CN2672824Y - Conjoined leading wire of sheet type ceramic capacitor - Google Patents
Conjoined leading wire of sheet type ceramic capacitor Download PDFInfo
- Publication number
- CN2672824Y CN2672824Y CN 200320119725 CN200320119725U CN2672824Y CN 2672824 Y CN2672824 Y CN 2672824Y CN 200320119725 CN200320119725 CN 200320119725 CN 200320119725 U CN200320119725 U CN 200320119725U CN 2672824 Y CN2672824 Y CN 2672824Y
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- conjoined
- disjunctor
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model relates to the technical field of an electronic element and discloses a conjoined leading wire of sheet type ceramic capacitor (30), characterized in that it comprises a conjoined bar (36); a lead wire (31) which is equidistant and identical with the conjoined bar (36) is extended from the same side of the conjoined bar (36); the lead wire is bent downwards on the solder side (33) of the lead wire end (32), forming a pi-shaped bending (34). A fabrication hole (35) is arranged on the position of the pi-shaped bending (34). A positioning hole (37) is arranged on the conjoined bar (36). Due to the conjoined lead wire mode, the product manufacturing processing quality is ensured; the production efficiency is improved; the large scale automatic production is realized.
Description
Technical field:
The utility model relates to the electronic component technology field, refers in particular to a kind of disjunctor lead-in wire of sheets type ceramic dielectric capacitor.
Background technology:
The high-voltage ceramic capacitor of producing has disk high-voltage ceramic capacitor, chip multilayer ceramic capacitor etc. at present.The disk high-voltage ceramic capacitor is a traditional structure, and its production technology is the lead-in wire of burn-oning on by silver-colored ceramics, and lead-in wire is two thin long leads, makes the silver-colored ceramics of the quilt surface of burn-oning after going between wrap one deck insulating material housing, and this insulating material is an epoxy resin.
The circuit board that components and parts are installed has two apertures to give the capacitor plug-in mounting, and this installation form manufacturability is poor, can not tolerate high mechanical oscillation or impact, and because lead-in inductance, the frequency of utilization upper limit is restricted.The development trend that be to adapt to miniaturization, slimming, the electronic component structure form is changed into surface card dress (SMT) and is become irresistible trend by being used for traditional plug-in.Chip multilayer ceramic capacitor can satisfy the needs that SMT mounts production, it can be made into high pressure larger capacity capacitor, has certain difficulty but make than the capacitor of low capacity, and its process equipment and technology want complicated a lot, cause industrialization cost height, selling price is also high.Under this background, our company's independent development chip individual layer high-voltage ceramic capacitor, and utility application has been proposed on April 29th, 2002, now obtained the utility model patent (patent No.: ZL02227213.5) that State Intellectual Property Office authorizes.
In this patent, our company has designed chip high-voltage ceramic capacitor (70), as shown in Figure 1, its structure is by silver-colored ceramics (10), mould shell (71) and two lead-out wires (21,31), by the tow sides silver electrode (11 of silver-colored ceramics (10), 12) be welded with lead-in wire (21 on respectively, 31), moulding shell (71) is sealing by silver-colored ceramics (10) and is being welded in by the lead-in wire (21 on the silver-colored ceramics (10), 31) a end, moulded shell (71) by silver-colored ceramics (10) and sealed back formation cube shaped, lead-in wire (21,31) be flat, lead-in wire (21,31) be exposed to the end edge of moulding outside the shell (71) and mould shell (71) bending, its termination is fixed on the same plane of moulding shell (71).Mould shell (71) and adopt epoxy resin, go between (21,31) but the employing conducting metal.
For realizing the industrialization production of this product, our company has developed the method for manufacturing technology of sheets type ceramic dielectric capacitor specially, and the disjunctor lead-in wire is introduced in its production technology.
The utility model content:
The purpose of this utility model just be to provide can a kind of new construction lead-in wire, can realize the mass automatic production of product.
The utility model is achieved by the following technical solution: the disjunctor lead-in wire (30) of sheets type ceramic dielectric capacitor, it is characterized in that: it comprises disjunctor bar (36), extend equidistant identical lead-in wire (31) in the same side of disjunctor bar (36), between the solder side (33) of lead ends (32), become π shape bending (34) downwards.
