CN101118882A - Glass crystal packaging structure for image sensory element - Google Patents
Glass crystal packaging structure for image sensory element Download PDFInfo
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- CN101118882A CN101118882A CN 200610099584 CN200610099584A CN101118882A CN 101118882 A CN101118882 A CN 101118882A CN 200610099584 CN200610099584 CN 200610099584 CN 200610099584 A CN200610099584 A CN 200610099584A CN 101118882 A CN101118882 A CN 101118882A
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- package structure
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- 239000011521 glass Substances 0.000 title claims abstract description 134
- 239000013078 crystal Substances 0.000 title abstract 7
- 238000004806 packaging method and process Methods 0.000 title description 4
- 230000001953 sensory effect Effects 0.000 title 1
- 239000011248 coating agent Substances 0.000 claims abstract description 69
- 238000000576 coating method Methods 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims description 67
- 239000000084 colloidal system Substances 0.000 claims description 41
- 230000003287 optical effect Effects 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 16
- 230000000903 blocking effect Effects 0.000 abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 52
- 238000013461 design Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000693 micelle Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention relates to a glass crystal coating sealing structure for the image sensor, which mainly comprises a glass basal plate, an image sensor crystal and a point photoresist coating body. One active face of the image sensor crystal comprises a light sensing area, and the glass basal plate has a closed blocking ring around the light sensing area, and the active face of the image sensor crystal is provided with a plurality of protruding blocks which can be distorted, and when the protruding blocks which can be distorted are connected with the connecting cushion of the glass basal plate, the present invention can reduce the clearance between the image sensor crystal and the glass basal plate to make the closed blocking ring easily blocking the flowing to the light sensing area of the image sensor crystal for the point photoresist coating body, thereby ensuring having good point coating effect.
Description
Technical field
The present invention relates to a kind of semiconductor packaging of image sensor wafer, particularly relate to a kind of gap that can dwindle between image sensor wafer and the glass substrate, make this airtight baffle ring be easier to stop point and be coated with the optical sensing area that colloid flows into the image sensor wafer, and can guarantee to have the glass coating package structure (Chip-On-Glass (COG) package) of the image sensor of good some glue effect.
Background technology
In the image sensor packaging structure in early days, the image sensor wafer is sticking being located on the printed circuit board (PCB), utilizes bonding wire to reach both and electrically connects.One optical glass is to be sticked in advance on the active surface of wafer before encapsulation, or on the barricade that is located on the substrate of after encapsulation, adhering, so the thickness of whole encapsulation becomes thicker.The image sensor packaging structure is to attempt changing to glass flip chip (Chip-On-Glass in recent years; COG) encapsulation; the image sensor wafer has electroplates the golden projection that forms; on the glass substrate that is engaged in a tool line layer; economize the step of removing routing simultaneously; to meet light, thin, short, the little requirement of present semiconductor product, in the process of spot printing, can flow to coat the projection of image sensor wafer yet put micelle colloid, its flowability is polluted the optical sensing area of image sensor wafer through regular meeting.In the bake process of this external some micelle colloid, can produce escaping gas and pollute this optical sensing area.
Seeing also shown in Figure 1ly, is the schematic cross-section of the glass coating package structure of existing known image sensor.Have the glass coating package structure 100 of known image sensor now, comprise a glass substrate 110, an image sensor wafer 120 and a bit be coated with colloid 130.One active surface 121 of this image sensor wafer 120 includes an optical sensing area 122, and the golden projection 123 that a plurality of plating form is arranged on this active surface 121 and a periphery at this optical sensing area 122.Include a plurality of connection gaskets 111 on one line layer of this glass substrate 110, for joint, and can use the spot printing colloid 130 of underfill (underfill material) to be formed between this glass substrate 110 and this image sensor wafer 120 with those golden projections 123.Usually electrogilding projection 123 hard are higher, gap between this glass substrate 110 and this image sensor wafer 120 does not have the elasticity of dwindling, and this spot printing colloid 130 can flow arbitrarily, and pollutes to this sensing area 122, the problem that anaclasis and light disturb takes place, and causes the image sensing distortion.In addition, usually these spot printing colloid 130 palpus heated bakings are to reach curing, when this spot printing colloid 130 of baking, this spot printing colloid 130 can be discharged escaping gas, this optical sensing area 122 of this image sensor wafer 120 is polluted, cause the Image Sensor in this optical sensing area 122 to break down or the sensing sensitivity deterioration.
