CN100499101C - Thin film crystal-coated package structure with extended pin - Google Patents
Thin film crystal-coated package structure with extended pin Download PDFInfo
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- CN100499101C CN100499101C CN 200610099186 CN200610099186A CN100499101C CN 100499101 C CN100499101 C CN 100499101C CN 200610099186 CN200610099186 CN 200610099186 CN 200610099186 A CN200610099186 A CN 200610099186A CN 100499101 C CN100499101 C CN 100499101C
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- 239000010409 thin film Substances 0.000 title claims description 56
- 239000013078 crystal Substances 0.000 title abstract 5
- 238000004806 packaging method and process Methods 0.000 claims abstract description 57
- 238000010276 construction Methods 0.000 claims description 55
- 239000010408 film Substances 0.000 claims description 54
- 239000000084 colloidal system Substances 0.000 claims description 43
- 238000007639 printing Methods 0.000 claims description 33
- 238000003466 welding Methods 0.000 claims description 16
- 230000009286 beneficial effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 6
- 238000000576 coating method Methods 0.000 abstract 6
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- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Wire Bonding (AREA)
Abstract
The present invention relates to a film crystal coating packaging structure with the extending pins, which mainly comprises a circuit film, a protruding block wafer and a point coating glue body. The circuit film is the crystal coating connecting area in a rectangle corresponding to the wafer with a soft dielectric layer, a plurality of long side pins and short side pins. A plurality of inner connecting parts for the long side pins and the short side pins are respectively arranged on the two long sides or two short sides of the crystal coating connecting area, wherein the long side pins have a plurality of prolonging pins, and the inner connecting part of the prolonging pins is the inner connecting part longer than the neighboring long side pins and extends towards the center of the crystal coating connecting area to prevent the falling of the soft dielectric layer when connecting the protruding block of the wafer, so the point coating glue body can smoothly be filled between the circuit film and the wafer without producing air bubble.
Description
Technical field
The present invention relates to a kind of IC circuit packing structure, particularly relate to and a kind ofly can prevent subsiding of when the projection of joint wafer soft dielectric layer, make the spot printing colloid can be filled in smoothly between circuit film and this wafer, and can the gassing phenomenon have a thin-film flip-chip packaging construction (Chip-On-Film package) that prolongs pin.
Background technology
In existing integrated circuits packaging structure in the past, a kind of thin-film flip-chip packaging construction is to drive wafer and establish at the display of long rectangle, on the input of wafer two long sides and output, be equipped with a gold medal projection respectively, and through bestowing pressing and heating, to be engaged to the pin of a circuit film.When the heating-up temperature of wafer is passed to this circuit film, regular meeting causes this circuit film to be heated subsiding, and causes distortion, makes follow-up gluing difficulty, and acceptance rate reduces.Especially when the highdensity display of encapsulation drives wafer, because the output quantity of wafer increases, can't all be configured in a wherein long side of wafer,, and can influence the flow rate of spot printing colloid so the wafer output (projection) of part can be disposed at the wherein two short sides of wafer.
Seeing also Fig. 1, shown in Figure 2, is schematic cross-section and the underside perspective view that has known thin-film flip-chip packaging construction now.A kind of existing known thin-film flip-chip packaging construction 100 comprises a circuit film 110, a wafer 120 and a bit is coated with colloid 130.This wafer 120 has plurality of bump 121, to be engaged to this circuit film 110.This spot printing colloid 130 is to form in the spot printing mode after sticking brilliant and through capillary flow, to be filled between this wafer 120 and this circuit film 110.This circuit film 110 has a soft dielectric layer 111, a plurality of long side pin 112, a plurality of short side pin 113 and a welding resisting layer 114.This welding resisting layer 114 has a perforate 115, to appear those a plurality of interior junction surface 112A that grow side pins 112, those a plurality of interior junction surface 113A that lack side pins 113 and this soft dielectric layer 111 middle position corresponding to this wafer 120.And those projections 121 of this wafer 120 are the surroundings (as shown in Figure 2) that are arranged in an active surface, are engaged to the interior junction surface 112A of those long side pins 112 and the interior junction surface 113A of those short side pins 113 with the hot pressing method.