Description of drawings:
Accompanying drawing 1 is the structural representation of sheets type ceramic dielectric capacitor
Accompanying drawing 2 is the stereogram of following disjunctor lead-in wire
Stereogram after accompanying drawing 3 welds together for upper and lower disjunctor lead-in wire and by silver-colored ceramics
Accompanying drawing 4 is the left view of accompanying drawing 3
Accompanying drawing 5 is the stereogram of disjunctor plastic part group (50)
Accompanying drawing 6 is with after disjunctor plastic part group (50) incision, the shaping, the stereogram of single plastic part (60).
Accompanying drawing 7 is the stereogram of sheets type ceramic dielectric capacitor (70)
Accompanying drawing 8 is the partial enlarged drawing of accompanying drawing 3
Embodiment:
The manufacture method of sheets type ceramic dielectric capacitor is a welding lead on by silver-colored ceramics, and make the silver-colored ceramics molded packages of quilt insulating material housing behind the welding lead, it is characterized in that: disjunctor lead-in wire and molded packages are introduced in its production technology, to realize its chip type and automated production, specifically follow these steps to finish successively:
1. placed corresponding lead ends (22) that goes up disjunctor lead-in wire (20) and following disjunctor to go between between the lead ends (32) of (30) by silver-colored ceramics (10) row, and between by the solder side (23) of the last silver electrode (11) of silver-colored ceramics (10) and lead ends (22), by the following silver electrode (12) of silver-colored ceramics (10) and following disjunctor, go between and apply soldering paste between the solder side (33) of lead ends (32) of (30).Following disjunctor lead-in wire (30) as shown in Figure 2.
2. will go up disjunctor lead-in wire (20), descend disjunctor lead-in wire (30) and welded together, shown in Fig. 3,4,8 by silver-colored ceramics (10).
The silver-colored ceramics of quilt (10) that 3. will be welded between disjunctor lead-in wire (20), following disjunctor lead-in wire (30) is put into mould, mould envelope body (40) in flakes with the epoxy resin mold encapsulation, last disjunctor lead-in wire (20), following disjunctor lead-in wire (30) are formed disjunctor plastic part group (50) with plastic-sealed body (40), as shown in Figure 5.
4. last disjunctor lead-in wire (20), the following disjunctor lead-in wire (30) with disjunctor plastic part group (50) is that a unit is cut into single plastic part (60) with a plastic-sealed body (40), as shown in Figure 6.
5. going up of plastic part (60) gone between (21) and go between down (31) along the surperficial bending of plastic-sealed body (40), be flattened on the same plane of plastic part (60), then make single piece type ceramic capacitor (70), as shown in Figure 7.
6. sheets type ceramic dielectric capacitor (70) is carried out braid.
Guarantee the processing quality that product is made, can enhance productivity, and then realize mass automatic production.
Shown in Fig. 2,8, following disjunctor lead-in wire (30) makes progress into π shape bending (34) between the solder side (33) of lead ends (32), after will descending disjunctor lead-in wire (30) to cut, can strengthen go between down (31) together by the thrust between silver-colored ceramics (10), the solder side (33) that makes lead ends (32) simultaneously is near still being filled capsulation material between the edge of silver-colored ceramics (10) together by the edge of silver-colored ceramics (10), as shown in Figure 4, can reduce the arcing phenomena of chip individual layer high-voltage ceramic capacitor (70) like this.
Following disjunctor lead-in wire (30) locates to be provided with fabrication hole (35) in π shape bending (34), is in order to improve the precision of π shape bending (34).
Following disjunctor lead-in wire (30) is provided with location hole (37) on disjunctor bar (36), be for the ease of processing down disjunctor lead-in wire (30), and is convenient to down disjunctor lead-in wire (30) and is accurately located during the coating soldering paste between silver-colored ceramics (10).
The shape of disjunctor lead-in wire (30) is identical down together for last disjunctor lead-in wire (20), and the purpose which is provided with π shape bending (24), fabrication hole (25) and location hole (27) is same as above.
