CN100587946C - Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream - Google Patents
Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream Download PDFInfo
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- CN100587946C CN100587946C CN200710187846A CN200710187846A CN100587946C CN 100587946 C CN100587946 C CN 100587946C CN 200710187846 A CN200710187846 A CN 200710187846A CN 200710187846 A CN200710187846 A CN 200710187846A CN 100587946 C CN100587946 C CN 100587946C
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- counterdie
- envelope portion
- patrix
- envelope
- slotted eye
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention relates to a window up and down mold flow balance packaging structure and a packaging method. The window ball grid array packaging structure mainly comprises a substrate provided with anopen-window slotted hole, a wafer and a mold packaging adhesive. Two ends of the open-window slot hole expose to form an adhesive outlet and an adhesive inlet after wafer adhesion. The open-window slotted hole is designed with eccentric displacement to make the adhesive inlet smaller than the adhesive outlet. The mold packaging adhesive is provided with an upper mold packaging part above the substrate and a lower mold packaging part below the substrate. Therefore, the mold flows o the upper mold packaging part and the lower mold packaging part are balanced, and the problems of adhesive filling gaps of the prior upper mold packaging part and overflow of adhesive of the prior lower mold packaging part at the lower part of the substrate are solved. In addition, the invention also provides the window up and down mode flow balance packaging method.
Description
Technical field
The present invention relates to a kind of window-shaped semiconductor encapsulation technology, particularly relate to a kind of packaging structure and method for packing of window upper and lower mould mobile equilibrium.
Background technology
In numerous integrated circuit encapsulated types, Window-type packaging structure (WBGA, Window BallGrid Array) be utilize have the slotted eye of windowing base plate carrying one wafer thereon and suitably sealing it.Forming the mould adhesive body at present is that transfer formation (transfer molding) technology forms, it is that this Window-type packaging structure is placed a mould, this mould is injected the in addition slaking again of mould adhesive body predecessor, to seal the inner member of this Window-type packaging structure, for example wafer with electrically connect element.Yet when injecting this mould adhesive body, the long-pending substrate counterdie front cover greater than this mould adhesive body of the substrate patrix front cover of this mould adhesive body is long-pending, easily causes the situation of upper and lower mould flow velocity degree inequality.This kind phenomenon can cause mould flow velocity degree, and colloid can be in the excessive glue problem of substrate surface generation faster, and mould flows slow colloid and then has not enriching of filler and form bubble or space.
As shown in Figure 1, a kind of existing Window-type packaging structure 100 mainly comprises the electric connection element 130 and a mould adhesive body 140 of a substrate 110, a wafer 120, a plurality of for example bonding wires.This substrate 110 has the slotted eye 113 of windowing that a upper surface 111, a lower surface 112 and run through this upper surface 111 and this lower surface 112.As shown in Figure 2, this upper surface 111 of this substrate 110 includes a crystal bonding area 114 and at this upper surface 111 coatings one glutinous brilliant glue 116, makes this wafer 120 cemented on this substrate 110 in order to this wafer 120 of gluing.This lower surface 112 is formed with a plurality of outer connection pads 115 (as shown in Figure 1).Again as shown in Figure 2, the two ends of this slotted eye 113 of windowing form one respectively and go into a glue mouth 113A and a gum outlet 113B outside this crystal bonding area 114.As shown in Figures 1 and 2, an active surface 121 of this wafer 120 is for down and be arranged at this crystal bonding area 114 and do not hide this and go into glue mouth 113A and this gum outlet 113B.This active surface 121 of this wafer 120 is formed with a plurality of weld pads 123 and can connects described weld pad 123 to this substrate 110 by this slotted eye 113 of windowing by described electric connection element 130.This mould adhesive body 140 includes a patrix envelope portion 141 and a counterdie envelope portion 142, wherein this patrix envelope portion 141 is formed at this upper surface 111 and in order to seal this wafer 120, this counterdie envelope portion 142 is formed at this lower surface 112 and this slotted eye 113 of windowing, in order to seal described electric connection element 130.A plurality of external terminals 150 are the described outer connection pads 115 that are arranged at this substrate 110, in order to externally to be electrically connected to a printed circuit board (PCB) (not drawing among the figure).In substrate framework in the past, this slotted eye 113 of windowing is to be center configuration, promptly the central point of this slotted eye 113 of windowing is in alignment with substrate in each encapsulation unit 110 central point with this wafer 120, and this is gone into glue mouth 113A and has identical perforated area with this gum outlet 113B.
