multicore assembly is connected with lead-in wire.The multicore assembly of low ESR value ceramic capacitor with multiple core assemblies uses bridging type to be connected with lead-in wire, and the interior electrode of multicore assembly is parallel with the plane at lead-in wire place, and makes the one side of lead-in wire be exposed with the plastic-sealed body after epoxy resin bag.This connected mode effectively shortens the positive pole distance to the electric loop of negative pole, thus greatly reduces ESR value and the ESL value of ceramic capacitor with multiple core assemblies.
The processing technology of low ESR value multicore group ceramic condenser include the parallel stack of assembly, assembly and lead frame connection, connect after the encapsulation of assembly.Specifically include following manufacturing process steps:
1, using multiple-layer sheet ceramic capacitor as monomer pellet (i.e. monomer), one or more monomer pellets are selected according to different Capacity design, first by high-temperature insulation glue material, monomer is connected with monomer, re-use high temperature resistant high conductivity leypewter material the metal end of each monomer to be connected, form multicore assembly.
2, by using the silver paste of high temperature resistant high conductivity to be connected with specially designed lead frame by multicore assembly.Multicore assembly is that one end of assembly is connected with a piece of lead-in wire of lead frame with the connected mode of lead frame, the other end of assembly goes between with another sheet of lead frame and is connected, the plane residing for junction point of the two panels lead-in wire of the two ends of assembly and lead frame and plane-parallel.The design of lead frame is to use the tin plating lead material of copper, and every a piece of lead-in wire all has one piece of connection sheet being perpendicular to lead-in wire.
3, use injection mold and former, certain thickness epoxy resin layer is wrapped up in multicore assembly periphery.The one side of lead-in wire is inside the plastic-sealed body that epoxy resin wraps up, and the another side of lead-in wire is exposed to be connected with the pad of circuit board.
This utility model is the preparation method of a kind of low ESR value ceramic capacitor with multiple core assemblies, it is intended to while improving ceramic capacitor content volume ratio, reduces the ESR value of ceramic capacitor by optimizing design.This utility model makes capacity increase by using high temperature resistant high conductivity leypewter to connect in parallel or series multiple multiple-layer sheet ceramic capacitors without encapsulating, and by improving the lead-out mode of terminal, employing bridging type is drawn, shorten wire length, increase width and the thickness of lead-in wire, the copper simultaneously using tin plating lead goes between, and the one side gone between is wrapped up by epoxy resin after being connected with the metal terminal of multicore assembly, the another side of lead-in wire is exposed outside to be connected with the pad of circuit board, ESR value is made to be reduced to the ESR value half of ceramic capacitor with multiple core assemblies of currently available technology.
Existing ceramic capacitor with multiple core assemblies is the most multiple without encapsulating multiple-layer sheet ceramic capacitor increase capacity, similar with the parallel way that this utility model uses, but the assembly after parallel connection is with on the lead-out mode of lead-in wire, and this utility model is different from existing technology.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. made, within being all contained in protection domain of the present utility model.
Claims (6)
1. a low ESR value ceramic capacitor with multiple core assemblies, the lead-in wire including the multicore assembly stacked by monomer, connecting multicore assembly, the epoxy resin enclosed layer being encapsulated on multicore assembly outer surface；Multicore assembly includes interior electrode, it is characterized in that, described multicore assembly uses bridging type to be connected with lead-in wire, and the interior electrode of assembly is parallel with the upper surface of lead-in wire.
Low ESR value ceramic capacitor with multiple core assemblies the most according to claim 1, it is characterized in that, described multicore assembly includes that metal terminal, lead-in wire connect metal terminal, the one side of lead-in wire is wrapped up by epoxy resin after being connected with the metal terminal of multicore assembly, and the another side of lead-in wire is exposed outside.
Low ESR value ceramic capacitor with multiple core assemblies the most according to claim 1, is characterized in that, described monomer is multiple-layer sheet ceramic capacitor.
Low ESR value ceramic capacitor with multiple core assemblies the most according to claim 1, is characterized in that, described monomer includes metal terminal, and the metal terminal of adjacent monomer is connected by high temperature resistant high conductivity leypewter.
Low ESR value ceramic capacitor with multiple core assemblies the most according to claim 1, is characterized in that, described lead-in wire is two, two lead-in wire composition lead frames；Multicore assembly is connected with lead frame by high temperature resistant high conductivity leypewter, multicore assembly with the connected mode of lead frame is: one end of multicore assembly is connected with a piece of lead-in wire of lead frame, the other end of multicore assembly goes between with another sheet of lead frame and is connected, and the two ends of multicore assembly are in same level with two junction points of the two panels lead-in wire of lead frame.
Low ESR value ceramic capacitor with multiple core assemblies the most according to claim 5, is characterized in that, lead frame uses the tin plating lead material of copper, and every a piece of lead-in wire is equipped with one piece of connection sheet being perpendicular to lead-in wire.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201521123070.2U CN205452049U (en) | 2015-12-31 | 2015-12-31 | Low ceramic capacitor of ESR value multicore group |
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| CN201521123070.2U CN205452049U (en) | 2015-12-31 | 2015-12-31 | Low ceramic capacitor of ESR value multicore group |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428062A (en) * | 2015-12-31 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Multi-core assembly ceramic capacitor with low ESR value and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428062A (en) * | 2015-12-31 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Multi-core assembly ceramic capacitor with low ESR value and manufacturing method thereof |
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