CN213483569U - Low-ESR laminated chip type solid aluminum electrolytic capacitor - Google Patents
Low-ESR laminated chip type solid aluminum electrolytic capacitor Download PDFInfo
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- CN213483569U CN213483569U CN202021500863.2U CN202021500863U CN213483569U CN 213483569 U CN213483569 U CN 213483569U CN 202021500863 U CN202021500863 U CN 202021500863U CN 213483569 U CN213483569 U CN 213483569U
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Abstract
The utility model discloses a laminated chip type solid aluminum electrolytic capacitor with low ESR, which comprises a plurality of laminated cores, lead terminals and epoxy resin, wherein the laminated cores comprise an aluminum core, a dielectric layer, a conductive polymer layer, a conductive graphite layer and a conductive silver layer from inside to outside; a plurality of conductive silver adhesive dots are arranged on the conductive silver layer of the laminated core, and after extrusion and curing, a good bonding effect is formed between the silver layer and the silver layer and between the silver layer and the lead terminal, and the silver glue does not overflow. By adopting the technical scheme, a good conduction path can be formed between the silver layer and the silver layer of the laminated core and between the silver layer and the lead terminal, so that the equivalent series resistance of the laminated chip type solid-state aluminum electrolytic capacitor can be well reduced.
Description
Technical Field
The utility model belongs to the technical field of solid-state aluminum electrolytic capacitor, concretely relates to low ESR's solid-state aluminum electrolytic capacitor of lamination piece formula.
Background
In recent years, as the market puts higher demands on miniaturization, portability, high availability and the like of intelligent products, so that elements in the intelligent products need to be improved continuously to meet the requirement of light weight, capacitors also need to be improved, and the miniaturization is required more and more nowadays. The appearance and development of the laminated chip type solid aluminum electrolytic capacitor just meet the market demand. A laminated chip type solid aluminum electrolytic capacitor is a novel electronic element using a high molecular conductive polymer as a capacitor cathode, and the equivalent series resistance is reduced by forming a parallel stacking structure of layers by anode welding and connecting a conductive silver paste with the cathode. However, the bonding effect between the cathode layers directly affects the reduction of the equivalent series resistance of the solid-state aluminum electrolytic capacitor. At present, the conductive silver adhesive is coated by a domestic capacitor manufacturer in a roll coating mode, but the method has the defects that the encapsulation is poor due to the overflow of the extruded silver adhesive, and the poor bonding effect between layers is inevitably caused if the overflow of the silver adhesive is reduced by reducing the roll coating amount of the silver adhesive. Therefore, how to better ensure that the silver adhesive bonding effect between the layers is good and does not overflow is a problem which is urgently needed to be solved by practitioners.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low ESR's stromatolite piece formula solid-state aluminum electrolytic capacitor is provided with a plurality of electrically conductive silver glue points on the electrically conductive silver layer of stromatolite core, and through extrusion solidification back, stromatolite core silver layer and silver layer form fine bonding effect silver between silver layer and the lead terminal and glue and not spill over to reduce stromatolite piece formula aluminum electrolytic capacitor's equivalent series resistance.
In order to solve the technical problem, the utility model provides a following technical scheme:
a laminated chip type solid aluminum electrolytic capacitor with low ESR comprises a plurality of laminated cores, lead terminals and epoxy resin, wherein each laminated core comprises an aluminum core, a dielectric layer, a conductive high polymer layer, a conductive graphite layer and a conductive silver layer from inside to outside; and a plurality of conductive silver adhesive dots are arranged on the conductive silver layer of the laminated core, and after extrusion and solidification, the silver layer is well electrically connected with the silver layer and the lead terminal.
Preferably, the silver paste is disposed at a distance of 0.3-1.7mm from the edge of the aluminum foil.
Preferably, the number of the silver paste dots is set to 2 to 6.
Preferably, the diameter of the silver colloid is set to be 0.7-1.5 mm.
Compared with the prior art, the beneficial effects of the utility model reside in that:
an object of the utility model is to provide a low ESR's stromatolite piece formula solid-state aluminum electrolytic capacitor adopts and is provided with a plurality of electrically conductive silver glue points on the electrically conductive silver layer of stromatolite core, through extrusion solidification back, stromatolite core silver layer and silver layer, form fine bonding effect silver between silver layer and the lead terminal and glue and not spill over to reduce stromatolite piece formula aluminum electrolytic capacitor's equivalent series resistance.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, it is obvious that the drawings in the following description are only one embodiment of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a transverse cross-sectional view of the stacked chip solid-state aluminum electrolytic capacitor with low ESR of the present invention.
