CN106003382A - Forming press of ceramic medium chip of high-pressure ceramic capacitor - Google Patents

Forming press of ceramic medium chip of high-pressure ceramic capacitor Download PDF

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Publication number
CN106003382A
CN106003382A CN201610545893.7A CN201610545893A CN106003382A CN 106003382 A CN106003382 A CN 106003382A CN 201610545893 A CN201610545893 A CN 201610545893A CN 106003382 A CN106003382 A CN 106003382A
Authority
CN
China
Prior art keywords
disk
annulus
recess
protuberance
convex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610545893.7A
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Chinese (zh)
Inventor
钱云春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU HONGQUAN HIGH VOLTAGE CAPACITOR Co Ltd
Original Assignee
SUZHOU HONGQUAN HIGH VOLTAGE CAPACITOR Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU HONGQUAN HIGH VOLTAGE CAPACITOR Co Ltd filed Critical SUZHOU HONGQUAN HIGH VOLTAGE CAPACITOR Co Ltd
Priority to CN201610545893.7A priority Critical patent/CN106003382A/en
Publication of CN106003382A publication Critical patent/CN106003382A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B13/00Feeding the unshaped material to moulds or apparatus for producing shaped articles; Discharging shaped articles from such moulds or apparatus
    • B28B13/04Discharging the shaped articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B15/00General arrangement or layout of plant Industrial outlines, plant installations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B5/00Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in, or on conveyors irrespective of the manner of shaping
    • B28B5/06Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in, or on conveyors irrespective of the manner of shaping in moulds on a turntable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B7/00Moulds; Cores; Mandrels
    • B28B7/0097Press moulds; Press-mould and press-ram assemblies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B7/00Moulds; Cores; Mandrels
    • B28B7/10Moulds with means incorporated therein, or carried thereby, for ejecting or detaching the moulded article

Abstract

The invention discloses a forming press of a ceramic medium chip of a high-pressure ceramic capacitor. The forming press comprises a rotating disc capable of rotating; multiple round holes are uniformly formed in the peripheral direction of the rotating disc; lower molds are respectively arranged in all the round holes; and the lower molds include ring lower concave parts and disc lower convex parts upwards projected. The rotating disc is provided with a feeding station, a punching station and an unloading station in the rotating direction in sequence. An upper mold capable of lifting the height is arranged rightly above the punching station, and includes a ring upper concave part and a disc upper convex part downwards projected. A vertical groove, a transverse groove, a spring and an unloading plate are arranged on the disc upper convex part; and ejecting rods capable of lifting the heights are arranged in the disc lower convex parts. The unloading station includes an unloading push rod and an unloading groove. After the structure is adopted, the forming press can automatically punch the ceramic medium chip of the high-pressure ceramic capacitor, and is high in punching efficiency and excellent in molding; and the punched ceramic medium chip is small in size, high in capacitance, difficult to generate cracks or burrs and high in compressive strength.

