CN1635594A - Technique for making laminated ceramic capacitor - Google Patents
Technique for making laminated ceramic capacitor Download PDFInfo
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- CN1635594A CN1635594A CN 200310117543 CN200310117543A CN1635594A CN 1635594 A CN1635594 A CN 1635594A CN 200310117543 CN200310117543 CN 200310117543 CN 200310117543 A CN200310117543 A CN 200310117543A CN 1635594 A CN1635594 A CN 1635594A
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Abstract
This invention relates to electron element technique field and discloses a piece ceramic medium capacitor process method, which comprises the following: introducing the connector lead wire and mode shape sealing to the capacitor process, which firstly processes the connector sealing set; then cutting the set into single sealing part to bend over the lead wire; finally knitting the product and the sealing is used as ceramic sealing isolation material shell by welding upper and down connection wire.
Description
Technical field:
The present invention relates to the electronic component technology field, refer in particular to a kind of method of manufacturing technology of sheets type ceramic dielectric capacitor.
Background technology:
High-voltage ceramic capacitor, the AC capacitor of producing has disk high-voltage ceramic capacitor, chip multilayer ceramic capacitor etc. at present.The disk high-voltage ceramic capacitor is a traditional structure, and its production technology is the lead-in wire of burn-oning on by silver-colored ceramics, and lead-in wire is two thin long leads, makes the silver-colored ceramics of the quilt surface of burn-oning after going between wrap one deck insulating material housing, and this insulating material is an epoxy resin.
The circuit board that components and parts are installed has two apertures to give the capacitor plug-in mounting, and this installation form manufacturability is poor, can not tolerate high mechanical oscillation or impact, and because lead-in inductance, the frequency of utilization upper limit is restricted.The development trend that be to adapt to miniaturization, slimming, the electronic component structure form is changed into surface card dress (SMT) and is become irresistible trend by being used for traditional plug-in.Chip multilayer ceramic capacitor can satisfy the needs that SMT mounts production, it can be made into high pressure larger capacity capacitor, has certain difficulty but make than the capacitor of low capacity, and its process equipment and technology want complicated a lot, cause industrialization cost height, selling price is also high.Under this background, our company's independent development the chip high-voltage ceramic capacitor, and utility application has been proposed on April 29th, 2002, now obtained the utility model patent (patent No.: ZL02227213.5) that State Intellectual Property Office authorizes.
In this patent, our company has designed chip high-voltage ceramic capacitor (70), as shown in Figure 1, its structure is by silver-colored ceramics (10), mould shell (71) and two lead-in wires (21,31), by positive and negative two silver electrodes (11 of silver-colored ceramics (10), 12) be welded with lead-in wire (21 on respectively, 31), moulding shell (71) is sealing by silver-colored ceramics (10) and is being welded in by the lead-in wire (21 on the silver-colored ceramics (10), 31) a end, moulded shell (71) by silver-colored ceramics (10) and sealed back formation cube shaped, lead-in wire (21,31) be flat, lead-in wire (21,31) be exposed to the end edge of moulding outside the shell (71) and mould shell (71) bending, its termination is fixed on the same plane of moulding shell (71).Mould shell (71) and adopt epoxy resin, go between (21,31) but the employing conducting metal, the same constructed products of the existing expansion of chip high-voltage ceramic capacitor thus also has chip AC capacitor, chip secondary capacitor.
For realizing the industrialization production of this product, our company has developed the method for manufacturing technology of sheets type ceramic dielectric capacitor specially.
Summary of the invention:
But purpose of the present invention just is to provide a kind of industrialization to produce the manufacture method of chip high-voltage ceramic capacitor, chip AC capacitor, chip secondary capacitor.
The present invention is achieved through the following technical solutions: the method for manufacturing technology of sheets type ceramic dielectric capacitor, welding lead on by silver-colored ceramics, and make the silver-colored ceramics molded packages of quilt insulating material housing behind the welding lead, it is characterized in that: disjunctor lead-in wire and molded packages are introduced in the production technology of ceramic capacitor, to realize the chip type and the automated production of sheets type ceramic dielectric capacitor.