Shown in Fig. 1～3, in the process that forms this mould adhesive body 140, utilize a mold 10 and a bed die 20 to insert and put this substrate 110, and inject the predecessor of this mould adhesive body 140, make mould adhesive body 140 predecessors flow into upper mould cave and flow to down die cavity to form this counterdie envelope portion 142 to form this patrix envelope portion 141 and to go into glue mouth 113A from this.For another example shown in Fig. 1～3, because the packing space of this counterdie envelope portion 142 is less than this patrix envelope portion 141, the counterdie flow velocity degree 142A that forms this counterdie envelope portion 142 can be greater than the patrix flow velocity degree 141A that forms this patrix envelope portion 141, in the case, die cavity can fill up down earlier and than 141 more Zao this gum outlet 113B that arrive of this patrix envelope portion in this counterdie envelope portion 142, so this counterdie envelope portion 142 can be by this gum outlet 113B and toward these patrix envelope portion 141 ejections, and persistent pressure mould stream fills up upper mould cave up to this patrix envelope portion 141, the time difference that produces can cause this counterdie envelope portion 142 to produce the glue 142B (as shown in Figure 1) that overflows at the lower surface 112 of this substrate 110, even cover to described outer connection pad 115, making partly, external terminal 150 engages bad.In addition, this counterdie envelope portion 142 can produce the patrix flow disturbance by this gum outlet 113B ejection, influence the former discharge of air in upper mould cave, is easy to formation bubble 141B (as shown in Figure 1) in this patrix envelope portion 141, makes the quality variation of this Window-type packaging structure 100.
Because the defective that above-mentioned existing Window-type packaging structure and method for packing exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of packaging structure and method for packing of novel window upper and lower mould mobile equilibrium, can improve general existing Window-type packaging structure and method for packing, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing Window-type packaging structure and method for packing exist, and provide a kind of packaging structure of novel window upper and lower mould mobile equilibrium, technical problem to be solved be make its by the displacement off-centre of the slotted eye of windowing with form bore narrow go into Jiao Kou, and then the mould flow velocity degree that slows down counterdie stream reaches the effect of upper and lower mould mobile equilibrium, avoid the mould flow velocity of counterdie stream to spend defective fast and excessive glue of formation and bubble, thereby be suitable for practicality more.
A time purpose of the present invention is, a kind of method for packing of window upper and lower mould mobile equilibrium is provided, and technical problem to be solved is to prevent that in the process that forms the mould adhesive body this mould adhesive body to excessive glue, avoiding substrate to be subjected to the pollution of this mould adhesive body.
The object of the invention to solve the technical problems realizes by the following technical solutions.The packaging structure of a kind of window upper and lower mould mobile equilibrium that proposes according to the present invention, comprise: a substrate, have a upper surface, a lower surface and at least one slotted eye of windowing, this upper surface comprises that a crystal bonding area and surrounds the patrix envelope district of this crystal bonding area and this slotted eye of windowing, this lower surface includes a counterdie envelope of surrounding this slotted eye of windowing and distinguishes, and the two ends of this slotted eye of windowing form a gum outlet that Jiao Kou and exceeds this crystal bonding area of going into that exceeds this crystal bonding area, and it is young in this gum outlet that this goes into glue; One wafer is arranged at this crystal bonding area and local cover this and window slotted eye and make this go into Jiao Kou and this gum outlet exposes; A plurality of electric connection elements electrically connect this wafer and this substrate by this slotted eye of windowing; An and mould adhesive body, have a patrix envelope portion and a counterdie envelope portion, this patrix envelope portion is formed at this patrix envelope district, this counterdie envelope portion is formed at this counterdie envelope district and this slotted eye of windowing, this patrix envelope portion and this counterdie envelope portion are connected in this and go into Jiao Kou and this gum outlet, and this patrix envelope portion is greater than this counterdie envelope portion.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, the central point of the wherein said slotted eye of windowing are the central point of misalignment in this wafer.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, wherein said patrix envelope portion seals this wafer.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, wherein said counterdie envelope portion seals described electric connection element.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, this upper surface of wherein said substrate is formed with a cast gate, and it is adjacent to this and goes into Jiao Kou.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, the wherein said Jiao Kou of going into have one less than semicircular curved edge.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, wherein said gum outlet have the curved edge of semicircular in shape without exception.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, wherein said substrate have a plurality of outer connection pads, and it is to be located at this lower surface and outside this counterdie envelope district.
