CN206250189U - A kind of island-free framework encapsulation structure - Google Patents
A kind of island-free framework encapsulation structure Download PDFInfo
- Publication number
- CN206250189U CN206250189U CN201621140849.XU CN201621140849U CN206250189U CN 206250189 U CN206250189 U CN 206250189U CN 201621140849 U CN201621140849 U CN 201621140849U CN 206250189 U CN206250189 U CN 206250189U
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- Prior art keywords
- island
- framework
- chip
- free
- free framework
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model is related to a kind of island-free framework encapsulation structure, and it includes island-free framework（1）, the island-free framework（1）Front is covered with cured film（2）, the cured film（2）On be provided with chip（3）, the chip（3）With island-free framework（1）By being electrically connected with part（4）It is electrically connected with, the island-free framework（1）, cured film（2）, be electrically connected with part（4）It is encapsulated with plastic packaging material outward（5）, the island-free framework（1）The back side is exposed to plastic packaging material（5）.A kind of island-free framework encapsulation structure of the utility model, it forms the chip supporting structure that Ji Dao is acted on after cured film solidification is pasted on island-free framework, can effectively solve the problem that chip and pins contact area are too small causes the problem that routing shakiness is rocked or chip is lifted during routing, while framework warpage issues caused by can also avoiding pre-packaged framework both sides copper face product proportional difference big.
Description
Technical field
The utility model is related to a kind of island-free framework encapsulation structure, belongs to technical field of semiconductor encapsulation.
Background technology
The lead frame island-free product for being formed by etching at present is frame during chip load on pin.In fact,
When chip carrier is on pin, because chip is too small with pins contact area, routing shakiness is caused to be rocked or chip stress during routing
While the anomaly lifted.
Although the pre-packaged framework of island-free can reach the purpose of support chip by pre-fill plastic packaging material, island-free is pre-
Encapsulating framework is big due to framework both sides copper face product proportional difference, can produce framework warpage issues, and load glue can be in plastic packaging material
Upper diffusion, stains onto framework pin, influences product yield and reliability.
The content of the invention
Technical problem to be solved in the utility model is directed to above-mentioned prior art and provides a kind of island-free framework encapsulation
Structure, it forms the chip supporting structure that Ji Dao is acted on, can effectively solve the problem that core after cured film solidification is pasted on island-free framework
Piece and pins contact area are too small to cause the problem that routing shakiness is rocked or chip-side is lifted during routing, while can also avoid
Framework warpage issues caused by pre-packaged framework both sides copper face product proportional difference is big.
The technical scheme in the invention for solving the above technical problem is：A kind of island-free framework encapsulation structure, it is wrapped
Include island-free framework, the island-free framework front is covered with cured film, be provided with chip in the cured film, the chip with
Island-free framework is electrically connected with by being electrically connected with part, outside the island-free framework, cured film, electric connection part
Plastic packaging material is encapsulated with, the island-free framework back side is exposed to plastic packaging material.
Compared with prior art, the utility model has the advantage of：
1st, the chip supporting structure that Ji Dao is acted on is formed after cured film solidification is pasted on island-free framework, being capable of reinforced frame
Enabling capabilities, can effectively solve the problem that chip and pins contact are too small causes routing shakiness to be rocked or chip-side is lifted during routing
Problem, improve routing when chip stability and product yield；
2nd, compared with pre-packaged technology：（1）The warpage issues of framework can be avoided；（2）Chip load glue can be avoided to exist
Diffusion on plastic packaging material（It is fine that load glue spreads management and control effect on this kind of film）.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of island-free framework encapsulation structure of the utility model.
Fig. 2 ~ Fig. 7 is a kind of each operation flow chart of island-free framework encapsulation technique of the utility model.
Wherein：
Island-free framework 1
Cured film 2
Chip 3
It is electrically connected with part 4
Plastic packaging material 5.
Specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in figure 1, a kind of island-free framework encapsulation structure in the present embodiment, it includes island-free framework 1, the nothing
The front of base island framework 1 is covered with cured film 2, and chip 3 is provided with the cured film 2, and the chip 3 leads to island-free framework 1
Cross electric connection part 4 to be electrically connected with, modeling is encapsulated with outside the island-free framework 1, cured film 2, electric connection part 4
Envelope material 5, the back side of island-free framework 1 is exposed to plastic packaging material 5.
Its process is as follows：
Step one, referring to Fig. 2, cured film is arranged on conversion film, according to needed for island-free framework is dimensioned to
Size, cured film can be FOW films or FOD films etc.；
The characteristic of above-mentioned cured film：This film has half mobility before curing, is mounted on by changing pad pasting, alignment method
The framework back side will not be flowed to when on hollow out framework from frame gap stain profile；When by heating, film is turned by half flow regime
It is changed into solid-state, also will not flows to the framework back side from frame gap in the process, after this film changes into solid-state, at normal temperatures or again
Secondary heating will not also revert to half flow regime；
Step 2, referring to Fig. 3, conversion film is provided with the one side of cured film and is attached on the interior pin of island-free framework, make
Cured film is attached on the interior pin of island-free framework；
Step 3, referring to Fig. 4, cured film is solidified, cured film complete solidification after remove conversion film；
Step 4, referring to Fig. 5, positive cartridge chip is carried out by load glue in cured film；
Step 5, referring to Fig. 6, be electrically connected with part and be electrically connected with chip and island-free framework, it is weldering to be electrically connected with part
Line；
Step 6, referring to Fig. 7, encapsulating coats framework, cured film, chip, is electrically connected with part, and nothing with plastic packaging material
The base island framework back side is exposed to plastic packaging material.
In addition to the implementation, the utility model also includes other embodiment, all use equivalents or equivalent
The technical scheme that substitute mode is formed, all should fall within the utility model scope of the claims.
Claims (1)
1. a kind of island-free framework encapsulation structure, it is characterised in that：It includes island-free framework（1）, the island-free framework（1）
Front is covered with cured film（2）, the cured film（2）On be provided with chip（3）, the chip（3）With island-free framework（1）It is logical
Cross electric connection part（4）It is electrically connected with, the island-free framework（1）, cured film（2）, be electrically connected with part（4）It is outer equal
It is encapsulated with plastic packaging material（5）, the island-free framework（1）The back side is exposed to plastic packaging material（5）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621140849.XU CN206250189U (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621140849.XU CN206250189U (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250189U true CN206250189U (en) | 2017-06-13 |
Family
ID=58996149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621140849.XU Active CN206250189U (en) | 2016-10-20 | 2016-10-20 | A kind of island-free framework encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250189U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373935A (en) * | 2016-10-20 | 2017-02-01 | 江苏长电科技股份有限公司 | Paddle-free frame package process and package structure |
-
2016
- 2016-10-20 CN CN201621140849.XU patent/CN206250189U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373935A (en) * | 2016-10-20 | 2017-02-01 | 江苏长电科技股份有限公司 | Paddle-free frame package process and package structure |
| CN106373935B (en) * | 2016-10-20 | 2019-04-16 | 江苏长电科技股份有限公司 | A kind of island-free framework encapsulation technique and its encapsulating structure |
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