Description of drawings:
Accompanying drawing 1 is the structural representation of chip high-voltage ceramic capacitor
Accompanying drawing 2 is the stereogram of following disjunctor lead-in wire
Stereogram after accompanying drawing 3 welds together for upper and lower disjunctor lead-in wire and by silver-colored ceramics
Accompanying drawing 4 is the left view of accompanying drawing 3
Accompanying drawing 5 is the stereogram of disjunctor plastic part group (50)
Accompanying drawing 6 is with after disjunctor plastic part group (50) incision, the shaping, the stereogram of single plastic part (60)
Accompanying drawing 7 is the stereogram of sheets type ceramic dielectric capacitor (70)
Accompanying drawing 8 is the partial enlarged drawing of accompanying drawing 3 (be added with and mould shell (71))
Embodiment:
The method of manufacturing technology of sheets type ceramic dielectric capacitor, welding lead on by silver-colored ceramics, and make the silver-colored ceramics molded packages of quilt insulating material housing behind the welding lead, it is characterized in that: disjunctor lead-in wire and molded packages are introduced in the production technology of ceramic capacitor, to realize the chip type and the automated production of sheets type ceramic dielectric capacitor.Specifically follow these steps to finish successively:
1. it is identical to go up disjunctor lead-in wire (20) and following disjunctor (30) shape that goes between; Place upper and lower corresponding lead ends (22) that goes up disjunctor lead-in wire (20) and following disjunctor to go between between the lead ends (32) of (30) the silver-colored ceramics of a collection of quilt (10), and between by the solder side (23) of the last silver electrode (11) of silver-colored ceramics (10) and lead ends (22), by the following silver electrode (12) of silver-colored ceramics (10) and following disjunctor, go between and apply soldering paste (28,38) respectively between the solder side (33) of lead ends (32) of (30).Following disjunctor lead-in wire (30) as shown in Figure 2.
2. will go up disjunctor lead-in wire (20), descend disjunctor lead-in wire (30) and welded together, shown in Fig. 3,4,8 by silver-colored ceramics (10).
The silver-colored ceramics of quilt (10) that 3. will be welded between disjunctor lead-in wire (20), following disjunctor lead-in wire (30) is put into mould, mould envelope body (40) in flakes with the epoxy resin mold encapsulation, last disjunctor lead-in wire (20), following disjunctor lead-in wire (30) are formed disjunctor plastic part group (50) with plastic-sealed body (40), as shown in Figure 5.
4. last disjunctor lead-in wire (20), the following disjunctor lead-in wire (30) with disjunctor plastic part group (50) is that a unit is cut into single plastic part (60) with a plastic-sealed body (40), as shown in Figure 6.
5. going up of plastic part (60) gone between (21) and go between down (31) along the surperficial bending of plastic-sealed body (40), be flattened on the same plane of plastic part (60), then make single piece type ceramic capacitor (70), as shown in Figure 7.
6. sheets type ceramic dielectric capacitor (70) is carried out braid.
Shown in Fig. 2,8, following disjunctor lead-in wire (30) makes progress into π shape bending (34) between the solder side (33) of lead ends (32), after will descending disjunctor lead-in wire (30) to cut, can strengthen go between down (31) together by the thrust between silver-colored ceramics (10), the solder side (33) that makes lead ends (32) simultaneously is near still being filled capsulation material between the edge of silver-colored ceramics (10) together by the edge of silver-colored ceramics (10), as shown in Figure 4, can reduce the arcing phenomena of chip individual layer high-voltage ceramic capacitor (70) like this.
Following disjunctor lead-in wire (30) locates to be provided with fabrication hole (35) in π shape bending (34), is in order to improve the precision of π shape bending (34).
Following disjunctor lead-in wire (30) is provided with location hole (37) on disjunctor bar (36), be for the ease of processing down disjunctor lead-in wire (30), and is convenient to down disjunctor lead-in wire (30) and is accurately located during the coating soldering paste between silver-colored ceramics (10).
The shape of disjunctor lead-in wire (30) is identical down together for last disjunctor lead-in wire (20), and the purpose which is provided with π shape bending (24), fabrication hole (25) and location hole (27) is same as above.
Adopt disjunctor lead-in wire mode, once can be simultaneously on the disjunctor lead-in wire welding last consignment of enhanced productivity greatly by silver-colored ceramics, and the disjunctor lead-in wire is provided with location hole, is convenient to automated production equipment it is grasped the location, so just can realize large-scale production.
The silver-colored ceramics of quilt that is welded between upper and lower disjunctor lead-in wire is put into mould, mould the envelope body in flakes, adopt the molded packages mode can realize the chip type production of ceramic capacitor with the epoxy resin mold encapsulation.
Claims (8)
1. the method for manufacturing technology of sheets type ceramic dielectric capacitor, welding lead on by silver-colored ceramics, and make the silver-colored ceramics molded packages of quilt insulating material housing behind the welding lead, it is characterized in that: disjunctor lead-in wire and molded packages are introduced in the production technology of ceramic capacitor, to realize the chip type and the automated production of sheets type ceramic dielectric capacitor.
2. the method for manufacturing technology of sheets type ceramic dielectric capacitor as claimed in claim 1, it is characterized in that: this method specifically follows these steps to finish successively:
1. it is identical to go up disjunctor lead-in wire (20) and following disjunctor (30) shape that goes between; Place upper and lower corresponding lead ends (22) that goes up disjunctor lead-in wire (20) and following disjunctor to go between between the lead ends (32) of (30) the silver-colored ceramics of a collection of quilt (10), and between by the solder side (23) of the last silver electrode (11) of silver-colored ceramics (10) and lead ends (22), by the following silver electrode (12) of silver-colored ceramics (10) and following disjunctor, go between and apply soldering paste (28,38) respectively between the solder side (33) of lead ends (32) of (30).