This shows that the glass coating package structure of above-mentioned existing image sensor obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of glass coating package structure of new image sensor, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that the glass coating package structure of above-mentioned existing image sensor exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of glass coating package structure of new image sensor, can improve the glass coating package structure of general existing image sensor, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective of the glass coating package structure existence of existing image sensor, and provide a kind of glass coating package structure of new image sensor, technical problem to be solved is the gap that can dwindle when making those deformability bump bond to the connection gasket of this glass substrate between image sensor wafer and the glass substrate, and make this airtight baffle ring be easier to stop that any is coated with the optical sensing area that colloid flows into this image sensor wafer, and can guarantee the some glue effect of image sensor, be very suitable for practicality.
Another object of the present invention is to, a kind of glass coating package structure of new image sensor is provided, technical problem to be solved is to make wherein employed spot printing colloid further dwindle gap between image sensor wafer and the glass substrate when solidifying, and can make this airtight baffle ring have more the effect of isolated gas, prevent that the volatilization gas that the spot printing colloid produces from infiltrating in this optical sensing area when solidifying, thereby be suitable for practicality more.
An also purpose of the present invention is, a kind of glass coating package structure of new image sensor is provided, technical problem to be solved is to make wherein that this airtight baffle ring and those connection gaskets are surface relief, and can make those deformability projections when being engaged to the connection gasket of this glass substrate, can have bigger deflection, and can not open circuit and the problem that engages failure, thereby be suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.The glass coating package structure of a kind of image sensor that proposes according to the present invention, it comprises: a glass substrate, it has a plurality of connection gaskets and an airtight baffle ring; One image sensor wafer, it is located on this glass substrate, and this image sensor wafer has an active surface, and this active surface comprises an optical sensing area, and this active surface is provided with a plurality of deformability projections (deformable bumps), to be engaged to those connection gaskets; And a bit being coated with colloid, it is formed on this glass substrate and the part is filled between this glass substrate and this image sensor wafer, to coat those deformability projections; Wherein, this airtight baffle ring is to be surrounded on outside this optical sensing area, flows in this optical sensing area to stop this spot printing colloid.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The glass coating package structure of aforesaid image sensor, wherein said spot printing colloid are the non-conductive adhesives (NCP) for having cure shrinkage.
The glass coating package structure of aforesaid image sensor, the distortion that wherein said those deformability projections are produced makes this airtight baffle ring contact this active surface of this image sensor wafer.
The glass coating package structure of aforesaid image sensor, the height of wherein said those deformability projections after distortion are the thickness less than those connection gaskets.
The glass coating package structure of aforesaid image sensor, the gap between wherein said glass substrate and this image sensor wafer is between 10～22 microns.
The glass coating package structure of aforesaid image sensor, wherein said airtight baffle ring are to be about contour with those connection gaskets.
The glass coating package structure of aforesaid image sensor, wherein said airtight baffle ring and those connection gaskets are to be formed at same line layer.
The glass coating package structure of aforesaid image sensor, the material of wherein said airtight baffle ring and those connection gaskets are to be gold.
The glass coating package structure of aforesaid image sensor, the bottom of wherein said airtight baffle ring and those connection gaskets are to be formed with an adhesion coating, to be bonded to this glass substrate.
The glass coating package structure of aforesaid image sensor, the material of wherein said adhesion coating are to be titanium-tungsten.
The glass coating package structure of aforesaid image sensor, wherein said spot printing colloid are to be selected from one of them of high flow underfill, non-current underfill and marine glue.
The glass coating package structure of aforesaid image sensor, wherein said those deformability projections are the tie lines projections (stud bump) that form for routing.
The glass coating package structure of aforesaid image sensor, it includes a flexible circuit board in addition, and it is attached at a wherein side of this glass substrate.
The glass coating package structure of aforesaid image sensor, wherein said glass substrate are to lack welding resisting layer, are that surface relief is in this glass substrate and make this airtight baffle ring and those connection gaskets.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, according to the present invention, a kind of glass coating package structure of image sensor mainly comprises a glass substrate, an image sensor wafer and a bit is coated with colloid.This glass substrate has a plurality of connection gaskets and an airtight baffle ring.This image sensor wafer is located on this glass substrate, and this image sensor wafer has an active surface, and this active surface comprises an optical sensing area, and this active surface is provided with a plurality of deformability projections, to be engaged to those connection gaskets.This spot printing colloid is to be formed on this glass substrate and the part is filled between this glass substrate and this image sensor wafer, to coat those deformability projections.Wherein, this airtight baffle ring is to be surrounded on outside this optical sensing area, flows in this optical sensing area to stop this spot printing colloid.
