CN112802685A - Plate-type array multi-core group ceramic capacitor filter and production method thereof - Google Patents
Plate-type array multi-core group ceramic capacitor filter and production method thereof Download PDFInfo
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- CN112802685A CN112802685A CN202110102898.3A CN202110102898A CN112802685A CN 112802685 A CN112802685 A CN 112802685A CN 202110102898 A CN202110102898 A CN 202110102898A CN 112802685 A CN112802685 A CN 112802685A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 20
- 238000004382 potting Methods 0.000 claims abstract description 14
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000012945 sealing adhesive Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 11
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 11
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 8
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a plate-type array multi-core-group ceramic capacitor filter which comprises an upper PCB, a lower PCB, a plurality of connecting rods, a plurality of ceramic capacitor groups and a potting adhesive layer, wherein the upper PCB and the lower PCB are vertically arranged at intervals, a plurality of first annular bonding pads are arranged on the lower surface of the upper PCB at intervals, the upper PCB is also provided with a plurality of first through holes respectively positioned in the first annular bonding pads, the first annular bonding pads are connected in series through a conducting wire, the lower PCB is provided with a plurality of second through holes corresponding to the first through holes, a second annular bonding pad is arranged at each second through hole, the diameter of each first annular bonding pad is larger than that of each second annular bonding pad, each connecting rod respectively penetrates through the first through hole and the second through hole, and a group of ceramic capacitor groups is arranged at each connecting rod. The invention also provides a production method of the ceramic capacitor filter. The invention adopts a conventional universal standard ceramic capacitor inside, improves the welding and assembling modes, has strong adaptability, small processing difficulty, flexible capacity change and long service life.
Description
Technical Field
The invention relates to a plate-type array multi-core group ceramic capacitor filter and a production method thereof.
Background
As described in a high-temperature ceramic plate array capacitor and a method for manufacturing the same (patent No. 202010555887.6), a conventional plate array ceramic capacitor filter is formed by forming a ceramic dielectric having a disk shape or other shape from a ceramic material and then providing a desired electrode on the ceramic dielectric to form a ceramic capacitor body. Such ceramic capacitor filters have the following drawbacks: firstly, the ceramic capacitor main part is the special non-standard ceramic capacitor of its producer self-production, and the model is single, can only be applicable to certain specific occasion, and adaptability is poor, and secondly the processing degree of difficulty is big, and thirdly can not change the electric capacity in a flexible way, and fourthly because of ceramic dielectric area is great, still breaks easily in the use, and life is short.
Disclosure of Invention
The invention aims to provide a plate-type array multi-core group ceramic capacitor filter and a production method thereof aiming at the defects of the prior art.
The invention is realized by the following technical scheme:
a plate-type array multi-core group ceramic capacitor filter comprises an upper PCB, a lower PCB, a plurality of connecting rods, a plurality of ceramic capacitor groups and a potting adhesive layer, wherein the upper PCB and the lower PCB are vertically arranged at intervals, a plurality of first annular bonding pads are arranged on the lower surface of the upper PCB at intervals, the upper PCB is also provided with a plurality of first through holes respectively positioned in the first annular bonding pads, the first annular bonding pads are connected in series through a lead, the lower PCB is provided with a plurality of second through holes corresponding to the first through holes, each second through hole is provided with a second annular bonding pad, the diameter of each first annular bonding pad is larger than that of each second annular bonding pad, each connecting rod respectively passes through the first through hole and the second through hole, each connecting rod is provided with a group of ceramic capacitor groups, each ceramic capacitor group comprises a plurality of capacitor chips, one end of each capacitor chip is welded on the first annular bonding pad, the other end of each capacitor chip, the connecting rod is communicated with the second arc-shaped bonding pad, and the encapsulating adhesive layer is positioned between the first PCB and the lower PCB so as to fill the gap between the first through hole and the second through hole and the connecting rod and the gap between the upper PCB and the lower PCB.
Furthermore, a plurality of first annular bonding pads arranged on the upper PCB are arranged into a plurality of concentric rings with gradually increased radiuses, and a first annular bonding pad is arranged at the center of each concentric ring.
Furthermore, the edge of the upper PCB is provided with a grounding plug-in hole, the upper surface of the upper PCB is provided with a grounding pad, the grounding pad is arranged at the grounding plug-in hole, and the first annular pad is connected with the grounding pad through a wire.
Furthermore, a grounding limiting hole corresponding to the grounding plug-in hole is formed in the edge of the lower PCB.
Furthermore, the ceramic capacitor group comprises four capacitor chips which are uniformly distributed on the circumference, and the other end of each capacitor chip is tangent to the connecting rod.