Therefore, seeing also shown in Figure 3ly, is the existing known schematic cross-section of thin-film flip-chip packaging construction when wafer engages.This soft dielectric layer 111 is the individual layer kenel corresponding to the place, active surface central authorities below of this wafer 120, lack enough supports, can be heated at the engaging process of this wafer 120 and to cause subsiding (111A of place that subsides as shown in Figure 3), active surface central authorities that cause this wafer 120 and the gap of the gap of this circuit film 110 less than active surface periphery with this circuit film 110 of this wafer 120, so this spot printing colloid 130 can produce different flow rates at diverse location in follow-up spot printing process, particularly subside and to produce bubble 131 (as shown in Figure 1) between the 111A of place and this wafer 120 at this, because the filling of this spot printing colloid 130 is unreal, reduce and cause encapsulating acceptance rate.
The original application people has disclosed a kind of " thin-film flip-chip packaging construction " No. 505315 at the TaiWan, China patent announcement, one flow guide bar is the upper surface that is formed at a flexible film, fill flowing of material (being the spot printing colloid) to guide a bottom, for reaching the water conservancy diversion effect, the configuration direction of this flow guide bar be with a wafer than long side for vertical, can't reach obvious support effect, subside so this flexible film still can be heated.
This shows that above-mentioned existing thin-film flip-chip packaging construction obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel thin-film flip-chip packaging construction with prolongation pin, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing thin-film flip-chip packaging construction exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new thin-film flip-chip packaging construction with prolongation pin, can improve general existing thin-film flip-chip packaging construction, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing thin-film flip-chip packaging construction exists, and a kind of novel thin-film flip-chip packaging construction that prolongs pin that has is provided, technical problem to be solved is to make it can prevent subsiding of when engaging the projection of a wafer soft dielectric layer, makes to keep the consistent gap that can flow smoothly for colloid between circuit film and wafer.Therefore the spot printing colloid that forms at successive process mid point glue can be filled between this circuit film and this wafer smoothly, can gassing, with the effect of heat conduction, be very suitable for practicality with electrical barrier.
Another object of the present invention is to, a kind of novel thin-film flip-chip packaging construction with prolongation pin is provided, technical problem to be solved is to make wherein that to prolong pins at those of the longer side of difference in this chip bonding district be for being staggered, and can avoid those to prolong between pins electrically short circuit and a bit be coated with the interference that colloid flows, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of thin-film flip-chip packaging construction that the present invention proposes, it comprises: a circuit film, and it has a soft dielectric layer, a plurality of long side pin and a plurality of short side pin; One wafer, it has plurality of bump, and those projections are to be engaged to those long side pins and those short side pins; And a bit being coated with colloid, it is to be formed between this circuit film and this wafer; Wherein, this circuit film definition has one corresponding to this wafer and general rectangular chip bonding district, the a plurality of interior junction surface of those long side pins is the two longer sides that are arranged in this chip bonding district, the a plurality of interior junction surface of those short side pins is two shorter sides that are arranged in this chip bonding district, wherein in those long side pins, comprise a plurality of prolongation pins, those extensions that prolong pin are central authorities' extensions of being longer than interior junction surface and past this chip bonding district of adjacent long side pin, to prevent being beneficial to the filling of this spot printing colloid engaging those projections the subsiding of this soft dielectric layer when those long side pins are lacked the side pin with those.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid thin-film flip-chip packaging construction, the wherein said length that those prolong those extensions of pin is the average length greater than the interior junction surface of those long side pins that do not prolong, and is not more than a half width in this chip bonding district.
Aforesaid thin-film flip-chip packaging construction, it includes a welding resisting layer in addition, it is formed on this soft dielectric layer and local those long side pins and those the short side pins of covering, and this welding resisting layer is to have a perforate, and it is those interior junction surfaces that appear those long side pins, those interior junction surfaces of those short side pins and those extensions of those prolongation pins.
Aforesaid thin-film flip-chip packaging construction, wherein said spot printing colloid are those interior junction surfaces that seal those projections, those long side pins, those interior junction surfaces of those short side pins and those extensions of those prolongation pins.
