CN106910648A - The preparation method of lightening capacitor - Google Patents
The preparation method of lightening capacitor Download PDFInfo
- Publication number
- CN106910648A CN106910648A CN201510962686.7A CN201510962686A CN106910648A CN 106910648 A CN106910648 A CN 106910648A CN 201510962686 A CN201510962686 A CN 201510962686A CN 106910648 A CN106910648 A CN 106910648A
- Authority
- CN
- China
- Prior art keywords
- lightening
- preparation
- capacitor
- capacitor according
- bending part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
Abstract
The invention provides a kind of preparation method of lightening capacitor, it is comprised the following steps：Prepare flat chip portion, and two positive and negative electrodes are installed in the opposing sides in chip portion；Prepare the two pins portion of sheet, and the one end in two pins portion is fixedly connected positive and negative electrode, the relative other end stretches out, while two pins portion is set in left and right and upper and lower mirror image；Prepare housing section, be coated on chip portion, and the flat hole stretched out for lead portion is reserved in housing section.The present invention solves the problems, such as that the lightening development of electronic product cannot be adapted to because capacitor volume is big in the prior art, so that the volume of capacitor is reduced, adapts to the welding manner of Reflow Soldering, and design and welded bands to integrated circuit carry out benefit.
Description
Technical field
The present invention relates to a kind of capacitor manufacturing technology, in particular to a kind of system of lightening capacitor
Preparation Method.
Background technology
Capacitor is a kind of electronic component being widely used in electronic equipment, according to the difference of material, at present
The capacitor for being used includes porcelain capacitor, mica condenser, organic capacitor and electrolytic capacitor again
Etc..
The lead portion (2) in chip portion (1) and round wires shape of the current capacitor typically all including round pie.
But, as current electronic product gradually develops towards lightening direction, traditional capacitor is gradually
This trend cannot be adapted to.Main reason is that following two aspects：First, traditional annular shaped capacitor by
In the lead portion (2) for needing installation electrode and round wires shape on chip, cannot accomplish thinner on thickness, and
Whole capacitor cannot accomplish that thickness is uniform；Second, the lead portion (2) of traditional annular shaped capacitor is only suitable
Conjunction carries out wave soldering, and for the solder reflow techniques being particularly in lightening electronic product, it cannot be adapted to,
Therefore and it is unfavorable for the design and welding of integrated circuit.
The content of the invention
In consideration of it, the invention provides a kind of preparation method of lightening capacitor, it is intended to solve prior art
It is middle to adapt to the problem of the lightening development of electronic product because capacitor volume is big, so that capacitor
Volume is reduced, and adapts to the welding manner of Reflow Soldering, and design and welded bands to integrated circuit carry out benefit.
The invention provides a kind of preparation method of lightening capacitor, it is comprised the following steps：
Prepare flat chip portion, and two positive and negative electrodes are installed in the opposing sides in chip portion；
Prepare the two pins portion of sheet, and the one end in two pins portion is fixedly connected positive and negative electrode, relative another
One end stretches out, while two pins portion is set in left and right and upper and lower mirror image；
Prepare housing section, be coated on chip portion, and reserved in housing section and stretch out for lead portion
Flat hole.
Further, by above-mentioned lead portion from the handing-over edge in two faces in chip portion thereto a face
The heart extends obliquely out to form the first bending part, and first bending part is in the inside of housing section.
Further, above-mentioned first bending part is formed into the second bending part to outside extension of housing section, this
Two bending parts are in inverted L-shaped.
Further, above-mentioned second bending part is continued into the 3rd bending part of horizontally extending formation.
Further, above-mentioned housing section is prepared into its both sides has outwardly swells.
Further, the section of above-mentioned swells is triangular in shape.
Further, above-mentioned lead portion is welded on positive and negative electrode by solder.
Further, the rectangular shape of above-mentioned solder.
Further, semicircle is processed into the connection end of above-mentioned lead portion and positive and negative electrode.
Further, above-mentioned positive and negative electrode selects circular electric pole piece.
The chip capacitor that the present invention is provided, by setting flat chip portion, and in the positive and negative of chip portion
The lead portion of body in the form of sheets is connected on electrode, and installs the housing section with flat hole additional, while by two pins
Portion is set to left and right and upper and lower mirror image is set so that whole capacitor has made a shape for flat box, phase
SMD capacitor can be formed compared with traditional annular shaped capacitor so that wiring board is by original one side line
Road design is changed to Double-side line design, reduces the volume of wiring board, and the height of paster is greatly reduced in addition,
Therefore substantially do small on thickness, while the lead portion of plates with circuit board when being attached, can be with complete
The full welding manner for adapting to Reflow Soldering, so as to the design and welded bands to integrated circuit carry out benefit, and herein
On the basis of can also adapt to the mode of traditional wave soldering.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, various other advantages and benefit are for ability
Domain those of ordinary skill will be clear understanding.Accompanying drawing is only used for showing the purpose of preferred embodiment, and simultaneously
It is not considered as limitation of the present invention.And in whole accompanying drawing, identical is denoted by the same reference numerals
Part.In the accompanying drawings：
Fig. 1 be lightening capacitor provided in an embodiment of the present invention preparation method in involved capacitor
Profile front view；
Fig. 2 be lightening capacitor provided in an embodiment of the present invention preparation method in involved capacitor
Profile top view；
Fig. 3 be lightening capacitor provided in an embodiment of the present invention preparation method in involved capacitor
Profile left view；
Fig. 4 be lightening capacitor provided in an embodiment of the present invention preparation method in involved capacitor exist
Structure sectional view under depression angle；
Fig. 5 be lightening capacitor provided in an embodiment of the present invention preparation method in involved capacitor exist
The structure sectional view of (removal housing section) under main view angle.