Further, the upper PCB plate and the lower PCB plate have the same shape and can be circular, square or polygonal.
Furthermore, the potting adhesive layer is epoxy resin potting adhesive.
Further, the first through hole is concentric with the corresponding first annular bonding pad.
The invention is also realized by the following technical scheme:
a production method of a plate-type array multi-core group ceramic capacitor filter comprises the following steps:
A. arranging the lower PCB array on a welding jig, and printing solder paste on each second annular bonding pad by using a printer;
B. uniformly distributing the capacitor chips of each ceramic capacitor group on the lower PCB by using a chip mounter, enabling the other end of each capacitor chip to correspond to the second annular bonding pad, and then inserting each wiring rod;
C. arranging the upper PCB array on another welding jig, and printing solder paste on each first annular bonding pad by using a printer;
D. b, fixing and positioning the two welding jigs, and buckling and installing the upper PCB on the lower PCB after the step B, wherein one end of each capacitor chip corresponds to the first annular bonding pad;
E. after the solder is welded through reflow soldering, gaps between the first through hole and the second through hole and the connecting rod and between the upper PCB and the lower PCB are filled and sealed, and a filling and sealing adhesive layer is formed after filling and sealing solidification, so that production is completed.
Further, the welding jig comprises a bottom plate and a plurality of grooves arranged on the bottom plate in an array mode, the grooves are matched with the upper PCB and the lower PCB, third through holes are formed in the grooves and can expose all the first through holes or the second through holes, and inward protruding portions are arranged on the edges of the grooves to be completely matched with the upper PCB or the lower PCB.
The invention has the following beneficial effects:
1. the filter is provided with the upper PCB and the lower PCB at intervals, and the ceramic capacitor chip is arranged between the upper PCB and the lower PCB, is a conventional universal standard ceramic capacitor in the market, and can select a proper number of standard ceramic capacitors to achieve required performance indexes according to actual use scenes, so that the capacitance of the filter can be flexibly changed, and the adaptability is high; the upper PCB is provided with a plurality of first annular bonding pads which are connected in series through a lead, the lower PCB is provided with a plurality of second annular bonding pads which respectively correspond to the first annular bonding pads, one end of each ceramic capacitor chip is welded on the first annular bonding pad, and the other end of each ceramic capacitor chip is welded on the second annular bonding pad; the arrangement of the first annular bonding pad and the second annular bonding pad can ensure that two ends of the ceramic capacitor chip cannot be communicated with a short circuit, and the normal use of the ceramic filter is ensured; in the production process, the positioning accuracy of the chip mounter can be improved through the design of the first annular bonding pad and the second annular bonding pad, and mass production can be carried out through the cooperation of the first annular bonding pad and the second annular bonding pad, so that the production efficiency is improved.
2. The first annular welding pads are arranged to form a plurality of concentric rings with gradually increased radiuses, the first annular welding pads are arranged at the circle centers of the concentric rings, and the second annular welding pads are correspondingly arranged.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic view of the structure of the present invention (removing the potting adhesive layer).
FIG. 3 is a schematic structural view of the present invention (removing the potting adhesive layer and the upper PCB).
FIG. 4 is a schematic structural view of the present invention (with the potting adhesive layer, the lower PCB and the tie bars removed).
Fig. 5-1 is a schematic view of the structure of the upper PCB board of the present invention (showing the lower surface).
Fig. 5-2 is a schematic view of the structure of the upper PCB board of the present invention (showing the upper surface).
FIG. 6 is a schematic structural diagram of a lower PCB board according to the present invention.
Fig. 7 is a schematic structural diagram of a welding jig of the present invention.
Wherein, 1, an upper PCB board; 11. a first annular pad; 12. a first through hole; 13. a wire; 14. a ground plug-in hole; 15. a ground pad; 2. a lower PCB board; 21. a second ring pad; 22. a second through hole; 23. a ground limiting hole; 3. a connecting rod; 4. a capacitor chip; 5. pouring a sealing adhesive layer; 61. a base plate; 62. a groove; 63. a third through hole; 64. a projection.
