CN217719334U

CN217719334U - Welding frame for multi-core group capacitor filter

Info

Publication number: CN217719334U
Application number: CN202221053942.2U
Authority: CN
Inventors: 朱江滨; 叶育辉; 吴育东; 黄新宽; 黄晓云
Original assignee: Fujian Torch Electron Technology Co ltd
Current assignee: Fujian Torch Electron Technology Co ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2022-11-01
Anticipated expiration: 2032-05-05

Abstract

The utility model provides a welding frame for multicore group electric capacity filter, including the first pad of upper and lower interval arrangement, second pad and third pad, connect first, connection piece between the second pad and the end of drawing forth of being connected with the third pad, it is first, second and third pad are the annular and arrange with one heart, the diameter of third pad is greater than the second pad, during the use, a plurality of ceramic electric capacity chip levels are arranged, the upside welding of the electrically conductive end of second pad and each ceramic electric capacity chip, the downside welding of the electrically conductive end of third pad and each ceramic electric capacity chip another. The utility model discloses can weld a plurality of ceramic capacitor chip simultaneously, make multicore group condenser can change the capacitance according to actual conditions, be applicable to multiple environment, and the reliability is high.

Description

Welding frame for multi-core group capacitor filter

Technical Field

The utility model relates to a welding frame for multicore group capacitor filter.

Background

The interior of the existing ceramic capacitor filter is a special non-standard ceramic capacitor which is produced by manufacturers, has single model, can only be suitable for a certain specific occasion, has poor adaptability, is difficult to adjust and change according to the actual use condition, can not flexibly change the capacitance, and has low reliability.

SUMMERY OF THE UTILITY MODEL

The utility model provides a welding frame for multicore group electric capacity filter can weld a plurality of ceramic capacitor chip simultaneously, makes multicore group condenser can change the electric capacity according to actual conditions, is applicable to multiple environment, and the reliability is high.

The utility model discloses a following technical scheme realizes:

the utility model provides a welding frame for multicore group electric capacity filter, be used for with a plurality of ceramic capacitor chip welding, including the first pad of upper and lower interval arrangement, second pad and third pad, connect connection piece between first, the second pad and the end of drawing forth of being connected with the third pad, first, second and third pad are the annular and arrange with one heart, the diameter of third pad is greater than the second pad, during the use, a plurality of ceramic capacitor chip horizontal layout, the upside welding of second pad and each ceramic capacitor chip electrically conductive end, the downside welding of third pad and each ceramic capacitor chip other electrically conductive end.

Further, the diameter of the first bonding pad is smaller than that of the second bonding pad, and the connecting piece is arranged between the edges of the first bonding pad and the second bonding pad.

Further, the leading-out end comprises four bending pieces shaped like a Chinese character '\21274', which are arranged on the third bonding pad at intervals.

Furthermore, the connecting piece comprises a first transverse piece arranged at the edge of the first bonding pad, a vertical piece arranged at the end part of the first transverse piece and extending downwards, and a second transverse piece arranged between the lower end of the vertical piece and the first transverse piece.

Furthermore, the first pad, the second pad and the connecting sheet are integrally formed, and the third pad and the leading-out end are integrally formed.

The utility model discloses following beneficial effect has:

1. the utility model discloses a first pad of upper and lower interval arrangement, second pad and third pad, during the use, it is first, the second pad passes through the connection piece and connects, second pad and the welding of a conductive end upside of each ceramic capacitor chip, third pad and the welding of another conductive end downside of each ceramic capacitor chip, second pad and third pad interval arrangement, can avoid ceramic capacitor chip two conductive end intercommunication short circuit, third pad diameter is greater than the second pad, can make each ceramic capacitor chip keep the level to be arranged, also can regard as the supporting mechanism of ceramic capacitor chip, the welding is accomplished the back, recycle follow-up process and make the plastic envelope shell, can form multicore group electric capacity filter, so do not set up the wire in the whole multicore group electric capacity filter, but regard welding frame as electrically conductive mechanism, can guarantee electrically conductive reliability, it is first, second and third pad are annular and multicore concentric arrangement, when multicore group electric capacity filter uses, can adopt the connecting rod to pass first, second and third pad and with connecting rod and first pad welding pad, the end then is used for ground connection, and because of between second and the third pad, therefore the ceramic capacitor chip that a plurality of electric capacity group electric capacity filter can change according to the welding condition of a plurality of ceramic capacitor chip, thereby the change according to the ceramic capacitor group electric capacity filter that the welding.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is the schematic diagram of the utility model after the ceramic capacitor chip is welded.

Fig. 3 is a schematic structural diagram of a multi-core group capacitive filter.

Wherein, 1, a first pad; 2. a second bonding pad; 3. a third pad; 4. connecting sheets; 41. a first cross piece; 42. a vertical sheet; 43. a second cross piece; 5. leading out the terminal; 6. a ceramic capacitor chip; 7. plastic packaging the shell; 8. a wire connecting rod; 81. a circular ring.

