CN217562411U - Welding frame for plate-type array capacitor filter - Google Patents
Welding frame for plate-type array capacitor filter Download PDFInfo
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- CN217562411U CN217562411U CN202221055553.3U CN202221055553U CN217562411U CN 217562411 U CN217562411 U CN 217562411U CN 202221055553 U CN202221055553 U CN 202221055553U CN 217562411 U CN217562411 U CN 217562411U
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Abstract
The utility model provides a welding frame for plate-type array capacitor filter, a plurality of ceramic capacitor chips for weld, concatenate and form closed annular pad group including the multiunit through first bonding pad, pad group is including the first pad of upper and lower interval arrangement, second pad and third pad, it is first to connect, second bonding pad between the second pad, and the end of drawing forth of being connected with the third pad, it is first, second and third pad are annular pad and arrange with one heart, each pad group all corresponds the ceramic capacitor chip that a plurality of levels were arranged, in use, the second pad of each pad group is rather than the electrically conductive end upside welding of a plurality of ceramic capacitor chips that correspond, the electrically conductive end downside welding of third pad and these ceramic capacitor chips. The utility model discloses can weld a plurality of ceramic capacitor chip simultaneously, make board-like array capacitor filter can change the electric capacity according to the in-service use condition, be applicable to multiple environment, and the reliability is high.
Description
Technical Field
The utility model relates to a welding frame for plate array capacitor filter.
Background
The interior of the existing ceramic capacitor filter is a special non-standard ceramic capacitor which is produced by manufacturers, has single model, can only be suitable for a certain specific occasion, has poor adaptability, is difficult to adjust and change according to the actual use condition, can not flexibly change the capacitance, and has low reliability.
SUMMERY OF THE UTILITY MODEL
The utility model provides a welding frame for plate-type array capacitor filter can weld a plurality of ceramic capacitor chip simultaneously, makes plate-type array capacitor filter can change the electric capacity according to the in-service use condition, is applicable to multiple environment, and the reliability is high.
The utility model discloses a following technical scheme realizes:
a welding frame for a plate-type array capacitor filter is used for welding a plurality of ceramic capacitor chips and comprises a plurality of groups of bonding pads which are connected in series through first connecting pieces and form a closed ring shape, wherein each bonding pad group comprises a first bonding pad, a second bonding pad, a third bonding pad, a second connecting piece and a leading-out end, the first bonding pad, the second bonding pad and the third bonding pad are arranged at intervals up and down, the second connecting piece is connected between the first bonding pad and the second bonding pad, the leading-out end is connected with the third bonding pad, the first bonding pad, the second bonding pad and the third bonding pad are annular bonding pads and are arranged concentrically, each bonding pad group corresponds to a plurality of horizontally arranged ceramic capacitor chips, when the welding frame is used, the second bonding pad of each bonding pad group is welded with the upper side of one conducting end of the corresponding ceramic capacitor chip, and the third bonding pad is welded with the lower side of the other conducting end of the ceramic capacitor chips.
Further, the diameter of the third pad of each pad group is larger than that of the corresponding second pad.
Furthermore, the diameter of the first bonding pad of each bonding pad group is smaller than that of the corresponding second bonding pad, and the second connecting piece is arranged between the edges of the first bonding pad and the second bonding pad.
Furthermore, the leading-out end comprises two oppositely arranged '21274', folding pieces, one folding piece is connected with the third bonding pad of two adjacent bonding pad groups, and the other folding piece is connected with the third bonding pad of the two adjacent bonding pad groups opposite to the two adjacent bonding pad groups.
Furthermore, the bending piece comprises a first horizontal piece connected with a third bonding pad of the two adjacent bonding pad groups, a vertical piece connected with the end part of the first horizontal piece and a second horizontal piece arranged at the lower end of the vertical piece and extending inwards, and the first horizontal piece is provided with a stress hole.
Furthermore, each pad group and each first connecting piece are integrally formed, and the first pad, the second pad and the second connecting piece of each pad group are also integrally formed.