Adopt disjunctor lead-in wire mode, once can be simultaneously on the disjunctor lead-in wire welding last consignment of enhanced productivity greatly by silver-colored ceramics, and the disjunctor lead-in wire is provided with location hole, is convenient to automated production equipment it is grasped the location, so just can realize large-scale production.
Claims (3)
1. the disjunctor of sheets type ceramic dielectric capacitor lead-in wire (30), it is characterized in that: it comprises disjunctor bar (36), extend equidistant identical lead-in wire (31) in the same side of disjunctor bar (36), between the solder side (33) of lead ends (32), become π shape bending (34) downwards.
2. the disjunctor of the sheets type ceramic dielectric capacitor shown in claim 1 lead-in wire (30) is characterized in that: locate to be provided with fabrication hole (35) in π shape bending (34).
3. the disjunctor of the sheets type ceramic dielectric capacitor shown in claim 1 or 2 lead-in wire (30) is characterized in that: be provided with location hole (37) on disjunctor bar (36).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119725 CN2672824Y (en) | 2003-12-26 | 2003-12-26 | Conjoined leading wire of sheet type ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320119725 CN2672824Y (en) | 2003-12-26 | 2003-12-26 | Conjoined leading wire of sheet type ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2672824Y true CN2672824Y (en) | 2005-01-19 |
Family
ID=34475757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320119725 Expired - Fee Related CN2672824Y (en) | 2003-12-26 | 2003-12-26 | Conjoined leading wire of sheet type ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2672824Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161299A (en) * | 2015-09-29 | 2015-12-16 | 株洲宏达陶电科技有限公司 | Preparation method for multi-core-set porcelain capacitor lead wire and lead wire |
-
2003
- 2003-12-26 CN CN 200320119725 patent/CN2672824Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161299A (en) * | 2015-09-29 | 2015-12-16 | 株洲宏达陶电科技有限公司 | Preparation method for multi-core-set porcelain capacitor lead wire and lead wire |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101096957B1 (en) | Electromagnetic coil means | |
| JP5312021B2 (en) | Surface mount capacitor and manufacturing method thereof | |
| CN1008569B (en) | Invariable inductance and its manufacturing process | |
| CN103280298A (en) | Inductance coil and laser-cutting manufacturing method of inductance coil | |
| CN1635594A (en) | Technique for making laminated ceramic capacitor | |
| CN114334428B (en) | Manufacturing method of integrally-formed molded inductor | |
| CN1086055A (en) | 3-terminal noise filter and manufacture process thereof | |
| CN204792436U (en) | Multicore piece integrated form surface mounting type ann rule condenser | |
| CN2672824Y (en) | Conjoined leading wire of sheet type ceramic capacitor | |
| CN113053636B (en) | Large-current surface-mounted power inductor and manufacturing method thereof | |
| CN211670063U (en) | Forming structure of surface-mounted inductor | |
| EP0443044A1 (en) | Lead frame for semiconductor device and semiconductor device using the lead frame | |
| CN111899970A (en) | Preparation method of inductor | |
| CN1260745C (en) | Anticurrent coil and its manufacturing method | |
| CN202058519U (en) | Novel precise metal film plastic package resistor | |
| CN110911145A (en) | Method for manufacturing inductive elements in batches | |
| CN2541937Y (en) | Chip high voltage ceramic capacitor | |
| CN2720593Y (en) | Sheet-type ac. ceramic-medium capacitor | |
| CN103038878A (en) | Diode package having improved lead wire and manufacturing method thereof | |
| JPH08130164A (en) | Chip-type solid electrolytic capacitor | |
| CN220691850U (en) | Improved miniature inductor | |
| CN2718744Y (en) | Sheet type voltage-dependent resistor | |
| CN2461152Y (en) | Packing image sensing chip with transparent piece | |
| CN214956862U (en) | Chip packaging structure and packaged chip | |
| CN218101253U (en) | Pre-molded lead frame for semiconductor device and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Guangdong Nanfang Hongming Electronic Co. Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Guangdong Nanfang Hongming Electronic Co. Ltd. Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050119 Termination date: 20121226 |