CN107578930A - A kind of capacitor fast packing method - Google Patents
A kind of capacitor fast packing method Download PDFInfo
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- CN107578930A CN107578930A CN201710883868.4A CN201710883868A CN107578930A CN 107578930 A CN107578930 A CN 107578930A CN 201710883868 A CN201710883868 A CN 201710883868A CN 107578930 A CN107578930 A CN 107578930A
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- China
- Prior art keywords
- capacitor
- battery core
- packing method
- stamped groove
- encapsulating structure
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Abstract
The invention discloses a kind of capacitor fast packing method, comprise the following steps：Pretreatment, melt melten gel, pressure injection-moulded and die sinking.Capacitor fast packing method of the present invention, pass through encapsulating structure, capacitor battery core is packaged using pressure injection-moulded mode, such method for packing speed of production is fast, efficiency high, effectively improve the sealing effectiveness between packaging body and capacitor battery core, so it is not likely to produce between the contact surface of eutectic dispensing and capacitor battery core because of hole, and then avoid because encapsulate it is bad cause in air moisture intrusion capacitor internal influence its electrical characteristic intensity, even it is caused to damage, so as to which its service life be greatly improved, cause that capacitor battery core surface is more smooth simultaneously, strengthen conductor terminal and the bonding strength of the junction of capacitor battery core, avoid it easily damaged, so that the encapsulation of battery core is more firm, further lift the yield rate of battery core encapsulation and the service life of capacitor.
Description
Technical field
The present invention relates to capacitor package technical field, and in particular to a kind of capacitor fast packing method.
Background technology
Capacitor has been widely used for consumer electrical home appliances, computer motherboard and its periphery, power supply unit, led to
The primary element of product and automobile etc. is interrogated, its main effect includes：Filtering, bypass, rectification, coupling, decoupling, phase inversion etc., it is
One of indispensable element in electronic product.With the progress of manufacture of semiconductor technology, by the electronic product of semi-conductor packaging
Start to develop towards more accurate advanced direction because of the demand in market.The encapsulation generally use pottery of capacitor in the prior art
Porcelain or plastic-aluminum membrane material are individually packaged to chip, use melting welding or soldering processes during encapsulation, during specific implementation, by special
Battery core is encapsulated as independent seal by sealed in unit, and sealed in unit input is big, and packaging cost is high and encapsulation flow is complicated, and
And encapsulate after chip volume it is also larger, plastic-aluminum membrane material make package casing when, its matrix is relatively thin, it is easy in production
During occur damaged, sealing effectiveness is influenceed, so as to reduce yield rate, in addition, being encapsulated for existing solid electrolytic capacitor
Easily produced because encapsulating bad hole, if the moisture in air is invaded between the contact surface of both structure, conducting terminal and packaging body
Enter, the electrical characteristic intensity of capacitor can be influenceed, more seriously may speed-up capacitor device assembly damage, and significantly drop
The service life of low capacitor assembly.Therefore, in order to solve the above problems, the application provides a kind of new technical scheme.
The content of the invention
The invention aims to overcome deficiency of the prior art, there is provided a kind of capacitor fast packing method.
To solve the above problems, the technical solution used in the present invention is as follows：
A kind of capacitor fast packing method, comprises the following steps：（1）Pretreatment：Clean encapsulating structure；（2）Melt melten gel：Take
Eutectic dispensing, its melt temperature is heated to, and equilibrium temperature is constant is kept molten by it, and note is placed in after eutectic dispensing fusing
In molding apparatus；（3）It is pressure injection-moulded：Capacitor battery core is placed in encapsulating structure, encapsulating structure is encapsulated tightly, uses injection to fill
Put it is carried out it is pressure injection-moulded, while carry out pressurize and preformed processing；（4）Die sinking：Cooling treatment is carried out after injection molding, then
It is die sinking action, takes out product.
As the improvement of above-mentioned technical proposal, the encapsulating structure includes upper die and lower die, and is provided with the upper mould
One stamped groove, the first stamped groove are provided at both ends with the first connectivity port, and the first connectivity port is connected with the first stamped groove, on
The first injection hole is additionally provided with mould, the first main flow is provided with the first injection hole and is done, the dry both ends of the first main flow are provided with
First drains off, and the first tributary dry end portion is provided with the first melten gel import, and the first melten gel import is connected with the first stamped groove；Institute
State and the second stamped groove is provided with lower mould, the second stamped groove is provided at both ends with second connection end mouth, second connection end mouth and
Two stamped grooves are connected, and the second injection hole is additionally provided with lower mould, and the second main flow is provided with the second injection hole and is done, the second main flow
Dry both ends are provided with second and drained off, and the second tributary dry end portion is provided with the second melten gel import, the second melten gel import and the
Two stamped grooves are connected, and locating dowel is provided with upper mould, locating slot is provided with lower mould, locating dowel and locating slot are adapted.