Fig. 2 is a longitudinal sectional view of the low ESR stacked chip solid-state aluminum electrolytic capacitor of the present invention.
Fig. 3 is a schematic diagram of the distribution of the conductive silver glue dots on the silver layer of the laminated core of the present invention.
The labels in the figures are: 1-aluminum core, 2-dielectric layer, 3-barrier glue, 4-conductive polymer layer, 5-graphite layer, 6-conductive silver layer, 7-conductive silver glue, 8-leading-out terminal and 9-epoxy resin.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the following description is made for the technical solution of the present invention in the embodiments to explain the present invention clearly and completely, obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a low ESR's solid-state aluminum electrolytic capacitor of lamination piece formula, includes aluminium core 1, dielectric layer 2, separation glue 3, conductive polymer layer 4, conductive graphite layer 5, the negative pole of the solid-state aluminum electrolytic capacitor core of lamination piece formula of conductive silver layer 6 bonds to the negative pole end of lead terminal 8 through conductive silver glue 7, and the positive pole is through resistance welding to accomplish the pile up of first layer core on the positive pole end of lead terminal 8. And then the cathode of the laminated chip type solid aluminum electrolytic capacitor core comprising the aluminum core 1, the dielectric layer 2, the barrier glue 3, the conductive high polymer layer 4, the conductive graphite layer 5 and the conductive silver layer 6 is adhered to the cathode end of the first layer of core through the conductive silver glue 7, and the anode is welded to the anode end of the lead terminal 8 through resistance to complete the stacking of the second layer of core. After the lamination of all cores is completed according to the above operation, the plastic package is performed by using epoxy resin 9.
The utility model discloses in, the silver of intermediate point is glued the position and is 1.4mm to the distance at aluminium foil edge, and the silver of all the other four points is glued the position and is 0.5mm to the distance at aluminium foil edge.
The utility model discloses in, the quantity that sets up the silver point of gluing is 5.
The utility model discloses in, the silver glue of intermediate point is some diameter size and is 1.4mm, and the silver glue of all the other four points is some diameter size and is 0.8 mm.
An object of the utility model is to provide a low ESR's stromatolite piece formula solid-state aluminum electrolytic capacitor is provided with a plurality of electrically conductive silver glue points on the electrically conductive silver layer of stromatolite core, and through extrusion solidification back, stromatolite core silver layer and silver layer form fine bonding effect silver between silver layer and the lead terminal and glue and not spill over to reduce stromatolite piece formula aluminum electrolytic capacitor's equivalent series resistance.
Having described embodiments of the invention, it will be apparent to those skilled in the art that the invention is not limited to details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (4)
1. A laminated chip type solid aluminum electrolytic capacitor with low ESR is characterized by comprising a plurality of laminated cores, lead terminals and epoxy resin, wherein each laminated core comprises an aluminum core, a dielectric layer, a conductive high polymer layer, a conductive graphite layer and a conductive silver layer from inside to outside; and a plurality of conductive silver adhesive dots are arranged on the conductive silver layer of the laminated core, and after extrusion and solidification, the silver layer is well electrically connected with the silver layer and the lead terminal.
2. The low ESR laminated chip solid aluminum electrolytic capacitor as claimed in claim 1, wherein the silver paste is disposed at a distance of 0.3-1.7mm from the edge of the aluminum foil.
3. The low ESR laminated chip solid aluminum electrolytic capacitor as claimed in claim 1, wherein the amount of silver paste is set to 2-6.
4. The low ESR laminated chip solid aluminum electrolytic capacitor as claimed in claim 1, wherein the silver paste is set to have a diameter of 0.7-1.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021500863.2U CN213483569U (en) | 2020-07-27 | 2020-07-27 | Low-ESR laminated chip type solid aluminum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021500863.2U CN213483569U (en) | 2020-07-27 | 2020-07-27 | Low-ESR laminated chip type solid aluminum electrolytic capacitor |
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| CN213483569U true CN213483569U (en) | 2021-06-18 |
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| CN202021500863.2U Active CN213483569U (en) | 2020-07-27 | 2020-07-27 | Low-ESR laminated chip type solid aluminum electrolytic capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707453A (en) * | 2021-08-23 | 2021-11-26 | 姜健偉 | Capacitor packaging structure with elastic sheet |
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2020
- 2020-07-27 CN CN202021500863.2U patent/CN213483569U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707453A (en) * | 2021-08-23 | 2021-11-26 | 姜健偉 | Capacitor packaging structure with elastic sheet |
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