CN106182581A - The preparation method of a kind of electronic chip and electronic chip - Google Patents
The preparation method of a kind of electronic chip and electronic chip Download PDFInfo
- Publication number
- CN106182581A CN106182581A CN201610591015.9A CN201610591015A CN106182581A CN 106182581 A CN106182581 A CN 106182581A CN 201610591015 A CN201610591015 A CN 201610591015A CN 106182581 A CN106182581 A CN 106182581A
- Authority
- CN
- China
- Prior art keywords
- electronic chip
- circuit board
- preparation
- injection mold
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention discloses the preparation method of a kind of electronic chip, comprises the following steps: A, put into by circuit board in the injection mold with die cavity, is fixed on injection mold by circuit board by the locating dowel in die cavity；B, in injection mold, injected the plastic cement of fluid state by the injection hole on injection mold；C, open injection mold, integrated electronic chip is taken out.The electronic chip prepared relative to prior art employing process for filling colloid, the present invention provides the preparation method of a kind of electronic chip to use Shooting Technique to carry out electronic chip, eliminate the operation such as encapsulating, drying, and a Shooting Technique can produce multiple electronic chip, substantially increases the production efficiency of electronic chip.And, the circuit board of electronic chip and handle integrated injection molding, it is not necessary to additionally prepare shell.
Description
Technical field
The present invention relates to electronic equipment manufacturing field, relate generally to preparation method and the electronic chip of a kind of electronic chip.
Background technology
The electronic chip using process for filling colloid to prepare generally comprises circuit board and for housing the shell of circuit board, and it is prepared
Technique, for put in shell by circuit board, is injected encapsulating material in shell, is filled described shell.This process for filling colloid exist with
Lower shortcoming: one, encapsulating speed but the most slowly, has had a strong impact on whole work efficiency；Two, after encapsulating, in addition it is also necessary to enter
Row baking operation, until encapsulating material thoroughly parches, the longest.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide preparation method and the electricity of a kind of electronic chip
Sub-chip, it is intended to solve existing employing process for filling colloid and prepare the inefficient problem of electronic chip.
Technical scheme is as follows:
The preparation method of a kind of electronic chip, wherein, comprises the following steps:
A, circuit board is put in the injection mold with die cavity, by the locating dowel in die cavity, circuit board is fixed on
On injection mold；
B, in injection mold, injected the plastic cement of fluid state by the injection hole on injection mold；
C, open injection mold, integrated electronic chip is taken out.
The preparation method of described electronic chip, wherein, is provided with at least two locating dowel in described injection mold.
The preparation method of described electronic chip, wherein, the midpoint between two of which locating dowel is set to and injection hole
Relatively.
The preparation method of described electronic chip, wherein, described injection mold is provided with multiple die cavity, each die cavity pair
One injection hole should be set.
The preparation method of described electronic chip, wherein, circuit board includes pre-buried part and the use being wrapped in plastic cement
In the grafting part electrically connected with other equipment；It is provided with the cavity for laying pre-buried part in described die cavity, and is used for
The opening that grafting part is extended.
The preparation method of described electronic chip, wherein, circuit board is provided with multiple grafting part, and die cavity is correspondingly arranged on
Multiple openings.
The preparation method of described electronic chip, wherein, described circuit board is set to horizontal components and parts, SMD components
And integrated circuit；Components and parts select transistor-like components and parts, resistance class components and parts.
The preparation method of described electronic chip, wherein, the size of components and parts is that diameter is less than or equal to 5mm；Circuit
The size of plate is at 80mm × below 80mm.
The preparation method of described electronic chip, wherein, the size of circuit board is at 30mm × below 30mm.
A kind of electronic chip, wherein, described electronic chip uses preparation method as above to prepare；Electronics core
Sheet includes that handle and circuit board, handle and circuit board are one-body molded.