Description

A kind of high voltage ceramic capacitor ceramic dielectric chip moulding press
Technical field
The present invention relates to ceramic capacitor production field, particularly a kind of high voltage ceramic capacitor porcelain Dielectric chip moulding press.
Background technology
Traditional discrete component ceramic capacitor is based on disc, and this shaping structures is simple List, technical maturity, easy and simple to handle, it is simple to mass, large-scale production.But for high pressure For ceramic capacitor, primary concern is that compressive resistance and rated capacitors are the highest.And Between Zhe Liangzhe, the most conflicting.Under equal conditions: medium is the thinnest, capacitance is more Greatly, compressive resistance is the lowest, and vice versa.Traditional disc type ceramic capacitor volume is relatively large, It is unfavorable for the assembling of electrical device.
It addition, during ceramic capacitor molding, easily produce burr or crackle.Follow-up insulation coating Time, when, under identical coating, due to burr or the existence of crackle, ceramic capacitor being made Insulation thickness difference is big, also makes the compressive resistance of ceramic capacitor reduce.
Summary of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, and provides one Plant high voltage ceramic capacitor ceramic dielectric chip moulding press, this high voltage ceramic capacitor ceramic dielectric core Sheet moulding press energy automatic press high voltage ceramic capacitor ceramic dielectric chip, ram efficiency is high, becomes Type is good, and the ceramic dielectric chip volume stamped out is little, and capacitance is big and is not likely to produce crackle or hair Thorn, compressive resistance is high.
For solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of high voltage ceramic capacitor ceramic dielectric chip moulding press, ceramic dielectric chip includes coaxially The disk recess arranged and annulus protuberance, disk recess is positioned at the inside of annulus protuberance, and annulus is convex The thickness in portion is disk recess thickness 1.2~3 times, a diameter of ceramic dielectric chip of disk recess 2/3~4/5;The disk recess of disk recess and the junction of annulus protuberance are provided with circular arc, porcelain Dielectric chip is overall compressing.
Moulding press includes the rotating disk that can rotate, and rotating disk is circumferentially evenly arranged with some Individual circular hole, is placed with a lower mold in each circular hole;Lower mold includes annulus lower concave part and convex Protuberance under the disk risen.
Rotating disk is disposed with feed station, stamping station and unloading station along direction of rotation.
Feed station is provided above feed pipe.
The upper mold being arranged above highly can lifting of stamping station;Upper mold includes on annulus Recess and downwardly convex disk upper convex portion.
Disk upper convex portion is all corresponding with the disk recess of ceramic dielectric chip with protuberance under disk;Circle Ring upper recess is all corresponding with the annulus protuberance of ceramic dielectric chip with annulus lower concave part.
The junction of protuberance and annulus upper recess and disk epirelief under annulus lower concave part and disk The junction in portion is provided with the chamfering corresponding with circular arc.
Being provided with vertical slot in disk upper convex portion, the bottom of vertical slot is provided with connect horizontal Groove;It is provided with spring in vertical slot, in transverse groove, is provided with stripper;One end of spring is fixed In vertical slot, the other end of spring is fixing with stripper to be connected;When the spring is compressed, discharging The bottom of plate can be with the bottom flush of disk upper convex portion.
The ejector beam that height can lift it is provided with in protuberance under disk.
Unloading station includes discharge ram and the blowpit being arranged on rotating disk side, discharge ram Ceramic dielectric chip on unloading station can be pushed on blowpit.
The quantity of described circular hole is 8.
The quantity of described circular hole is 6.
Described blowpit is inclined at the side of rotating disk.
Between described blowpit and horizontal plane in sharp clevis angle be 30~60 °.
After the present invention uses said structure, can automatic press high voltage ceramic capacitor ceramic dielectric core Sheet, ram efficiency is high, and forming, the ceramic dielectric chip volume stamped out is little, and capacitance is big And it being not likely to produce crackle or burr, compressive resistance is high.