As the improvement of above-mentioned technical proposal, first connectivity port and second connection end mouth are funnel-form, and first
Connectivity port and second connection end mouth include the first connector and the second connector respectively.
As the improvement of above-mentioned technical proposal, first connector and the second connector are taper.
As the improvement of above-mentioned technical proposal, die sinking mouth is additionally provided with the lower mould.
As the improvement of above-mentioned technical proposal, the die sinking mouth is the groove of arc.
Compared with prior art, beneficial effects of the present invention are as follows by the present invention：
Capacitor fast packing method of the present invention, by encapsulating structure, using pressure injection-moulded mode to capacitor battery core
It is packaged, such method for packing speed of production is fast, efficiency high, effectively improves the sealing between packaging body and capacitor battery core
Effect, it is not likely to produce because of hole, and then avoids bad because encapsulating between such eutectic dispensing and the contact surface of capacitor battery core
Causing the moisture in air to invade capacitor internal influences its electrical characteristic intensity, or even it is caused to damage, so as to significantly
Its service life is improved, while make it that capacitor battery core surface is more smooth, strengthens conductor terminal and capacitor battery core
The bonding strength of junction, avoid it easily damaged, so that the encapsulation of battery core is more firm, further lift battery core encapsulation
Yield rate and capacitor service life, the application uses eutectic dispensing, can avoid packing colloid to capacitor battery core
Caused by corrosion and high temperature failure, also reduce encapsulation volume, simplify encapsulation operation flow so that encapsulation operation more it is simple soon
Victory, easily facilitate operating personnel easily understanding and left-hand seat.
Brief description of the drawings
Fig. 1 is the structural representation of encapsulating structure in a kind of capacitor fast packing method of the present invention；
Fig. 2 is the structure chart under lower mould use state in encapsulating structure of the present invention；
Fig. 3 is the structure chart of the capacitor after being encapsulated in capacitor fast packing method of the present invention.
Embodiment
Illustrate present disclosure below in conjunction with specific embodiments.
A kind of capacitor fast packing method, comprises the following steps：（1）Pretreatment：Encapsulating structure is cleaned, is prevented inside it
Capacitor package is influenceed containing melten gel, avoids the inhomogeneity of melten gel, encapsulating structure is heated, softens melten gel, wipe,
Or repeatedly wipe encapsulating structure with Tianna solution, gasoline, acetone or diesel oil, gently scraped more using cutter while wiping
Easily remove, pay attention to not scraping encapsulating structure, or encapsulating structure is put into -15 DEG C of environment, kept for 5-15 minutes, melten gel
Cold resistance is poor, this not resistance to low temperature, and the melten gel on encapsulating structure can Automatic-falling afterwards；（2）Melt melten gel：Take low melting point
Glue, its melt temperature is heated to, and equilibrium temperature is constant is kept molten by it, eutectic temperature for dispensing glue is relatively low and nontoxic
It is tasteless, belong to environmental-protecting chemical product, relatively low not only is required to used application apparatus, also there is energy-conservation, and be not easy
Glued material is damaged because of high temperature, is placed in after eutectic dispensing fusing in injection moulding apparatus, in melting glue gun；（3）It is pressure injection-moulded：Will
Capacitor battery core 30 is placed in encapsulating structure, and the conductor terminal 31 of the capacitor battery core 30 and the connection of capacitor battery core 30
Portion region is also covered by the encapsulating structure, and encapsulating structure is encapsulated tightly, uses injection moulding apparatus（Such as melting glue gun）It is entered
Row is pressure injection-moulded, while carries out pressurize and preformed processing, so overcomes due to the imbalance of encapsulating structure external and internal pressure and causes
" staying saliva " phenomenon, pressure injection-moulded speed of production is fast, efficiency high, operates and automation can be achieved, can produce in batches, and can also
The complicated product of forming shape；（4）Die sinking：Cooling treatment is carried out after injection molding, that is, is then that die sinking is dynamic after the completion of cooling down
Make, take out product, that is, the capacitor after encapsulating, die sinking process is divided into three phases, and the first stage molds at a slow speed, prevents product from existing
Torn in die cavity, second stage quickly molds, and to shorten open time, the phase III molds at a slow speed, is made with lowering die sinking inertia
Into impact and vibration.