Aforesaid thin-film flip-chip packaging construction, wherein prolonging pins at those of the longer side of difference in this chip bonding district is to be staggered.
Aforesaid thin-film flip-chip packaging construction, wherein said those extensions that those prolong pin are gradually long along with the central authorities in past this chip bonding district.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of thin-film flip-chip packaging construction that the present invention proposes, it comprises: a circuit film, and it has a soft dielectric layer and a plurality of pin; One wafer, it has plurality of bump, and those projections are a plurality of interior junction surfaces that are engaged to those pins; And a bit being coated with colloid, it is formed between this circuit film and this wafer; Wherein, this circuit film definition has one corresponding to this wafer and general rectangular chip bonding district, junction surface is the periphery that is arranged in this chip bonding district in those of those pins, wherein in those pins, comprise at least one prolongation pin, the extension of this prolongation pin is central authorities' extension of being longer than interior junction surface and past this chip bonding district of adjacent leads, to prevent subsiding of when engaging those pins and those projections this soft dielectric layer, be beneficial to the filling of this spot printing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid thin-film flip-chip packaging construction, the wherein said length that those prolong those extensions of pin is the average length greater than the interior junction surface of those pins that do not prolong, and is not more than a half width in this chip bonding district.
Aforesaid thin-film flip-chip packaging construction, it includes a welding resisting layer in addition, and it is formed on this soft dielectric layer and locally covers those pins, and this welding resisting layer has a perforate, and it is those extensions that appear those pins and this prolongation pin.
Aforesaid thin-film flip-chip packaging construction, wherein said spot printing colloid are this extensions of this prolongation pin of sealing.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object,, mainly comprise a circuit film, a wafer and a bit be coated with colloid according to a kind of thin-film flip-chip packaging construction of the present invention.This circuit film has a soft dielectric layer, a plurality of long side pin and a plurality of short side pin.This wafer has plurality of bump, and it is to be engaged to those long side pins and those short side pins.This spot printing colloid is to be formed between this circuit film and this wafer.Wherein, this circuit film is that definition has one corresponding to this wafer and general rectangular chip bonding district, the a plurality of interior junction surface of those long side pins is the two longer sides that are arranged in this chip bonding district, the a plurality of interior junction surface of those short side pins is two shorter sides that are arranged in this chip bonding district, in those long side pins, be to comprise a plurality of prolongation pins wherein, those interior junction surfaces that prolong pin are central authorities' extensions of being longer than interior junction surface and past this chip bonding district of adjacent long side pin, can prevent from engaging those projections the subsiding of this soft dielectric layer when those long side pins are lacked the side pin with those, be beneficial to the filling of this spot printing colloid, can the gassing phenomenon.
By technique scheme, the present invention has the thin-film flip-chip packaging construction that prolongs pin and has following advantage at least:
1, the present invention is that definition has rectangular without exception chip bonding district at a circuit film, and have a plurality of long side pin and an a plurality of short side pin on a soft dielectric layer, wherein in those long side pins, comprise a plurality of prolongation pins, those interior junction surfaces that prolong pin are central authorities' extensions of being longer than interior junction surface and past this chip bonding district of adjacent long side pin, can prevent subsiding of when engaging the projection of a wafer this soft dielectric layer, make that keep can be for the smooth mobile consistent gap of colloid between this circuit film and this wafer.Therefore, the spot printing colloid that forms at successive process mid point glue can be filled between this circuit film and this wafer smoothly, can gassing, with the effect of heat conduction, be very suitable for practicality with electrical barrier.
2, to prolong pins at those of the longer side of difference in this chip bonding district be for being staggered in the present invention, and can avoid those to prolong between pins electrically short circuit and a bit be coated with the interference that colloid flows, thereby be suitable for practicality more.
In sum, the present invention is relevant a kind of thin-film flip-chip packaging construction that prolongs pin that has, consist predominantly of a circuit film, one projection wafer and a bit be coated with colloid, this circuit film is that definition has one corresponding to this wafer and general rectangular chip bonding district and have a soft dielectric layer, a plurality of long side pins and a plurality of short side pin, those long side pins are two longer sides and two shorter sides that are arranged in this chip bonding district respectively with a plurality of interior junction surface of short side pin, in those long side pins, be to comprise a plurality of prolongation pins wherein, those interior junction surfaces that prolong pins are to be longer than the interior junction surface of adjacent long side pin and to extend toward the central authorities in this chip bonding district, can prevent subsiding of when engaging the projection of this wafer this soft dielectric layer.Therefore, this spot printing colloid can be filled between this circuit film and this wafer smoothly, can the gassing phenomenon.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing thin-film flip-chip packaging construction has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section that has known thin-film flip-chip packaging construction now.
Fig. 2 is the underside perspective view that has known thin-film flip-chip packaging construction now.
Fig. 3 is the existing known schematic cross-section of thin-film flip-chip packaging construction when wafer engages.
Fig. 4 is according to first preferred embodiment of the present invention, a kind of schematic cross-section of thin-film flip-chip packaging construction.
Fig. 5 is according to first preferred embodiment of the present invention, the underside perspective view of this thin-film flip-chip packaging construction.
Fig. 6 is according to first preferred embodiment of the present invention, the schematic cross-section of this thin-film flip-chip packaging construction when wafer engages.
Fig. 7 is according to second preferred embodiment of the present invention, the underside perspective view of another thin-film flip-chip packaging construction.
100: thin-film flip-chip packaging construction 110: circuit film
111: soft dielectric layer 111A: the place subsides
112: long side pin 112A: interior junction surface
113: short side pin 113A: interior junction surface
114: welding resisting layer 115: perforate
120: wafer 121: projection
130: spot printing colloid 131: bubble
200: thin-film flip-chip packaging construction 210: circuit film
210A: chip bonding district 211: soft dielectric layer
212: long side pin 212A: interior junction surface
213: short side pin 213A: interior junction surface
214: prolong pin 214A: extension
215: welding resisting layer 216: perforate
220: wafer 221: projection
230: spot printing colloid 310: circuit film
310A: chip bonding district 311: long side pin
311A: interior junction surface 312: short side pin
312A: interior junction surface 313: prolong pin
313A: extension
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, have its embodiment of thin-film flip-chip packaging construction, structure, feature and an effect thereof that prolongs pin to what foundation the present invention proposed, describe in detail as after.
Seeing also shown in Figure 4ly, is according to first preferred embodiment of the present invention, a kind of schematic cross-section of thin-film flip-chip packaging construction.A kind of thin-film flip-chip packaging construction 200 that the present invention's first specific embodiment discloses mainly comprises a circuit film 210, a wafer 220 and a bit is coated with colloid 230.This wafer 220 is to be engaged on this circuit film 210, and this circuit film 210 is that definition has one corresponding to this wafer 220 and general rectangular chip bonding district 210A (as shown in Figure 5).
See also Fig. 4 and shown in Figure 5, Fig. 5 is the underside perspective view according to first this thin-film flip-chip packaging construction of preferred embodiment of the present invention.This circuit film 210 has a soft dielectric layer 211, a plurality of long side pin 212 and a plurality of short side pin 213, wherein includes a plurality of prolongation pins 214 in those long side pins 212.Usually the material of this soft dielectric layer 211 is to can be polyimides (polyimide PI), as those long side pins 212, those short side pins 213 film carrier with those prolongation pins 214, transmits in order to coil type.And on hardness, those prolong pin 214 is to be higher than this soft dielectric layer 211, for example copper (Cu).Wherein, as shown in Figure 5, the a plurality of interior junction surface 212A of those long side pins 212 is the two longer sides that are arranged in this chip bonding district 210A, the a plurality of interior junction surface 213A of those short side pins 213 is two shorter sides that are arranged in this chip bonding district 210A, and those a plurality of extension 214A that prolong pins 214 are longer than the interior junction surface 212A of adjacent long side pin 212 and extend (as shown in Figure 5) toward the central authorities of this chip bonding district 210A.Usually those length that prolong the extension 214A of pin 214 are the average lengths greater than the interior junction surface 212A of the long side pin 212 that does not prolong, and be not more than the half width of this chip bonding district 210A, promptly be no more than the center line of this chip bonding district 210A (wafer 220), can avoid electrical short circuit taking place with the long side pin 212 of another long side, can promote the diffuses flow of this spot printing colloid 230 again, prevent that colloid from returning the packet generation bubble in central authorities.Preferably, more as shown in Figure 5, those prolongation pins 214 that are positioned at the longer side of difference of this chip bonding district 210A are for being staggered the interference that can avoid those prolongation 214 electrical short circuits of pin and this spot printing colloid 230 to flow.