Detailed Description
As shown in fig. 1 to 6, the plate-type array multi-core group ceramic capacitor filter can be used on an interactive plug-in component of a large-scale device, and includes an upper PCB 1, a lower PCB 2, a plurality of connecting rods 3, a plurality of ceramic capacitor groups, and a potting adhesive layer 5. Go up PCB board 1, lower PCB board 2 vertical interval arrangement, go up PCB board 1 lower surface interval and be provided with a plurality of first annular pad 11, go up PCB board 1 and still be provided with a plurality of first through-holes 12 that are located each first annular pad 11 respectively, first through-hole 12 is concentric rather than the first annular pad 11 that corresponds, and each first annular pad 11 concatenates through wire 13. The upper and lower surfaces of the lower PCB have the same structure, and specifically, the lower PCB 2 is provided with a plurality of second through holes 22 corresponding to the first through holes 12, each second through hole 22 is provided with a second annular pad 21, and the second annular pad 21 includes a portion disposed on the upper and lower surfaces of the lower PCB 2 and a portion disposed inside the second through hole 22. The first annular bonding pad 11 has a larger diameter than the second annular bonding pad 21, and the first annular bonding pads 11 are arranged in a plurality of concentric rings with gradually increasing radii, and one first annular bonding pad 11 is arranged at the center of each concentric ring. Each connecting rod 3 passes first through-hole 12 respectively, second through-hole 22, each connecting rod 3 department all is provided with a set of ceramic capacitor group, ceramic capacitor group includes a plurality of condenser chip 4, the one end welding of each condenser chip 4 is on first annular pad 11, the other end welding is on second annular pad 21, connecting rod 3 and second arc pad intercommunication, potting compound glue film 5 is located first PCB board, with filling first through-hole 12 between the lower PCB, the space between second through-hole 22 and the connecting rod 3, and go up PCB board 1, space between the lower PCB board 2.
Two opposite grounding plug-in holes 14 are formed in the edge of the upper PCB 1, a grounding pad 15 is arranged on the upper surface of the upper PCB 1, the grounding pad 15 is arranged at the position of the grounding plug-in hole 14, and the first annular pad 11 is connected with the grounding pad 15 through a lead 13. Two grounding limiting holes 23 corresponding to the two grounding plug-in holes 14 are formed in the edge of the lower PCB 2.
In this embodiment, the ceramic capacitor bank includes four capacitor chips 4 uniformly distributed circumferentially, and the other end of each capacitor chip 4 is tangent to the connecting rod 3. In other embodiments, each ceramic capacitor bank may include a different number of capacitor chips 4 to suit the needs of the corresponding operating application.
In this embodiment, the upper PCB 1 and the lower PCB 2 have the same shape and are both circular.
In the present embodiment, the potting adhesive layer 5 is an epoxy resin potting adhesive.
The production method of the plate-type array multi-core group ceramic capacitor filter comprises the following steps:
A. arranging the lower PCB 2 array on a welding jig, and printing solder paste on each second annular bonding pad 21 by using a printer; as shown in fig. 7, the welding jig is already provided with a lower PCB 2, the welding jig includes a bottom plate 61 and six grooves 62 (in other embodiments, other numbers of grooves 62 may be provided, as the case may be, that are arranged on the bottom plate 61 in an array), the grooves 62 are matched with the upper and lower PCBs 2, a third through hole 63 is provided in the groove 62, the third through hole 63 may expose all of the first through holes 12 or the second through holes 22, and an inward protrusion 64 is provided at an edge of the groove 62 to be completely matched with the upper PCB 1 or the lower PCB 2;
B. uniformly distributing the capacitor chips 4 of each ceramic capacitor group on the lower PCB 2 by using a chip mounter, enabling the other ends of the capacitor chips 4 to correspond to the second annular bonding pad 21, and then inserting the wiring rods, as shown in FIG. 3;
C. arranging the upper PCB 1 array on another welding jig, and printing solder paste on each first annular bonding pad 11 by using a printer;
D. b, fixing and positioning the two welding jigs, and buckling and installing the upper PCB 1 on the lower PCB 2 obtained in the step B, wherein one end of each capacitor chip 4 corresponds to the first annular bonding pad 11, as shown in FIG. 2;
E. after the solder is welded through reflow soldering, gaps among the first through hole 12, the second through hole 22 and the connecting rod 3 and gaps among the upper PCB 1 and the lower PCB 2 are encapsulated, and an encapsulating adhesive layer 5 is formed after encapsulation and solidification, so that production is completed, as shown in fig. 1.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (10)
1. A plate-type array multi-core group ceramic capacitor filter is characterized in that: the ceramic capacitor comprises an upper PCB, a lower PCB, a plurality of connecting rods, a plurality of ceramic capacitor groups and a potting adhesive layer, wherein the upper PCB and the lower PCB are arranged at vertical intervals, a plurality of first annular bonding pads are arranged on the lower surface of the upper PCB at intervals, the upper PCB is also provided with a plurality of first through holes respectively positioned in the first annular bonding pads, the first annular bonding pads are connected in series through a lead, a plurality of second through holes corresponding to the first through holes are arranged on the lower PCB, a second annular bonding pad is arranged at each second through hole, the diameter of each first annular bonding pad is larger than that of each second annular bonding pad, each connecting rod respectively penetrates through the first through hole and the second through hole, a group of ceramic capacitor groups is arranged at each connecting rod, each ceramic capacitor group comprises a plurality of capacitor chips, one end of each capacitor chip is welded on the first annular bonding pad, the other end of each capacitor chip is welded on the second annular bonding pad, the connecting rods are communicated, The lower PCB is filled with a gap between the first through hole and the connecting rod and a gap between the upper PCB and the lower PCB.
2. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, wherein: a plurality of first annular bonding pads arranged on the upper PCB are arranged into a plurality of concentric rings with gradually increased radiuses, and a first annular bonding pad is arranged at the circle center of each concentric ring.
3. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, wherein: the PCB comprises an upper PCB and a lower PCB, and is characterized in that a grounding plug-in hole is formed in the edge of the upper PCB, a grounding pad is arranged on the upper surface of the upper PCB, the grounding pad is arranged at the grounding plug-in hole, and the first annular pad is connected with the grounding pad through a wire.
4. A plate array multi-core group ceramic capacitor filter as claimed in claim 3, wherein: and the edge of the lower PCB is provided with a grounding limiting hole corresponding to the grounding plug-in hole.
5. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, 2, 3 or 4, wherein: the ceramic capacitor group comprises four capacitor chips which are uniformly distributed on the circumference, and the other end of each capacitor chip is tangent to the connecting rod.
6. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, 2, 3 or 4, wherein: the upper PCB and the lower PCB are identical in shape and can be circular, square or polygonal.
7. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, 2, 3 or 4, wherein: the potting adhesive layer is epoxy resin potting adhesive.
8. A plate array multi-core group ceramic capacitor filter as claimed in claim 1, 2, 3 or 4, wherein: the first through hole is concentric with the corresponding first annular bonding pad.
9. A production method of a plate-type array multi-core group ceramic capacitor filter is characterized by comprising the following steps: the method comprises the following steps:
A. arranging the lower PCB array on a welding jig, and printing solder paste on each second annular bonding pad by using a printer;
B. uniformly distributing the capacitor chips of each ceramic capacitor group on the lower PCB by using a chip mounter, enabling the other end of each capacitor chip to correspond to the second annular bonding pad, and then inserting each wiring rod;
C. arranging the upper PCB array on another welding jig, and printing solder paste on each first annular bonding pad by using a printer;
D. b, fixing and positioning the two welding jigs, and buckling and installing the upper PCB on the lower PCB after the step B, wherein one end of each capacitor chip corresponds to the first annular bonding pad;
E. after the solder is welded through reflow soldering, gaps between the first through hole and the second through hole and the connecting rod and between the upper PCB and the lower PCB are filled and sealed, and a filling and sealing adhesive layer is formed after filling and sealing solidification, so that production is completed.
10. The method for producing a plate-array multi-core-group ceramic capacitor filter as claimed in claim 9, wherein: the welding jig comprises a base plate and a plurality of grooves arranged on the base plate in an array mode, the grooves are matched with the upper PCB and the lower PCB, third through holes are formed in the grooves and can expose all the first through holes or the second through holes, and inward protruding portions are arranged on the edges of the grooves to be completely matched with the upper PCB or the lower PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102898.3A CN112802685A (en) | 2021-01-26 | 2021-01-26 | Plate-type array multi-core group ceramic capacitor filter and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102898.3A CN112802685A (en) | 2021-01-26 | 2021-01-26 | Plate-type array multi-core group ceramic capacitor filter and production method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112802685A true CN112802685A (en) | 2021-05-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110102898.3A Pending CN112802685A (en) | 2021-01-26 | 2021-01-26 | Plate-type array multi-core group ceramic capacitor filter and production method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114758893A (en) * | 2022-05-05 | 2022-07-15 | 福建火炬电子科技股份有限公司 | Plate-type array capacitor filter and production method thereof |
| CN114914645A (en) * | 2022-05-05 | 2022-08-16 | 福建火炬电子科技股份有限公司 | Multi-core group capacitor filter and production method thereof |
-
2021
- 2021-01-26 CN CN202110102898.3A patent/CN112802685A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114758893A (en) * | 2022-05-05 | 2022-07-15 | 福建火炬电子科技股份有限公司 | Plate-type array capacitor filter and production method thereof |
| CN114914645A (en) * | 2022-05-05 | 2022-08-16 | 福建火炬电子科技股份有限公司 | Multi-core group capacitor filter and production method thereof |
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