As shown in figure 1, the encapsulating structure includes upper mould 10 and lower mould 20, upper mould 10 is rectangle, is provided with upper mould 10
Locating dowel 16, lower mould 20 are rectangle, and locating slot 26 is provided with lower mould 20, and locating dowel 16 and locating slot 26 are adapted, locating dowel
In 16 insertion locating slots 26, so as to which upper mould 10 and lower mould 20 and mould are integrally formed；The first stamped groove is provided with the upper mould 10
11, the first stamped groove 11 is provided at both ends with the first connectivity port 17, and the first connectivity port 17 is connected with the first stamped groove 11,
And first connectivity port 17 be funnel-form, the first injection hole 12 is additionally provided with upper mould 10, is provided with the first injection hole 12
One main flow dry 13, the both ends of the first main flow dry 13 are provided with first and drain off 14, and first 14 end set that drain off has first
Melten gel import 15, the first melten gel import 15 are connected with the first stamped groove 11；The second stamped groove 21 is provided with the lower mould 20,
Second stamped groove 21 is provided at both ends with second connection end mouth 27, and second connection end mouth 27 is connected with the second stamped groove 21, and
Second connection end mouth 27 is funnel-form, and the second injection hole 22 is additionally provided with lower mould 20, second is provided with the second injection hole 22
Main flow dry 23, the both ends of the second main flow dry 23 are provided with second and drain off 24, and second 24 end set that drain off has second molten
Gel feed 25, the second melten gel import 25 are connected with the second stamped groove 21.
As shown in Figure 1 and Figure 2, the first stamped groove 11 and the second stamped groove 21 are adapted, and locating dowel 16 inserts locating slot 26
In, so upper mould 10 and lower mould 20 can close composition encapsulating structure, after upper mould 10 and lower mould 20 close, the He of the first stamped groove 11
Second stamped groove 21 forms a die cavity, and the first connectivity port 17 and second connection end mouth 27 form a strip through-hole, electric capacity
Device can be hung in the die cavity, and the conductor terminal 31 of capacitor battery core 30 is located in strip through-hole, the first note on upper mould 10
The second injection hole 22 moulded on mouth 12 and lower mould 20 forms injection hole, and the first injection hole 12 and the second injection hole 22 are configured note
Mouth is moulded as funnel-form, is easy to eutectic dispensing to enter encapsulating structure, melten gel can be molded into encapsulating structure by injection hole
To go, the first main flow dry 13 and the dry 23 composition main flow of the second main flow are done, first 14 and second 24 composition Zhi Liugan that drain off that drain off,
First melten gel import 15 and the second melten gel import 25 form melten gel import so that melten gel can enter stamped groove from both direction
In, injection moulding speed is so accelerated, also the both ends of capacitor battery core 30 are molded simultaneously, and ensure that injection is uniform, first connects
Connect port 17 and second connection end mouth 27 respectively including taper the first connector 171 and taper the second connector 271, first
Connectivity port 17 and second connection end mouth 27 form connectivity port, and the first connector 171 and the second connector 271 form connection
Mouthful, the conductor terminal 31 of the capacitor battery core 30 is placed in connectivity port, the conductor terminal 31 of such capacitor battery core 30 with
The connecting portion region of capacitor battery core 30 is just placed in connector, i.e. the conductor terminal 31 of capacitor battery core 30 and capacitor battery core
30 connecting portion region is also covered by the encapsulating structure, and so its connecting portion region can also be covered packaged by eutectic dispensing
Lids, conductor terminal 31 and the bonding strength of capacitor battery core 30 are further reinforced, solves the problems, such as the fragile fracture in junction,
Avoid junction from damaging, the service life of capacitor is greatly improved；When being packaged, first capacitor battery core 30 can be put
In the second stamped groove 21 of lower mould 20, conductor terminal 31 is placed in second connection end mouth 27, is then covered upper mould 10 and is closed,
Capacitor battery core 30 is fixed, carries out pressure injection-moulded, finally cooling die sinking, the capacitor after being encapsulated afterwards.The application
The capacitor fast packing method is packaged using pressure injection-moulded mode to capacitor battery core 30 by encapsulating structure,
Low-pressure injection molding is only needed using eutectic dispensing during pressure injection-moulded, this makes it possible to ensure in encapsulating structure full of low
Fusing point glue, such method for packing speed of production is fast, efficiency high, operates and automation can be achieved, can produce in batches, and can also
The complicated product of forming shape, in addition, eutectic dispensing packaging body is tightly bonded the contact surface of capacitor battery core 30, improve packaging body
With the sealing effectiveness between capacitor battery core 30, be not likely to produce between such eutectic dispensing and the contact surface of capacitor battery core 30 because
Hole, its electrical characteristic intensity is influenceed because encapsulating the bad moisture intrusion capacitor internal caused in air so as to avoid, very
Extremely it is caused to damage, and its service life is greatly improved.
As shown in Figure 1 and Figure 2, die sinking mouth 28 is additionally provided with the lower mould 20, die sinking mouth 28 is the groove of arc, is easy to
Die sinking, as shown in Figure 1, Figure 2, Figure 3 shows, the first connectivity port 17 and second connection end mouth 27 are funnel-form, the first connectivity port
17 and second connection end mouth 27 respectively including taper the first connector 171 and taper the second connector 271, such capacitor
The conductor terminal 31 of battery core 30 is covered with the connecting portion region of capacitor battery core 30 by the encapsulating structure, and then its connecting portion
Region can also cover packaged by eutectic dispensing, further reinforce conductor terminal 31 and the bonding strength of capacitor battery core 30,
Solve the problems, such as the fragile fracture in junction, avoid junction from damaging, so as to improve the service life of capacitor, described
One main flow dry 13 is provided with buffering area with first 14 junction of draining off, second main flow do 23 and second drain off 24
Junction is also equipped with buffering area, for buffering eutectic dispensing so that eutectic dispensing flow velocity is steady, so as to avoid unequal cause
Package surface out-of-flatness.
Capacitor fast packing method of the present invention, by encapsulating structure, using pressure injection-moulded mode to capacitor
Battery core 30 is packaged, and such method for packing speed of production is fast, efficiency high, effectively improve packaging body and capacitor battery core 30 it
Between sealing effectiveness, be not likely to produce between such eutectic dispensing and the contact surface of capacitor battery core 30 because of hole, and then avoid
Its electrical characteristic intensity is influenceed because encapsulating the bad moisture intrusion capacitor internal caused in air, or even it is caused to damage,
So as to which its service life be greatly improved, while make it that the surface of capacitor battery core 30 is more smooth, strengthen conductor terminal 31
With the bonding strength of the junction of capacitor battery core 30, avoid it easily damaged, so that the encapsulation of battery core is more firm, enter
The yield rate of one step lifting battery core encapsulation and the service life of capacitor, the application use eutectic dispensing, can avoid encapsulating
Colloid also reduces encapsulation volume, simplifies encapsulation operation flow so that envelope to corrosion and high temperature failure caused by capacitor battery core 30
Dress operation more simple and fast, easily facilitate operating personnel easily understanding and left-hand seat.
Above content is detailed description made for the present invention in conjunction with specific embodiments, it is impossible to assert that the present invention is specific real
Apply and be only limitted to these explanations.For those skilled in the art, before present inventive concept is not departed from
Put, some simple deduction or replace can also be made, should all be considered as belonging to the scope of protection of the invention.
Claims (6)
- A kind of 1. capacitor fast packing method, it is characterised in that comprise the following steps：（1）Pretreatment：Clean encapsulating structure； （2）Melt melten gel：Eutectic dispensing is taken, is heated to its melt temperature, and equilibrium temperature is constant is kept molten by it, low melting point It is placed in after glue fusing in injection moulding apparatus；（3）It is pressure injection-moulded：By capacitor battery core（30）It is placed in encapsulating structure, by encapsulating structure Encapsulation is tight, it is carried out using injection moulding apparatus pressure injection-moulded, while carries out pressurize and preformed processing；（4）Die sinking：Injection molding After carry out cooling treatment, follow by die sinking act, take out product.
