CN117711815A - Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof - Google Patents
Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof Download PDFInfo
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- CN117711815A CN117711815A CN202410030601.0A CN202410030601A CN117711815A CN 117711815 A CN117711815 A CN 117711815A CN 202410030601 A CN202410030601 A CN 202410030601A CN 117711815 A CN117711815 A CN 117711815A
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- mlcc
- foot rest
- ceramic capacitor
- multilayer ceramic
- smc
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 64
- 239000004033 plastic Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 11
- 230000004907 flux Effects 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000005520 cutting process Methods 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 14
- 238000004381 surface treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 11
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a plastic package patch type multilayer ceramic capacitor and a manufacturing method thereof, wherein the multilayer ceramic capacitor comprises an MLCC chip, and a first foot rest and a second foot rest which are symmetrically arranged at two ends of the MLCC chip, wherein a first welding flux for realizing the welding fixation of the first foot rest and the MLCC chip is arranged between the first foot rest and the MLCC chip, a second welding flux for realizing the welding fixation of the second foot rest and the MLCC chip is arranged between the second foot rest and the MLCC chip, epoxy resin is packaged outside the first foot rest, the MLCC chip and the second foot rest, the packaging molding is realized through the epoxy resin, and a product plastic package body is formed; in the invention, the epoxy resin is adopted for conjoined packaging, so that the product has higher mechanical stress resistance, the safety of the product in the application process is greatly enhanced, and meanwhile, the plastic packaging is adopted, so that the distance between two poles is increased, the creepage distance of the product is increased, the product requirement of a customer for resisting higher voltage is met, and a wider market space is developed for the product with the specification.
Description
Technical Field
The invention belongs to the technical field of capacitors, and particularly relates to a plastic package patch type multilayer ceramic capacitor and a manufacturing method thereof.
Background
Ceramic capacitors are also known as ceramic dielectric capacitors or monolithic capacitors, which are capacitors whose dielectric material is ceramic. The ceramic material may be classified into a low-frequency ceramic capacitor and a high-frequency ceramic capacitor. The capacitor is classified into a wafer-shaped capacitor, a tubular capacitor, a rectangular capacitor, a chip capacitor, a feedthrough capacitor and the like according to the structural style.
The capacitor products commonly used in the market at present are mostly patch type multilayer ceramic capacitors, and the patch type multilayer ceramic capacitors have the following defects:
1. the traditional patch type multilayer ceramic capacitor adopts a multilayer chip structure inside and ceramic materials outside for encapsulation, and because the ceramic materials have poor capability of resisting mechanical stress, when the patch type multilayer ceramic capacitor is installed on a client, the MLCC multilayer ceramic capacitor is easy to break, so that the performance of the product is invalid;
2. the electrode spacing at two ends of the patch type multilayer ceramic capacitor is relatively close, the creepage distance is relatively short, and thus the level of the withstand voltage of the product is relatively low, and the product requirement of customers on relatively high voltage cannot be met.
Disclosure of Invention
The invention aims to provide a plastic package patch type multilayer ceramic capacitor and a manufacturing method thereof, which are used for solving the problems that the conventional multilayer ceramic capacitor proposed in the background art is easy to break and has a short creepage distance.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a plastic envelope paster type multilayer ceramic capacitor, this multilayer ceramic capacitor includes MLCC chip, and symmetrical foot rest one and foot rest two that set up in MLCC chip both ends position, be provided with the solder one that realizes both welded fastening between foot rest one and the MLCC chip, be provided with the solder two that realizes both welded fastening between foot rest two and the MLCC chip, the outside encapsulation of foot rest one, MLCC chip, foot rest two is equipped with epoxy, realizes the encapsulation shaping through epoxy, and forms the product plastic envelope body; the first foot rest and the second foot rest extend out from the middle lower position of the end face of the product plastic package body, and the extending parts are outwards bent to form pins of the multilayer ceramic capacitor.
As a preferable technical scheme in the invention, the top end surfaces of the parts of the first foot rest and the second foot rest which are arranged in the plastic package body of the product are lower than or equal to the top end surfaces of the MLCC chips.
As a preferable technical scheme in the invention, the pin parts of the first foot rest and the second foot rest are Z-shaped, and the bottom end surfaces of the pins are lower than the bottom end surface of the product plastic package body.
As a preferable technical scheme in the invention, the first foot rest, the first welding flux, the MLCC chip, the second welding flux and the second foot rest form a welding product assembly.
The invention also discloses a manufacturing method of the plastic package patch type multilayer ceramic capacitor, which comprises the following steps:
step one: firstly, assembling a lower lead of an SMC-MLCC onto a welding jig;
step two: placing a first solder on each pin head on the lower lead of the SMC-MLCC in a lying way, filling a first MLCC chip on each first solder after the placement is completed, placing a second solder on each first solder in a lying way, finally assembling the upper lead of the SMC-MLCC, melting the first solder and the second solder under the high temperature condition after the assembly is completed, and welding electrodes of the MLCC chip, the lower lead of the SMC-MLCC and the upper lead of the SMC-MLCC into a whole to obtain an SMC-MLCC welded finished product;
step three: the SMC-MLCC patch type multilayer ceramic capacitor is welded to a finished product, and is packaged by epoxy resin, so that the product has higher mechanical stress resistance, the safety of the product in the application process is greatly enhanced, and a foot rest of the product after the SMC-MLCC patch type multilayer ceramic capacitor is packaged is shaped by using a pin cutting and bending die, so that the foot rest shape meeting the use requirement of a customer is achieved;
step four: copper pins of the SMC-MLCC patch type multilayer ceramic capacitor are subjected to pin surface treatment by adopting a tin immersion process;
step five: cutting and separating the conjoined plastic-packaged SMC-MLCC patch type multilayer ceramic capacitor product into a single SMC-MLCC patch type multilayer ceramic capacitor, thereby meeting the production requirements of terminal customers.
In the fourth step, pure tin is melted to be liquid by high temperature, pins of the SMC-MLCC patch type multilayer ceramic capacitor product are immersed below the liquid surface of the tin, so that the liquid pure tin is attached to the surfaces of the pins, and the surface treatment of the pins is completed; harmful chemical liquid is not generated in the tin immersion process, and green production of the pin surface treatment process is basically realized.
As a preferable technical scheme in the invention, the temperature for melting pure tin to liquid state is 240-260 ℃.
In the fifth step, the cutting and separating technology uses the round diamond blade and the gasket to assemble a group of precise cutting tools, then the conjoined plastic packaged SMC-MLCC patch type multilayer ceramic capacitor is precisely positioned in the belt slot of the driving wheel, the cutting tools and the driving wheel of the belt are operated relatively, and the cutting and separating of the SMC-MLCC patch type multilayer ceramic capacitor product of the conjoined plastic package is completed.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the epoxy resin is integrally packaged, so that the product has higher mechanical stress resistance, the safety of the product in the application process is greatly enhanced, meanwhile, the plastic packaging is adopted, the distance between two poles is increased, the creepage distance of the product is increased, the higher voltage resistance of the product is further improved, the higher voltage resistance product requirement of customers is met, a wider market space is developed for the product with the specification, and a new production technology is utilized, the adhesive channel is used as a body to integrally mold the SMC-MLCC patch type multilayer ceramic capacitor, the utilization rate of the epoxy resin is greatly improved, the utilization rate of the epoxy resin is improved to 75%, and the further improvement space is provided, so that the scrappage of the epoxy resin waste is greatly reduced, and the adverse effect of the production of electronic elements on the environment is greatly reduced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view showing an assembled state of the multilayer ceramic capacitor of the present invention in manufacturing;
FIG. 3 is a schematic view showing a state in which the multilayer ceramic capacitor of the present invention is assembled in the production process;
FIG. 4 is a schematic view showing a package state of the multilayer ceramic capacitor of the present invention in manufacturing;
FIG. 5 is a schematic diagram showing the formation of a stand during the production of the multilayer ceramic capacitor according to the present invention;
fig. 6 is a schematic diagram showing the dicing of the multilayer ceramic capacitor of the present invention in the production.
In the figure: 1. a foot rest I; 2. solder I; 3. an epoxy resin; 4. an MLCC chip; 5. solder II; 6. a second foot rest; 7. SMC-MLCC down-lead; 8. SMC-MLCC upper lead.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 6, the present invention provides a technical solution: a plastic package patch type multilayer ceramic capacitor comprises an MLCC chip 4, a first foot rest 1 and a second foot rest 6 which are symmetrically arranged at two ends of the MLCC chip 4, wherein a first welding flux 2 for realizing the welding fixation of the first foot rest 1 and the MLCC chip 4 is arranged between the first foot rest 1 and the MLCC chip 4, a second welding flux 5 for realizing the welding fixation of the second foot rest 6 and the MLCC chip 4 is arranged between the first foot rest 6 and the MLCC chip 4, epoxy resin 3 is packaged outside the first foot rest 1, the MLCC chip 4 and the second foot rest 6, package molding is realized through the epoxy resin 3, and a product plastic package body is formed; the first foot rest 1 and the second foot rest 6 extend out from the middle lower position of the end face of the product plastic package body, and the extending parts are outwards bent to form pins of the multilayer ceramic capacitor.
In this embodiment, the top end surfaces of the first foot rest 1 and the second foot rest 6 placed in the plastic package body of the product are lower than or equal to the top end surface of the MLCC chip 4.
In this embodiment, the pin portions of the first and second stand 1 and 6 are Z-shaped, and the bottom end surfaces of the pins are lower than the bottom end surface of the product plastic package.
In this embodiment, the first stand 1, the first solder 2, the MLCC chip 4, the second solder 5, and the second stand 6 constitute a solder assembly.
The invention also discloses a manufacturing method of the plastic package patch type multilayer ceramic capacitor, which comprises the following steps:
step one: firstly, assembling an SMC-MLCC lower lead 7 on a welding jig;
step two: placing a piece of solder I2 on each pin head on the lower lead 7 of the SMC-MLCC in a lying way, wherein the materials, the added thickness and the required welding temperature of the solder I2 and the solder II 5 are identical, through the classification, the corresponding drawing can be more clearly corresponding, the positions can be correspondingly changed according to the actual requirements, after the placement is completed, each piece of solder I2 is filled with one piece of MLCC chip 4, a piece of solder II 5 is placed on each piece of MLCC chip 4 in a lying way, finally, the upper lead 8 of the SMC-MLCC is assembled, specifically referring to FIG. 2, after the assembly is completed, the solder I2 and the solder II 5 are melted, and the electrodes of the MLCC chip 4, the lower lead 7 of the SMC-MLCC and the upper lead 8 of the SMC-MLCC are welded into a whole, thus obtaining a finished product of the SMC-MLCC welding, specifically referring to FIG. 3;
step three: the SMC-MLCC patch type multilayer ceramic capacitor welded finished product is packaged by adopting epoxy resin 3, and particularly referring to FIG. 4, so that the product has higher mechanical stress resistance, the safety of the product in the application process is greatly enhanced, and the foot rest of the product after the SMC-MLCC patch type multilayer ceramic capacitor is packaged is shaped by utilizing a pin cutting die, so that the foot rest shape meeting the requirements of customers is achieved, and particularly referring to FIG. 5;
step four: copper pins of the SMC-MLCC patch type multilayer ceramic capacitor are subjected to pin surface treatment by adopting a tin immersion process;
step five: cutting and separating the conjoined plastic-packaged SMC-MLCC patch type multilayer ceramic capacitor product to obtain a single SMC-MLCC patch type multilayer ceramic capacitor, which meets the production requirements of terminal customers, and referring to FIG. 6.
In the fourth step, the surface treatment is to melt pure tin to liquid state by using high temperature, immerse the pins of the SMC-MLCC patch type multilayer ceramic capacitor product under the liquid surface of tin, so that the liquid pure tin is attached to the surfaces of the pins, and the treatment of the surfaces of the pins is completed; harmful chemical liquid is not generated in the tin immersion process, and green production of the pin surface treatment process is basically realized.
In this example, the temperature at which pure tin is melted to a liquid state is 240 to 260 ℃.
In the fifth embodiment, the cutting and separating technology uses the interval assembly of the round diamond blade and the gasket to assemble a group of precise cutting tools, then the conjoined plastic-packaged SMC-MLCC patch type multilayer ceramic capacitor is precisely positioned in the material carrying groove of the driving wheel, the cutting tools and the driving wheel with materials relatively run, and the cutting and separating of the SMC-MLCC patch type multilayer ceramic capacitor products of the conjoined plastic package are completed.
Although embodiments of the present invention have been shown and described in detail with reference to the foregoing detailed description, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A plastic package patch type multilayer ceramic capacitor is characterized in that: the multilayer ceramic capacitor comprises an MLCC chip (4), and a first foot rest (1) and a second foot rest (6) which are symmetrically arranged at two ends of the MLCC chip (4), wherein a first welding flux (2) for realizing the welding fixation of the first foot rest (1) and the MLCC chip (4) is arranged between the first foot rest (1) and the MLCC chip, a second welding flux (5) for realizing the welding fixation of the second foot rest (6) and the MLCC chip (4) is arranged between the second foot rest (6), and epoxy resin (3) is packaged outside the first foot rest (1), the MLCC chip (4) and the second foot rest (6) to form a product plastic package body; the first foot rest (1) and the second foot rest (6) extend out from the lower position of the middle of the end face of the product plastic package body, and the extending parts are outwards bent to form pins of the multilayer ceramic capacitor.
2. The plastic-encapsulated patch-type multilayer ceramic capacitor as set forth in claim 1, wherein: the top end surfaces of the parts of the foot rest I (1) and the foot rest II (6) which are arranged in the plastic package body of the product are lower than or equal to the top end surfaces of the MLCC chips (4).
3. The plastic-encapsulated patch-type multilayer ceramic capacitor as set forth in claim 2, wherein: the pin parts of the first foot rest (1) and the second foot rest (6) are Z-shaped, and the bottom end surfaces of the pins are lower than the bottom end surfaces of the plastic package body of the product.
4. The plastic-encapsulated patch-type multilayer ceramic capacitor as set forth in claim 1, wherein: the first foot rest (1), the first solder (2), the MLCC chip (4), the second solder (5) and the second foot rest (6) form a welding product assembly.
5. A method for manufacturing a plastic-encapsulated chip-type multilayer ceramic capacitor, comprising the multilayer ceramic capacitor as set forth in any one of claims 1 to 4, characterized in that: the method specifically comprises the following steps:
step one: firstly, assembling an SMC-MLCC lower lead (7) on a welding jig;
step two: placing a first solder (2) on each pin head on the lower lead (7) of the SMC-MLCC in a lying way, filling a second solder (5) on each first solder (2) after the placement, placing a second solder (5) on each first solder (2) in a lying way, finally assembling the upper lead (8) of the SMC-MLCC, melting the first solder (2) and the second solder (5) under the high temperature condition after the assembly is completed, and welding electrodes of the first MLCC (4), the lower lead (7) of the SMC-MLCC and the upper lead (8) of the SMC-MLCC into a whole to obtain an SMC-MLCC welded finished product;
step three: the SMC-MLCC patch type multilayer ceramic capacitor is welded to a finished product, the finished product is packaged by adopting epoxy resin (3), and a foot rest of the product packaged by the SMC-MLCC patch type multilayer ceramic capacitor is shaped by utilizing a foot cutting and bending die so as to achieve the foot rest shape meeting the use requirement of customers;
step four: copper pins of the SMC-MLCC patch type multilayer ceramic capacitor are subjected to pin surface treatment by adopting a tin immersion process;
step five: cutting and separating the conjoined plastic-packaged SMC-MLCC patch type multilayer ceramic capacitor product to obtain a single SMC-MLCC patch type multilayer ceramic capacitor.
6. The method for manufacturing a plastic-encapsulated chip multi-layer ceramic capacitor as defined in claim 5, wherein: in the fourth step, the surface treatment is to melt pure tin to liquid state by utilizing high temperature, immerse the pins of the SMC-MLCC patch type multilayer ceramic capacitor product under the liquid surface of tin, so that the liquid pure tin is attached to the surfaces of the pins, and the treatment of the surfaces of the pins is completed.
7. The method for manufacturing a plastic-encapsulated chip multi-layer ceramic capacitor as defined in claim 6, wherein: the pure tin is melted to the liquid state at the temperature of 240-260 ℃.
8. The method for manufacturing a plastic-encapsulated chip multi-layer ceramic capacitor as defined in claim 5, wherein: in the fifth step, the cutting and separating technology is assembled by using a circular diamond blade and a gasket at intervals to form a group of precise cutting tools, then the conjoined plastic packaged SMC-MLCC patch type multilayer ceramic capacitor is precisely positioned in a material carrying groove of a driving wheel, and the cutting tools and the driving wheel with materials are operated relatively to finish cutting and separating of the SMC-MLCC patch type multilayer ceramic capacitor product of the conjoined plastic package of the material sheet type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410030601.0A CN117711815A (en) | 2024-01-09 | 2024-01-09 | Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410030601.0A CN117711815A (en) | 2024-01-09 | 2024-01-09 | Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN117711815A true CN117711815A (en) | 2024-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410030601.0A Pending CN117711815A (en) | 2024-01-09 | 2024-01-09 | Plastic package patch type multilayer ceramic capacitor and manufacturing method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105489488A (en) * | 2015-11-26 | 2016-04-13 | 钟运辉 | Manufacturing method for patch diode employing runner as body |
| CN108511188A (en) * | 2018-05-15 | 2018-09-07 | 山东晶导微电子股份有限公司 | A kind of patch capacitor encapsulating structure |
-
2024
- 2024-01-09 CN CN202410030601.0A patent/CN117711815A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105489488A (en) * | 2015-11-26 | 2016-04-13 | 钟运辉 | Manufacturing method for patch diode employing runner as body |
| CN108511188A (en) * | 2018-05-15 | 2018-09-07 | 山东晶导微电子股份有限公司 | A kind of patch capacitor encapsulating structure |
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