2. will go up disjunctor lead-in wire (20), descend disjunctor lead-in wire (30) and welded together by silver-colored ceramics (10).
The silver-colored ceramics of quilt (10) that 3. will be welded between disjunctor lead-in wire (20), following disjunctor lead-in wire (30) moulds envelope body (40) in flakes with the epoxy resin mold encapsulation, and last disjunctor lead-in wire (20), following disjunctor lead-in wire (30) are formed disjunctor plastic part group (50) with plastic-sealed body (40).
4. last disjunctor lead-in wire (20), the following disjunctor lead-in wire (30) with disjunctor plastic part group (50) is that a unit cuts and be shaped to single plastic part (60) with a plastic-sealed body (40).
5. going up of plastic part (60) gone between (21) and go between down (31) along the surperficial bending of plastic-sealed body (40), be flattened on the same plane of plastic part (60), then make single piece type ceramic capacitor (70).
6. sheets type ceramic dielectric capacitor (70) is carried out braid.
3. the last disjunctor lead-in wire (20) shown in claim 1 or 2 is characterized in that: go up disjunctor lead-in wire (20) and make progress into π shape bending (24) between the solder side (23) of lead ends (22).
4. the following disjunctor shown in claim 1 or 2 goes between (30), it is characterized in that: following disjunctor lead-in wire (30) becomes the same disjunctor lead-in wire (20) π shape bending (34) equally downwards from the solder side (33) of lead ends (32).
5. the last disjunctor lead-in wire (20) shown in claim 3 is characterized in that: go up disjunctor lead-in wire (20) and locate to be provided with fabrication hole (25) in π shape bending (24).
6. the following disjunctor shown in claim 4 goes between (30), it is characterized in that: following disjunctor lead-in wire (30) locates to be provided with fabrication hole (35) in π shape bending (34).
7. the last disjunctor lead-in wire (20) shown in claim 3 is characterized in that: go up disjunctor lead-in wire (20) and be provided with location hole (27) on disjunctor bar (26).
8. the last disjunctor shown in claim 4 goes between (20), it is characterized in that: following disjunctor lead-in wire (30) is provided with location hole (37) on disjunctor bar (36).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310117543 CN1635594A (en) | 2003-12-26 | 2003-12-26 | Technique for making laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310117543 CN1635594A (en) | 2003-12-26 | 2003-12-26 | Technique for making laminated ceramic capacitor |
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| CN1635594A true CN1635594A (en) | 2005-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200310117543 Pending CN1635594A (en) | 2003-12-26 | 2003-12-26 | Technique for making laminated ceramic capacitor |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105161299A (en) * | 2015-09-29 | 2015-12-16 | 株洲宏达陶电科技有限公司 | Preparation method for multi-core-set porcelain capacitor lead wire and lead wire |
| CN108109796A (en) * | 2017-12-14 | 2018-06-01 | 贵州凯里经济开发区中昊电子有限公司 | The production method of SMD plastic-packaged electronic components and the metal tape of use |
| CN108257750A (en) * | 2018-03-07 | 2018-07-06 | 朱同江 | The production method and product of plastic packaging patch hot pressing sensitive resistor |
| CN108492953A (en) * | 2018-03-27 | 2018-09-04 | 朱同江 | The production method and product of communication interface plastic packaging paster thermistor device |
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
| CN109300689A (en) * | 2018-11-02 | 2019-02-01 | 北京元六鸿远电子科技股份有限公司 | Molding Surface Mount ceramic capacitor and preparation method with non-slip groove |
| CN115229286A (en) * | 2022-09-21 | 2022-10-25 | 广东南方宏明电子科技股份有限公司 | Chip component assembling and welding process |
-
2003
- 2003-12-26 CN CN 200310117543 patent/CN1635594A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105161299A (en) * | 2015-09-29 | 2015-12-16 | 株洲宏达陶电科技有限公司 | Preparation method for multi-core-set porcelain capacitor lead wire and lead wire |
| CN108109796A (en) * | 2017-12-14 | 2018-06-01 | 贵州凯里经济开发区中昊电子有限公司 | The production method of SMD plastic-packaged electronic components and the metal tape of use |
| CN108257750A (en) * | 2018-03-07 | 2018-07-06 | 朱同江 | The production method and product of plastic packaging patch hot pressing sensitive resistor |
| CN108492953A (en) * | 2018-03-27 | 2018-09-04 | 朱同江 | The production method and product of communication interface plastic packaging paster thermistor device |
| CN108493119A (en) * | 2018-05-11 | 2018-09-04 | 朱同江 | Production method of patch electronics components and products thereof |
| CN109300689A (en) * | 2018-11-02 | 2019-02-01 | 北京元六鸿远电子科技股份有限公司 | Molding Surface Mount ceramic capacitor and preparation method with non-slip groove |
| CN115229286A (en) * | 2022-09-21 | 2022-10-25 | 广东南方宏明电子科技股份有限公司 | Chip component assembling and welding process |
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