The utility model discloses following beneficial effect has:
1. the utility model discloses a welding frame includes a plurality of concatenations and forms closed annular pad group, pad group is then including the first pad of upper and lower interval arrangement, second pad and third pad, each pad group all corresponds the ceramic capacitor chip that a plurality of levels were arranged, in use, the second pad of each pad group is rather than the electrically conductive end upside welding of a plurality of ceramic capacitor chips that correspond, third pad and the welding of another electrically conductive end downside of these ceramic capacitor chips, second pad and third pad interval arrangement, can avoid two electrically conductive end intercommunication short circuits of ceramic capacitor chip, the third pad also can be regarded as the supporting mechanism of ceramic capacitor chip, after the welding is accomplished, recycle follow-up process and make the plastic envelope, can form plate array capacitor filter, so do not set up the wire in whole capacitor filter, but regard welding frame as electrically conductive mechanism, can guarantee electrically conductive reliability, and first, second and third pad are the annular and arrange with one heart, when plate array capacitor filter uses, can pass the first of each pad group with many wire pole respectively, second and third pad group lead out and the ceramic capacitor chip and the pad group is used for the welding of the ceramic capacitor chip and the pad again because of the change because of the welding, thus the ceramic capacitor chip has the bonding pad and the bonding pad between the multiple sets of the welding, and the ceramic capacitor chip, thereby the welding environment change.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the ceramic capacitor chip of the present invention after being welded.
Fig. 3 is a schematic structural diagram of a plate array capacitor filter.
11, a first bonding pad; 12. a second pad; 13. a third pad; 14. a second connecting sheet; 15. leading-out terminals; 151. a first horizontal sheet; 152. a vertical sheet; 153. a second horizontal plate; 154. a stress hole; 2. a first connecting piece; 3. a ceramic capacitor chip; 4. plastic packaging the shell; 5. a junction pole; 51. a circular ring.
Detailed Description
As shown in fig. 1 to 3, the plate-type array capacitor filter includes a solder frame, a plurality of ceramic capacitor chips 3, six connection rods 5, and a plastic package 4. The welding frame comprises six groups of pad groups which are connected in series through a first connecting piece 2 and form a closed ring shape, each pad group comprises a first pad 11, a second pad 12, a third pad 13, a second connecting piece 14 connected between the first pad 11 and the second pad 12 and a leading-out end 15 connected with the third pad 13, the first pad 11, the second pad 12 and the third pad 13 are arranged at intervals up and down, the first pad 11, the second pad 12 and the third pad 13 are all annular pads and are arranged concentrically, each pad group corresponds to four horizontally arranged ceramic capacitor chips 3, the diameter of the third pad 13 is larger than that of the corresponding second pad 12, the diameter of the first pad 11 is smaller than that of the corresponding second pad 12, the second connecting piece 14 is arranged between the edges of the first pad 11 and the second pad 12, the second pad 12 of each pad group is welded with the upper sides of the conductive ends of the four ceramic capacitor chips 3 corresponding to the third pad 13, the third pad 13 is welded with the lower sides of the other conductive ends of the ceramic capacitor chips 3, and the second pad 12 and the third pad 13 are matched to enable the ceramic capacitor chips 3 to keep horizontal and support the third pad 13.
In the six groups of welding disc groups, two pairs of welding disc groups are oppositely arranged, the other two welding disc groups are positioned between the two pairs of welding disc groups, each pair of welding disc groups comprises two adjacent welding disc groups which are oppositely arranged, the leading-out end 15 comprises two oppositely arranged bending pieces in the shape like a Chinese character '21274', wherein the bending pieces are connected with one pair of welding disc groups in a team, and the other bending piece is connected with the other pair of welding disc groups in a pair. More specifically, the bending piece comprises a first horizontal piece 151 connected with the third bonding pads 13 of two adjacent bonding pad groups, a vertical piece connected with the end part of the first horizontal piece 151, and a second horizontal piece arranged at the lower end of the vertical piece and extending inwards, and the first horizontal piece 151 is provided with a stress hole 154 to improve the mechanical stress of the welding frame.
In the present embodiment, the third pad 13, the first connecting piece 2, and the lead 15 of each pad group are integrally formed, and the first pad 11, the second pad 12, and the second connecting piece 14 of each pad group are also integrally formed.