Accompanying drawing explanation
Fig. 1 is the structure of the present invention a kind of high voltage ceramic capacitor ceramic dielectric chip moulding press Schematic diagram.
Fig. 2 shows the structural representation of upper mold.
Fig. 3 shows the structural representation of lower mold.
Fig. 4 shows the structural representation of ceramic dielectric chip.
Detailed description of the invention
With concrete better embodiment the present invention made further details of theory below in conjunction with the accompanying drawings Bright.
As shown in Figures 1 to 4, a kind of high voltage ceramic capacitor ceramic dielectric chip moulding press, Including upper mold 1, annulus upper recess 11, disk upper convex portion 12, vertical slot 121, spring 122, Protuberance 22 under transverse groove 123, stripper 124, lower mold 2, annulus lower concave part 21, disk, Ejector beam 221, rotating disk 3, circular hole 31, stamping station 32, feed station 33, charging Pipe 331, unloading station 34, discharge ram 341, blowpit 342, ceramic dielectric chip 4, The technical characteristics such as annulus protuberance 41, disk recess 42 and circular arc 43.
As shown in Figure 4, ceramic dielectric chip includes disk recess and the annulus protuberance being coaxially disposed, Disk recess is positioned at the inside of annulus protuberance.
The thickness of annulus protuberance is disk recess thickness 1.2~3 times, preferably 1.2~2 times, enters One step is preferably 1.2~1.6 times.
The 2/3~4/5 of a diameter of ceramic dielectric chip of disk recess.
The junction of disk recess and annulus protuberance is provided with circular arc, and the angle of circular arc is preferably 15-60 °, more preferably 45 °.The setting of this circular arc, can prevent molding burr and split The generation of stricture of vagina, compacting qualification rate is high.
Above-mentioned ceramic dielectric chip is overall compressing.
Can be used for arranging interior electrode on disk recess, annulus protuberance can be used for arrange external electrode.
As it is shown in figure 1, moulding press includes the rotating disk that can rotate, rotating disk is the most equal Even several circular holes that is provided with, are placed with a lower mold in each circular hole;Under as it is shown on figure 3, Mould includes annulus lower concave part and protuberance under the disk raised up.
Rotating disk is disposed with feed station, stamping station and unloading station along direction of rotation.
Feed station is provided above feed pipe.
The upper mold being arranged above highly can lifting of stamping station.On as in figure 2 it is shown, Mould includes annulus upper recess and downwardly convex disk upper convex portion.
Disk upper convex portion is all corresponding with the disk recess of ceramic dielectric chip with protuberance under disk;Circle Ring upper recess is all corresponding with the annulus protuberance of ceramic dielectric chip with annulus lower concave part.
The junction of protuberance and annulus upper recess and disk epirelief under annulus lower concave part and disk The junction in portion is provided with the chamfering corresponding with circular arc.
Being provided with vertical slot in disk upper convex portion, the bottom of vertical slot is provided with connect horizontal Groove;It is provided with spring in vertical slot, in transverse groove, is provided with stripper;One end of spring is fixed In vertical slot, the other end of spring is fixing with stripper to be connected;When the spring is compressed, discharging The bottom of plate can be with the bottom flush of disk upper convex portion.
The ejector beam that height can lift it is provided with in protuberance under disk.Ejector beam is preferably by arranging Motor in rotating disk is driven.
Unloading station includes discharge ram and the blowpit being arranged on rotating disk side, discharge ram Ceramic dielectric chip on unloading station can be pushed on blowpit.
The quantity of above-mentioned circular hole is preferably 8 or 6.
Further, above-mentioned blowpit is inclined at the side of rotating disk, blowpit and horizontal plane Between in sharp clevis angle be preferably 30~60 °.
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited to Detail in above-mentioned embodiment, in the technology concept of the present invention, can be to this The technical scheme of invention carries out multiple equivalents, and these equivalents belong to the guarantor of the present invention Protect scope.

