CN210610216U

CN210610216U - Circular element convenient to install by surface-mounted reflow soldering

Info

Publication number: CN210610216U
Application number: CN201921636347.XU
Authority: CN
Inventors: 吴作金
Original assignee: Taizhou Ai Saikang Electronic Co Ltd
Current assignee: Taizhou Ai Saikang Electronic Co Ltd
Priority date: 2019-09-28
Filing date: 2019-09-28
Publication date: 2020-05-22
Anticipated expiration: 2029-09-28

Abstract

The utility model discloses a circular element convenient for installing by surface-mounted reflow soldering, which relates to the electrical technology and is used for solving the problem that the common circular electrical element can not be installed on a circuit board by a surface-mounted technology, and comprises an element body, wherein at least three connecting pins are formed by extending outwards in the element body, the connecting pins are in bending arrangement, the connecting pins after bending are divided into two groups, and the bending directions of the two groups of connecting pins are respectively towards the two sides of the element body; the utility model has the advantages of it is following and effect: the circular element with the multiple groups of connecting pins with opposite directions can be stably erected on the circuit board by adopting a patch mounting method, so that the circular element can be fixed on the circuit board together with other elements in a reflow soldering mode, the steps of processing the circuit board are reduced, and the aim of improving the production efficiency of the circuit board is fulfilled.

Description

Circular element convenient to install by surface-mounted reflow soldering

Technical Field

The utility model relates to the field of electrical technology, in particular to conveniently adopt table to paste circular element that reflow soldering installed.

Background

The mounting of circuit components on a circuit board is mainly classified into two types, one is a plug-in mounting type, and the other is a patch mounting type. The plug-in mainly refers to an installation mode of performing wave soldering or manual soldering fixation after pins of a circuit element penetrate through jacks reserved on a circuit board, and the patch refers to an installation mode of attaching the pins of the circuit element to contacts of the circuit board and then performing reflow soldering fixation.

Some existing circuit components have circular appearance, such as a varistor, a capacitor, etc., and the structure of the existing circuit component is as shown in fig. 1, and includes a component body 1 and two connection pins 2 extending from the interior of the component body 1, for a circuit board mainly including a patch component, because the connection pins 2 of the component are long and the number is only two, if the component is in the form of a patch, the component cannot stand on the circuit board to keep continuous contact with contacts, so that component missing soldering can occur in the subsequent wave soldering process, so that the varistor can only be mounted on the circuit board in the form of a plug-in component, and the mounting form of the plug-in component can only be fixed in the way of wave soldering or manual soldering, which results in that the circuit component needs to be subjected to at least one wave soldering or manual soldering operation after reflow soldering, this increases the number of steps for processing the circuit board, resulting in inefficient production of the circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a conveniently adopt surface mounting reflow soldering to carry out the circular component of installing can let circular component and ordinary paster component equally adopt the paster technology to install to reduce the production step of circuit board, thereby reach the purpose that improves circuit board production efficiency.

The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a circular component that conveniently adopts table to paste reflow soldering to install, includes the component body, it is formed with three at least connection pins to extend outside in the component body, connection pin is the setting of buckling, and the connection pin after buckling divide into two sets ofly, and two sets of connection pins are connected with the positive, negative level electricity of component body respectively, and the both sides of the direction of bending of two sets of connection pins towards the component body respectively.

Since the circular element is generally in the form of a plate, if there are only two connection pins, even if it is bent, the center of gravity of the element is unstable, making it difficult to ensure sufficient contact between the connection pins and the contacts on the circuit board, by adopting the above-described solution, the element has two sets of connection pins, and after the two groups of connecting pins are respectively bent towards the two sides of the element body, the center of the element body can fall in a supporting surface formed by the connecting pins, therefore, the component body can be stably supported, so that the circular component can be mounted on the circuit board by the chip mounter, and stably stands on the circuit board and keeps contact with the contact of the circuit board, so that the circuit board can weld and fix all elements on the circuit board at one time through a reflow soldering machine, thereby reducing the production steps of the circuit board and achieving the purpose of improving the production efficiency of the circuit board.

The utility model discloses a further set up to: the bending angle of the connecting pin is 90 degrees.

Through adopting above-mentioned scheme, 90 the angle of buckling can make the bending section of connecting pin and the surface parallel of circuit board, connecting pin when contacting with the circuit board like this, can have bigger area of contact with between the circuit board, can let circular component place more steadily on the circuit board like this on the one hand, also can guarantee the abundant contact between the contact on connecting pin and the circuit board better simultaneously to make the welding of circular component on the circuit board more firm.

The utility model discloses a further set up to: the bending sections on the two groups of connecting pins are folded towards the sides far away from each other in a ladder shape so as to increase the distance between the two groups of connecting pins.

When the circuit board is electrified, voltage can be generated between the connecting pins of the circular element, when the applied voltage is too high, electric arcs can possibly be generated between the connecting pins, and even the circuit board can be broken down.

The utility model discloses a further set up to: and the bending section of the connecting pin is coated with insulating paint.

By adopting the scheme, after the bending section of the connecting pin is coated with the insulating paint, a barrier can be formed between the connecting pin and the air on the periphery of the circular element, so that the connecting pin is prevented from generating electric conduction with the air, and the use safety of the circular element is further improved.

The utility model discloses a further set up to: one end of the connecting pin, which is far away from the resistor main body, is provided with a reciprocating folding stability augmentation section.

Through adopting above-mentioned scheme, set up on connecting pin and increase after the steady section can increase the area of contact between connecting pin and the circuit board for circular component adopts the paster mode to place can be more steady after on the circuit board, just so the circular component contacts with the contact on the circuit board more easily when adopting the chip mounter to install, with the location degree of difficulty when reducing the component installation, thereby reaches the purpose that further improves circuit board production efficiency.

To sum up, the utility model discloses following beneficial effect has:

1. the circular element with the multiple groups of connecting pins with opposite directions can be stably erected on the circuit board by adopting a patch mounting method, so that the circular element can be fixed on the circuit board together with other elements in a reflow soldering mode, steps of processing the circuit board are reduced, and the aim of improving the production efficiency of the circuit board is fulfilled;

2. the distance between the connecting pins can be increased by the step-shaped folding mode, so that the conductive distance of air can be prolonged, electric arcs are not easy to generate between the connecting pins, and the purpose of improving the use safety of the round element is achieved;

3. the stability augmentation section can increase the area of contact between connecting pin and the circuit board, can increase the stability when circular component adopts the chip mounter installation on the one hand, and on the other hand also can reduce the location degree of difficulty when connecting pin also contacts on the circuit board between the contact to make things convenient for circular component's installation, accelerate the installation rate of this component, thereby reach the purpose that further improves circuit board production efficiency.

Drawings

FIG. 1 is a schematic structural view of a prior art circular element;

FIG. 2 is an overall structural view of the present embodiment;

FIG. 3 is a schematic view of the connection pin of FIG. 2 folded for high voltage applications;

FIG. 4 is a schematic structural diagram of the connection pin folded out of the augmentation stabilizing section for stability enhancement based on FIG. 3;

FIG. 5 is a schematic structural diagram of the connection pin folded out of the augmentation stabilizing section for stability enhancement based on FIG. 2;

fig. 6 is a bottom oblique view of the present embodiment.

In the figure: 1. an element body; 2. connecting pins; 21. bending the section; 22. and (5) a stability augmentation section.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 2, a circular component which is convenient to install by surface-mounted reflow soldering, comprising a component body 1, wherein the component body 1 is in a wafer shape, a plurality of connecting pins 2 are formed by extending outwards from the inside of the component body and are used for being connected with a circuit board, the number of the connecting pins 2 can be set at will, the number of the connecting pins 2 is considered to be more, the number of reserved contact positions of the circuit board during processing is also required to be correspondingly increased, and therefore the number of the connecting pins 2 is set to be three, so that stable support can be formed on the component body 1, and meanwhile, the structure of the circuit board is not too complex.