Fig. 6 is the process sequence diagram of the preparation method of lightening capacitor provided in an embodiment of the present invention.
Specific embodiment
The exemplary embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although being shown in accompanying drawing
The exemplary embodiment of the disclosure, it being understood, however, that may be realized in various forms the disclosure without should be by
Embodiments set forth here is limited.Conversely, there is provided these embodiments are able to be best understood from this
It is open, and can by the scope of the present disclosure it is complete convey to those skilled in the art.
Referring to Fig. 1 to Fig. 6, the preparation side of lightening capacitor provided in an embodiment of the present invention is shown in figure
The preferred structure of method.The preparation method is comprised the following steps：
S1：Prepare flat chip portion 1, and two positive and negative electrodes are installed in the opposing sides in chip portion 1
" lead shaping " step in 11, i.e. Fig. 6；
S2：Prepare the two pins portion 2 of sheet, and the one end in two pins portion 2 is fixed by means such as welding
Connection positive and negative electrode 11, the relative other end stretch out, while by two pins portion 2 in left and right and upper and lower
Mirror image is set, i.e. " inserted sheet " and " welding " step in Fig. 6；
S3：Prepare housing section 3, be coated on chip portion 1, and reserved for pin in housing section 3
The flat hole 31 that portion 2 stretches out, i.e. " plastic packaging " step in Fig. 6.
Except above-mentioned several steps as improvements, can also be included in the preparation method " cleaning ",
" rib cutting ", " solidification ", " drying ", " test ", " appearance test ", " packaging " and " ware-house-in inspection " etc.
Step.
The chip capacitor that the present embodiment is provided, by setting flat chip portion, and in chip portion
The lead portion of body in the form of sheets is connected on positive and negative electrode, and installs the housing section with flat hole additional, while by two
Lead portion is set to left and right and upper and lower mirror image is set so that whole capacitor has made a shape for flat box
Shape, can form SMD capacitor so that wiring board is by original compared to traditional annular shaped capacitor
The design of one side circuit is changed to Double-side line design, reduces the volume of wiring board, and the height of paster is significantly in addition
Reduce, therefore substantially do small on thickness, while the lead portion of plates with circuit board when being attached,
The welding manner of Reflow Soldering can be completely adapted to, so as to the design and welded bands to integrated circuit carry out benefit, and
And the mode of traditional wave soldering can also be adapted on this basis.
Referring to Fig. 5, lead portion 2 (outwards can also be prolonged again from the handing-over edge in two faces in chip portion 1
Stretch a little) thereto the center in a face extend obliquely out to form the first bending part 21, the first bending part 21 is in
The inside of housing section 3, thus can while ensureing that integral capacitor body product does small, lead portion 2 it
Between creep age distance can do as best one can greatly so that this capacitor both has the advantages that small volume, and with climbing
The big advantage of electrical distance.
With continued reference to Fig. 5, the first bending part 21 is formed into the second bending part to outside extension of housing section 3
22, the second bending part 22 is in inverted L-shaped so that the creep age distance between lead portion 2 can also be as far as possible
Do again big in ground.
With continued reference to Fig. 5, the second bending part 22 is continued into the 3rd bending part 23 of horizontally extending formation,
In order to realize Reflow Soldering welding on circuit boards.
Referring to Fig. 3, housing section 3 is prepared into its both sides has outwardly swells 32, with as far as possible
Ensure the installing space of internal components in the case of forcing down the thickness of capacitor.
With continued reference to Fig. 3, the section of swells 32 is triangular in shape, can further ensure housing section 3
Overall steadiness, it is also possible to be easy in the way of two panels come assembled housing section 3, it is right to be formed in addition
The circulation water conservancy diversion of heat reduces the operating temperature of integral capacitor device in housing section 3.
Referring to Fig. 4, lead portion 2 is welded on positive and negative electrode 11 by solder 4.The solder 4 specifically can be with
It is tin material etc., to ensure the firm connection between lead portion 2 and positive and negative electrode 11.
With continued reference to Fig. 4, the rectangular shape of solder 4 can further ensure lead portion 2 and positive and negative electrode
Firm connection between 11.
With continued reference to Fig. 4, the semicircular in shape of connection end 24 of lead portion 2 and positive and negative electrode 11, compared to side
The connection end of shape can effectively prevent the wedge angle when mounted may be to caused by chip 1 and positive and negative electrode 11
Damage.
With continued reference to Fig. 4, positive and negative electrode 11 selects circular electric pole piece, can facilitate positive and negative electrode 11 in core
Installation on piece 1.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this hair to the present invention
Bright spirit and scope.So, if it is of the invention these modification and modification belong to the claims in the present invention and
Within the scope of its equivalent technologies, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. the preparation method of lightening capacitor, it is characterised in that comprise the following steps：
Prepare flat chip portion (1), and two are installed in the opposing sides of the chip portion (1) just
Negative electrode (11)；
Prepare the two pins portion (2) of sheet, and one end of the two pins portion (2) is fixedly connected described
Positive and negative electrode (11), the relative other end stretch out, at the same by the two pins portion (2) in left and right and
Upper and lower mirror image is set；
Prepare housing section (3), be coated on the chip portion (1), and in the housing section (3)
Reserve the flat hole (31) stretched out for the lead portion (2).
2. the preparation method of lightening capacitor according to claim 1, it is characterised in that by institute
The center that lead portion (2) is stated from the handing-over edge in two faces of the chip portion (1) face thereto is oblique
The first bending part (21) is formed to extending, first bending part (21) is in the housing section (3)
It is internal.
3. the preparation method of lightening capacitor according to claim 2, it is characterised in that by institute
State the first bending part (21) and form the second bending part (22), institute to outside extension of the housing section (3)
The second bending part (22) is stated in inverted L-shaped.
4. the preparation method of lightening capacitor according to claim 3, it is characterised in that by institute
State the second bending part (22) and continue the 3rd bending part (23) of horizontally extending formation.
5. the preparation method of lightening capacitor according to claim 1, it is characterised in that by institute
Stating housing section (3) and being prepared into its both sides has outwardly swells (32).
6. the preparation method of lightening capacitor according to claim 5, it is characterised in that described
The section of swells (32) is triangular in shape.
7. the preparation method of lightening capacitor according to claim 1, it is characterised in that described
Lead portion (2) is welded on the positive and negative electrode (11) by solder (4).
8. the preparation method of lightening capacitor according to claim 7, it is characterised in that described
Solder (4) rectangular shape.
9. the preparation method of the lightening capacitor according to claim 1 or 7, it is characterised in that
The lead portion (2) is processed into semicircle with the connection end (24) of the positive and negative electrode (11).
10. the preparation method of the lightening capacitor according to claim 1 or 7, it is characterised in that
The positive and negative electrode (11) selects circular electric pole piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962686.7A CN106910648A (en) | 2015-12-21 | 2015-12-21 | The preparation method of lightening capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962686.7A CN106910648A (en) | 2015-12-21 | 2015-12-21 | The preparation method of lightening capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106910648A true CN106910648A (en) | 2017-06-30 |
Family
ID=59199969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510962686.7A Pending CN106910648A (en) | 2015-12-21 | 2015-12-21 | The preparation method of lightening capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106910648A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Sheet-type ac. ceramic-medium capacitor |
| JP2008270253A (en) * | 2007-04-16 | 2008-11-06 | Hitachi Aic Inc | Chip-type solid-state electrolytic capacitor and manufacturing method thereof |
| CN202275714U (en) * | 2011-10-26 | 2012-06-13 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN202633053U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Multi-core-set ceramic capacitor |
| CN203277089U (en) * | 2013-03-27 | 2013-11-06 | 合肥联宝信息技术有限公司 | Capacitor and a mainboard using same |
| CN104658758A (en) * | 2015-02-05 | 2015-05-27 | 深圳江浩电子有限公司 | Flat aluminum electrolytic capacitor and manufacturing method thereof |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
| CN204668160U (en) * | 2015-06-17 | 2015-09-23 | 刘世军 | A kind of horizontal Disk Ceramic Capacitors |
-
2015
- 2015-12-21 CN CN201510962686.7A patent/CN106910648A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Sheet-type ac. ceramic-medium capacitor |
| JP2008270253A (en) * | 2007-04-16 | 2008-11-06 | Hitachi Aic Inc | Chip-type solid-state electrolytic capacitor and manufacturing method thereof |
| CN202275714U (en) * | 2011-10-26 | 2012-06-13 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN202633053U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Multi-core-set ceramic capacitor |
| CN203277089U (en) * | 2013-03-27 | 2013-11-06 | 合肥联宝信息技术有限公司 | Capacitor and a mainboard using same |
| CN104658758A (en) * | 2015-02-05 | 2015-05-27 | 深圳江浩电子有限公司 | Flat aluminum electrolytic capacitor and manufacturing method thereof |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
| CN204668160U (en) * | 2015-06-17 | 2015-09-23 | 刘世军 | A kind of horizontal Disk Ceramic Capacitors |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |
|
| RJ01 | Rejection of invention patent application after publication |