Claims (5)

1. a high voltage ceramic capacitor ceramic dielectric chip moulding press, it is characterised in that: porcelain is situated between Matter chip includes disk recess and the annulus protuberance being coaxially disposed, and disk recess is positioned at annulus protuberance Inside, the thickness of annulus protuberance is disk recess thickness 1.2~3 times, the diameter of disk recess For ceramic dielectric chip 2/3~4/5;The disk recess of disk recess and the junction of annulus protuberance Being provided with circular arc, ceramic dielectric chip is overall compressing;
Moulding press includes the rotating disk that can rotate, and rotating disk is circumferentially evenly arranged with some Individual circular hole, is placed with a lower mold in each circular hole;Lower mold includes annulus lower concave part and convex Protuberance under the disk risen;
Rotating disk is disposed with feed station, stamping station and unloading station along direction of rotation;
Feed station is provided above feed pipe;
The upper mold being arranged above highly can lifting of stamping station;Upper mold includes on annulus Recess and downwardly convex disk upper convex portion;
Disk upper convex portion is all corresponding with the disk recess of ceramic dielectric chip with protuberance under disk;Circle Ring upper recess is all corresponding with the annulus protuberance of ceramic dielectric chip with annulus lower concave part;
The junction of protuberance and annulus upper recess and disk epirelief under annulus lower concave part and disk The junction in portion is provided with the chamfering corresponding with circular arc;
Being provided with vertical slot in disk upper convex portion, the bottom of vertical slot is provided with connect horizontal Groove;It is provided with spring in vertical slot, in transverse groove, is provided with stripper;One end of spring is fixed In vertical slot, the other end of spring is fixing with stripper to be connected;When the spring is compressed, discharging The bottom of plate can be with the bottom flush of disk upper convex portion;
The ejector beam that height can lift it is provided with in protuberance under disk;
Unloading station includes discharge ram and the blowpit being arranged on rotating disk side, discharge ram Ceramic dielectric chip on unloading station can be pushed on blowpit.
High voltage ceramic capacitor ceramic dielectric chip moulding press the most according to claim 1, It is characterized in that: the quantity of described circular hole is 8.
High voltage ceramic capacitor ceramic dielectric chip moulding press the most according to claim 1, It is characterized in that: the quantity of described circular hole is 6.
High voltage ceramic capacitor ceramic dielectric chip moulding press the most according to claim 1, It is characterized in that: described blowpit is inclined at the side of rotating disk.
High voltage ceramic capacitor ceramic dielectric chip moulding press the most according to claim 4, It is characterized in that: between described blowpit and horizontal plane in sharp clevis angle be 30~60 °.
CN201610545893.7A 2016-07-12 2016-07-12 Forming press of ceramic medium chip of high-pressure ceramic capacitor Pending CN106003382A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610545893.7A CN106003382A (en) 2016-07-12 2016-07-12 Forming press of ceramic medium chip of high-pressure ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610545893.7A CN106003382A (en) 2016-07-12 2016-07-12 Forming press of ceramic medium chip of high-pressure ceramic capacitor

Publications (1)

Publication Number Publication Date
CN106003382A true CN106003382A (en) 2016-10-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610545893.7A Pending CN106003382A (en) 2016-07-12 2016-07-12 Forming press of ceramic medium chip of high-pressure ceramic capacitor

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001155957A (en) * 1999-04-30 2001-06-08 Matsushita Electric Ind Co Ltd Electronic component
US20020154985A1 (en) * 2001-04-20 2002-10-24 Schmidt Scientific Taiwan Ltd. Automatic dipping machine
CN202428526U (en) * 2011-11-12 2012-09-12 广东南方宏明电子科技股份有限公司 Press die for forming ceramic discs of ceramic dielectric capacitors with circular discs
CN104701009A (en) * 2015-02-10 2015-06-10 鞍山奇发电子陶瓷科技有限公司 Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor
CN105583944A (en) * 2016-02-19 2016-05-18 福州欣翔威电子科技有限公司 Dry pressing equipment for ceramic capacitors
CN205835624U (en) * 2016-07-12 2016-12-28 苏州宏泉高压电容器有限公司 A kind of high voltage ceramic capacitor ceramic dielectric chip moulding press

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001155957A (en) * 1999-04-30 2001-06-08 Matsushita Electric Ind Co Ltd Electronic component
US20020154985A1 (en) * 2001-04-20 2002-10-24 Schmidt Scientific Taiwan Ltd. Automatic dipping machine
CN202428526U (en) * 2011-11-12 2012-09-12 广东南方宏明电子科技股份有限公司 Press die for forming ceramic discs of ceramic dielectric capacitors with circular discs
CN104701009A (en) * 2015-02-10 2015-06-10 鞍山奇发电子陶瓷科技有限公司 Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor
CN105583944A (en) * 2016-02-19 2016-05-18 福州欣翔威电子科技有限公司 Dry pressing equipment for ceramic capacitors
CN205835624U (en) * 2016-07-12 2016-12-28 苏州宏泉高压电容器有限公司 A kind of high voltage ceramic capacitor ceramic dielectric chip moulding press

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161012

WD01 Invention patent application deemed withdrawn after publication