- 2. a kind of capacitor fast packing method as claimed in claim 1, it is characterised in that the encapsulating structure includes upper mould （10）With lower mould（20）, the upper mould（10）On be provided with the first stamped groove（11）, the first stamped groove（11）Be provided at both ends with First connectivity port（17）, the first connectivity port（17）With the first stamped groove（11）It is connected, upper mould（10）On be additionally provided with One injection hole（12）, the first injection hole（12）Place is provided with the first main flow and done（13）, the first main flow does（13）Both ends be respectively provided with There is first to drain off（14）, first drains off（14）End set has the first melten gel import（15）, the first melten gel import（15）With First stamped groove（11）It is connected；The lower mould（20）On be provided with the second stamped groove（21）, the second stamped groove（21）Both ends It is provided with second connection end mouth（27）, second connection end mouth（27）With the second stamped groove（21）It is connected, lower mould（20）On also set It is equipped with the second injection hole（22）, the second injection hole（22）Place is provided with the second main flow and done（23）, the second main flow does（23）Both ends Second is provided with to drain off（24）, second drains off（24）End set has the second melten gel import（25）, the second melten gel import （25）With the second stamped groove（21）It is connected, upper mould（10）On be provided with locating dowel（16）, lower mould（20）On be provided with locating slot （26）, locating dowel（16）And locating slot（26）It is adapted.
- A kind of 3. capacitor fast packing method as claimed in claim 2, it is characterised in that first connectivity port（17） With second connection end mouth（27）It is funnel-form, the first connectivity port（17）With second connection end mouth（27）Include first respectively to connect Interface（171）With the second connector（271）.
- A kind of 4. capacitor fast packing method as claimed in claim 3, it is characterised in that first connector（171） With the second connector（271）It is taper.
- A kind of 5. capacitor fast packing method as claimed in claim 2, it is characterised in that the lower mould（20）On also set up There is die sinking mouth（28）.
- A kind of 6. capacitor fast packing method as claimed in claim 5, it is characterised in that the die sinking mouth（28）For arc Groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710883868.4A CN107578930A (en) | 2017-09-26 | 2017-09-26 | A kind of capacitor fast packing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710883868.4A CN107578930A (en) | 2017-09-26 | 2017-09-26 | A kind of capacitor fast packing method |
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| Publication Number | Publication Date |
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| CN107578930A true CN107578930A (en) | 2018-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710883868.4A Pending CN107578930A (en) | 2017-09-26 | 2017-09-26 | A kind of capacitor fast packing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379631A (en) * | 2019-06-21 | 2019-10-25 | 赣州市柏瑞凯电子科技有限公司 | A kind of small size solid-state aluminum electrolytic capacitor |
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| US5253148A (en) * | 1991-03-01 | 1993-10-12 | Nec Corporation | Electric double layer capacitor |
| CN201659662U (en) * | 2010-04-19 | 2010-12-01 | 珠海市雷鸣达通讯技术发展有限公司 | Adjustable injection mold for battery packaging |
| CN102074666A (en) * | 2010-12-23 | 2011-05-25 | 华为终端有限公司 | Battery encapsulating method and battery |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105269760A (en) * | 2015-10-20 | 2016-01-27 | 成都长迪传感技术有限公司 | Plastic injection mold |
| CN205522238U (en) * | 2016-04-14 | 2016-08-31 | 珠海科斯特电源有限公司 | Secondary injection mold of cellphone built -in battery |
| CN106182581A (en) * | 2016-07-25 | 2016-12-07 | 胡小庆 | The preparation method of a kind of electronic chip and electronic chip |
-
2017
- 2017-09-26 CN CN201710883868.4A patent/CN107578930A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5253148A (en) * | 1991-03-01 | 1993-10-12 | Nec Corporation | Electric double layer capacitor |
| CN201659662U (en) * | 2010-04-19 | 2010-12-01 | 珠海市雷鸣达通讯技术发展有限公司 | Adjustable injection mold for battery packaging |
| CN102074666A (en) * | 2010-12-23 | 2011-05-25 | 华为终端有限公司 | Battery encapsulating method and battery |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105269760A (en) * | 2015-10-20 | 2016-01-27 | 成都长迪传感技术有限公司 | Plastic injection mold |
| CN205522238U (en) * | 2016-04-14 | 2016-08-31 | 珠海科斯特电源有限公司 | Secondary injection mold of cellphone built -in battery |
| CN106182581A (en) * | 2016-07-25 | 2016-12-07 | 胡小庆 | The preparation method of a kind of electronic chip and electronic chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379631A (en) * | 2019-06-21 | 2019-10-25 | 赣州市柏瑞凯电子科技有限公司 | A kind of small size solid-state aluminum electrolytic capacitor |
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Application publication date: 20180112 |
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| RJ01 | Rejection of invention patent application after publication |