The packaging structure of aforesaid window upper and lower mould mobile equilibrium, it includes a plurality of external terminals in addition, and it is to be arranged at described outer connection pad.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The method for packing of a kind of window upper and lower mould mobile equilibrium that proposes according to the present invention, comprise: a substrate is provided, have a upper surface, a lower surface and at least one slotted eye of windowing, this upper surface includes the patrix envelope district that a crystal bonding area and surrounds this crystal bonding area and this slotted eye of windowing, this lower surface includes a counterdie envelope of surrounding this slotted eye of windowing and distinguishes, and the two ends of this slotted eye of windowing form a gum outlet that Jiao Kou and exceeds this crystal bonding area of going into that exceeds this crystal bonding area, and this goes into Jiao Kou is less than this gum outlet; One wafer is set in this crystal bonding area and local cover this and window slotted eye and make this go into Jiao Kou and this gum outlet exposes; Form a plurality of electric connection elements, electrically connect this wafer and this substrate by this slotted eye of windowing; And form a mould adhesive body, have a patrix envelope portion and a counterdie envelope portion, this patrix envelope portion is formed at this patrix envelope district, this counterdie envelope portion is formed at this counterdie envelope district and this slotted eye of windowing, this patrix envelope portion and this counterdie envelope portion are connected in this and go into Jiao Kou and this gum outlet, and this patrix envelope portion is greater than this counterdie envelope portion.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, the mould flow velocity degree that forms this patrix envelope portion and this counterdie envelope portion is a balance, to meet at this gum outlet.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, the central point of the wherein said slotted eye of windowing are the central point of misalignment in this wafer.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, wherein said patrix envelope portion is this wafer of sealing.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, wherein said counterdie envelope portion seals described electric connection element.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, this upper surface of wherein said substrate is formed with a cast gate, and it is to be adjacent to this to go into Jiao Kou.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, the wherein said Jiao Kou of going into have one less than semicircular curved edge.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, wherein said gum outlet have the curved edge of semicircular in shape without exception.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, wherein said substrate have a plurality of outer connection pads, and it is to be located at this lower surface and outside this counterdie envelope district.
The method for packing of aforesaid window upper and lower mould mobile equilibrium, it includes in addition: the below that a plurality of external terminals connection pad outside described is set.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, the invention provides a kind of packaging structure of window upper and lower mould mobile equilibrium, comprise a substrate, a wafer, a plurality of electric connection element and a mould adhesive body.This substrate has a upper surface, a lower surface and at least one slotted eye of windowing, this upper surface includes the patrix envelope district that a crystal bonding area and surrounds this crystal bonding area and this slotted eye of windowing, this lower surface includes a counterdie envelope of surrounding this slotted eye of windowing and distinguishes, and the two ends of this slotted eye of windowing form a gum outlet that Jiao Kou and exceeds this crystal bonding area of going into that exceeds this crystal bonding area, and this goes into Jiao Kou is less than this gum outlet.This wafer is to be arranged at this crystal bonding area and local cover this and window slotted eye and make this go into Jiao Kou and this gum outlet exposes.Described electric connection element is to electrically connect this wafer and this substrate by this slotted eye of windowing.This mould adhesive body has a patrix envelope portion and a counterdie envelope portion, this patrix envelope portion is formed at this patrix envelope district, this counterdie envelope portion is formed at this counterdie envelope district and this slotted eye of windowing, this patrix envelope portion and this counterdie envelope portion are connected in this and go into Jiao Kou and this gum outlet, and this patrix envelope portion is greater than this counterdie envelope portion.Other discloses the manufacture method of aforesaid Window-type packaging structure.