Beneficial effect: the electronic chip prepared relative to prior art employing process for filling colloid, the present invention provides a kind of electronics
The preparation method of chip, is to use Shooting Technique to be prepared electronic chip, eliminates the operation such as encapsulating, drying, and once
Shooting Technique can produce multiple electronic chip, substantially increases the production efficiency of electronic chip.And, the circuit of electronic chip
Plate and handle integrated injection molding, it is not necessary to additionally prepare shell.
Accompanying drawing explanation
Fig. 1 is the flow chart of the preparation method of electronic chip of the present invention.
Fig. 2 is the structural representation of lower mold in the embodiment of the present invention 1.
Fig. 3 is the cross-sectional view of injection mold in the embodiment of the present invention 1.
Fig. 4 is the structural representation of electronic chip in the embodiment of the present invention 1.
Detailed description of the invention
The present invention provides preparation method and the electronic chip of a kind of electronic chip, for making the purpose of the present invention, technical scheme
And effect is clearer, clear and definite, the present invention is described in more detail below.Should be appreciated that described herein being embodied as
Example only in order to explain the present invention, is not intended to limit the present invention.
The preparation method of a kind of electronic chip provided by the present invention, by the technique of injection by handle and circuit board one
Molding, it is not necessary to encapsulating, drying, efficiency greatly improves.Specifically, the preparation method of described electronic chip, as it is shown in figure 1, bag
Include following steps:
A, circuit board is put in the injection mold with die cavity, by the locating dowel in injection mold, circuit board is fixed
On injection mold；
B, in injection mold, injected the plastic cement of fluid state by the injection hole on injection mold；
C, open injection mold, integrated electronic chip is taken out.
Circuit board is divided into two parts, and a part is the pre-buried part being wrapped in plastic cement, a part be for other
The grafting part of equipment electrical connection.It is equipped with electronic devices and components in pre-buried part.It is provided with for laying pre-buried in described die cavity
The cavity of part, and it is provided with the opening extended for grafting part.One circuit board can be arranged as required to
Multiple grafting parts, die cavity is correspondingly arranged on multiple opening.
Owing to the temperature of the plastic cement of fluid state is higher, and, the impulsive force of injection is higher, in order to improve electronic chip
Qualification rate, components and parts preferably must be able to bear the high temperature of injection and impact-resistant components and parts, it is preferable that on described circuit board
The components and parts that can bear more than 150 degrees Celsius selected by components and parts, as selected horizontal components and parts, SMD components and integrated electricity
Road, selects transistor-like components and parts, resistance class components and parts etc., circuit board is not selected electrochemical capacitor, inductance coil etc., it is ensured that note
Mould technique will not components and parts be impacted.And, can also be further preferred to the size of the components and parts on circuit board
For diameter less than or equal to 5mm, reduce the Shooting Technique impact to components and parts.It addition, the size of circuit board also fall to impulsive force
Low having an impact, circuit board is preferably dimensioned to be at 80mm × below 80mm, is not easy to be noted at this size range interior circuit board
Enter the plastic cement impact of fluid state and sideslip, more preferably below, preferably for 30mm × below 30mm.
The present invention have employed in step A and step C multiple method combine, avoid circuit board because of injection punching further
Hit power and cause the situation of circuit board sideslip.
Specifically, the injection hole on injection mold is preferably arranged on the side of circuit board, so can reduce injection right
The impact of circuit board, the effect being perpendicular to circuit board setting than injection hole is a lot.And, it is molded from the side of circuit board, moulds
Sizing material can be split into two halves the two sides diffluence to circuit board by circuit board, can be the components and parts injection impulsive forces that reduce half；Separately
Outer in-mould injection is uniform, can be with fully wrapped around circuit board and components and parts thereof, injection mo(u)lding effective, it is not easy to bubble.Close
Can be PP, PE, ABS, PET etc. in injection molding plastic rubber material, if injection function use can, in the present invention program
Plastic rubber material is not defined.
Described injection mold is provided with at least two locating dowel, for fixing circuit board position in injection mold.