After the ceramic capacitor chips 3 are welded, the subsequent die pressing process is utilized, and die pressing is carried out according to the frame after the ceramic capacitor chips 3 are welded, so that the insulated plastic package shell 4 is formed, more specifically, the plastic package shell 4 is made of epoxy molding compound, and part of the vertical pieces 152 and the first transverse pieces of the leading-out terminals 15 are positioned outside the plastic package shell 4, so that grounding is facilitated. Then, six wiring rods 5 respectively penetrate through the first bonding pad 11, the second bonding pad 12 and the third bonding pad 13 of each bonding pad group and are welded with the first bonding pad 11, the wiring rods 5 are in the prior art, in order to facilitate the welding of the wiring rods 5 and the first bonding pad 11, the first bonding pad 11 of each bonding pad group is located at the upper end of the plastic package shell 4, and the wiring rods 5 are provided with circular rings 51. When the plate-type array capacitor filter is used, the contact pins are connected to two ends of the junction pole 5, or the connection wires are welded to two ends of the junction pole 5, and the leading-out end 15 is connected with a shell of a product using the plate-type array capacitor filter of the embodiment or the ground on a PCB (printed circuit board), so that a filtering function can be realized.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is to be construed as being modified and modified in accordance with the appended claims and their equivalents.
Claims (6)
1. A welding frame for a plate array capacitor filter for welding a plurality of ceramic capacitor chips, comprising: the ceramic capacitor chip packaging structure comprises a plurality of groups of bonding pads which are connected in series through first connecting pieces and form a closed ring shape, wherein each bonding pad group comprises a first bonding pad, a second bonding pad, a third bonding pad, a second connecting piece and a leading-out end, the first bonding pad, the second bonding pad and the third bonding pad are arranged at intervals up and down, the second connecting piece is connected between the first bonding pad and the second bonding pad, the leading-out end is connected with the third bonding pad, the first bonding pad, the second bonding pad and the third bonding pad are all annular bonding pads and are arranged concentrically, each bonding pad group corresponds to a plurality of horizontally arranged ceramic capacitor chips, in use, the second bonding pad of each bonding pad group is welded with the upper side of one conductive end of each ceramic capacitor chip corresponding to the second bonding pad, and the third bonding pad is welded with the lower side of the other conductive end of each ceramic capacitor chip.
2. A solder frame for a plate array capacitor filter as claimed in claim 1, wherein: the diameter of the third bonding pad of each bonding pad group is larger than that of the corresponding second bonding pad.
3. A solder frame for a plate array capacitor filter as claimed in claim 1, wherein: the diameter of the first bonding pad of each bonding pad group is smaller than that of the corresponding second bonding pad, and the second connecting piece is arranged between the edges of the first bonding pad and the second bonding pad.
4. A solder frame for a plate array capacitor filter according to claim 1 or 2 or 3, wherein: the leading-out end comprises two oppositely arranged '21274', a bending piece is connected with the third bonding pad of two adjacent bonding pad groups, and the other bending piece is connected with the third bonding pad of the two adjacent bonding pad groups opposite to the two adjacent bonding pad groups.
5. A solder frame for a plate array capacitor filter according to claim 4, wherein: the bending piece comprises a first horizontal piece connected with a third bonding pad of two adjacent bonding pad groups, a vertical piece connected with the end part of the first horizontal piece and a second horizontal piece arranged at the lower end of the vertical piece and extending inwards, and the first horizontal piece is provided with a stress hole.
6. A solder frame for a plate array capacitor filter according to claim 1 or 2 or 3, wherein: each pad group and each first connecting piece are integrally formed, and the first pad, the second pad and the second connecting piece of each pad group are also integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221055553.3U CN217562411U (en) | 2022-05-05 | 2022-05-05 | Welding frame for plate-type array capacitor filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221055553.3U CN217562411U (en) | 2022-05-05 | 2022-05-05 | Welding frame for plate-type array capacitor filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217562411U true CN217562411U (en) | 2022-10-11 |
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ID=83474879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221055553.3U Active CN217562411U (en) | 2022-05-05 | 2022-05-05 | Welding frame for plate-type array capacitor filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217562411U (en) |
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2022
- 2022-05-05 CN CN202221055553.3U patent/CN217562411U/en active Active
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