In aforesaid packaging structure, the central point of slotted eye is the central point of misalignment in this wafer but this is windowed.
In aforesaid packaging structure, this salable this wafer of patrix envelope portion.
In aforesaid packaging structure, the salable described electric connection element of this counterdie envelope portion.
In aforesaid packaging structure, this upper surface of this substrate can be formed with a cast gate, and it is to be adjacent to this to go into Jiao Kou.
In aforesaid packaging structure, this goes into Jiao Kou can have one less than semicircular curved edge.
In aforesaid packaging structure, this gum outlet can have the curved edge of a semicircular in shape.
In aforesaid packaging structure, this substrate can have a plurality of outer connection pads, and it is to be located at this lower surface and outside this counterdie envelope district.
In aforesaid packaging structure, can include a plurality of external terminals in addition, it is the below that is arranged at described outer connection pad.
By technique scheme, the packaging structure and the method for packing of window upper and lower mould mobile equilibrium of the present invention have following advantage at least:
1) by the displacement off-centre of the slotted eye of windowing with form bore narrow go into Jiao Kou, and then the mould flow velocity degree that slows down counterdie stream reaches the effect of upper and lower mould mobile equilibrium, avoids the mould flow velocity of counterdie stream to spend fast and forms the defective of overflow glue and bubble.
2) the present invention to excessive glue, avoids substrate to be subjected to the pollution of this mould adhesive body to prevent this mould adhesive body in the process that forms the mould adhesive body.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
The schematic cross-section of the existing Window-type packaging structure of Fig. 1 crosscut window.
The upper surface schematic diagram of a substrate in the existing Window-type packaging structure of Fig. 2.
The substrate schematic cross-section that the existing Window-type packaging structure of Fig. 3 dissects along window when mould seals.
Fig. 4 is according to a specific embodiment of the present invention, a kind of schematic cross-section of Window-type packaging structure crosscut window.
Fig. 5 is according to a specific embodiment of the present invention, the upper surface schematic diagram of a substrate in this Window-type packaging structure.
Fig. 6 is according to a specific embodiment of the present invention, and mould seals preceding base lower surface schematic diagram in this Window-type packaging structure.
Fig. 7 foundation specific embodiment of the present invention, the upper surface of base plate schematic diagram of this Window-type packaging structure before the mould envelope.
Fig. 8 is according to a specific embodiment of the present invention, the substrate schematic cross-section that this Window-type packaging structure dissects along window when mould seals.
10: mold 20: bed die
30: mold 40: bed die
100: packaging structure 110: substrate
111: upper surface 112: lower surface
113: slotted eye 113A windows: go into Jiao Kou
113B: gum outlet 114: crystal bonding area
115: outer connection pad 116: glutinous brilliant glue
120: wafer 121: active surface
122: the back side 123: weld pad
130: electrically connect element 140: the mould adhesive body
141: the patrix envelope 141A of portion: patrix flow velocity degree
141B: bubble 142: counterdie envelope portion
142A: counterdie flow velocity degree 142B: glue overflows
150: external terminal 200: packaging structure
210: substrate 211: upper surface
212: lower surface 213: the slotted eye of windowing
213A: go into glue mouth 213B: gum outlet
214: crystal bonding area 215: patrix envelope district
216: counterdie envelope district 217: cast gate
218: outer connection pad 219: glutinous brilliant glue
220: wafer 221: active surface
222: the back side 223: weld pad
230: electrically connect element 240: the mould adhesive body
241: the patrix envelope 241A of portion: patrix flow velocity degree
242: the counterdie envelope 242A of portion: counterdie flow velocity degree
250: external terminal
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, packaging structure and its embodiment of method for packing, structure, feature and the effect thereof of the window upper and lower mould mobile equilibrium that foundation the present invention is proposed, describe in detail as after.
According to a specific embodiment of the present invention, as shown in Figure 4, a kind of packaging structure 200 of window upper and lower mould mobile equilibrium comprises a substrate 210, a wafer 220, a plurality of electric connection element 230 and a mould adhesive body 240.