In the present embodiment, this circuit film 210 is to include a welding resisting layer 215 in addition, liquid photosensitive welding cover layer (liquid photoimagable solder mask for example, LPI), photosensitive cover lay (photoimagable cover layer, PIC) or can be the non-conductive printing ink or the cover layer (cover layer) of general non-photosensitive dielectric material.This welding resisting layer 215 is to be formed on this soft dielectric layer 211 and local those long side pins 212 and those the short side pins 213 of covering, and this welding resisting layer 215 is to have a perforate 216, and it is those interior junction surface 212A that appear those long side pins 212, those interior junction surface 213A of those short side pins 213 and those extensions 214A of those prolongation pins 214.
This wafer 220 is to have plurality of bump 221, and it is a periphery of being located at an active surface of this wafer 220.Those projections 221 are those interior junction surface 212A that are engaged to those long side pins 212, those interior junction surface 213A of those short side pins 213 and those extensions 214A of those prolongation pins 214.This spot printing colloid 230 is to be formed between this circuit film 210 and this wafer 220.Usually this spot printing colloid 230 is to be a underfill, has good fluidity when spot printing, is filled between this circuit film 210 and this wafer 220 by capillarity.In the present embodiment, this spot printing colloid 230 is those interior junction surface 212A that seal those projections 221, those long side pins 212, those interior junction surface 213A of those short side pins 213 and those extensions 214A of those prolongation pins 214.
Be engaged to the process of this circuit film 210 at this wafer 220, can apply pressure force and heat this wafer 220 and this circuit film 210, make those projections 221 be bonded to those interior junction surface 212A of those long side pins 212, those interior junction surface 213A of those short side pins 213 and those extensions 214A of those prolongation pins 214.
Seeing also shown in Figure 6ly, is according to first preferred embodiment of the present invention, the schematic cross-section of this thin-film flip-chip packaging construction when wafer engages.Those those extensions 214A (not shown)s that prolong pin 214 can support this soft dielectric layer 211 that is heated, and it is excessively subsided.So after those projections 221 engage, the gap that can be consistent between this soft dielectric layer 21 and this wafer 220, in follow-up some glue step, this spot printing colloid 230 can be filled between this wafer 220 and this circuit film 210, can gassing.
Seeing also shown in Figure 7ly, is the underside perspective view according to second another thin-film flip-chip packaging construction of preferred embodiment of the present invention.In second specific embodiment, disclosed another kind of thin-film flip-chip packaging construction, mainly comprise a circuit film, a wafer and a bit be coated with colloid, wherein wafer can be identical with first specific embodiment with the spot printing colloid, so no longer illustrate and give unnecessary details.As shown in Figure 7, this circuit film 310 also defines rectangular without exception chip bonding district 310A, and has an a plurality of long side pin 311 on a soft dielectric layer, a plurality of short side pins 312 and a plurality of prolongation pin 313, a plurality of extension 313A of junction surface 311A and those prolongation pins 313 are the two longer sides in this chip bonding district 310A of being staggered in those long side pins 311 a plurality of, the a plurality of interior junction surface 312A of those short side pins 312 is two shorter sides that are arranged in this chip bonding district 310A, those those extensions 313A that prolong pin 313 are central authorities' extensions of being longer than interior junction surface 311A and past this chip bonding district 310A of adjacent long side pin 311, this soft dielectric layer is heated and subsides in the time of can preventing the wafer joint, and has influenced the filling of spot printing colloid.In the present embodiment, those those extensions 313A that prolong pin 313 are gradually long along with the central authorities of past this chip bonding district 310A, can strengthen anti-the subside intensity of this circuit film 310 corresponding to the middle position of this wafer.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of thin-film flip-chip packaging construction is characterized in that it comprises:
One circuit film, it has a soft dielectric layer, a plurality of long side pin and a plurality of short side pin;
One wafer, it has plurality of bump, and those projections are to be engaged to those long side pins and those short side pins; And
Any is coated with colloid, and it is to be formed between this circuit film and this wafer;
Wherein, this circuit film definition has one corresponding to this wafer and general rectangular chip bonding district, the a plurality of interior junction surface of those long side pins is the two longer sides that are arranged in this chip bonding district, the a plurality of interior junction surface of those short side pins is two shorter sides that are arranged in this chip bonding district, wherein in those long side pins, comprise a plurality of prolongation pins, those extensions that prolong pin are central authorities' extensions of being longer than interior junction surface and past this chip bonding district of adjacent long side pin, to prevent being beneficial to the filling of this spot printing colloid engaging those projections the subsiding of this soft dielectric layer when those long side pins are lacked the side pin with those.