By technique scheme, the glass coating package structure of image sensor of the present invention has following advantage at least:
1, a glass substrate of the present invention be have one can be around the airtight baffle ring of an optical sensing area, and be to be provided with a plurality of deformability projections (deformablebumps) on the active surface of an image sensor wafer, when those deformability bump bond can be dwindled gap between image sensor wafer and the glass substrate during to the connection gasket of this glass substrate, thereby making that this airtight baffle ring is easier stops that any is coated with the optical sensing area that colloid flows into this image sensor wafer, and can guarantee the some glue effect of image sensor, be very suitable for practicality.
2, in addition, it is for having the non-conductive adhesive (NCP of cure shrinkage that the present invention makes wherein employed spot printing colloid, Non-Conductive Paste), can when solidifying, further dwindle in the spot printing colloid gap between image sensor wafer and the glass substrate, and can make this airtight baffle ring have more the effect of isolated gas, can prevent that the volatilization gas that the spot printing colloid produces from infiltrating in this optical sensing area when solidifying, thereby be suitable for practicality more.
3 moreover, the present invention's this glass substrate wherein is for lacking the welding resisting layer structure, and make that this airtight baffle ring and those connection gaskets are surface relief, and can make those deformability projections when being engaged to the connection gasket of this glass substrate, can have bigger deflection, and can not open circuit and the problem that engages failure, thereby be suitable for practicality more.
In sum, the invention relates to a kind of glass coating package structure of image sensor, mainly comprise a glass substrate, an image sensor wafer and a bit be coated with colloid.One active surface of this image sensor wafer comprises an optical sensing area, this glass substrate has one can be around the airtight baffle ring of this optical sensing area, and the active surface of this image sensor wafer is provided with a plurality of deformability projections, when those deformability bump bond during to the connection gasket of this glass substrate, can dwindle the gap between image sensor wafer and the glass substrate, and can make easier this spot printing colloid that stops of this airtight baffle ring flow into the optical sensing area of this image sensor wafer, can guarantee to have good some glue effect.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, obvious improvement is arranged technically, and produced handy and practical effect, and the glass coating package structure of more existing image sensor has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section that has the glass coating package structure of known image sensor now.
Fig. 2 is according to a specific embodiment of the present invention, a kind of schematic cross-section of glass coating package structure of image sensor.
Fig. 3 is according to a specific embodiment of the present invention, the upper surface schematic diagram of its glass substrate of glass coating package structure of this image sensor.
Fig. 4 is according to a specific embodiment of the present invention, the schematic cross-section of the glass coating package structure of this image sensor when chip bonding.
100: the glass coating package structure 110 of image sensor: glass substrate
111: connection gasket 120: image sensing wafer
121: active surface 122: optical sensing area
123: electrogilding projection 130: the spot printing colloid
200: the glass coating package structure 210 of image sensor: glass substrate
211: connection gasket 212: airtight baffle ring
213: outer connection pad 214: adhesion coating
220: image sensing wafer 221: active surface
222: the back side 223: optical sensing area
224: deformability projection 225: weld pad
230: spot printing colloid 240: flexible circuit board
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of glass coating package structure, structure, feature and the effect thereof of the image sensor that foundation the present invention is proposed, describe in detail as after.
According to first specific embodiment of the present invention, see also Fig. 2 to shown in Figure 4, disclosed a kind of glass coating package structure of image sensor.Seeing also shown in Figure 2ly, is the schematic cross-section according to the glass coating package structure of a kind of image sensor of the present invention's one specific embodiment.The glass coating package structure 200 of this image sensor mainly comprises a glass substrate 210, an image sensor wafer 220 and a bit is coated with colloid 230.This glass substrate 210 is these image sensor wafers 220 of carrying and provides telecommunication switching and light to accept the function in path.This spot printing colloid 230 is that partially sealed this image sensor wafer 220 and this image sensor wafer 220 of strong bonded are to this glass substrate 210.In a concrete structure, this glass coating package structure 200 can include a flexible circuit board 240 in addition, and it is a wherein side that is attached at this glass substrate 210.