This substrate 210 has a upper surface 211, an opposing lower surface 2121 and at least one slotted eye 213 of windowing, and this slotted eye 213 of windowing is through to this lower surface 212 for long and narrow and by this upper surface 211.This substrate 210 is as chip carrier and has single or multiple lift line construction, for example printed circuit board (PCB).
As shown in Figure 4, and please cooperate and consult Fig. 5, this upper surface 211 of this substrate 210 includes a crystal bonding area 214 and and surrounds this crystal bonding area 214 and distinguish 215 with the patrix envelope of this slotted eye 213 of windowing.This crystal bonding area 214 is to define according to the area coverage of pasting of this wafer 220 at the upper surface 211 of this substrate 210.This patrix envelope district 215 defines according to the area coverage of this mould adhesive body 240 at the upper surface 211 of this substrate 210, and this patrix envelope is distinguished that 215 outer rim can be alignd with the upper surface 211 of this substrate 210 or be slightly little.And these two ends of windowing slotted eye 213 form a gum outlet 213B that glue mouth 213A and exceeds this crystal bonding area 214 that goes into that exceeds this crystal bonding area 214.As shown in Figure 7, when this wafer 220 is attached at the upper surface 211 of this substrate 210, this goes into glue mouth 213A and this gum outlet 213B for exposing, for this mould adhesive body 240 go into glue mouth 213A and this gum outlet 213B by this smoothly.Wherein this slotted eye 213 of windowing is set for the eccentric, and the central point misalignment of slotted eye 213 is less than this gum outlet 213B in this crystal bonding area 214 so this goes into glue mouth 213A so that this is windowed.As shown in Figure 4, and please cooperate and consult Fig. 6, this lower surface 212 includes a counterdie envelope district 216 that surrounds this slotted eye 213 of windowing, and it is to define according to the area coverage of this mould adhesive body 240 at the lower surface 212 of this substrate 210.
See also Fig. 4 and shown in Figure 5, this upper surface 211 of this substrate 210 is to be coated with a glutinous brilliant glue 219, fixes this wafer 220 for pasting, and the coating scope of this glutinous brilliant glue 219 is to be slightly larger than this crystal bonding area 214 (as shown in Figure 5).In the present embodiment, this upper surface 211 of this substrate 210 can be formed with a cast gate 217, and this cast gate 217 is adjacent to this and goes into glue mouth 213A.In different embodiment, cast gate also can be located at other zone of substrate strip outside this substrate 210.See also shown in Figure 6ly, this substrate 210 can have a plurality of outer connection pads 218, and it is located at this lower surface 212 and outside this counterdie envelope district 216, described outer connection pad 218 is to be many row's arrangements or trellis array kenels.
This wafer 220 is to have an active surface 221 and an opposing backside surface 222 that is formed with a plurality of weld pads 223, and wherein said weld pad 223 is the external electrode tips that can be used as the internal integrated circuit element of this wafer 220.See also Fig. 4 and shown in Figure 7, this active surface 221 of this wafer 220 is to be arranged at this crystal bonding area 214 down and to utilize should glutinous brilliant glue 219 to be fixed on this substrate 210 and to appear described weld pad 223, and this wafer 220 is locally to cover this and window slotted eye 213 and make this go into glue mouth 213A and this gum outlet 213B exposes.The central point of slotted eye 213 is misalignment central points in this wafer 220 but this is windowed, and is less than this gum outlet 213B so that this goes into glue mouth 213A.See also shown in Figure 7ly, in one embodiment, this goes into glue mouth 213A can have one less than semicircular curved edge, and this gum outlet 213B can have the curved edge of semicircular in shape without exception, so that colloid imports and discharges.
See also shown in Figure 4ly, described electric connection element 230 electrically connects this wafer 220 and this substrate 210 by this slotted eye 213 of windowing.Wherein said electric connection element 230 is to can be the bonding wire that routing forms, one end of described bonding wire connects the described weld pad 223 of this wafer 220, and the other end be connected to this substrate 210 this lower surface 212 connect finger (figure do not draw), reach the electrical interconnects of this wafer 220 and this substrate 210.
