CN112802686A - Double-layer structure die pressing multi-core group ceramic capacitor and production method thereof - Google Patents
Double-layer structure die pressing multi-core group ceramic capacitor and production method thereof Download PDFInfo
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- CN112802686A CN112802686A CN202110102922.3A CN202110102922A CN112802686A CN 112802686 A CN112802686 A CN 112802686A CN 202110102922 A CN202110102922 A CN 202110102922A CN 112802686 A CN112802686 A CN 112802686A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 23
- 238000007723 die pressing method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 81
- 239000003990 capacitor Substances 0.000 claims abstract description 52
- 239000004033 plastic Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 48
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 229920006336 epoxy molding compound Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- -1 polytetrafluoroethylene Polymers 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- 238000003825 pressing Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a double-layer structure die pressing multi-core group ceramic capacitor and a production method thereof, the multi-core group ceramic capacitor comprises a plastic package shell, a frame arranged in the plastic package shell, four capacitor chip modules and insulating gaskets, wherein the frame comprises a first leading-out end, a second leading-out end, a lower welding layer and an upper welding layer, the capacitor chip modules are welded at the upper end and the lower end of the upper welding layer and the lower welding layer, the insulating gaskets are arranged between the two adjacent capacitor chip modules to play an isolating role, and the first leading-out end and the second leading-out end respectively extend out of the plastic package shell. The invention realizes the multi-core group capacitor lamination in space, greatly increases the capacitance, saves the welding area and has higher electrical property and reliability.
Description
Technical Field
The invention relates to a double-layer structure die pressing multi-core group ceramic capacitor and a production method thereof.
Background
Besides the characteristic of the capacitor of 'blocking direct current and alternating current', the ceramic capacitor has the characteristics of small volume, large specific volume, long service life, high reliability, suitability for surface mounting and the like. With the rapid development of the electronic industry in the world, ceramic capacitors have also advanced at an alarming rate as basic elements of the electronic industry, increasing at a rate of 10% to 15% every year. Currently, ceramic capacitors are demanded in the world in an amount of over 2000 billion, 70% of which are produced in japan, and then in europe, the united states, and south-east asia (including china). With the improvement of reliability and integration level of chip volume products, the application range of the chip volume products is wider and wider, and the chip volume products are widely applied to various military and civil electronic complete machines and electronic equipment, such as computers, telephones, program-controlled switches, precise testing instruments, radar communication and the like. The internal structure of the existing molded multi-core group ceramic capacitor is a single-layer or double-layer chip patch welding structure, the type is single, the limitation of the maximum chip bearing quantity of the product is caused by the restriction of a design structure, and the increasing customer requirements cannot be met.
Disclosure of Invention
The invention aims to provide a double-layer structure die pressing multi-core group ceramic capacitor and a production method thereof aiming at the defects of the prior art, so that the multi-core group capacitor lamination is realized in space, the capacitance is greatly increased, the welding area is saved, and the electrical property and the reliability are higher.
The invention is realized by the following technical scheme:
a double-layer structure die pressing multi-core group ceramic capacitor comprises a plastic package shell, a frame arranged in the plastic package shell, four capacitor chip modules and an insulating gasket, wherein the frame comprises a first leading-out end, a second leading-out end, a lower welding layer and an upper welding layer, the first leading-out end and the second leading-out end are oppositely arranged at intervals, the lower welding layer comprises two first welding strips and two second welding strips which are arranged in a staggered mode and extend horizontally, the two first welding strips are arranged at the first leading-out end at intervals, the two second welding strips are arranged at the second leading-out end at intervals, the two third welding strips and the two fourth welding strips are arranged in a staggered mode and respectively provided with a vertical section and a horizontal section arranged at the upper end of the vertical section, each horizontal section forms an upper welding layer, the lower ends of the two vertical sections of the two third welding strips are arranged at the first leading-out end at intervals, the lower ends of the two vertical sections of the four welding strips are arranged at the second leading-out end at intervals, and the two ends, the insulating gasket sets up between two adjacent capacitor chip modules in order to play the isolation effect, and first, second lead-out terminal stretches out the plastic envelope shell respectively.
Further, the capacitor chip module is a single-layer rectangular array formed by stacking a plurality of capacitor chips.