See also Fig. 2 also in conjunction with consulting Fig. 3, shown in Figure 4, Fig. 3 is the upper surface schematic diagram according to its glass substrate of glass coating package structure of this image sensor in the specific embodiment of the present invention, and Fig. 4 is according to the glass coating package structure of this image sensor in the present invention's one specific embodiment schematic cross-section when the chip bonding.Above-mentioned glass substrate 210 is to have a plurality of connection gaskets 211 and an airtight baffle ring 212.
Those connection gaskets 211 are the periphery peripheries that are arranged in this airtight baffle ring 212.In addition, this glass substrate 210 can have a plurality of outer connection pads 213 in addition, electrically connects the same side that corresponding connection gasket 211 also can be arranged in this glass substrate 210 by circuit, for engaging this flexible circuit board 240 or other outer element that connects.
Wherein, this airtight baffle ring 212 is for gold (Au) with the material of those connection gaskets 211, has antirust effect, does not need to electroplate separately.And the bottom of this airtight baffle ring 212 and those connection gaskets 211 is to be formed with an adhesion coating 214, to be bonded to this glass substrate 210, still is difficult for peeling off under the protection of no welding resisting layer.Wherein, the material of this adhesion coating is to can be titanium-tungsten (Ti-W).
Above-mentioned image sensor wafer 220 is to be arranged on this glass substrate 210, and this image sensor wafer 220 has an active surface 221 and an opposing backside surface 222.
This active surface 221, it comprises an optical sensing area 223, is provided with Image Sensor in it, and making this image sensor wafer 220 is a CMOS image sensing wafer or other sensor wafer.And this active surface 221 is provided with a plurality of deformability projections 224 (deformable bump), and it is to be positioned on a plurality of weld pads 225 at these active surface 221 places, to be engaged to those connection gaskets 211.
Wherein, those deformability projections 224 in Fig. 2 are for after being out of shape, and those deformability projections 224 in Fig. 4 are for before the distortion, and it highly can be controlled in 10～50 microns.After wafer engaged, the deflection of those deformability projections 224 was about percentage 50 or more.Usually those deformability projections 224 are tie lines projection (stud bump) or other the soft conductive projections that form for routing, for example be to utilize wire bonding machine table to freeze a balling end of gold thread on those weld pads 225 and block immediately, to form those deformability projections 224.
Therefore, by said structure, can effectively dwindle the gap between the glass surface of this active surface 221 of this image sensor wafer 220 and this glass substrate 210, and then make the maximum retaining glue function of these airtight baffle ring 212 performances.So in the design of this glass substrate 210, this airtight baffle ring 212 can be about the contour effect that can bring into play retaining glue with those connection gaskets 211.
In the present embodiment, this airtight baffle ring 212 is to be formed at same line layer with those connection gaskets 211, can reduce the cost of this airtight baffle ring 212.In addition, in the present embodiment, after wafer engaged, the gap between this glass substrate 210 and this image sensor wafer 220 was between 10～22 microns (thickness that comprise those connection gaskets 211).Preferably, the distortion that those deformability projections 224 are produced makes this active surface 221 of these airtight baffle ring 212. these image sensor wafers 220 of contact, and can reach the effect of escaping gas diffusion when stopping the mobile of this spot printing colloid 230 and solidifying.Again as shown in Figure 2, the height of those deformability projections 224 after distortion is can be less than the thickness of those connection gaskets 211, those deformability projections 224 can be gold-gold bonding (Au-Au bonding) with the engagement relationship of corresponding those connection gaskets 211, and its bonding mode can adopt the combination of hot pressing, ultrasonic wave (ultrasonic waves) pressing or above-mentioned two kinds of methods.
Above-mentioned spot printing colloid 230 is to be formed on this glass substrate 210, and the part is filled between this glass substrate 210 and this image sensor wafer 220, to coat those deformability projections 224.Wherein, this airtight baffle ring 212 is to be surrounded on outside this optical sensing area 223, flows in this optical sensing area 223 to stop this spot printing colloid 230.Preferably, this spot printing colloid 230 is non-conductive adhesive (the Non-Conductive Paste for having cure shrinkage, NCP), so can when this spot printing colloid 230 solidifies, further dwindle the gap between this image sensor wafer 220 and this glass substrate 210, make this airtight baffle ring 212 have more the effect of isolated gas, prevent that the volatilization gas that spot printing colloid 230 produces from infiltrating in this optical sensing area 223 when solidifying.Yet, in the present embodiment, although illustrate that with preferable specific embodiment this spot printing colloid 230 is is non-conductive adhesive (NCP), yet in the utilization of different embodiment, this spot printing colloid 230 is to can be selected from one of them of high flow underfill, non-current underfill and marine glue.
Preferably, this glass substrate 210 is be to lack the welding resisting layer structure, and make this airtight baffle ring 212 and those connection gaskets 211 for surface relief in the glass surface of this glass substrate 210, have the effect that reduces substrate component.And make those deformability projections 224 when being engaged to those connection gaskets 211 of this glass substrate 210, can have bigger deflection, and can not open circuit and the problem that engages failure.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (14)
1. the glass coating package structure of an image sensor is characterized in that it comprises:
One glass substrate, it has a plurality of connection gaskets and an airtight baffle ring;
One image sensor wafer, it is located on this glass substrate, and this image sensor wafer has an active surface, and this active surface comprises an optical sensing area, and this active surface is provided with a plurality of deformability projections (deformable bumps), to be engaged to those connection gaskets; And
Any is coated with colloid, and it is formed on this glass substrate and the part is filled between this glass substrate and this image sensor wafer, to coat those deformability projections;
Wherein, this airtight baffle ring is to be surrounded on outside this optical sensing area, flows in this optical sensing area to stop this spot printing colloid.
2. the glass coating package structure of image sensor according to claim 1 is characterized in that wherein said spot printing colloid is the non-conductive adhesive (NCP) for having cure shrinkage.
3. the glass coating package structure of image sensor according to claim 1 and 2 is characterized in that the distortion that wherein said those deformability projections are produced makes this airtight baffle ring contact this active surface of this image sensor wafer.
4. the glass coating package structure of image sensor according to claim 1 is characterized in that the height of wherein said those deformability projections after distortion is the thickness less than those connection gaskets.
5. the glass coating package structure of image sensor according to claim 1 is characterized in that the gap between wherein said glass substrate and this image sensor wafer is between 10～22 microns.
6. the glass coating package structure of image sensor according to claim 1 is characterized in that wherein said airtight baffle ring is to be about contour with those connection gaskets.
7. the glass coating package structure of image sensor according to claim 6 is characterized in that wherein said airtight baffle ring and those connection gaskets are to be formed at same line layer.
8. the glass coating package structure of image sensor according to claim 7, the material that it is characterized in that wherein said airtight baffle ring and those connection gaskets is to be gold.
9. according to the glass coating package structure of claim 7 or 8 described image sensor, the bottom that it is characterized in that wherein said airtight baffle ring and those connection gaskets is to be formed with an adhesion coating, to be bonded to this glass substrate.
10. the glass coating package structure of image sensor according to claim 9, the material that it is characterized in that wherein said adhesion coating is to be titanium-tungsten.
11. the glass coating package structure of image sensor according to claim 1 is characterized in that wherein said spot printing colloid is to be selected from one of them of high flow underfill, non-current underfill and marine glue.
12. the glass coating package structure of image sensor according to claim 1 is characterized in that wherein said those deformability projections are the tie lines projections (stud bump) that form for routing.
13. the glass coating package structure of image sensor according to claim 1 is characterized in that it includes a flexible circuit board in addition, it is attached at a wherein side of this glass substrate.
14., it is characterized in that wherein said glass substrate is to lack welding resisting layer, be that surface relief is in this glass substrate and make this airtight baffle ring and those connection gaskets according to the glass coating package structure of claim 1 or 7 described image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610099584 CN101118882A (en) | 2006-08-01 | 2006-08-01 | Glass crystal packaging structure for image sensory element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610099584 CN101118882A (en) | 2006-08-01 | 2006-08-01 | Glass crystal packaging structure for image sensory element |
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| CN101118882A true CN101118882A (en) | 2008-02-06 |
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| CN 200610099584 Pending CN101118882A (en) | 2006-08-01 | 2006-08-01 | Glass crystal packaging structure for image sensory element |
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| CN106409784A (en) * | 2016-08-23 | 2017-02-15 | 南通富士通微电子股份有限公司 | Fingerprint identification module and preparation method thereof |
| WO2018006738A1 (en) * | 2016-07-04 | 2018-01-11 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method |
-
2006
- 2006-08-01 CN CN 200610099584 patent/CN101118882A/en active Pending
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| CN106098570A (en) * | 2016-06-23 | 2016-11-09 | 江阴芯智联电子科技有限公司 | Cavity type plastic packaged module structure and manufacture method thereof |
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