See also shown in Figure 4, this mould adhesive body 240 has a patrix envelope portion 241 and a counterdie envelope portion 242, this patrix envelope portion 241 is formed at this patrix envelope to distinguish for 215 (as shown in Figure 5), this counterdie envelope portion 242 is formed at this counterdie envelope district 216 and this slotted eye 213 (as shown in Figure 6) of windowing, this patrix envelope portion 241 is connected in this to go into glue mouth 213A and this gum outlet 213B with this counterdie envelope portion 242, and this patrix envelope portion 241 is greater than this counterdie envelope portion 242.This patrix envelope portion 241 that is formed at this upper surface 211 of this substrate 210 can be in order to sealing this wafer 220, and this is formed at the then described electric connection element 230 of sealing of this lower surface 212 of this substrate 210 and more a spot of counterdie envelope portion 242.
Particularly, this Window-type packaging structure 200 can include a plurality of external terminals 250 in addition, it is arranged at described outer connection pad 218, to be provided as input and/or output so that this Window-type packaging structure 200 and external device, as forming to electrically connect to close be with a printed circuit board (PCB) (not drawing among the figure).Described external terminal 250 is to comprise soldered ball, tin cream, contact mat or contact pin.
See also Fig. 4 and shown in Figure 8, in the forming process of this mould adhesive body 240, utilize a mold 30 and a bed die 40 to insert and put this substrate 210, be located in the upper mould cave of this mold 30, make this following die cavity of slotted eye 213 of windowing in alignment with this bed die 40 to make this wafer 220.When the predecessor of this mould adhesive body 240 is injected into upper mould cave, mould adhesive body predecessor flows to upper mould cave to form this patrix envelope portion 241, and go into glue mouth 213A through this and flow to down die cavity forming this counterdie envelope portion 242, after curing to form this mould adhesive body 240.
Therefore, see also Figure 6 and Figure 7, go into glue mouth 213A by narrow this of the bore that mode forms of these slotted eye 213 displacement off-centre of windowing, to slow down the counterdie flow velocity degree 242A of this counterdie envelope portion 242, make the patrix flow velocity degree 241A of this counterdie flow velocity degree 242A and this patrix envelope portion 241 reach balance (as shown in Figure 8), with even filling this patrix envelope portion 241 and this counterdie envelope portion 242, make each corner in this patrix envelope portion 241 and this counterdie envelope portion 242 all this mould adhesive body 240 of even filling not had hole and excessive glue phenomenon (as shown in Figure 4).Wherein, this patrix envelope portion 241 can be pooled to this gum outlet 213B simultaneously with the precursors of this counterdie envelope portion 242, does not have the problem of disturbing patrix stream, forms the defective of bubble to avoid 240 times bags of this mould adhesive body.
In addition, when this mould adhesive body 240 is gone into glue mouth 213A via this and is flowed into the die cavity of this bed die 40, owing to this narrow counterdie flow velocity degree 242A of this mould adhesive body 240 that makes of bore that goes into glue mouth 213A slows down, shortened the time difference of waiting for that this patrix envelope portion 241 fills up, these counterdie envelope portion 242 unlikely overflows of this mould adhesive body 240 are gone in this lower surface 212 and the pressing gap between this bed die 40 surfaces of this substrate 210, avoid described outer connection pad 218 is produced the problem of excessive glue pollution, engage bad problem with external terminal so solved the outer connection pad of existing substrate, and then promote the electric connection and the transmission quality of this Window-type packaging structure 200.
The present invention discloses the manufacture method of aforesaid Window-type packaging structure 200 in addition, its step comprises, above-mentioned substrate 210 at first is provided, it is to have a upper surface 211, a lower surface 212 and at least one slotted eye 213 of windowing, these two ends of windowing slotted eye 213 are to form a gum outlet 213B that glue mouth 213A and exceeds this crystal bonding area 214 that goes into that exceeds this crystal bonding area 214, and this to go into glue mouth 213A be less than this gum outlet 213B.
Then, above-mentioned wafer 220 is set on this substrate 210, connects down with a active surface 221 and place this crystal bonding area 214 and make this go into glue mouth 213A and this gum outlet 213B exposes this wafer 220.After this wafer 220 is set, form a plurality of electric connection elements 230, the bonding wire that forms of routing for example electrically connects the described weld pad 223 and this substrate 210 of these wafers 220 by this slotted eye 213 of windowing.