2, thin-film flip-chip packaging construction according to claim 1, it is characterized in that the wherein said length that those prolong those extensions of pin is the average length greater than the interior junction surface of those long side pins that do not prolong, and be not more than a half width in this chip bonding district.
3, thin-film flip-chip packaging construction according to claim 1, it is characterized in that it includes a welding resisting layer in addition, it is formed on this soft dielectric layer and local those long side pins and those the short side pins of covering, and this welding resisting layer is to have a perforate, and it is those interior junction surfaces that appear those long side pins, those interior junction surfaces of those short side pins and those extensions of those prolongation pins.
4,, it is characterized in that wherein said spot printing colloid is those interior junction surfaces that seal those projections, those long side pins, those interior junction surfaces of those short side pins and those extensions of those prolongation pins according to claim 1 or 3 described thin-film flip-chip packaging constructions.
5, thin-film flip-chip packaging construction according to claim 1 is characterized in that wherein prolonging pins at those of the longer side of difference in this chip bonding district is to be staggered.
6, thin-film flip-chip packaging construction according to claim 1 is characterized in that wherein said those extensions that those prolong pin are gradually long along with the central authorities in past this chip bonding district.
7, a kind of thin-film flip-chip packaging construction is characterized in that it comprises:
One circuit film, it has a soft dielectric layer and a plurality of pin;
One wafer, it has plurality of bump, and those projections are a plurality of interior junction surfaces that are engaged to those pins; And
Any is coated with colloid, and it is formed between this circuit film and this wafer;
Wherein, this circuit film definition has one corresponding to this wafer and general rectangular chip bonding district, junction surface is the periphery that is arranged in this chip bonding district in those of those pins, wherein in those pins, comprise at least one prolongation pin, the extension of this prolongation pin is central authorities' extension of being longer than interior junction surface and past this chip bonding district of adjacent leads, to prevent subsiding of when engaging those pins and those projections this soft dielectric layer, be beneficial to the filling of this spot printing colloid.
8, thin-film flip-chip packaging construction according to claim 7, it is characterized in that the wherein said length that those prolong those extensions of pin is the average length greater than the interior junction surface of those pins that do not prolong, and be not more than a half width in this chip bonding district.
9, thin-film flip-chip packaging construction according to claim 7, it is characterized in that it includes a welding resisting layer in addition, it is formed on this soft dielectric layer and locally covers those pins, and this welding resisting layer has a perforate, and it is those extensions that appear those pins and this prolongation pin.
10, thin-film flip-chip packaging construction according to claim 7 is characterized in that wherein said spot printing colloid is this extension of this prolongation pin of sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610099186 CN100499101C (en) | 2006-08-02 | 2006-08-02 | Thin film crystal-coated package structure with extended pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610099186 CN100499101C (en) | 2006-08-02 | 2006-08-02 | Thin film crystal-coated package structure with extended pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101118896A CN101118896A (en) | 2008-02-06 |
| CN100499101C true CN100499101C (en) | 2009-06-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610099186 Expired - Fee Related CN100499101C (en) | 2006-08-02 | 2006-08-02 | Thin film crystal-coated package structure with extended pin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447889B (en) * | 2011-08-05 | 2014-08-01 | Chipmos Technologies Inc | Chip package structure |
| TWI726427B (en) * | 2019-09-27 | 2021-05-01 | 友達光電股份有限公司 | Device substrate |
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