Furthermore, two condenser chip modules are welded on the upper surface and the lower surface of the first welding strip and the second welding strip, and condenser chip modules are welded on the upper surface and the lower surface of the horizontal section of the third welding strip and the horizontal section of the fourth welding strip.
Further, the insulating gasket is made of polytetrafluoroethylene material.
Furthermore, the plastic package shell is made of epoxy molding compound.
Furthermore, the first leading-out end and the second leading-out end are respectively provided with a first bending part bent downwards and a pin bonding pad which is arranged at the lower end of the first bending part and bent inwards, and the pin bonding pad is tightly attached to the plastic package shell.
Furthermore, the bottom of the plastic package shell is provided with a protruding block, and the height of the protruding block is the same as that of the pin bonding pad.
The invention is also realized by the following technical scheme:
a production method of a double-layer structure die-pressing multi-core group ceramic capacitor comprises the following steps:
A. four horizontal bars are arranged on the first leading-out end and the second leading-out end at equal intervals, and the horizontal bars at the two intervals on the first leading-out end and the second leading-out end are respectively bent upwards, so that the lower welding layer is formed: the left horizontal strips of the first leading-out end and the second leading-out end are respectively a first welding strip and a second welding strip;
B. welding a capacitor chip module on the upper surface and the lower surface of each first welding strip and each second welding strip;
C. bonding an insulating gasket to the upper end of the capacitor chip module positioned above by using red glue, placing a capacitor chip module on the upper end of the insulating gasket, and applying solder paste on the upper end of the capacitor chip module;
D. c, performing secondary bending molding on the horizontal strips bent upwards in the step A to form vertical sections and horizontal sections, wherein each horizontal section forms an upper welding layer, and the lower end of each horizontal section is in contact with the solder paste dotted in the step C;
E. solder paste is applied to the upper end point of each horizontal section, a capacitor chip module is placed, and then the two capacitor chip modules are respectively welded at the upper end and the lower end of each horizontal section;
F. and E, performing die pressing on the product processed in the step E, and forming the pin bonding pad after die pressing.
Further, the capacitor chip module is welded on the upper welding layer and the lower welding layer through reflow soldering.
The invention has the following beneficial effects:
1. the frame is of a two-layer structure comprising an upper welding layer and a lower welding layer, the upper end and the lower end of the upper welding layer and the lower end of the lower welding layer are both welded with the capacitor chip modules, namely, the height of the frame is slightly increased under the condition of not enlarging the size of the horizontal plane of the frame, so that the lamination of multi-core capacitor groups is realized in space, and the capacitance is greatly increased; in addition, in the production process, the capacitor chip groups are welded on the lower welding layer, the frame is secondarily formed by secondarily bending the vertical horizontal strips to obtain the upper welding layer, and the capacitor chip groups are welded on the upper welding layer; the insulating gasket is used for isolating adjacent two layers of capacitor chip groups, so that short circuit caused by the communication of the ends of the capacitor chips is avoided, and the capacitor chips can be prevented from being damaged by stress extrusion.
2. The capacitor chip module is a single-layer rectangular array formed by stacking a plurality of capacitor chips, the number of the capacitor chips can be selected according to the requirements of customers, the operation is flexible, and the requirements of the customers can be better met.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the present invention (plastic package housing removed).
Fig. 3 is a schematic structural diagram of the frame of the present invention.
FIG. 4 is a schematic diagram corresponding to step A of the production method of the present invention.
FIG. 5 is a schematic diagram corresponding to step B of the production method of the present invention.
FIG. 6 is a schematic diagram corresponding to step C of the production method of the present invention.
FIG. 7 is a schematic diagram corresponding to step D of the production method of the present invention.
Wherein, 1, plastic packaging the shell; 11. a protruding block; 2. a frame; 21. a first lead-out terminal; 22. a second lead-out terminal; 23. a first welding bar; 24. a second weld bar; 25. a third weld bar; 26. a fourth weld bar; 27. a vertical section; 28. a horizontal segment; 29. a first bending portion; 210. a pin pad; 3. a capacitor chip; 4. and an insulating gasket.