Detailed Description

As shown in fig. 1 to 3, the multi-core group capacitor filter includes a plastic package housing 7, a welding frame, 4 ceramic capacitor chips 6 and a connection rod 8, the welding frame includes a first pad 1, a second pad 2 and a third pad 3 which are arranged at an upper and lower interval, a connection sheet 4 connected between the first pad 1 and the second pad 2, and a leading-out terminal 5 connected with the third pad 3, the first pad 1, the second pad 2 and the third pad 3 are all arranged in a ring shape and concentrically, the diameter of the third pad 3 is larger than that of the second pad 2, the diameter of the first pad 1 is smaller than that of the second pad 2, when in use, the four ceramic capacitor chips 6 are arranged horizontally, the second pad 2 is welded to the upper side of one conductive terminal of each ceramic capacitor chip 6, and the third pad 3 is welded to the lower side of the other conductive terminal of each ceramic capacitor chip 6.

The leading-out terminal 5 comprises four bending pieces shaped like Chinese character '\' 21274arranged on the third bonding pad 3 at intervals. The connecting sheet 4 is arranged between the edges of the first bonding pad 1 and the second bonding pad 2, and the connecting sheet 4 comprises a first transverse sheet 41 arranged at the edge of the first bonding pad 1, a vertical sheet 42 arranged at the end part of the first transverse sheet 41 and extending downwards, and a second transverse sheet 43 arranged between the lower end of the vertical sheet 42 and the first transverse sheet 41.

In this embodiment, the vertical piece 42 disposed at the end of the first horizontal piece 41 and extending downward and the second horizontal piece 43 disposed between the lower end of the vertical piece 42 and the first horizontal piece 41 are integrally formed, and the third pad 3 and the terminal 5 are integrally formed, so that the production is simple and convenient.

After the four ceramic capacitor chips 6 are welded between the second bonding pad 2 and the third bonding pad 3, the subsequent die pressing process is utilized, and die pressing is carried out according to a frame after the ceramic capacitor chips 6 are welded to form the insulated plastic package shell 7, more specifically, the plastic package shell 7 is made of epoxy molding compound, and part of the vertical pieces 42 and the first transverse pieces 43 of the leading-out terminals 4 are located outside the plastic package shell so as to be conveniently grounded. Then pass first pad 1, second pad 2 and third pad 3 with terminal lever 8 and with first pad 1 welding, terminal lever 8 is prior art, and when multicore group condenser used, utilize the contact pin to connect in terminal lever 8 both ends, perhaps weld the wiring in terminal lever 8 both ends, draw forth end 5 then with use the shell of the product of the multicore group capacitor filter of this embodiment or the ground on the PCB board be connected, can realize filtering function. The annular design of the first pad 1, the second pad 2 and the third pad 3 can provide a space through which the terminal bar 8 passes. In order to facilitate the welding of the wiring rod 8 and the first bonding pad 1, the first bonding pad 1 is located at the upper end of the plastic package shell 7, and a circular ring 81 is arranged on the wiring rod 8.

The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.

Claims

1. A welding frame for a multiple core group capacitor filter for welding to a plurality of ceramic capacitor chips, comprising: the ceramic capacitor chip comprises a first bonding pad, a second bonding pad, a third bonding pad, a connecting piece and a leading-out end, wherein the first bonding pad, the second bonding pad and the third bonding pad are arranged at an upper interval and a lower interval, the connecting piece is connected between the first bonding pad and the second bonding pad, the leading-out end is connected with the third bonding pad, the first bonding pad, the second bonding pad and the third bonding pad are arranged in an annular shape and in a concentric mode, the diameter of the third bonding pad is larger than that of the second bonding pad, when the ceramic capacitor chip is used, a plurality of ceramic capacitor chips are arranged horizontally, the second bonding pad is welded with the upper side of one conductive end of each ceramic capacitor chip, and the third bonding pad is welded with the lower side of the other conductive end of each ceramic capacitor chip.

2. A welding frame for a multi-core group capacitive filter as claimed in claim 1, wherein: the first bonding pad is smaller in diameter than the second bonding pad, and the connecting piece is arranged between the edges of the first bonding pad and the second bonding pad.

3. A welding frame for a multi-core group capacitive filter as claimed in claim 2, wherein: the leading-out end comprises four bending pieces shaped like a Chinese character '\' 21274arranged on the third bonding pad at intervals.

4. A welding frame for a multi-core group capacitive filter according to claim 2 or 3, characterized in that: the connecting piece comprises a first transverse piece arranged at the edge of the first bonding pad, a vertical piece arranged at the end part of the first transverse piece and extending downwards, and a second transverse piece arranged between the lower end of the vertical piece and the first transverse piece.

5. A welding frame for a multi-core group capacitive filter according to claim 1, 2 or 3, characterized in that: the first bonding pad, the second bonding pad and the connecting piece are integrally formed, and the third bonding pad and the leading-out end are integrally formed.