At last, form a mould adhesive body 240 in this upper surface 211 of this substrate 210, window slotted eye 213 and this lower surface 212.In the process that forms this mould adhesive body 240,, utilize a mold 30 and a bed die 40 to insert and put this substrate 210, and inject the predecessor of this mould adhesive body 240 as Fig. 4 and shown in Figure 8.The patrix envelope portion 241 of this mould adhesive body 240 is formed at this patrix envelope district 215 to seal this wafer 220, the counterdie envelope portion 242 of this mould adhesive body 240 is formed at this counterdie envelope district 216 and this slotted eye 213 of windowing to seal described electric connection element 230, wherein this patrix envelope portion 241 is connected in this to go into glue mouth 213A and this gum outlet 213B with this counterdie envelope portion 242, and this patrix envelope portion 241 is greater than this counterdie envelope portion 242.Utilization is dwindled goes into glue mouth 213A, slow down the counterdie flow velocity degree 242A that forms this counterdie envelope portion 242, can reach balance so form patrix flow velocity degree 241A and this counterdie flow velocity degree 242A of this patrix envelope portion 241, and meet at this gum outlet 213B, so can avoid existing too fast filler space that produces of counterdie flow velocity degree 242A and excessive glue problem.See also Fig. 4 and shown in Figure 8, going into glue mouth 213A by narrow this of bore can make the counterdie flow velocity degree 242A of this counterdie envelope portion 242 slow down, make these mould adhesive body 240 unlikely overflows to described outer connection pad 218, so have the effect of avoiding window pattern envelope excessive glue pollution, and can continue to use existing sealed in unit and carry out packaging operation, do not need other setting element, also can not increase fabrication steps.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (19)
1, a kind of packaging structure of window upper and lower mould mobile equilibrium is characterized in that it comprises:
One substrate, have a upper surface, a lower surface and at least one slotted eye of windowing, this upper surface comprises that a crystal bonding area and surrounds the patrix envelope district of this crystal bonding area and this slotted eye of windowing, this lower surface includes a counterdie envelope of surrounding this slotted eye of windowing and distinguishes, and the two ends of this slotted eye of windowing form a gum outlet that Jiao Kou and exceeds this crystal bonding area of going into that exceeds this crystal bonding area, and it is young in this gum outlet that this goes into glue;
One wafer is arranged at this crystal bonding area and local cover this and window slotted eye and make this go into Jiao Kou and this gum outlet exposes;
A plurality of electric connection elements electrically connect this wafer and this substrate by this slotted eye of windowing; And
One mould adhesive body, have a patrix envelope portion and a counterdie envelope portion, this patrix envelope portion is formed at this patrix envelope district, this counterdie envelope portion is formed at this counterdie envelope district and this slotted eye of windowing, this patrix envelope portion and this counterdie envelope portion are connected in this and go into Jiao Kou and this gum outlet, and this patrix envelope portion is greater than this counterdie envelope portion.
2, the packaging structure of window upper and lower mould mobile equilibrium according to claim 1, the central point that it is characterized in that the described slotted eye of windowing are the central point of misalignment in this wafer.
3, the packaging structure of window upper and lower mould mobile equilibrium according to claim 1 is characterized in that described patrix envelope portion seals this wafer.
4,, it is characterized in that described counterdie envelope portion seals described electric connection element according to the packaging structure of claim 1 or 3 described window upper and lower mould mobile equilibriums.
5, the packaging structure of window upper and lower mould mobile equilibrium according to claim 1 is characterized in that this upper surface of described substrate is formed with a cast gate, and it is adjacent to this and goes into Jiao Kou.
6, the packaging structure of window upper and lower mould mobile equilibrium according to claim 1 is characterized in that the described Jiao Kou of going into has one less than semicircular curved edge.
7,, it is characterized in that described gum outlet has the curved edge of a semicircular in shape according to the packaging structure of claim 1 or 6 described window upper and lower mould mobile equilibriums.
8, the packaging structure of window upper and lower mould mobile equilibrium according to claim 1 is characterized in that described substrate has a plurality of outer connection pads, and it is to be located at this lower surface and outside this counterdie envelope district.
9, the packaging structure of window upper and lower mould mobile equilibrium according to claim 8 is characterized in that it includes a plurality of external terminals in addition, and it is arranged at the below of described outer connection pad.
10, a kind of method for packing of window upper and lower mould mobile equilibrium is characterized in that it comprises:
One substrate is provided, have a upper surface, a lower surface and at least one slotted eye of windowing, this upper surface includes the patrix envelope district that a crystal bonding area and surrounds this crystal bonding area and this slotted eye of windowing, this lower surface includes a counterdie envelope of surrounding this slotted eye of windowing and distinguishes, and the two ends of this slotted eye of windowing form a gum outlet that Jiao Kou and exceeds this crystal bonding area of going into that exceeds this crystal bonding area, and this goes into Jiao Kou is less than this gum outlet;
One wafer is set in this crystal bonding area and local cover this and window slotted eye and make this go into Jiao Kou and this gum outlet exposes;
Form a plurality of electric connection elements, electrically connect this wafer and this substrate by this slotted eye of windowing; And
Form a mould adhesive body, have a patrix envelope portion and a counterdie envelope portion, this patrix envelope portion is formed at this patrix envelope district, this counterdie envelope portion is formed at this counterdie envelope district and this slotted eye of windowing, this patrix envelope portion and this counterdie envelope portion are connected in this and go into Jiao Kou and this gum outlet, and this patrix envelope portion is greater than this counterdie envelope portion.
11, the method for packing of window upper and lower mould mobile equilibrium according to claim 10, the mould flow velocity degree that it is characterized in that forming this patrix envelope portion and this counterdie envelope portion is a balance, to meet at this gum outlet.
12, the method for packing of window upper and lower mould mobile equilibrium according to claim 10, the central point that it is characterized in that the described slotted eye of windowing are the central point of misalignment in this wafer.
13, the method for packing of window upper and lower mould mobile equilibrium according to claim 10 is characterized in that described patrix envelope portion is this wafer of sealing.
14,, it is characterized in that described counterdie envelope portion seals described electric connection element according to the method for packing of claim 10 or 13 described window upper and lower mould mobile equilibriums.
15, the method for packing of window upper and lower mould mobile equilibrium according to claim 10 is characterized in that this upper surface of described substrate is formed with a cast gate, and it is to be adjacent to this to go into Jiao Kou.
16, the method for packing of window upper and lower mould mobile equilibrium according to claim 10 is characterized in that the described Jiao Kou of going into has one less than semicircular curved edge.
17,, it is characterized in that described gum outlet has the curved edge of a semicircular in shape according to the method for packing of claim 10 or 16 described window upper and lower mould mobile equilibriums.
18, the method for packing of window upper and lower mould mobile equilibrium according to claim 10 is characterized in that described substrate has a plurality of outer connection pads, and it is to be located at this lower surface and outside this counterdie envelope district.
19, the method for packing of window upper and lower mould mobile equilibrium according to claim 18 is characterized in that described its includes in addition: the below that a plurality of external terminals connection pad outside described is set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710187846A CN100587946C (en) | 2007-11-19 | 2007-11-19 | Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710187846A CN100587946C (en) | 2007-11-19 | 2007-11-19 | Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101442031A CN101442031A (en) | 2009-05-27 |
| CN100587946C true CN100587946C (en) | 2010-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200710187846A Expired - Fee Related CN100587946C (en) | 2007-11-19 | 2007-11-19 | Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328611B (en) * | 2016-10-21 | 2019-03-12 | 苏州日月新半导体有限公司 | Semiconductor packaging structure and its manufacturing method |
| CN107369655A (en) * | 2017-07-13 | 2017-11-21 | 睿力集成电路有限公司 | A kind of window-type ball grid array package assembling |
| CN107706158B (en) * | 2017-11-14 | 2023-11-03 | 长鑫存储技术有限公司 | Semiconductor packaging structure and manufacturing method |
| CN113284856B (en) * | 2020-02-19 | 2022-03-18 | 长鑫存储技术有限公司 | Package structure and method for forming the same |
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| CN101442031A (en) | 2009-05-27 |
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