As shown in fig. 6, the connection pins 2 are divided into two groups, two groups of connection pins 2 are respectively electrically connected with the positive electrode and the negative electrode of the element body 1, so as to supply power to the element body, one group of connection pins is two, the other group of connection pins is only one, two groups of connection pins 2 are respectively bent and arranged at 90 degrees towards two sides of the element body 1, and thus, after the circular element is placed on the circuit board, the gravity center of the circular element can fall in the space range formed by the two groups of connection pins 2 in a surrounding manner, so that the circular element cannot fall down, and therefore, the circular element can be installed on the circuit board in a form.

The electrical field is a component with a circular structure, typically a varistor or a capacitor, for which the use is divided into two cases, one for low voltage applications and one for high voltage applications. The circuit is relatively safe in a low-voltage environment, but in a high-voltage environment, the voltage attached to the circular element may be up to kilovolts, and at this time, air between the connection pins 2 may be broken down, so that an arc phenomenon is generated, and the circuit board is easily short-circuited or even burnt. In consideration of the safety problem under the high-voltage use environment, in the practical application process, the insulating paint on the outer surface of the element body 1 is extended onto the connecting pins 2, and the connecting pins 2 are coated with the insulating paint to block the contact between air and the connecting pins 2, so that the possibility of the air conducting due to high voltage is reduced, and the safety of the element in use is ensured.

As shown in fig. 3, in addition to the form of coating the insulating varnish, the portions of the bent sections 21 of the two groups of connection pins 2 close to the element body 1 may be folded in a step shape toward the sides away from each other, so as to increase the distance between the connection pins 2, thereby improving the safety of the element.

As shown in fig. 4 and 5, in the using process, considering that the connection pin 2 needs to be contacted with a contact on the circuit board when the mounting process is performed, so as to ensure the normal use of the component, because the end of the connection pin 2 away from the component body 1 is folded to obtain an augmentation stabilizing section 22, the folding manner of the augmentation stabilizing section 22 may be a broken line type, or may be a wave type, and the folding manner shown in fig. 4 and 5 is a wave type folding method. The main purpose of the stabilizing section 22 is to increase the divergence range of the connecting pins 2 when contacting the circuit board, so as to increase the possibility that the connecting pins 2 contact the contacts on the circuit board while improving the stability of the mounting of the components, so as to accelerate the mounting speed of the circular components, thereby further improving the production efficiency of the circuit board. Therefore, the protection scope of the present embodiment is included for the purpose of this disclosure.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Claims

1. The utility model provides a conveniently adopt surface mounting reflow soldering to carry out circular component of installation, includes component body (1), its characterized in that: the component comprises a component body (1), and is characterized in that at least three connecting pins (2) are formed by extending outwards in the component body (1), the connecting pins (2) are arranged in a bending mode, the connecting pins (2) after being bent are divided into two groups, the two groups of connecting pins (2) are respectively electrically connected with a positive level and a negative level of the component body (1), and the bending directions of the two groups of connecting pins (2) respectively face the two sides of the component body (1).

2. A circular component for facilitating surface mount reflow soldering installation as recited in claim 1, wherein: the bending angle of the connecting pin (2) is 90 degrees.

3. A circular component for facilitating surface mount reflow soldering installation as recited in claim 1, wherein: the bending sections (21) on the two groups of connecting pins (2) are folded towards the sides far away from each other in a ladder shape to increase the distance between the two groups of connecting pins (2).

4. A circular component for facilitating surface mount reflow soldering installation as recited in claim 1, wherein: and the bending section (21) of the connecting pin (2) is coated with insulating paint.

5. A circular component for facilitating surface mount reflow soldering installation as recited in claim 1, wherein: one end of the connecting pin (2) far away from the resistor main body is provided with a reciprocating folding stability augmentation section (22).