Described locating dowel can be provided in the surrounding of pre-buried part, the position of fixing circuit board four edges.Preferably, two of which is fixed
Midpoint between the post of position is set to relative with injection hole, can be so that these two locating dowels can be circuit in injection moulding process
Plate provides position-limiting action, helps circuit board to withstand the impact of plastic cement stream.
Further, described injection mold being provided with multiple die cavity, each die cavity is correspondingly arranged an injection hole.This
Sample, one time injection step can prepare multiple electronic chip, substantially increases production efficiency.
The electronic chip prepared relative to prior art employing process for filling colloid, the present invention provides the preparation of a kind of electronic chip
Method uses Shooting Technique to carry out electronic chip, eliminates the operation such as encapsulating, drying, and a Shooting Technique can produce many
Individual electronic chip, substantially increases the production efficiency of electronic chip.And, the circuit board of electronic chip becomes with handle integrated injection molding
Type, it is not necessary to additionally prepare shell.
Also providing for a kind of electronic chip in the present invention, described electronic chip uses preparation method as above to prepare
's.Electronic chip includes that handle and circuit board, handle and circuit board are one-body molded.User can be by grips said handle by Plug Division
Divide the docking of corresponding interface.
Below by way of specific embodiment, the invention will be further described, but the present embodiment is not used to limit this
Bright.
Embodiment 1
Shown in Fig. 2 and Fig. 3, described injection mold includes upper mold 15 and lower mold 10；Upper mold 15 and lower mold 10 are provided with
The groove part corresponding with the handle 23 of electronic chip, when upper mold 15 and lower mold 10 matched moulds, groove part is collectively forming type
Chamber 11, the size of die cavity 11 is suitable with electronic chip handle 23；Fixing electricity it is separately provided in lower mold 10 and upper mold 15
The locating dowel 12 of road plate grafting part 22, being respectively used to fixing circuit board grafting part 22 can not move top to bottom, left and right, front and rear.
Because injection time impulse force big, fix grafting part 22 by locating dowel 12 top to bottom, left and right, front and rear, be possible to prevent in injection
During circuit board displacement.Further, locating dowel 12 is the biggest with the contact area of circuit board, prevents locating dowel 12 to electricity
Circuit board is caused damage when carrying out spacing by road plate.Injection hole 13 is arranged on the side of circuit board, and with described locating dowel 12 phase
To setting.
Being put into by circuit board in the injection mold with die cavity 11, the pre-buried part 21 of circuit board puts into the die cavity of lower mold 10
In 11, grafting part 22 is fixed on injection mold by locating dowel 12.By upper mold 15 and lower mold 10, by injection hole 13 to type
Injecting the plastic cement of fluid state in chamber 11, plastic cement surrounds the pre-buried part 21 of circuit board completely.After plastics solidification, open injection
Mould, takes out the electronic chip after solidification from injection mold.
As shown in Figure 4, pre-buried part 21 is fixed in handle 23 electronic chip of injection mo(u)lding, and grafting part 22 extension sets
Put outside handle 23.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved according to the above description or to convert, all these modifications and variations all should belong to the guarantor of claims of the present invention
Protect scope.
Claims (10)
1. the preparation method of an electronic chip, it is characterised in that comprise the following steps:
A, circuit board is put in the injection mold with die cavity, by the locating dowel in die cavity, circuit board is fixed on injection
On mould；
B, in injection mold, injected the plastic cement of fluid state by the injection hole on injection mold；
C, open injection mold, integrated electronic chip is taken out.
The preparation method of electronic chip the most according to claim 1, it is characterised in that described injection mold is provided with to
Few two locating dowels.
The preparation method of electronic chip the most according to claim 2, it is characterised in that between two of which locating dowel
Point is set to relative with injection hole.
The preparation method of electronic chip the most according to claim 1, it is characterised in that be provided with many on described injection mold
Individual die cavity, each die cavity is correspondingly arranged an injection hole.
The preparation method of electronic chip the most according to claim 1, it is characterised in that circuit board includes being wrapped in plastic cement
In pre-buried part and for the grafting part that electrically connects with other equipment；It is provided with in described die cavity for laying pre-buried part
Cavity, and the opening extended for grafting part.