Detailed Description
As shown in fig. 1 to 3, the double-layer structure die-pressed multi-core group ceramic capacitor comprises a plastic package housing 1, a frame arranged in the plastic package housing 1, four capacitor chip modules and an insulating gasket 4, wherein the frame comprises a first leading-out end 21, a second leading-out end 22, a lower welding layer and an upper welding layer, the first leading-out end 21 and the second leading-out end 22 are oppositely arranged at intervals, the lower welding layer comprises two first welding strips 23 and two second welding strips 24 which are staggered and horizontally extend, the two first welding strips 23 are arranged at the first leading-out end 21 at intervals, the two second welding strips 24 are arranged at the second leading-out end 22 at intervals, the two third welding strips 25 and the two fourth welding strips 26 are staggered and both have vertical sections 27 and horizontal sections 28 arranged at the upper ends of the vertical sections 27, each horizontal section 28 forms an upper welding layer, the lower ends of the vertical sections 27 of the two third welding strips 25 are arranged at the first leading-out end 21 at intervals, the lower extreme interval of two fourth welding strip 26 vertical sections 27 sets up at the second and draws forth end 22, and the upper and lower both ends on upper welding layer, lower welding layer all weld condenser chip module, and insulating gasket 4 sets up between two adjacent condenser chip modules in order to play the isolation, and first end 21, the second of drawing forth are drawn forth end 22 and are stretched out plastic envelope shell 1 respectively. The parts of the first leading-out terminal 21 and the second leading-out terminal 22 extending out of the plastic package housing 1 are both provided with a first bending part 29 bending downwards and a pin bonding pad 210 arranged at the lower end of the first bending part 29 and bending inwards, and the pin bonding pad 210 is tightly attached to the plastic package housing 1. The bottom of the plastic package shell 1 is provided with a protruding block 11, and the height of the protruding block 11 is the same as that of the pin bonding pad 210, so that the multi-core group ceramic capacitor can be more stable.
The capacitor chip module is a single-layer rectangular array formed by stacking a plurality of capacitor chips 3.
More specifically, the capacitor chip modules are bonded to both upper and lower surfaces of the two first and second solder bars 23 and 24, and the capacitor chip modules are bonded to both upper and lower surfaces of the horizontal portions 28 of the two third and fourth solder bars 25 and 28 of the horizontal portions of the two fourth solder bars 26.
In this embodiment, the insulating gasket 4 is made of a teflon material. The plastic package housing 1 is made of epoxy molding compound.
The production method of the double-layer structure die-pressing multi-core group ceramic capacitor comprises the following steps:
A. all be provided with four horizontal strips on first leading-out end 21, the second leading-out end 22 at interval, respectively with first leading-out end 21, the second leading-out end 22 go up two spaced horizontal strips and upwards bend, then welding layer shaping down: the remaining horizontal strips of the first lead-out end 21 and the second lead-out end 22 are a first welding strip 23 and a second welding strip 24 respectively, as shown in fig. 4;
B. a capacitor chip module is reflow-soldered to both upper and lower surfaces of each of the first solder bars 23 and each of the second solder bars 24, as shown in fig. 5;
C. bonding an insulating gasket 4 to the upper end of the capacitor chip module positioned above by using red glue, placing a capacitor chip module on the upper end of the insulating gasket 4, and applying solder paste to the upper end of the capacitor chip module, as shown in fig. 6;
D. c, performing second bending molding on the horizontal strips bent upwards in the step A to form a vertical section 27 and a horizontal section 28, wherein each horizontal section 28 forms an upper welding layer, and the lower end of each horizontal section 28 is contacted with the solder paste dotted in the step C, as shown in fig. 7;
E. solder paste is applied to the upper end of each horizontal segment 28, a capacitor chip module is placed on the solder paste, and then two capacitor chip modules are respectively soldered to the upper end and the lower end of each horizontal segment 28 by reflow soldering, as shown in fig. 2;
F. the product processed in step E is molded and the pin pad 210 is formed after molding. The specific operations of bending and die pressing are all the prior art.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (9)
1. The utility model provides a bilayer structure mould pressing multicore group ceramic capacitor which characterized in that: the plastic package structure comprises a plastic package shell, a frame arranged in the plastic package shell, four capacitor chip modules and an insulating gasket, wherein the frame comprises a first leading-out end, a second leading-out end, a lower welding layer and an upper welding layer, the first leading-out end and the second leading-out end are oppositely arranged at intervals, the lower welding layer comprises two first welding strips and two second welding strips which are arranged in a staggered mode and extend horizontally, the two first welding strips are arranged at the first leading-out end at intervals, the two second welding strips are arranged at the second leading-out end at intervals, the two third welding strips and the two fourth welding strips are arranged in a staggered mode and are respectively provided with a vertical section and a horizontal section arranged at the upper end of the vertical section, each horizontal section forms an upper welding layer, the lower ends of the vertical sections of the two third welding strips are arranged at the first leading-out end at intervals, the lower ends of the vertical sections of the two fourth welding strips are arranged at the second leading-out end at intervals, and the upper, the insulating gasket sets up between two adjacent capacitor chip modules in order to play the isolation effect, and first, second lead-out terminal stretches out the plastic envelope shell respectively.
2. The double-layer structure molded multi-core group ceramic capacitor as claimed in claim 1, wherein: the capacitor chip module is a single-layer rectangular array formed by stacking a plurality of capacitor chips.
3. The double-layer structure molded multi-core group ceramic capacitor as claimed in claim 1, wherein: and the upper surface and the lower surface of the horizontal section of the second welding strip are respectively welded with a capacitor chip module, and the upper surface and the lower surface of the horizontal section of the third welding strip are respectively welded with a capacitor chip module.
4. The double-layer structure molded multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the insulating gasket is made of polytetrafluoroethylene material.
5. The double-layer structure molded multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the plastic package shell is made of epoxy molding compound.
6. The double-layer structure molded multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the first leading-out end and the second leading-out end are respectively provided with a first bending part bent downwards and a pin bonding pad which is arranged at the lower end of the first bending part and bent inwards, and the pin bonding pad is tightly attached to the plastic package shell.
7. The double-layer structure molded multi-core group ceramic capacitor as claimed in claim 6, wherein: the bottom of the plastic package shell is provided with a protruding block, and the height of the protruding block is the same as that of the pin bonding pad.
8. A production method of a double-layer structure die-pressing multi-core group ceramic capacitor is characterized by comprising the following steps: the method comprises the following steps:
A. four horizontal bars are arranged on the first leading-out end and the second leading-out end at equal intervals, and the horizontal bars at the two intervals on the first leading-out end and the second leading-out end are respectively bent upwards, so that the lower welding layer is formed: the left horizontal strips of the first leading-out end and the second leading-out end are respectively a first welding strip and a second welding strip;
B. welding a capacitor chip module on the upper surface and the lower surface of each first welding strip and each second welding strip;
C. bonding an insulating gasket to the upper end of the capacitor chip module positioned above by using red glue, placing a capacitor chip module on the upper end of the insulating gasket, and applying solder paste on the upper end of the capacitor chip module;
D. c, performing secondary bending molding on the horizontal strips bent upwards in the step A to form vertical sections and horizontal sections, wherein each horizontal section forms an upper welding layer, and the lower end of each horizontal section is in contact with the solder paste dotted in the step C;
E. solder paste is applied to the upper end point of each horizontal section, a capacitor chip module is placed, and then the two capacitor chip modules are respectively welded at the upper end and the lower end of each horizontal section;
F. and E, performing die pressing on the product processed in the step E, and forming the pin bonding pad after die pressing.
9. The method of claim 8, wherein the method comprises the steps of: the capacitor chip module is welded on the upper welding layer and the lower welding layer through reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102922.3A CN112802686A (en) | 2021-01-26 | 2021-01-26 | Double-layer structure die pressing multi-core group ceramic capacitor and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102922.3A CN112802686A (en) | 2021-01-26 | 2021-01-26 | Double-layer structure die pressing multi-core group ceramic capacitor and production method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112802686A true CN112802686A (en) | 2021-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110102922.3A Pending CN112802686A (en) | 2021-01-26 | 2021-01-26 | Double-layer structure die pressing multi-core group ceramic capacitor and production method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295312A (en) * | 2022-08-10 | 2022-11-04 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
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2021
- 2021-01-26 CN CN202110102922.3A patent/CN112802686A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295312A (en) * | 2022-08-10 | 2022-11-04 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
| CN115295312B (en) * | 2022-08-10 | 2023-05-12 | 福建火炬电子科技股份有限公司 | Preparation process of multi-core group capacitor |
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