The preparation method of electronic chip the most according to claim 5, it is characterised in that circuit board is provided with multiple Plug Division
Point, die cavity is correspondingly arranged on multiple opening.
The preparation method of electronic chip the most according to claim 1, it is characterised in that be set to horizontal on described circuit board
Components and parts, SMD components and integrated circuit；Components and parts select transistor-like components and parts, resistance class components and parts.
The preparation method of electronic chip the most according to claim 1, it is characterised in that the size of components and parts is diameter
Less than or equal to 5mm；The size of circuit board is at 80mm × below 80mm.
The preparation method of electronic chip the most according to claim 8, it is characterised in that the size of circuit board be 30mm ×
Below 30mm.
10. an electronic chip, it is characterised in that the preparation side as described in the employing of described electronic chip is as arbitrary in claim 1～9
Method prepares；Electronic chip includes that handle and circuit board, handle and circuit board are one-body molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591015.9A CN106182581A (en) | 2016-07-25 | 2016-07-25 | The preparation method of a kind of electronic chip and electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610591015.9A CN106182581A (en) | 2016-07-25 | 2016-07-25 | The preparation method of a kind of electronic chip and electronic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106182581A true CN106182581A (en) | 2016-12-07 |
Family
ID=57494955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610591015.9A Pending CN106182581A (en) | 2016-07-25 | 2016-07-25 | The preparation method of a kind of electronic chip and electronic chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106182581A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107578930A (en) * | 2017-09-26 | 2018-01-12 | 黄山申格电子科技有限公司 | A kind of capacitor fast packing method |
| CN110556302A (en) * | 2019-08-28 | 2019-12-10 | 大同新成新材料股份有限公司 | preparation method of electronic silicon carbide chip |
Citations (5)
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| CN1107256A (en) * | 1993-12-10 | 1995-08-23 | 株式会社日立制作所 | A packaged semiconductor device having a flange at its side surface and its manufacturing method |
| CN1131605A (en) * | 1994-11-17 | 1996-09-25 | 株式会社日立制作所 | Molding method and apparatus |
| CN1138212A (en) * | 1995-01-27 | 1996-12-18 | 日本电气株式会社 | Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips |
| CN1153996A (en) * | 1995-12-15 | 1997-07-09 | 日本电气株式会社 | Resin sealing mold die set with less resin remainder for semiconductor device |
| CN1212202A (en) * | 1997-09-19 | 1999-03-31 | 株式会社村田制作所 | Method for manufacturing insert-resin-moulded product and product produced thereby |
-
2016
- 2016-07-25 CN CN201610591015.9A patent/CN106182581A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1107256A (en) * | 1993-12-10 | 1995-08-23 | 株式会社日立制作所 | A packaged semiconductor device having a flange at its side surface and its manufacturing method |
| CN1131605A (en) * | 1994-11-17 | 1996-09-25 | 株式会社日立制作所 | Molding method and apparatus |
| CN1138212A (en) * | 1995-01-27 | 1996-12-18 | 日本电气株式会社 | Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips |
| CN1153996A (en) * | 1995-12-15 | 1997-07-09 | 日本电气株式会社 | Resin sealing mold die set with less resin remainder for semiconductor device |
| CN1212202A (en) * | 1997-09-19 | 1999-03-31 | 株式会社村田制作所 | Method for manufacturing insert-resin-moulded product and product produced thereby |
Non-Patent Citations (2)
| Title |
|---|
| 刘元义: "《塑料模具设计》", 30 September 2014, 清华大学出版社 * |
| 张云静、张云杰: "《UG NX9中文版模具设计和数控加工教程》", 31 July 2014, 清华大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107578930A (en) * | 2017-09-26 | 2018-01-12 | 黄山申格电子科技有限公司 | A kind of capacitor fast packing method |
| CN110556302A (en) * | 2019-08-28 | 2019-12-10 | 大同新成新材料股份有限公司 | preparation method of electronic silicon carbide chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |