CN1131605A - Molding method and apparatus - Google Patents
Molding method and apparatus Download PDFInfo
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- CN1131605A CN1131605A CN 95119722 CN95119722A CN1131605A CN 1131605 A CN1131605 A CN 1131605A CN 95119722 CN95119722 CN 95119722 CN 95119722 A CN95119722 A CN 95119722A CN 1131605 A CN1131605 A CN 1131605A
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Abstract
The invention relates to a chip-lead wire complex composed by matching a batch of semiconductor chips to a lead wire frame. The complex is arranged between an upper die and a lower die, which can be paired to form a die cavity, in a molding device. The die cavity is at least partly composed of porous material to prevent molding resin from going down and avoids the generation of holes through partial air. When the die is closed with the complex between the upper and lower die, the resin is injected into the die cavity; when the die cavity is communicated with the air through the porous material or arranged at a pressure lower than the injection pressure of the molding resin, the resin is injected into the die cavity. At least one of the upper die and the lower die of the molding device is provided with a two-stage ventilation part for educing the remained air in a resin pressure matching part.
Description
The present invention relates to the manufacture method and the equipment of semiconductor device, this kind method and apparatus comprises a kind of molding process that comes sealing semiconductor chips with moulding resin, or rather, the present invention relates to a technology, it can be effectively used to offer in the transfer molding technology of the mold apparatus of making semiconductor chip.
In order to be assembled into a kind of resin moulded equipment, it is a kind of mold apparatus of resin-sealed semiconducter IC (integrated circuit) device, semiconductor chip wherein then is the moulding resin sealing by a kind of thermmohardening, when for example being a kind of QFP (quad flat pack), in the current mold apparatus of using, for example there is J-P-A (disclosed in Japanese patent application 52-95765 number.
In addition, also provide a kind of molding process for making a kind of DIP of having (double-row type encapsulation) or the resin-sealed semiconductor device of qfp structure.In this kind molding process, with transfer molding equipment hermetic unit lead frame, and the latter's relevant portion, for example the inner of going between therewith of semiconductor chip, lead is then covered by the encapsulant of for example resinae.
Above-mentioned transfer molding equipment is on the transport path of a lead frame between charging machine and the unloader.After semiconductor chip was adhered on this lead frame, charging machine promptly was put into lead frame in the transfer molding equipment, and in wherein on lead frame, forming packing.Then with the resin-sealed semiconductor chip that obtains like this.From then on forming wrapped lead frame 1 above taking out in the mold apparatus is put in the unloader then.
This kind mold apparatus has upper mould and lower die, just constitutes die cavity when they cooperatively interact.Fixing the lead frame of a plurality of semiconductor chips above in each die cavity, being provided with.Under this kind state, molten resin is injected in the die cavity.This molten resin is to flow in the die cavity through chute and resin gate in the jar that forms from mould.
Be provided with pore in this mold apparatus in case for example air entrain into and resin deficiency and so on shortcoming, and this class phenomenon is might be when resin fill is in die cavity, comes across in each cavity section in each corner except that resin gate.Obviously, this pore is used for making moulding resin to be injected in the die cavity fully.Behind the hardening of resin in this injection die cavity, promptly formed moulded parts.For ease of from mould, taking out moulded parts, be provided with jemmy in the mould.Each jemmy is to protrude in the die cavity, is used for separating the lead frame that has defective material and corresponding to the molding portion of chute and resin gate from mould.
This transfer molding equipment for example in Nikkei " VLSL packing technique (end volume) " (BP. version, 1993,5,15), is described in the 34-40 page or leaf.Upper mould that is described in the literary composition and lower die also provide corresponding heater.Upper mould is by a movable plate supporting, and this plate can move both vertically along a guide, and can cooperate to come the clamping moulded parts with lower die.In addition, this article gives a chart and illustrates the molding program.In this chart, lead frame is positioned over that upper mould then is depressed into matched moulds on the lower die on the lower die.Then a pre-warmed resin sheet material is inserted in one jar.This sheet material is the fusion by the effect of heater in jar.The resin of fusion injects in the die cavity under the pressure that stamping is given.Surplus air in the die cavity is then discharged through pore.
In addition, relevant IC moulded parts structure and critical piece thereof are at paper " semiconductor dies CAD/CAM system-summary " " Electronic Materials ", 1987, be described among the Oct.pp81-86 (" industrial research association " editor, 1987.10.1 publishes).This article has been described a kind of molding thick stick device, comprises molding thick stick, holding plate, pressure plare and groove piece.
On the other hand, a kind of chute or the cushion chamber that is arranged in resin flow channel described then in the 73-79 of above-mentioned same publication page or leaf, as the device of space in the minimizing moulded parts and defective drawing lines stream.
In order to prevent the space, known a kind of technology is arranged is that stream material chamber is located at outside the pore.Be wrapped with air owing to clamp-on the top end of the resin in the die cavity firmly, this resin that is wrapped with air just directs into from pore and is used for storing the stream material chamber of resin.The explanation in the flat 4-314506 of Japanese patent application number of this stream material chamber technology.
Also disclose a kind of method that is used for forming moulded parts in Japan's (disclose) patent 62-135330 number, it utilizes a kind of mould of formation, in the continous way hole that forms in a collection of porous metals taper spare insertion die cavity.When moulded parts and mold separation, just pass through this metal taper spare supply gas from the outside.Disclose a kind of metal die in Japan's (disclosing) patent flat 5-74827 number, a collection of jemmy that it had all is to be made by porous metals.
In formation was used for semiconductor chip is sealed in packing in the lead frame, some unfavorable factor can make the flow velocity of resin in die cavity fluctuate in the space up and down of lead frame.These unfavorable factors for example are that the difference of resin flow velocity comes across up and down between the space of lead frame, between the upper space of lead frame and the upper space of semiconductor chip, or between the lower space of the lower space of lead frame and semiconductor chip.
If above-mentioned phenomenon takes place, the resin that flows with fast speed will arrive pore and with its obstruction.Constrain in the die cavity so stay surplus air just can't discharge die cavity in the die cavity.The volume of residual air can be reduced to the resin injection pressure that is wrapped with air, but bubble or depression can be in packing, caused.
In addition, if owing to cause resin to sew through the pore injection pressure, just the resin of then sewing can be attached on lead frame or the pore with the burr form.This burr can cut in follow-up operation or fall down on the latter during bending lead frame and damage packing.
If this resin burr is attached on the pore, will stops up pore, and when this packing of molding, cause defective resin fill.
On the other hand,, also promptly from mould, take out product, in mould, be provided with many jemmies and to cause mould complicated in order from metal die, to separate the product that counterdie is made.Design and to make such mould time-consuming expensive.For being used for the mould of molded thin product, having the product that is molded into of defective material down and during with overflow launder and the corresponding part of resin gate, on this product that is molded as, just may form recessed portion when from the mould that has jemmy, separating.These recessed portions just may become for example defective part such as chip cracks or packing slit.
In addition, the air of traditional transfer molding equipment surplus in being arranged to die cavity effluxes through pore, thereby has low amounts of resin and drain to the pore place with air.Very thin and be easy to cracked at the resin of pore place sclerosis.In the cutting action after sealing process, fall on the cutting die if this resin is cracked, just cracked resin can damage outside lead or make its distortion.
At this transfer molding equipment running hours, tackifying resin just accumulates in the pore and may stop up pore.Will cause the casting resin deficiency in the die cavity like this, and then cause pore (space) and depression, goods (semiconductor device) quality that is molded as is reduced.
In the mould of thin product (semiconductor device) that is used for being shaped, when from the mould that has the molding thick stick, isolate have defective material be molded as semiconductor device and and overflow launder and door during corresponding part, moulded parts at this moment (package resin) can be that the molding thick stick is pricked the hole.The result who pricks the hole can form recess or cause chip cracks sometimes or the packing slit on the surface of moulded parts.
In order to prevent the space, the jemmy that mould is provided with overflow launder, cushion chamber, pore, stream material chamber and is used for from the film chamber moulded parts (semiconductor device) being released.Therefore, the complex structure of this mould, time-consuming expensive in design and manufacturing.
It is a kind of that one of purpose of the present invention is to provide, and can make molding methods and equipment with semiconductor device of not being with bubble and sinking the recessed resin-sealed portion of high-quality.
Second purpose of the present invention is to provide a kind of molding methods and equipment, can be used for making the semiconductor device with the resin-sealed portion of high-quality and prevents to produce the resin burr.
The 3rd purpose of the present invention is to provide a kind of molding methods and equipment, can isolate the lead frame that top molding has resin-sealed portion from a mould that needn't adopt jemmy.
The 4th purpose of the present invention is to provide a kind of molding methods and equipment, can prevent that outside lead from defective distortion taking place and bring any damage.
The 5th purpose of the present invention is to provide a kind of molding methods and equipment, can reduce bubble and depression on moulded parts as much as possible.
The 6th purpose of the present invention is to provide a kind of molding methods and equipment, causes chip cracks and packing slit in the time of preventing jemmy thorn moulded parts surface.
The 7th purpose of the present invention is to provide a kind of mold apparatus with mould simple in structure.
Above-described and other purpose and features of novelty can be understood by following explanation and accompanying drawing.
Brief description is disclosed in the summary of the representational example of this invention among the application.
The method that is used for making semiconductor integrated circuit according to one aspect of the invention comprises the steps: to prepare a kind of chip-lead-in wire composite members that is made of lead frame or thin circuit sheet, include a collection of semiconductor chip and many inner leads, the latter electrically is coupled on the electrode that is formed on first interarea of each in these chips directly or indirectly; This kind chip-lead-in wire composite members is arranged between first mould and second mould of mold apparatus, this equipment is to be made of porous materials, form many die cavitys with its first and second mould, be used for and first mould sealing semiconductor chips of coming together, wherein, at least a portion inner surface in the die cavity of at least one can be used to limit the heavy notes of moulded parts resin to a desired depth and by being the gas component that is used for preventing the space generation of part at least in this first and second mould; Above-mentioned two moulds are positioned this wafer-lead-in wire composite members between this upper and lower mould being pressed into mutually; The above-mentioned die cavity that the mould that closes is formed is communicated with atmosphere by the part that porous material forms, or this kind moulding resin is injected in the die cavity under the low pressure far away than the moulding resin injection pressure, and seal the chip-lead-in wire composite members of a predetermined portions by moulding resin one; And from above-mentioned first and second mould at least one isolated the chip-lead-in wire composite members that has sealed.
When described mould separates down chip-lead-in wire composite members, be that mold apparatus by porous material system partly injects gas in the die cavity and carries out.
In the time of in moulding resin injects die cavity, can gas be extracted out side by side laterally by die cavity.
The method of above-mentioned manufacturing semiconductor device includes such step: when the molten resin injection is touched the die cavity that closes and form mutually by first and second mould, by being formed on the pore that by porous material constitute of these two moulds at least one, air remaining in the die cavity is discharged.
The method of above-mentioned manufacturing semiconductor device includes such step: chip-lead-in wire composite members is arranged between first mould and second mould of mold apparatus, this first and second mould forms a collection of die cavity, be used for sealing a collection of semiconductor chip simultaneously with first mould, in this mold apparatus, almost the surface of each die cavity all is made of porous materials, be used for limiting the heavy notes of moulding resin to a desired depth, and allow the portion gas component is prevented to produce hole by this kind porous material.
The method of above-mentioned manufacturing semiconductor device includes such step: chip-lead-in wire composite members is arranged between first and second mould of mold apparatus, this second mould is through being designed to have a collection of die cavity, be used for sealing a collection of semiconductor chip with first mould together, in this equipment, inboard for each these die cavitys, having a part relative with door at least is to be formed by porous material, be used for limiting that moulding resin is heavy annotates to a desired depth, and can allow the portion gas component be used for preventing to produce hole by this porous material.
The method of above-mentioned manufacturing semiconductor device includes such step: chip-lead-in wire composite members is arranged between first and second mould of mold apparatus, this second mould is through being designed to have a collection of die cavity, be used for sealing a collection of semiconductor chip with first mould together, this equipment also has one or more to be used for containing one or jar and one or more chute that links to each other with these jars of multi-disc resin material, in this kind equipment, at least be the part of each jar inboard, chute and be that an one of stamping inboard is arranged on each jar with form slidably at least, be used for limiting moulding resin to sinking to annotating to a desired depth, can allow simultaneously is that the portion gas component is by described porous material, in order to prevent to produce hole at least.
The method of above-mentioned manufacturing semiconductor device includes such step: by upper mould in the mold apparatus and the space between lower die, one resin sheet is inserted in the resin sheet insertion section that is located in the lower die, the top and the bottom mould of this mold apparatus is through being designed to have respectively a collection of die cavity that is used for sealing a collection of semiconductor chip and a collection ofly being used for containing the jar that is used for predetermined number die cavity resin sheet, and a collection of and tank connected chute of this batch, in this equipment, at least be the part inboard of each die cavity, jar and chute are to be formed by porous material, be used for limiting moulding resin to sinking to annotating to a desired depth, in order to prevent to produce hole.
The method of above-mentioned manufacturing semiconductor device includes such step: after in moulding resin is injected into die cavity, by porous material gas is injected into first mould is separated mutually with second mould, and separate down the chip of good seal-lead-in wire composite members on from these two moulds at least one, the method is performed and is used for making a kind of resin-sealed thin semiconductor device simultaneously, therefore and if this hermetic unit is separated by the molding thick stick that is located in the mold apparatus, will cause hermetic unit that substantial distortion takes place and reduce the quality of described device.
The method of above-mentioned manufacturing semiconductor device includes such step: the moulding resin of fusion is injected the die cavity that is formed by first and second mould, and under the state of the mutual clamping of this first and second mould, only discharge gas in the die cavity, the pore that possesses the main body that has the ventilation unit that forms by porous material on this first mould, is formed on pore on this body surfaces and filter course and leads to these pores, these pores are restrained the inflow of moulding resin molecule and wherein and are only allowed to flow through gas, and the internal diameter of pore is less than the internal diameter of pore.
According to one aspect of the present invention, this kind mold apparatus includes first mould and second mould, second mould through be designed to can near or be separated from first mould, form together and pack corresponding die cavity simultaneously with first mould, have at least one to have one and form the main body that comprises the ventilation unit that is made of porous materials and have pore simultaneously in this first and second mould, the surface of ventilation unit has a filter course, contain the pore that interlinks with pore above, these pores that lead to are used for suppressing in the moulding resin inflow pore and only allow in the gas stream blowhole.
According to the present invention, this mold apparatus includes first mould and second mould, this second mould through be designed to be moveable near or be separated from this first mould, simultaneously can be fit to form and pack corresponding die cavity with first mould, at least one is through forming the main body that the ventilation unit that is made of porous materials can be provided in this first and second mould, on this main body a pore and a meticulous porous portion are arranged simultaneously, the latter from the inner surface of each die cavity bury to a desired depth and form have the more above-mentioned pore internal diameter of internal diameter little lead to pore, these lead to pore and are used for preventing that moulding resin from sinking and allowing is that the portion gas component is passed through at least.On the surface of above-mentioned meticulous porous portion, can form a coating.
According to the present invention, in the time of in moulding resin is injected into die cavity, injection pressure by above-mentioned porous portion or reduction moulding resin makes two formed die cavitys of mould by closure be in the state that communicates with air, and for example air and so on gas remaining in the film chamber is discharged.Therefore, mold apparatus of the present invention can produce such semiconductor device, and it has the resin-sealed portion of the high-quality of not being with bubble and not having depression.Gas remaining in each die cavity can be discharged whole or in part.
By being that jar, chute or the stamping of part is made of porous materials at least, remain in jar or chute in gas for example air can when moulding resin directs into the corresponding die cavity from jar, discharge.
When the chip-lead-in wire composite members of sealing was isolated from described mould, gas can be injected into the die cavity from the outside.So just can use jemmy chip-lead-in wire composite members is taken out.Even in order to make semiconductor device, also can actually get on to change the shape of sealing and produce high-quality such device with thin resin-sealed portion.
On the surface of the mold body that forms by porous material, be formed with a filter course.This filter course provides the pore that leads to pore and diameter is little than hole diameter.Therefore, this filter course has prevented that effectively moulding resin from flowing in the pore.
In addition, because this meticulous porous portion buries to make respectively to lead to pore and reach a desired depth, so can prevent reliably in the moulding resin inflow pore.
The following describes the main points of disclosed more representational summary of the invention among the application.
(1) under lower die and state that upper mould matches, add in the method for the goods of making a kind of molding in the press-fitted portions (for example die cavity) by molten resin being added the resin that is press fit into formation thus, when molded this goods, remaining in the air that resin adds in the press-fitted portions discharges by a two-stage ventilation unit, this two-stage ventilation unit comprises: ventilation unit at the bottom of is formed in upper mould and the lower die at least one; A surperficial ventilation unit is positioned on this end ventilation unit, and contacts with molten resin when adding the interference fit molten resin.This surperficial ventilation unit is made of porous materials, and is replaced by new behind the predetermined molded number of times of process.The surface ventilation unit is a kind of extendible thin-film member drawn to be pasted on the parting surface of upper mould or lower die to form.This perforated membrane cooperates resin to be out of shape by this upper and lower mould is involutory with pressurization when forming surperficial ventilation unit.In addition, when upper and lower mould is separated from each other, the effect of the power during leveling by restoring force that is above-mentioned perforated membrane, molded product promptly separates mutually with upper and lower mould.When resin is added interference fit, stay the air that resin adds in the press-fitted portions and promptly force to be discharged to the outside by pore.When upper and lower mould is separated from each other, just compressed air is supplied in resin pressurization component by pore, the molded product that gets is got loose out from upper and lower mould.
(2) adding in the press-fitted portions (for example die cavity) and make in the mold apparatus of moulded product, on upper and lower mould, be provided with a twin-stage ventilation unit by molten resin being added resin that being press fit into is matched with upper mould by lower die forms.This ventilation unit is used for being directed to outside this upper and lower mould remaining in the air that resin adds in the press-fitted portions.Surperficial ventilation unit on this twin-stage ventilation unit comprises end ventilation unit and is positioned at end ventilation unit also contacts with motlten metal.These two kinds of ventilation units all are to be formed by porous material.The aperture that the surface ventilation unit is had is little than the hole of end ventilation unit, and available new replacing.The surface ventilation unit is pasted with the form that stretches by extendible porous membrane spare on each parting surface of upper and lower mould and forms.Be provided with a perforated membrane conveying mechanism in addition, be used for perforated membrane is fed between the parting surface of film up and down according to predetermined times (for example once).This mold apparatus also is provided with aspirator, and the twin-stage ventilation unit is continuous therewith, be displaced into outside the upper and lower mould to be used for forcibly air being added press-fitted portions from resin, the twin-stage ventilation unit is continuous therewith also to be provided with gas supply device, adds press-fitted portions to be used for that compressed air is supplied in resin.This aspirator is to work when resin adds interference fit, and the Compressed Gas feedway is work when two moulds are separated from each other.
In above-mentioned molding methods (1) and mold apparatus (2).
(a) upper mould and lower die respectively are provided with a twin-stage ventilation unit, are used for resin added that the air of surplus directs into outside the mould in the press-fitted portions (a for example die cavity), so do not need the pore of flute profile on each parting surface of upper mould and lower die.Can also prevent from addition to cause defective distortion and generation resin to flow on the outside lead in the pore because the resin of sclerosis falls into.
(b) pore is not set.Therefore resin can not take place be jammed in phenomenon in the pore, thereby can allow the resin fill of sufficient amount among cavity.In addition, hole and depression can not take place, so just can prevent to reduce the quality of moulded product (semiconductor device) in molded part.
(c) resin is added the air of surplus directs into outside the mould in the press-fitted portions owing to be provided with the twin-stage ventilation unit, just be provided with and be used for preventing parts that hole takes place for example overflow launder, cushion chamber, pore and stream material chamber etc.
(d) described ventilation unit is to be made of end ventilation unit and surperficial ventilation unit.In addition, the surperficial ventilation unit that is used for contacting with molten resin is compared with end ventilation unit, has less pore.Thereby in end ventilation unit, can not stop up.
(e) because surperficial ventilation unit is removable, so can when the molded number of times that is scheduled to, change this part.This just can prevent to stop up the defective moulded parts that causes because of resin.
(f) surperficial ventilation unit is by air-breathing and exhaust (and injection pressure of resin), forms by a kind of extendible perforated membrane is pasted do stretcher strain on each parting surface of upper and lower mould.Can not damage its outward appearance so can form suitable moulded parts.
(g) surperficial ventilation unit is to form by a kind of extendible perforated membrane is pasted do stretcher strain on each parting surface of upper and lower mould.So when this was separated from each other mould, the power in the time of can also being this perforated membrane leveling by restoring force made molded product isolate between upper and lower mould.So just, replaced jemmy.
(h) be that effect by the perforated membrane organization of supply is fed to multiple-hole die between each parting surface of upper mould and lower die in each moulding process.Therefore can in surperficial ventilation unit, not stop up.In other words, suitable moulded parts can be formed and its outward appearance can be do not damaged.
(i) because the aspirator that leads to ventilation unit is to work when resin is done to add interference fit, so can be promptly add air discharge in the press-fitted portions with remaining in resin.The outward appearance that so just can suitably keep the product that is molded to equally also can realize imporosity ground mold pressing.This helps to improve productive rate.
(j) the interference fit gas supply device that adds that interlinks with ventilation unit is to work when two moulds are separated from each other, and adds interference fit then thus and with gas the product that is molded as is released from upper and lower mould.So can separate the part (moulded product) that has been molded as reliably.
(k) when two moulds are separated from each other, by means of the restoring force of perforated membrane and add the interference fit gas supply device, molded part is got loose out between upper and lower mould.Therefore need not use jemmy.In other words, do not have jemmy and prick the phenomenon in hole, thereby can prevent chip cracks and packing slit in the molding portion of mechanograph.
(l) owing to not using jemmy, so simplified mould.This just is easy to design and mfg. moulding die, and can shorten manufacturing time and reduce manufacturing expense.
Fig. 1 is used for implementing sealing process in the method for manufacturing semiconductor device of the present invention, the perspective view of transfer molding equipment;
Fig. 2 is the front view that launches through local excision of major part in the transfer molding equipment shown in Figure 1;
Fig. 3 is an expansion profile, shows the involutory moulded state of upper unit shown in Fig. 2 and lower device;
Fig. 4 is an expansion profile, shows the opening of upper unit shown in Fig. 2 and lower device;
Fig. 5 is an expansion profile, shows upper unit and lower device set in the transfer molding equipment of bright another embodiment of the present invention;
Fig. 6 is a diagrammatic sketch before, shows the another kind of transfer molding equipment of sealing process in the bright method that is used for implementing manufacturing semiconductor device of the present invention;
Fig. 7 is the front view through the expansion of part excision, shows the major part of the equipment of transfer molding shown in Fig. 6;
Fig. 8 is a front view, shows the lower die shown in Fig. 7;
Fig. 9 is an expansion profile, shows the various piece of top shown in Fig. 7 and lower die;
Figure 10 is an expansion profile, shows the part of die main body shown in Fig. 9;
Figure 11 is an expansion front view, shows when lead frame is deviate from from mold apparatus after having packed the part of this lead frame.
Figure 12 is a profile, shows the semiconductor device after the bright bending that externally goes between;
Figure 13 is a flow chart, shows the process of bright manufacturing semiconductor device;
Figure 14 is a front view, show bright in another kind of transfer molding equipment with figure.The corresponding lower die of mould shown in 8;
Figure 15 is a profile, shows a kind of change pattern of transfer molding equipment shown in Fig. 3 and 4;
Figure 16 is a profile, shows a kind of change pattern of the equipment of transfer molding shown in Figure 15;
Figure 17 is a profile, shows a kind of change pattern of the equipment of transfer molding shown in Figure 15;
Figure 18 is a profile, shows in the another kind of transfer molding equipment and the corresponding part of part shown in Figure 9;
Figure 19 is a profile, shows in the another kind of transfer molding equipment and the corresponding part of part shown in Figure 10;
Figure 20 is a profile, shows in another transfer molding equipment and the corresponding part of part shown in Figure 19;
Figure 21 is an illustraton of model, shows the major part of bright transfer molding equipment according to another embodiment of the present invention (embodiment 11);
Figure 22 is a perspective view, shows the outward appearance of bright transfer molding equipment according to embodiment 11;
Figure 23 is the front view that cuts once part, shows bright according to the front view of molding part in the transfer molding equipment of embodiment 11 through the subdivision excision;
Figure 24 shows bright schematic cross sectional view according to mould in the transfer molding equipment of embodiment 11;
Figure 25 shows the schematic cross sectional view of the molding process mould that the bright transfer molding equipment that is arranged in according to embodiment 11 is carried out;
Figure 26 is a schematic cross sectional view, shows the mould opened of exposed installation in the transfer molding equipment of foundation embodiment 11;
Figure 27 is a schematic cross sectional view, shows the mould of exposed installation in another embodiment of the present invention (embodiment 12);
Figure 28 is a schematic cross sectional view, shows the mould of exposed installation in further embodiment of this invention (embodiment 13);
Figure 29 is an illustraton of model, shows bright according to the present invention's major part of the transfer molding equipment of another embodiment (embodiment 14) again.
Referring to accompanying drawing in detail most preferred embodiment of the present invention is described in detail below.
Fig. 1 is a perspective view, shows the bright outward appearance that is used for according to the overall transfer molding equipment of method of manufacturing semiconductor device of the present invention.This equipment is to be used for becoming semiconductor sheet device with resin-sealed a kind of semiconductor chip, also is bonded with the lead frame of semiconductor chip above promptly.
The lead frame that is bonded with semiconductor chip above this is from a charging machine 7 flows to wherein transfer molding equipment 8 to the semiconductor chip sealing.After this lead frame is package resin, this lead frame of having packed is transferred out, receive by unloader 9 then.
The detailed structure of transfer molding equipment 8 is shown among Fig. 2.Label 10 refers to a base.The column on the base 10 is fixed in label 11 finger lower ends.Be equipped with a movable platen 13 on the column 11.This movable platen 13 can be column 11 guidings along catenary motion.Movable platen 13 is provided with a drive block 14.Drive block 14 is connecting the piston rod 16 that is positioned at a cylinder body 15 on the base 10.Cylinder body 15 is borrowed oil pressure or pressure work.Movable platen 13 vertically moves by the effect of the drive block 14 that cylinder body 15 is driven.
Promptly be provided with a fixed head 12 on the upper press die device at upper unit 21, the mould coupling of this upper unit 21 faces down.On the other hand, the i.e. bottom pressing die device of a lower device 22 is installed on movable platen 13.This lower device 22 has a mould coupling face 22a up.
Form a gap 28 between lifting plate 27b and the backplate 25.In the scope in gap 28, lifting plate 27a can move both vertically by relative die body 24 with 27b.The catenary motion of lifting plate 27a and 27b causes moving both vertically of jemmy 26.
Identical with upper unit 22, lower device 22 also be by metal for example steel make.Lower device 22 has the box-shaped of an open-top to protect frame 33.Protecting frame 33 is fixed on as on the die body 34 of second mould.Backplate 35 is fixed on the inboard of die body 34.There is a collection of jemmy 36 to pass and its axial relative die body 34 and backplate 35.These jemmies 36 pass die body 34 and backplate 35 slidably.The bottom of each jemmy is pressed between the first template 37a and the second lifting plate 37b that is fixed thereon.
Be formed with gap 38 between lifting plate 37b and the backplate 35.In the scope in gap 38, lifting plate 37a can move both vertically by relative die body with 37b.Moving both vertically of lifting plate 37a and 37b causes jemmy 36 to move both vertically.Lifting plate 27a, 27b, 37a and 37b are that the drive unit drive moves both vertically.
On the surface of die body 24 or 34, be formed with one and resin molded corresponding recess.In these recesses, as shown in Figure 3, die cavity 42 be one with above be stained with the lead frame 42 of semiconductor chip part be resin-sealed corresponding part.
When die body 24 and 34 couplings went up, they had just formed and have been used for molten resin is directed into from jar 44 chute 47 and door 48 in chamber 43.
In addition, upper unit 21 can be made of an a collection of groove piece and a central block with lower device 22, and the recess that these groove pieces are had is corresponding with die cavity, and central block then comprises above-mentioned jar 44.Perhaps, described top or lower device can have a collection of jar 44.
Each die body 24 and 34 all is to be formed by porous material.So this die body can have such ventilation unit, can direct into the outside to the remaining gas in formed for example die cavity 43 and so on space in die body 24 and 34.As for this porous material, can adopt the agglomerated material of metal dust or ceramic powders.On the whole surface of die body 24 or 34, be formed with the pore of the several μ m of numerous length.
Stress the process of making semiconductor device below.In chip pre-welding operation, semiconductor chip shown in Figure 3 41 is fixed on the lead frame 42.The inner lead that will be formed on the lead frame 42 with lead is electrically connected with the electrode that is formed on 41 first of the semiconductor chips.The result who connects forms a chip-lead-in wire composite members 40.
Then the hard resin sheet 46 that was heated by pre-heater is placed on the stamping 45, simultaneously lead frame 42 is placed between die body 24 and 34.Fig. 2 to 4 is shown clear two die cavitys 43 for jar 44 resin fills of being supplied with, but in the vertical direction in these two figure, is formed with other die cavity on each die body 24 and 34.
Under above-mentioned state, drive cylinder 15 shown in Figure 2, allow lower device 22 move near upper unit 21, make the space that comprises die cavity 43 be limited by the surface of die body 24 and 34.When the stamping 45 that is driven by cylinder 17 was used for oppressing molten resin, this molten resin promptly flowed into die cavity 43 by chute 47 and door 48.
In the flow process of molten resin, in chute 47 and the die cavity 43 remaining gas just by forming die body 24 and 34 discharges on the whole with ventilation function.Discharge for the gas that will flow in die body 24 and 34, in protecting frame 23, be formed with a steam vent that runs through 49.This steam vent 49 also can connect aspirator, is used for the gas that flows in the die body 24 and 34 is discharged.
Resin in being filled to die cavity 43 promptly drives cylinder shown in Figure 2 lower device 22 is reduced after heating and solidifying.Two die bodys are separated from each other.Reduce the lifting plate 27a of upper unit 21 and 27b raise simultaneously the lifting plate 37a and the 37b of lower device 22 then.Such motion makes jemmy 26 and 36 give prominence to.Like this, the row of opening just of two moulds stops, as shown in Figure 4.Then chip-lead-in wire composite members 40 is deviate from.Obviously, this composite members 40 includes and is used for the molded package 43a of sealing semiconductor chips 41.
As shown in Figure 4, the chip of this good seal-lead-in wire composite members 40 is comprising the package 43a corresponding to die cavity 43a, corresponding to the part 47a of chute 47 and be not filled to defective material part 44a in the chute 47.
Embodiment 2
Fig. 5 shows bright transfer molding equipment according to another embodiment of the present invention, and with the previous embodiment identical parts of this embodiment in this figure have identical label.In Fig. 5, this transfer molding equipment does not comprise jemmy and lifting plate.Upper unit 21 forms with die body 24 by protecting frame 23.Lower device 22 is formed with die body 34 by protecting frame 33.This upper unit 21 is coupled on the fixed head shown in Figure 2 12, and lower device 22 is coupled to and is used for allowing on the movable platen 13 that its work moves both vertically.
Protect and be combined with ventilation duct 51 on the frame 23.Protect and then be combined with ventilation duct 52 on the frame 33.This ventilation duct 51 is connecting the pipe 55 that is provided with a reversal valve 53.Equally, each ventilation duct 52 connections one are provided with the pipe 56 of reversal valve 54.Pipe 55 is connected to a vacuum pump 57 and compressor 61.Pipe 56 is connected to a vacuum pump 58 and a compressor 62.
In mold apparatus shown in Figure 5, when resin when jar 44 is supplied to runner 47 to be filled to the die cavity 43 then with door 48, promptly drive vacuum pump 57 with 58 so that stay the gas that lefts in the die cavity 43 by die body 24 and 34 discharges.When molding process finishes to open mould when wherein getting loose out lead frame 42, by compressor 61 with 62 with compressed air by the die body 24 that ventilates and the face of coupling separately of two moulds of 34 supplies.So just can not adopt core body-lead-in wire composite members is taken out as the method for the sort of molding thick stick of the foregoing description.Obviously, this chip-lead-in wire composite members is comprising the packing 43a that is used for sealing semiconductor chips 41.In this simultaneously, inject air into and clean die body 24 and 34 own and surperficial on the surface of die body 25 and 34.
In the above-described embodiments, die body 24 and 34 is all formed by porous material, makes these two die bodys ventilate all over.But also can be in another way, a handle is used for the part of die cavity 43 or the parts of die cavity are made of porous materials.In Fig. 5,, can only a die body be formed by porous material though these two die bodys 24 and 34 all are to be formed by porous material.
Embodiment 3
Fig. 6 is the front view that shows bright transfer molding equipment according to another embodiment of the present invention.Fig. 7 is the amplification front view that shows the major part of equipment shown in Fig. 6.
As shown in Figure 6, this transfer molding equipment comprises a collection of column 66 that is fixed on the base 65.Each column 66 has a fixed head 67 that is contained on its top.Upper unit 68 is installed on the fixed head 67.Label 71 refers to a movable platen, and it is assembled on the piston rod 70 of a hydraulicdriven cylinder.Lower device 72 is housed on the movable platen 71.On fixed head 67, be equipped with and be used for driving in the mould 45 cylinder 73.Cylinder 69 and 73 is by control device 74 controls of being fixed on the base 65.
Fig. 7 shows the details of bright upper unit 68 and lower device 72.Upper unit 68 has a upper base part 75, is equipped with the upper mould 76 as first mould above it.Lower device 72 has a bottom base element 77, is equipped with the lower die 78 as second mould above it.The synchronised that moves both vertically of lower die 78 and the movable platen 71 that causes by cylinder 69, do near or leave the motion of upper mould 76.These two moulds 76 and 78 are complementary and form a die cavity 43, are used for being called the resinous packing 43a of formation on the mould coupling face of parting surface or moulded parts parting surface.
Be provided with a heater 79 in each bottom spare 75 and 77, be used for heating corresponding mould 76 and 78.Label 44 refers to a cylindricality jar 44 by upper base part 75.Stamping 45 is assemblied in the jar 44 it can be free to slide along the axis of jar 44.Stamping 45 is driven by cylinder 73, as shown in Figure 6.In the jar 44 resin sheet 46 is housed.This resin sheet 46 enters through pressurization in the die cavity 43 on the coupling face that is formed on die body 76 and 78.
For molten resin being directed in this die cavity, on above-mentioned coupling face, be formed with chute 47 jar 44 and die cavity 43 are led to.Chute 47 is doors 48 to the inlet of die cavity 43.
Fig. 8 is the plane graph that shows bright lower die 78.As shown in the figure, constituted lower die 78 by eight groove pieces 80 and a central block 81.Be formed with the die cavity 43 that is used to pack 43a in each groove piece.Be formed with a chute 47 that leads to each die cavity 43 in the central block 81.Lower die 78 has the space 82 of selecting materials, and the resin that overflows from chute 47 promptly stays in wherein.This space 82 of selecting materials is complementary with the jar 44 that is coupled on the upper mould 76.
In described embodiment, as shown in Figure 8, lower die 78 is got the structure with eight groove pieces.Can select the groove piece of any number in case of necessity, for example four or six.In Fig. 7, this structure has adopted single jar of shape with a jar.But can adopt two or more jar.
Fig. 9 is the amplification profile that partly shows bright upper mould 76 and lower die 78.Upper mould 76 comprise one be coupled on the top bottom spare 75 to protect the mold cavity block that piece 83 and is used for being formed for the die cavity 43 of molded packing 43a be die body 84, this die body 84 is arranged in and protects piece 83.Die body 84 is formed by porous material.As shown in figure 10, die body 84 has the loose structure of band pore 85.
Lower die 78 comprises that one is coupled to and protects piece 86 and a die cavity body 87 on the bottom bottom spare 77, and the latter is used for forming the die cavity of a molded packing 43a, also is that this die cavity body is one and is positioned at the mold cavity block of protecting piece 86.Identical with die body 84, die body 87 is made of porous materials.So die body 87 usefulness is a kind of loose structure with pore.
On the surface of each die body 84 or 87, be formed with a filter course 88 or 89.Each filter course 88 or 89 is comprising intercommunicating pore 90.90 of these intercommunicating pores allow to be formed between two film bodies 83 and 84 gas in cavity 43 and so on space by aforementioned gas holes, and can not allow molten resin pass through pore 85.In other words, these lead to hole 90 and can be used to independently gas be discharged from die body.This means that each filtering layer 88 and 89 is a kind of thin-film member.
Figure 10 is the profile that part is amplified, and shows the die body 84 of understanding upper mould 76 and is formed on this die body 84 lip-deep filter courses 88.As mentioned above, die body 84 is to be formed and pore 85 is arranged by porous material, and the average aperture of each pore is D.Being formed on the aperture of leading to hole 90 that is used for discharging respectively gas in the filter course 88 is d.Suppose that Sg is the full-size that remains in each molecule 91 of the gases such as for example air in die cavity 43 1 space-likes that formed by the upper and lower mould coupling, Sr is the size of each molecule 92 in the molten resin, then the aperture D of each pore 85 be formed on the aperture d that respectively leads to hole 90 in the filter course 88 and will set for to satisfy and concern D＞Sr＞d＞Sg.
Above-mentioned relation is desirable.But result of the test shows, except that above-mentioned relation, D＞(size relationship of Sr≤d)＞Sg also can allow.Be set to the numerical value of a suitable resin flows character by scope, just can suppress that resin is heavy to be injected into formed leading in the hole 90 in the filter course 88, and obtain needed effect size d.This die body 87 and filter course 89 for lower die 78 is so same.
As shown in Figure 9, each die body 84 and 87 comprises one in the face of protecting the exhaust space 93 or 94 of piece 83 or 86.Each exhaust space 93 and 94 leads to by a discharge duct 93a or 94a and outside.In order to promote this exhaust, a vacuum pump can be linked and be used for suction air on each discharge duct 93a and the 94a.
As shown in Figure 9, die body 84 or 87 has an exhaust recess 95 that is positioned at outside mould 76 or 78.On the surface of exhaust recess 95, be formed with filter course 88 and 89 equally.Exhaust thorough cut 95a and the exterior of exhaust recess 95 by forming in the lower die 78.So the gas of staying entirely in the die cavity 43 passes through filter course 88 and 89, the pore 85 by forming in the porous material then.After this, gas promptly flows into exhaust recess 95 and is discharged to the outside through exhaust thorough cut 95a again.But in assembling,, can economize except that exhaust recess 95 in order to improve exhaust performance.In addition, exhaust thorough cut 95a can be formed in the upper mould 76 or upper mould 76 and lower die 78 among both.
When manufacturing had the mould of filter course 88 and 89, for example available sintering metal formed die body 84 and 87 and has pore 85.Secondly, when the restriction face towards resin material of die body 84 and 87 is done fine finishining, be to annotate to pore 85 to cover its a part of aperture than the easier fluidised material of moulding resin with a kind of.Under another kind of situation, when for moulded product under the pressure higher than the normal mode pressing pressure, then the resin identical with moulding material can be used for have the plug members in pore 85 apertures of large-size, so that the diameter of this kind pore becomes less than ordinary circumstance.So just can on the surface of die body 88 and 89, form filter course 88 and 89.By selecting for example to cover the flowability and the quality of material, the pressure of moulding material and temperature, and time just can be controlled the lower limit of the port size of intending obstruction.
In addition, there is when preventing that mould in use the material of coverage to fall and adhere on the moulding material, simultaneously for the separability of improving die surface with tolerance and control the size of not stopping up the aperture, be can be with various coating technologies for example chromium plating or tin etc., give to touch on the whole surface of covering material and moulding material in addition coating.By the thickness and the coating technology of control coating, just can obtain to make that its aperture all has a suitable dimension d that each leads to the hole.
On die body and surface that resin material contacts, form a kind of porous microfiltration district of film system and have many holes 90 of leading to, the diameter in each such hole also is the pore 85 of basic material less than die body all.This microfiltration district provides such filter course 88 and 89, and they remain in air in the mould or the gas that produces in mould by the molded of resin material product time in the time of being separated in moulded product.
The process that mold apparatus is made semiconductor device of planting is thus described emphatically below.
At first semiconductor chip 41 is installed on the lead frame 42.Lead frame 42 has many leads to be electrically connected by lead and the electrode that is formed on first interarea of semiconductor chip 41.The lead frame that obtains so promptly becomes chip-lead-in wire composite members 40.
When patrix 76 and counterdie 78 separated states, this chip-lead-in wire composite members 40 is promptly between mould 76 and 78.Make counterdie 78 that movable platen 71 is risen by being used for then.This ascending motion has just formed the space that comprises die cavity between the surface of two moulds.Chip-lead-in wire composite members 40 is fixed in this space.To put into jars 44 by the hard resin sheet 46 that preheater has reduced viscosity then, be that the resin sheet 46 of heater 79 fusings pressurizes with 45 pairs of stampings.As a result, this kind resin material just flows in the die cavity 43 by chute 47 and door 48.
The moulding resin of mobile fusion of being stressed in die cavity 43 flow in the die cavity 43, remains in the gas air for example in the die cavity 43 simultaneously, promptly flows in die body 84 and 87 in the formed pore 85 by the formed hole 90 of leading in filter course 88 and 89.
Fig. 9 shows clear a kind of like this state, on the border of chip-lead-in wire composite members 40, resin flows on lower die 78 these sides gets comparatively fast, touches in the end of door 48 downstream part die cavitys 43, and the gap by chip-lead-in wire composite members 40 flows to upper mould 76.Just remain in as the gas of air one class in the vacancy part that does not have molten resin in the upper mould 76 and no longer mobile.But along with the injection of resin, gas just forms in via filter course 88 around vacancy portion 96 leads to hole 90 (referring to Figure 10), and then by exhaust space shown in Figure 9 93 and blast pipe 93a from upper mould 76 discharges.Resin is pressurized filing in the die cavity 43 and heat hardening therein.Respond the control signal that control device 74 shown in Figure 6 sends then, movable platen 71 descends, and upper mould 76 and lower die 78 are separated.After two moulds separated, as shown in figure 11, the chip-lead-in wire composite members 40 that has wherein formed package resin 43a promptly got loose out.This effect of getting loose is finished by jemmy.Put in place after, be used as from leading to the air that hole 90 is injected by compressed air is provided from blast pipe 93a and 94a, just can unload the good chip of lower mould-lead-in wire composite members 40.
Cut from the outstanding outside lead 42a of package 43a and with it and be molded as predetermined form, this chip-lead-in wire composite members 40 that wherein forms packing 43a just is made for semiconductor device shown in Figure 12.In Figure 12, label 97 refers to a joint, above by a kind of jointing material 98 for example silver paste and bonding semiconductor-on-insulator chip 41.This semiconductor chip 41 has electronic pads 41a and inside conductor 42b, and they all are to be electrically connected by the lead 99 that gold (Au) or aluminium (Al) are made.Such electrical connection enables the I/O of a supply voltage and signal (I/O) is flowed to semiconductor chip 41 by outer lead 42a from the outside.
Semiconductor integrated circuit shown in Figure 12 (IC) device has the thickness B of width A He the about 1mm of about 10mm.In this IC device, sealing the semiconductor chip 41 of about 0.4mm thickness C.This is a kind of plastic molded type.Even thin like this one type also is can manufacture under high yield and can not be out of shape to some extent actually.
Figure 13 has shown the process that is used for making the aforesaid semiconductor integrated circuit (IC)-components.In a kind of small pieces cohesive process, semiconductor crystal 41 is coupled on the joint 97 of lead frame 42.Secondly, in the wire-bonds process, the electronic pads 41a and the inside conductor 42b of this semiconductor chip 41 then are electrically connected by lead 99.Finish to be used for forming the process 1 of chip-lead-in wire composite members 40 then, got well chip-lead-in wire composite members 40 in this process of preparing.
Said chip-lead-in wire composite members 40 is transported in the transfer molding equipment.In this process 2, composite members 40 is placed on the mould of mold apparatus.Then in process 3, it is fixed that two moulds are matched the moulded parts folder.After the moulded parts folder is fixed, in process 4, resin sheet 46 is inserted in the jar 44.After inserting, promptly start stamping 45 and oppress resin sheet 46.In process 5, promptly inject this resin then.After the injection, make these two moulds be held in matched moulds state following a few minutes, resin promptly hardens then.In addition, being inserted into this procedure of resin sheet in process 4 also can carry out before being placed into composite members 40 on the mould.
Just carry out separation process 6 behind the hardening of resin, just in mould, take out the chip-lead-in wire composite members 40 that wherein has been formed with packing 43a then.
Embodiment 4
Figure 14 shows and understands and to be located at according to the lower die 78 in the transfer molding equipment of another embodiment of the present invention, and bright part shown in it is with shown in Figure 8 corresponding.In Figure 14, those parts common with parts shown in Figure 8 have identical label.
This kind transfer molding equipment has many jars.Lower die 78 is provided with 4 concave-boards 80, and each groove piece has 5 spaces of selecting materials corresponding with above-mentioned jar.Each space 82 of selecting materials links to each other with the recess of door 48 with two die cavitys 43 by chute 47.Can form lower die 78 by the groove piece of any number.Can form any a plurality of die cavity 43 in each groove piece 80.In Figure 14, the chip-lead-in wire composite members 40 that is placed on the lower die 78 is shown bright with double dot dash line.
As mentioned above, have a plurality of jars 44 multiple tank type transfer molding equipment when making semiconductor device in application, as shown in figure 13 process in jars 44 that resin sheet 46 is inserted is execution before the process 2 that chip-lead-in wire composite members 40 is placed on the mould.Other process is with aforesaid identical.
Embodiment 5
Figure 15 shows a kind of modification of understanding transfer molding equipment shown in Fig. 3 and 4.In Figure 15, with the identical label of parts employing identical among Fig. 3 and Fig. 4.
In the transfer molding equipment shown in Fig. 3 and 4, correspondingly in the same die cavity 43 of upper die body 24 and lower mold body 34 and the chute 47 be used for part that this upper and lower mould is harmonious through forming, all be to constitute by porous material.In transfer molding equipment shown in Figure 15, die body 24 and 34 respectively includes chamber piece 24a and the 34a that is used for forming a die cavity 43, and each chamber piece 24a and 34a form to constitute a ventilation unit with porous material.Die body 24 and 34 make by the steel that is used for mould with the corresponding part of chute 47.
Embodiment 6
Figure 16 shows a kind of modification of transfer molding equipment shown in bright Figure 15.Each chamber piece 24a and 34a are made of the steel that is used for mould, so these chamber pieces are nonventilated; But the part corresponding with chute 47 then is to be made of porous material, therefore ventilates.Jar 44 under this situation also can be formed by porous material with stamping 45.Therefore, when making it be filled to die cavity 43 in through hopper 47 with stamping 45 compressing resin sheets 46, before resin arrives die cavity 43, remain in jars 44 with hopper 47 in air or gas by ventilate jars 44, die body 24 and 34 is discharged through exhaust outlet 49 by the stamping 45 that ventilates simultaneously.
In addition,, in die cavity, be provided with pore (not showing bright), air remaining in the chamber is discharged through this pore according to this embodiment.
Figure 17 has shown a kind of modification of transfer molding equipment shown in Figure 16.In this modification, be used for forming die cavity 43 and all be made of porous materials with chute 47, jar 44 and stamping 45.Therefore, before resin arrives die cavity 43, remain in jar 44 and just discharged, also can discharge the air of staying in the die cavity 43 simultaneously with air or gas in the chute 47.In the mould shown in Figure 16 and 17 45 can only make it self top end be formed by porous material, make this top end become ventilation.
In equipment shown in Figure 17, all chambeies 43, chute 47, jar 44 and stamping 45 all are to be formed by porous material.But also can just make stamping 45 or just jars 44 form by porous material.
Embodiment 8
Figure 18 shows the transfer molding equipment of understanding according to another embodiment of the present invention, wherein provided this equipment with the corresponding part of part shown in Fig. 9.In Figure 18, the parts identical with parts shown in Figure 9 have identical label.
In this modification, door 48 is formed in the die body 87 of lower die 78.Therefore, being injected into resin the die cavity 43 from door 48 is to be positioned at the relative position of door therewith 48, and finally is filled to and the corresponding part in die cavity 43 tops.In the die body 84 of upper mould 76, formed a ventilation unit 84a who makes by porous material in the corresponding mode of part with the last institute of resin filling.On the surface of ventilation unit 84a, be formed with filter course 88.This transfer molding equipment is desirable to improve the version shown in the figure that traditional moulds obtains by part.If door 48 is to form by form recess in the die body 84 of upper mould,, and it is become and the corresponding part in the bottom of die cavity 43 just then the last part that is filled to of resin is positioned at the position relative with 48.So just can in the die body 87 of lower die 78, form ventilation unit 84a in this wise, make it corresponding, or in each die body of upper mould and lower die, form this ventilation unit 84a with above-mentioned counterpart.
Figure 19 shows the die body 84 of exposed installation at foundation another embodiment of the present invention transfer molding equipment middle and upper part mould 76, particularly with the corresponding die body part of die body shown in Figure 10.Identical with Figure 10, this die body 84 also is to be made by porous materials such as the metal of metal or ceramic powders sintering or potteries.So die body 84 has pore 85 and is loose structure.
Connected fine granules 101 formed meticulous porous portions 100 by adhesive 102, buried to a desired depth from the surface of die body 84.These fine granules 101 are metal or ceramic, and adhesive 102 for example can be the wax material in about 200 to 500 ℃ of following fusions.This meticulous porous portion 100 comprise communicate with pore 85 and diameter than the little hole 90 of leading to that is of pore.These lead to the hole and are used for suppressing that resin is heavy injects die body 84, and allow gas composition to small part by leading to hole 90 in case in packing 43a, produce hole.
The mean inside diameter of pore 85 is about 3 μ m or bigger.In numerous leading in the hole 90, certain is a few to have bigger aperture internal diameter, for example approximate number 10 μ m or bigger.If such situation is arranged, owing to have meticulous porous portion 100 to be embedded in the aperture of each pore and extend to a desired depth, just this pore mouth that leads to hole 90 can be formed on the surface of die body 84.The mean inside diameter that leads to hole 90 is about 2.5 μ m or littler, or about 0.5 μ m or littler.The kind of the used resin of moulded parts is depended in the selection of this average diameter.
By meticulous porous portion 100 being imbedded in the pore 85, just can shorten the gas that carefully leads to hole 90 and pass through to distinguish to a desired depth.Because the internal diameter of pore 85 is greater than the internal diameter that leads to hole 90, just the draft loss that can make gas stream cross die body 84 keeps lowlyer.
The die body 84 of upper mould 76 is shown among Figure 19.The die body 87 of lower die 78 is to use the mode identical with above-mentioned die body 84 to constitute.
In order to make die body 76 and 78 with above-mentioned meticulous porous portion 100, at first carry out one and form the process of module 84 and 87 by agglomerated material, make these two die bodys have pore 85.Secondly, when fine finishining is done on the surface of the restrictions of each die body 84 of being used for contacting with resin material or 87, can interconnect with the fine granules 101 that the suitable material of mold materials is made, and will mix with fine granules 101 as the wax material of bonding material 102, to lead at each on 85 inner surfaces of hole fine granules 101 is connected.This mixture is that coating arrives the lip-deep of die body.
To this coating mix pressurization, it is embedded in the pore 85, after removing excessive mixture, just carry out for example heating process of predefined procedure from its surface, fine granules 101 is interconnected be connected with the inner surface of pore 85 simultaneously.According to such process, meticulous porous portion 100 just is formed at the inboard of pore 85.Perhaps, also can on the surface of die body 84 or 87, form this meticulous porous portion 100.
By selecting to intend being filled to the size and the form of the fine granules 101 in the pore 85, the distribution ratio of 101 pairs of jointing materials 102 of fine granules, and this fine granules is filled to the mode on pore 85 surfaces or the inboard, and each that just can control the meticulous porous of this kind portion 100 leads to the size in hole 90.
As mentioned above, meticulous porous portion 100 can be a fine granules 101 and mixture as the granular wax material of binder 102.Perhaps, also can be applied to the wax material coating on the surface of fine granules 101.
As for binder 102, for example epoxy or polyimides system replace wax material can to adopt heat-staple adhesive, at this moment adhesive is that coating is to the surface of fine granules 101, then with the fine granules 101 of coating or the mixture of above-mentioned adhesive and fine granules are embedded in the pore 85.
Above-mentioned meticulous porous portion 100 also can only be formed by fine granules 101 without binder 102.At this moment, after being filled to fine granules 101 in the pore 85, promptly fine granules 101 is heated near its fusing point, so that fine granules 101 fusing and in conjunction with making fine granules 101 bonding simultaneously mutually with the inner surface of pore 85.Fusing and the result who combines have formed meticulous porous portion 100.
Be that can use thermal coefficient of expansion is big fine granules 101 than the masterbatch of die body 84 or 87 as the another kind of method of not using binder 102 to form meticulous porous portion 100.At this moment, at low temperatures fine granules 101 is filled in the pore 85, allows the temperature of these fine granules get back to normal temperature then,, constitute meticulous porous portion 100 thus so that they combine by the thermal stress effects that two kinds of coefficient of thermal expansion differences cause.This meticulous porous portion 100 expands by the heating of moulding resin, and when mould in use the time, the adhesion of this fine granules 101 can be stronger.
As the another kind of method that forms this meticulous porous portion 100, can adopt and be contained in distillation or the granular volatility material of volatilization and the mixture of coverage material under the predetermined temperature, that is to say, can go to form this meticulous porous portion 100 thus by in lower temperature or be to solidify or the granular volatility material that hardens under the identical temperature basically.In this case, when said mixture being filled in the pore 85, heat this mixture to distillation or volatilization temperature.In this simultaneously, when the granular volatility material volatilization or before, make the coverage hardened material.Final meticulous porous portion 100 promptly forms and has and the corresponding hole of volatile material volume by covering material.
Also can above-mentioned volatility material and form meticulous porous portion 100 by the mixture of a kind of foamed material and binder.When this foamed material of heating, just can be from wherein producing rill.At this moment, this mixture with after filling out in the pore 85, heat this mixture and just can produce many foams.So, resulting this meticulous porous portion 100 just just form, and have by granuliform binder with foamed material in the corresponding hole of leading to of foam that produced.
Also have another kind of meticulous porous portion 100, it can be rubber and so on highly elastic material as binder 102.When at this moment, meticulous porous portion 100 is by molded packing owing to want the resin applied pressure to be out of shape.That is to say that this pressure plays the effect that shrink in hole 90 of leading to that makes.This has just automatically prevented to have the moulding resin more than constant basis to enter in the pore 85.When this mold process enters a predefined phase or finishes, the state that this state that leads to hole 90 just can be returned to centimetre owing to elastic force, the size of just leading to hole 90 becomes big.Like this when by outside supply gas when from mould, isolating chip-lead-in wire composite members 40, just can reduce draft loss to gas.
Figure 20 shows a kind of modification of understanding this transfer molding equipment, particularly relates to the part with corresponding this equipment shown in Figure 19.On the surface of die body 84, form a coating 103.This coating 103 is that to be formed into die body shown in Figure 19 84 by film plating process or vacuum evaporation device lip-deep.For such coating, can adopt all surface coating methods that for example plate Cr or plating Sn.By control coating layer thickness and coating process, just can be determined to a closest value to the aperture size d that leads to hole 90.In addition, by forming coating 103 as mentioned above, just can be firmly meticulous porous portion 100 be fixed within the pore 85.
In addition, because the formation of coating 103, just can be only form meticulous porous portion 100, and do not need adhesives 102 such as for example wax material are used to form this meticulous porous portion 100 by fine granules 101.Can also not will fine granules 101 fusing fall in the pore 85 with the pellet that just can prevent this meticulous porous portion 100 that mutually combines.
Can be in the transfer molding equipment shown in Fig. 3 to 5 or Figure 15 to 17 on the surface of contained porous material, form filter course 88 shown in Figure 10.Perhaps shown in Figure 19 to 20, can on this surface, form meticulous porous portion 100.
As mentioned above, this invention that the inventor proposed had been done concrete description according to most preferred embodiment already.But the present invention is not limited to previous embodiment.Obviously, do not breaking away under the spirit of the present invention, can make all changes of the present invention and change pattern.
For example, shown in lead frame 42 on be provided with joint 97.But opposite, also can form the lead frame that another kind does not have joint.In such lead frame, semiconductor chip 41 is to be stacked on the lead 42b, makes second, also be this semiconductor chip 41 do not have circuit this in the face of to inside conductor 42b.The electronic pads 41a that is formed on first then is connected on the inside conductor 42b by lead 99.The composite members that obtains like this is formed into the semiconductor device of a kind of COL (chip on the lead-in wire) type.On the contrary, can make the face of winning to being laminated in this wise on the lead 42b of semiconductor chip 41, this one side that promptly is formed with circuit on the semiconductor chip 41 is relative with lead 42b.This lead 42b directly links on the electrode that is formed on the semiconductor chip by a welding electrode.The composite members that obtains like this is formed into a kind of LOC N-type semiconductor N integrated circuit (IC)-components.
Shown chip-lead-in wire composite members 40 is provided with lead frame 42.Replace this lead frame 42, this chip-lead-in wire composite members can adopt a kind of wiring sheet of diaphragm type.
Shown transfer molding equipment is through being configured such that lower die can be by moving both vertically and upper mould is toward or away from.On the contrary, also can fix lower die and upper mould is moved both vertically.In addition, these two moulds also can move horizontally and be toward or away from.
In the superincumbent description, the inventor etc. mainly are designed to be used for to make a kind of QFP N-type semiconductor N integrated circuit (IC)-components with this invention.But the present invention is not limited to this situation.The present invention can be used for making a kind of DIP (double-row type encapsulation) N-type semiconductor N integrated circuit (IC)-components, the semiconductor device of PLCC (the leaded sheet charge carriers of plastics) type or SOJ (minor loop J-go between packing) type, back two kinds by resin-sealed.
In the disclosed in this application summary of the invention, representational summary of the invention can provide following effect.
(1) can make the high-quality semiconductor integrated circuit (IC)-components that institute's tool sealing does not have bubble and depression.
(2) when making this semiconductor device, can prevent in cutting lead frame or bent outer leads process, fall on the sealing or leading part is out of shape because resin takes place undesirable flash.
(3) owing to after being molded into sealing, not using jemmy that moulded parts is deviate from, just can when disengaging moulded parts, prevent the sealing distortion, in addition, when making thin semiconductor device, can obtain very high productive rate.
Embodiment 11
Stress transfer molding equipment below in conjunction with accompanying drawing 21 to 29 according to another embodiment of the present invention.
Figure 21 is an illustraton of model, shows the major part of bright mobile mold apparatus according to another embodiment of the present invention (embodiment 11).Figure 22 is a perspective view, shows the outward appearance of bright this transfer molding equipment.Figure 23 is the plane graph that a part is cut, and shows the mold segment in the bright transfer molding equipment.Figure 24 shows bright schematic cross section when opening mould.Figure 25 shows that bright mould remains in the schematic cross section under the molded state.Figure 26 schematically shows the mould of having opened.
According to embodiment 11, the resin-molded situation with the manufacturing semiconductor device of being undertaken by transfer molding equipment is described emphatically below.As shown in figure 21, this transfer molding equipment is through being configured to, and makes material to be molded 105 be used between the parting surface 124a of the parting surface 123a of upper mould 123 of mould of mold pressing resin and lower die 124.The structure that this material to be molded 105 is got can make semiconductor chip 108 be fixed on the support plate (joint) 107 of lead frame 106, and the inner with a lead-in wire 109 is connected on the electrode (not showing bright) of semiconductor chip 108 by lead 104 simultaneously.This semiconductor chip 108, lead 104 are then sealed by resin with the inner of lead-in wire 109.Specifically, as shown in figure 22, material 105 to be molded is to be transferred to mold segment (resin molded section) 102 from a unloader 101, and molded in wherein carrying out.The goods that then this C are molded as shift and remain on the unloader 103.In Figure 21, refer to a upper unit several numbers 121.Quantity 122 refers to a lower device.
As shown in figure 23, resin molded section 102 through being configured to, and allows a collection of lead 111 vertically be fixed on the base 110, and each guide pillar 111 then is fixed with a stationary plate 112 in the upper end.Also be provided with a movable platen that can move both vertically 113 on the guide pillar 111.The lower end of movable platen 113 is provided with a drive block 114.This drive block 114 is supported by a bar 116 that is fixed in the pressure jack 115 on the base 110 by oil pressure or pressure work.The synchronised and up and down of moving both vertically of this drive block 114 and bar 116.So the work of pressure jack 115 can make portable plate 113 rise or descend.
Upper unit is fixed on the lower surface of stationary plate 112.122 of lower devices are fixed on the upper surface of movable platen 113.Upper unit 121 is coupled on the upper mould 123.Lower device 122 is coupled on the lower die 124.As shown in figure 24, this upper mould 123 is individually fixed in protecting on frame 125 and 126 of upper and lower part device 121 and 122 with lower die 124.
The parting surface 123a of upper mould 123 is relative with the parting surface 124a of lower die 124.These parting surfaces 123a and 124a provide resin to add press-fitted portions 130 and 131 respectively.This kind resin adds press-fitted portions and is spill, comprises the 130a of portion that selects materials, chute 130b, door 130c and die cavity 130d.The upper mould 123 here is not provided with overflow launder, cushion chamber, pore and stream material chamber and jemmy with 124 of lower die.Therefore mould 120 is simple in structure, and easily design also can be shortened manufacturing time.
In addition, as shown in figure 23, be combined with one on the drive block 114 and shift jack 117.This shifts jack 117 piston rod 118, and it enters the jar 119 that is positioned at lower device 122, is used for pressurizeing to establishing the resin sheet that is placed in the jar 119.As shown in figure 25, after resin sheet was pressurizeed, molten resin 128 promptly flowed among the die cavity 130d with door 130c by the 130a of the portion chute 130b that selects materials.
At the dorsal part of upper mould 121, fixing runner blocks 135 and 136 with lower die 122.The runner that runner blocks 135 provides horizontal-extending and led to mutually.Runner blocks 136 also is like this.On runner blocks 135 and surface that upper mould 123 contacts, be provided with various holes 139 of leading to.Equally, on runner blocks 136 and surface that lower die 124 contacts, be provided with various holes 140 of leading to.These lead to hole 139 and are connected with 138 with runner 137 with 140.So can allow gas pass through ventilation unit 123b and 124b and runner 137 and 138.
Each runner 137 is connected a collection of connecting pipe 141 with 138.The compressor 146 that each connecting pipe 141 connections one are used as the vacuum pump 145 of aspirator or are used as the device of a compressed gas supplying.For lower device 122, connecting pipe 141 forks are arm, and the end of each arm is connecting vacuum pump 145 or compressor 146.Communicating pipe 141 is provided with a valve 147 on a predetermined portions, be used for closing automatically and opening.
The driving of the switch of valve 147 and vacuum pump 145, can be used to will remain in the resin of upper mould 123 and lower die 124 add air discharge (sucking-off) in press-fitted portions 130 and 131.The driving of the switch of valve 147 and compressor 146 is used for that compressed air is supplied in resin and adds press-fitted portions 130 and 131, by this compressed-air actuated pressure efficiency, is used for that resin is added the moulded parts that is cooperated in the press-fitted portions 130 and 131 and releases.Figure 21 is a schematic cross sectional view, shows bright embodiment 11, and the piece 135 or 136 that wherein will circulate is removed and each parts are simplified.
As shown in figure 24, extravagant two extensible perforated membranes 150 and 151 between the parting surface 124a of the parting surface 123a of upper mould 123 and lower die 124.Perforated membrane 150 and 151 has ventilation unit (surperficial ventilation unit) 150a and 154a to allow air pass through.The diameter of each pore institute tool of ventilation unit 150a and 151a is greater than the ventilation unit 123b of top and lower film 123 and 124 and 124b.Specifically, the diameter of above-mentioned pore is about 0.1 to 1 μ m.The diameter of selecting in the present embodiment 11 is 0.5 μ m.Be used for the about 1 μ m of minimum grain size of molten resin of molded semiconductor device.In addition, selected thermally-stabilised film to be used as perforated membrane 150 and 151, so that these films can be resisted the heat that is occurred in molded semiconductor device process.For example can adopt the tetrafluoroethylene resin of suitable-120～260 ℃ of temperature ranges.Perforated membrane 150 and 150 is thinned to 300 μ m or littler, and this is owing to this kind film must be to be out of shape.
The perforated membrane 151 that extends on bottom module 124 has the hole corresponding with jar 119.Like this, the molten resin in jars 119 just flows into the 130a of portion that selects materials, chute 130b and then injects die cavity 130d with a door 130c.
Like this, the perforated membrane of sending here from above-mentioned conveying roller 152a and 153a 150 and 151 promptly extends between the parting surface 124a of the parting surface 123a of upper mould 123 and lower die 124, is wound up into respectively on takers-in 152b and the 153b then.
The method of making semiconductor device by above-mentioned transfer molding equipment is described emphatically below.
As shown in figure 24, when upper mould 123 is left lower die 124, that is these two moulds are held in when making mould become open mode, valve 147 is controlled to makes this up and down portion mould 123 and 124 become suction discharge state, start vacuum pump 145, make perforated membrane 150 and 151 add press-fitted portions 130 and 131 and do closely to contact with resin.Then semiconductor chip 108 is fixed on the lead frame 106.Then will be wherein the lead-in wire of electrode and semiconductor chip 108 have been made the material to be molded 105 that is electrically connected by lead, transferred on the parting surface 124a of lower die 124.Figure 24 shows that this material to be molded 105 is in floating state, but in fact this material 105 is to be placed on the multiple-hole die 151.Multiple- hole die 150 and 151 can keep having used before the distortion.
The resin sheet of preheating is put into jar 119 subsequently, and as shown in figure 25, lower device 122 promptly rises and carries out matched moulds.Starting transfer jack 117 this moment comes to the resin sheet pressurization so that the resin sheet fusion piston rod 118.The resin sheet of fusion flows through the 130a of portion that selects materials, chute 130b and enters die cavity 130 with door 130c.
In this process, remain in air that resin adds press-fitted portions 130 and 131 and be vacuum pump 145 and aspirate.The air of extracting out drains among the ventilation unit 123b and 124b of the ventilation unit 150a of multiple- hole die 150 and 151 and 151a and top and lower die 123 and 124, enters then and leads in hole 139 and 140.Subsequently, air is promptly discharged by leading to pipeline 141.Like this, remain in the air that resin adds in press-fitted portions 130 and 131 among the die cavity 130b for example and just can successfully discharge, and do not have any obstruction by vacuum pump.So air just can not wrap in the resin 128 that is filled to die cavity 130b.This means in the moulded parts (packing) and can not generate hole.
If have any make perforated membrane 150 and 151 not with the contacted position of die cavity 130d wall, the pressure when then resin 128 injects can be used for making perforated membrane 150 and 151 to keep closely contacting with the wall work of die cavity 130d.So final moulded parts can improvement and do not have an outward appearance damage.
After resin injected end, vacuum pump 145 stopped operation.Valve 147 promptly is that an appropriate device (not showing bright) is transformed into and makes ventilation unit be in the state of compressed gas supplying automatically.
After resin 128 sclerosis, promptly as shown in figure 26, mould is opened.In this simultaneously, compressor 146 startings make compressed air enter resin and add press-fitted portions 130 and 131.The pressure of this compressing hole gas and takers-in 152b and 153b draw and the perforated membrane 150 of formation and 151 restoring force, just moulded parts 160 are released resin and add outside press-fitted portions 130 and 131.This release effect can only realize under the restoring force effect of compressed air or perforated membrane 150 and 151.But, when above-mentioned compression stress is combined with restoring force, that is to say the power that forms a kind of equilibrium, then above-mentioned push can be more reliable.
When molded good product 160 was transported on the perforated membrane 151, perforated membrane conveying mechanism 152 and 153 just began to make roller to rotate and a new part of above-mentioned each film is between the parting surface 124a of the parting surface 123a of upper mould 123 and lower die 124.Adopt aforesaid way, just can not have the ground of obstruction and realize described molding process.
Transfer molding method and apparatus according to embodiment 11 can obtain following effect.
(1) above-mentioned mould 123 includes two-stage ventilation unit 123b with lower die 124,124b, and 150a, 151a is used for directing into outside the mould 120 remaining in the air that resin adds in the press-fitted portions (for example die cavity).So needn't on the parting surface 124a of the parting surface 123a of upper mould 123 and lower die 124, a flute profile pore be set.
(2) effect (1) can prevent because the undesirable resin that is hardened in the pore causes various crackles and the defective distortion on the outer lead.
(3) effect (1) can be exempted the pore on upper mould 23 parting surface 23a and the lower die 24 parting surface 24a, can save thus to elimination and sew the side cut work that resin carries out.
(4) effect (1) has been exempted any pore need be set, and this does not have resin as much as to say and is blocked in the pore.So resin is just filled among the die cavity 130d fully, and can not produce bubble (hole) and depression on moulded parts (packing) 159.The result just can keep the steady quality of moulded parts (semiconductor device).
(5) top and lower die include two- stage ventilation unit 123b, 124b, and 150a, 151a directs into the air of surplus in resin pressurization part 130 and 131 outside the mould 120.So overflow launder, cushion chamber, pore, chute just needn't be set to be waited and prevents to produce hole.The result can simplify Mould design.
(6) ventilation unit 123b, 124b, 150a, 151a have end ventilation unit (123b and 124b) and surperficial ventilation unit (150a, 151a).Be formed on surperficial ventilation unit that motlten metal 128 contacts in pore less than the pore that is formed in the end ventilation unit.Therefore in end ventilation unit, can not stop up.
(7) surperficial ventilation unit is removable, and each moulded parts is changed relatively, therefore can prevent from defective moulded parts to occur because of resin stops up.
(8) surperficial ventilation unit is to form like this: i.e. the swabbing effect of the suction (and resin pressure) by being used to discharge gas makes telescopic perforated membrane 150 extravagant with the parting surface 124a of lower die 124 and be out of shape to become along the parting surface 123a of upper mould 123 with 151.Therefore can make the moulded parts that makes become the proper product of no outward appearance damage.
(9) surperficial ventilation unit is to be formed by the extendible multiple- hole die 150 and 151 of stretching out on upper mould 123 parting surface 123a and lower die 124 parting surface 124a upper berths.When opening mould, the restoring force of multiple-hole die also is that leveling power just can make the molded product that gets from then on deviate from the mould of upper and lower part.This thin-film member can be replaced by jemmy.
(10). the effect of (9) is that jemmy needn't be set, and therefore can simplify mould structure.So being become, Mould design and manufacturing also can reduce manufacturing time and expense easily.
(11) for each molding process, perforated membrane 150 and 151 is to be transported between upper mould 123 parting surface 123a and the lower die 124 parting surface 124a by perforated membrane conveying mechanism 152 and 153.Therefore can in surperficial ventilation unit, not stop up.The result can make the undamaged moulded parts that meets the requirements of outward appearance.
(12) because the aspirator that leads to ventilation unit is to start working when suppressing resin, so can discharge air remaining in the resin pressurization part apace.The result can make no outward appearance damage and imporous suitable moulded parts.So just can significantly improve productive rate.
(13) when die sinking, start the compressed air feedway that leads to ventilation unit, mould 159 is released between top and lower die by this compressed air.Pine oil counterdie product (packing) reliably so just.
(14) finish die sinking after, the effect of restoring force and Compressed Gas feedway by perforated membrane, molded good product just takes out between upper mould 123 and lower die 124.Therefore jemmy need not arranged, and not need the result who takes out moulded parts with jemmy just can prevent to produce the chip crackle or pack the slit.
(15) when designing mould, unnecessary any overflow launder, cushion chamber, pore, chute etc. and the jemmy of providing, but so simplified structure.So Mould design and manufacturing become easily, and are reduced manufacturing time and expense.In addition, the size of mould has also reduced.
Figure 27 has shown the schematic cross sectional view that is located at the mould among another embodiment (embodiment 12).In this embodiment, identical with previous embodiment as shown in figure 27, be provided with resin in upper mould and lower die 123 and 124 and add press-fitted portions 130 and 131, their top perforated membrane 165 and 166 of then attaching respectively.When having any clogging, when also promptly reaching a predetermined molded number of times, just replace these old perforated membranes with new perforated membrane.So this embodiment can provide the effect identical with embodiment 11.
Figure 28 is a schematic cross sectional view, shows the mould of exposed installation in another embodiment (embodiment 13).In this embodiment 13, as shown in figure 28, upper mould 123 is provided with resin with lower die 124 and adds press-fitted portions 130 and 131, is formed with perforated membrane 170 and 171 above the latter.These perforated membranes 170 and 171 are that the coating by titanium nitride (TiN) or chromium (Cr) or other similar substance forms.The about 1-5 μ of thick coating m uses the electrolytic method coating.This coating is porous, thereby contains a collection of pore, the about 0.1-0.3 μ of the diameter of each pore m.This structure is anti-the obstruction, because it is the thin mould of coating and contains the pore that does not allow resin particle pass through.Therefore this structure can durable segment length's time.
Figure 29 is an illustraton of model, shows the major part of bright transfer molding equipment according to another embodiment of the present invention (embodiment 14).In this embodiment, upper mould 123 is not by porous material with lower die 124 but is formed by common hard metal.In this upper and lower mould 123 and 124, end ventilation unit 123b and 124b have been formed by the many pores that process above.These pores link to each other with a connecting pipe 141.If it is at least within die cavity 130d that these ventilation units 123b and 124b are positioned at, just hole can not take place in the moulded parts that makes.In addition, this end ventilation unit 123b and the 124b that is made up of pore can be applied in previous embodiment 11 and 12.
As mentioned above, the inventor waited already and understood the present invention specifically according to embodiment.But the present invention is not limited to previous embodiment, and can make many variations in not breaking away from spiritual scope of the present invention.
Top description relates to the transfer molding technology corresponding to background of the present invention, but application of the present invention then is not limited to this.For example the present invention can be used for the injection molding pressing of a common moulded resin, or the technology that is used for for example die casting or comes molded melted material with rubber pattern.
The present invention can be applied to molding technique at least.
The disclosed representational summary of the invention of the applicant has following effect.
(1) top and lower die comprise the two-stage ventilation unit, are used for adding and being press-fitted remaining in resin Close section for example the air in the die cavity be directed to outside the mould. So do not require at the mould parting surface On the flute profile pore is set. This means and to prevent owing in this kind pore, hardening not uncommon The resin that prestige has and crackle occurs at outer conductor.
(2) pore not being set just can avoid causing die cavity because the resin obstruction often takes place in the pore Middle resin fill deficiency. So bubble (hole) and depression in moulded product, can not occur. This Help to keep or improve the quality of the product (semiconductor devices) that is molded as.
(3) this upper and lower mould section provides and has been used for adding sky in the press-fitted portions with remaining in resin The twin-stage ventilation unit that conductance is drawn. So unnecessary for example overflow launder, slow of any device that arranges Rush chamber, pore or stream material chamber etc. and prevent hole.
(4) above-mentioned ventilation unit has end ventilation unit and surperficial ventilation unit. Be used for and molten resin Its diameter of pore that the surperficial ventilation unit of contact has is less than the diameter of end ventilation unit pore. Therefore in end ventilation unit, can not stop up.
(5) above-mentioned surperficial ventilation unit is removable. Therefore it can reach a predetermined mold pressing Change behind the number of times, thereby can prevent from causing defective moulded parts because resin stops up.
(6) above-mentioned surperficial ventilation unit is to form in this wise: namely discharge (and resin by suction Injection pressure) impact makes the extendible perforated membrane that extends on each parting surface of upper and lower mould Be out of shape and form. The moulded parts of gained is the harmless qualified moulded parts of outward appearance.
(7) above-mentioned surperficial ventilation unit is by extending extensible on each parting surface of upper and lower mould Multiple-hole die distortion and form. Therefore when opening mould, the restoring force of this many also moulds namely Leveling power just is used for releasing mechanograph from mould. This power can be by the work of jemmy Use replacement.
(8) when a molded product, be by the multiple-hole die conveying mechanism in each molding process Effect multiple-hole die is transported between upper mould and the lower die release surface. So aforementioned Can not stop up in the ventilation unit of surface, be harmless the closing of outward appearance and can make the moulded parts of gained The lattice moulded parts.
(9) when resin is pressed into resin and adds press-fitted portions, start the suction of leading to ventilation unit Device. So the air at this component can be discharged fast, carried out rightly molded Work and can not deface and cause hole. The result has improved productive rate.
When (10) opening mould, start the compression gas suppling device that leads to ventilation unit, with logical The effect of overcompression gas extrudes molded good product between up and down section mould. So energy Release reliably molded good product.
When (11) opening mould, by the work of perforated membrane restoring force and Compressed Gas feedway With, from top and lower die, take out moulded product. Therefore need not use jemmy. In other words Do not have jemmy and stab the problem of moulded parts, can prevent die crack or bag thus The dress slit.
(12) owing to need not use jemmy, the structure of mould is simplified. Therefore make mould Design becomes comparatively easy with manufacturing, can reduce manufacturing time and expense like this.
Claims (40)
1. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor step by the hot curing moulding resin, is characterised in that the method comprises the steps:
(a) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a kind of film sheet that connects up, the latter comprises a collection of lead, directly or indirectly be formed on described semiconductor chip first interarea on electrode be connected;
(b) form on first mould in a kind of like this mold apparatus of second mould of a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip having first mould and matching, the inboard at least a portion of above-mentioned each die cavity of at least one is to be formed by porous material in this first and second mould, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component to pass through in case produce hole, described chip-lead-in wire composite members is placed between first and second mould;
(c) make described chip-lead-in wire composite members between this first and second mould the tight one-tenth of described two die clamps;
(d) die cavity and the atmosphere that form of the mould by the above-mentioned cooperation of described porous material enable leads to, or this moulding resin is injected described die cavity under far below the pressure of described moulding resin injection pressure one, seal the predetermined portions of described chip-lead-in wire composite members with moulding resin thus; And
(e) porous part of gas by above-mentioned die cavity injected this die cavity to open aforementioned two moulds, be used for from described first and second mould, releasing this chip that has sealed-lead-in wire composite members at least one.
2. the method for manufacturing semiconductor device as claimed in claim 1 is characterised in that: when aforementioned moulding resin injected above-mentioned die cavity, remaining gas was promptly discharged from above-mentioned porous portion by exhaust apparatus in this die cavity.
3. the method for manufacturing semiconductor device as claimed in claim 2, be characterised in that: described mold apparatus includes the ventilation unit that is formed by porous material, this ventilation unit has pore and the filter course that leads to described die cavity, filter course then have be formed on this ventilation unit lip-deep and communicate with described pore lead to pore, this kind pore is used for suppressing that above-mentioned moulding resin is heavy injects above-mentioned pore and allow at least the portion gas component by wherein in case generate hole.
4. as being used to make the method for semiconductor device as described in the claim 3, be characterised in that: described mold apparatus includes ventilation unit, the latter is made of porous materials and has pore and above-mentioned die cavity and links to each other with meticulous porous portion, the latter imbeds this kind pore to a desired depth and communicates with described pore, is the little pore that leads to form the more said pore of many diameters.
5. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor chips step by the hot curing moulding resin, is characterised in that the method comprises the steps:
(a) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a kind of film wiring sheet;
(b) have first mould and match with first mould on form in a kind of like this mold apparatus of second mould of a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip, in this first and second mould above-mentioned each the die cavity inboard of at least one basically its whole surface be to form by porous material, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component to pass through in case produce hole, described chip-lead-in wire composite members is placed between first and second mould;
(c) make described chip-lead-in wire composite members between this first and second mould the tight one-tenth of described two die clamps;
(d) die cavity that forms of the mould by the above-mentioned cooperation of described porous material enable and atmosphere leads to or this moulding resin is injected described die cavity under far below the pressure of described moulding resin injection pressure seals the predetermined portions of described chip-lead-in wire composite members with resin thus; And
(e) porous part of gas by above-mentioned die cavity injected this die cavity to open aforementioned two moulds, be used for from described first and second mould, releasing this chip that has sealed-lead-in wire composite members at least one.
6. the method for manufacturing semiconductor device as claimed in claim 5 is characterised in that: when described first and second mould was opened mutually, gas promptly was injected in the above-mentioned die cavity from the outside through described porous material.
7. the method for manufacturing semiconductor device as claimed in claim 6 is characterised in that: when aforementioned moulding resin injected above-mentioned die cavity, gas remaining in this die cavity was promptly discharged by above-mentioned porous material via exhaust apparatus.
8. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor step by the hot curing moulding resin, is characterised in that the method comprises the steps:
(a) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a kind of film sheet that connects up, the latter comprises a collection of lead, directly or indirectly be formed on described semiconductor chip first interarea on electrode be connected;
(b) form on first mould in a kind of like this mold apparatus of second mould of a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip having first mould and matching, at least a portion of above-mentioned each the die cavity inboard of at least one is to be formed by porous material in this first and second mould, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component to pass through in case produce hole, described chip-lead-in wire composite members is placed between first and second mould;
(c) make described chip-lead-in wire composite members between this first and second mould the tight one-tenth of described two die clamps;
(d) die cavity and the atmosphere that form of the mould by the above-mentioned cooperation of described porous material enable leads to, or this moulding resin is injected described die cavity under far below the pressure of described moulding resin injection pressure one, seal the predetermined portions of described chip-lead-in wire composite members with resin thus; And
(e) porous part of gas by above-mentioned die cavity injected this die cavity to open aforementioned two moulds, be used for from described first and second mould, releasing this chip that has sealed-lead-in wire composite members at least one.
9. the method for manufacturing semiconductor device as claimed in claim 8 is characterised in that: described porous portion is formed in aforementioned first and second mould at least one.
10. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor step by the hot curing moulding resin, is characterised in that the method comprises the steps:
(a) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a kind of film sheet that connects up, the latter comprises a collection of lead, directly or indirectly be formed on described semiconductor chip first interarea on electrode be connected;
(b) in a kind of mold apparatus, this mold apparatus possesses first mould and second mould that has a collection of die cavity, one or more is used for keeping the jar of resin sheet, and one or more is used for making described die cavity and described jar of chute that links to each other, this second mould matches on first mould to form a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip, and at least a portion and the described chute of being located at a stamping inboard in each described jar all are to be formed by porous material with jar, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component to pass through in case produce hole, described chip-lead-in wire composite members is placed between first and second mould;
(c) make described chip-lead-in wire composite members between this first and second mould the tight one-tenth of described two die clamps;
(d) described moulding resin jar is injected in the described die cavity by described chute from described, seal the predetermined portions of described chip-lead-in wire composite members with moulding resin thus; And
(e) open aforementioned two moulds, be used for from described first and second mould, releasing this chip that has sealed-lead-in wire composite members at least one.
11. as being used to make the method for semiconductor device as described in the claim 10, be characterised in that: the inner surface of described each die cavity and chute all are to be formed by porous material, this kind porous material is used for suppressing the heavy notes of described moulding resin to a desired depth, and to allow be that the portion gas component passes through at least, in case produce hole.
12. as being used for making the method for semiconductor device as described in the claim 10, be characterised in that: the inner surface of each described die cavity and described chute all are to be formed by porous material with jar, this kind porous material is used for suppressing the heavy notes of described moulding resin to a desired depth, and to allow be that the portion gas component passes through at least, in case produce hole.
13. as being used for making the method for semiconductor device as described in the claim 10, be characterised in that: the inner surface of each described die cavity, chute, jar and be located at the described module that is used for oppressing aforementioned moulding resin in the jar slidably, all be made of porous materials, this kind porous material is used for suppressing the heavy notes of described moulding resin to a desired depth, and allow at least that the portion gas component passes through, in case produce hole.
14. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor step by the hot curing moulding resin, is characterised in that the method comprises the steps:
(a) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a kind of film sheet that connects up, the latter comprises a collection of lead, directly or indirectly be formed on described semiconductor chip first interarea on electrode be connected;
(b) in a kind of mold apparatus, this mold apparatus possesses first mould and second mould that has a collection of die cavity, be formed on the described die cavity of a predetermined number and respectively be used for keeping a collection of jar of resin sheet, and a collection of chute that is used for making described die cavity and described jar to link to each other, this second mould matches on first mould to form a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip, and be that a part and described jar and the chute of each described die cavity inboard is to be formed by porous material at least, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component to pass through in case produce hole, described resin sheet is inserted between aforementioned top and lower die in the resin sheet insertion section that is formed at the described lower die;
(c) described chip-lead-in wire composite members is placed between the described top of having beaten and lower die;
(d) described first mould and second die clamp are tightly become aforementioned chip-lead-in wire composite members is placed in a kind of state between these two moulds;
(e) in described jar, moulding resin is flow in the die cavity by chute, seal the compound predetermined portions of chip-lead-in wire with moulding resin thus; And
(f) open this two moulds, make the chip of good seal-lead-in wire composite members from then in upper mould and the lower die at least one pine oil go out.
15. one kind has the method that is used for making semiconductor device of being come the sealing semiconductor chips step by the hot curing moulding resin, this integrated circuit (IC)-components is if by being located at jemmy in the mold apparatus when releasing a sealing, then because physical deformation takes place in meeting in this hermetic unit, will damage its characteristic, the method is characterised in that and includes following step:
(c) preparation one chip-lead-in wire composite members, it has a collection of semiconductor chip, a lead frame or a collection of film sheet that connects up, the latter comprises a collection of lead, directly or indirectly be formed on described semiconductor chip first interarea on electrode be connected;
(b) form on first mould in a kind of like this mold apparatus of second mould of a collection of die cavity that is used for sealing above-mentioned this batch semiconductor chip having first mould and matching, at least be provided in a side of each described jar in an inboard part and the chute of a stamping be to form with jar by porous material, described moulding resin is heavy to be annotated to a desired depth to suppress, and allow the portion gas component by preventing to produce hole, simultaneously described chip-lead-in wire composite members is placed between first and second mould;
(c) make described chip-lead-in wire composite members between this first and second mould the tight one-tenth of described two die clamps;
(d) described moulding resin is injected by above-mentioned in two synthetic formed die cavitys of mould, to seal the predetermined portions of this chip-lead-in wire composite members by described moulding resin; And
(e) porous part of gas by above-mentioned die cavity injected this die cavity to open aforementioned two moulds, be used for from described first and second mould, releasing this chip that has sealed-lead-in wire composite members at least one.
16. one kind is come the mold apparatus of sealing semiconductor chips with package resin, is characterised in that this equipment comprises:
One first mould;
One second mould, it be arranged to can be relative first mould do the motion that is toward or away from, and can be complementary with first mould and be applicable to the die cavity of above-mentioned packing with formation; Simultaneously
Feature also is: have at least one to have one that be made of porous materials and include the die body of a ventilation unit in above-mentioned first and second mould, this ventilation unit includes pore and imbeds in each described pore meticulous guide hole portion to a desired depth from each described die cavity inner surface, this meticulous porous is then comprising some and is leading to pore, the more described pore of internal diameter that each pore had little, the heavy notes taken place to be used for suppressing described moulding resin, and to allow be the portion gas component by wherein at least, and the gas composition that remains in the described die cavity is then discharged via the above-mentioned pore that leads to.
17. mold apparatus as claimed in claim 16 is characterised in that: on the surface of described meticulous porous portion one deck coating is arranged.
18. method that is used for making semiconductor device, be characterised in that: in being used for carrying out the mould of transfer molding on the inner surface of formed each die cavity, having a part at least is to be formed by porous mass, or containing a collection of pore is used for suppressing the desired depth that sealing resin sinks to described inner surface.
19. a method that is used for making semiconductor device, it makes, being formed at transfer molding, to have a part at least with the inner surface of each die cavity in the mould be to be formed by porous mass, or contain a collection of pore that is used for suppressing the sealing resin sedimentation.
20. method that is used for making semiconductor device, it makes and each is used for outside the mould membrane removal chamber of transfer molding the inner surface of this part to have a part at least be to be formed by porous mass, or contain a collection of pore that is used for suppressing the sealing resin sedimentation, there is the part sealing resin to flow.
21. in the time of on a upper mould and lower die coupling; add in the press-fitted portions by molten resin being added two formed resins of mould that are press fit into by at this moment; make a kind of molding methods of moulded parts; be characterised in that: wherein carry out a moulding process; make by a twin-stage ventilation unit and to remain in the air that described resin adds in the press-fitted portions and discharge outside described two moulds; this twin-stage ventilation unit has the end ventilation unit that is formed in aforementioned upper mould or the lower die, the surperficial ventilation unit of going back and having on the surface that is positioned at this end ventilation unit and contact with molten resin.
22. molding methods as claimed in claim 21 is characterised in that: described surperficial ventilation unit is also can being changed after the molding manufacturing of carrying out pre-determined number of porous type.
23. molding methods as claimed in claim 22, be characterised in that: described surperficial ventilation unit is to be formed through distortion by the extensible perforated membrane on each parting surface that spreads into described top and lower die, by making this top and lower die matched moulds do to add interference fit to resin, the restoring force of described perforated membrane is that leveling power makes from then on moulded parts is got loose out on top and the lower die.
24. as the described molding methods of claim 21 to 23, be characterised in that: when resin is done to add interference fit, compressed air is sent to resin by described ventilation unit to be added in the press-fitted portions, with when opening mould pine oil goes out on top and lower die with moulded parts, make to remain in the air that resin adds in the press-fitted portions and can force to discharge by this ventilation unit.
25. mold apparatus, it adds and makes a kind of moulded parts in the press-fitted portions by molten resin being added press fit at the be complementary resin that forms of a upper mould and a lower die, this equipment comprises a twin-stage ventilation unit, be located at least one in this top and the lower die, be used for guiding out the air that this resin adds surplus in the press-fitted portions.
26. mold apparatus as claimed in claim 25 is characterised in that: described twin-stage ventilation unit has the end ventilation unit that is formed in aforementioned top and the lower die, and is positioned on the surface of this end ventilation unit and the surperficial ventilation unit that contacts with molten resin.
27. mold apparatus as claimed in claim 26, be characterised in that: described surperficial ventilation unit and end ventilation unit all are to be formed by porous material, the diameter that is formed on the pore in the surperficial ventilation unit is then less than the diameter that is formed on pore in the end ventilation unit, and these two ventilation units all can be changed.
28. mold apparatus as claimed in claim 27 is characterised in that: described surperficial ventilation unit is to be formed by the extensible perforated membrane that extends on this top and lower die.
29. mold apparatus as claimed in claim 28 is characterised in that: after the molding compacting of carrying out a pre-determined number, can above-mentioned perforated membrane be transported between the parting surface of upper mould and lower die by the perforated membrane conveying mechanism.
30. mold apparatus as claimed in claim 29 is characterised in that: be provided with aspirator, link to each other, be used for adding press-fitted portions and forcibly air be drawn into its outside from described resin with described ventilation unit; Also be provided with the Compressed Gas feedway, link to each other, be used for that Compressed Gas is supplied with described resin and add press-fitted portions with described ventilation unit.
31. method that is used for making semiconductor device, be characterised in that, the method includes such step: sealing resin is injected into the inner surface of each die cavity of mould and one treats by between the chip that a pair of thin slice sealed-lead-in wire composite members of being located in this die cavity, this all is porous to thin slice or is comprising and be used for suppressing the pore that this encapsulant resin is sunk in batch.
32. be used for adding in the press-fitted portions to make the method for a moulded parts, be characterised in that the method includes such step by molten resin being added be press fit into by the be complementary resin that forms of a upper mould and a lower die:
Molten resin added be press fit into above-mentioned this moulded parts product making between mould, described this to having at least one to have a twin-stage ventilation unit in the mould, this twin-stage ventilation unit have end ventilation unit and at this end ventilation unit lip-deep and with the contacted surperficial ventilation unit of molten resin.
33. molding methods as claimed in claim 32 is characterised in that: above-mentioned surperficial ventilation unit is to be formed by porous material, can load or unload with respect to ventilation unit of the described end on any position, and be changed behind the molding compacting number of times that carried out being scheduled to.
34. molding methods as claimed in claim 23, described surperficial ventilation unit are that an extendible perforated membrane each parting surface extravagance along described top and lower die is formed.
35. as each described molding methods in the claim 32 to 34, be characterised in that the method comprises the steps: when molten resin is added interference fit, adopt exhaust apparatus that the force air that resin adds surplus in the press-fitted portions is discharged; And when opening this, supply compressed air by aforementioned ventilation unit from the feeder of outside to mould, pine oil the upper and lower mould is gone out moulded parts from this.
36. be used for adding in the press-fitted portions to make the method for a moulded parts by molten resin being added be press fit into by a upper mould and the lower die resin that forms that is complementary, be characterised in that: be provided with a twin-stage ventilation unit at least one in described top and lower die, the latter has an end ventilation unit and on this ventilation unit surface, end and the surperficial ventilation unit that contacts with described molten resin.
37. mold apparatus as claimed in claim 36, be characterised in that: ventilation unit of the described end and surperficial ventilation unit all are to be formed by porous material, the diameter of contained pore is less than the pore in the end ventilation unit in the ventilation unit of surface, and surperficial ventilation unit can be changed with respect to end ventilation unit simultaneously.
38. as claim 36 or 37 described mold apparatus, be characterised in that: described surperficial ventilation unit is to be formed to each parting surface of aforementioned top and lower die by an extendible perforated membrane extravagance.
39. mold apparatus as claimed in claim 38 is characterised in that: after the molding compacting of carrying out a pre-determined number, can above-mentioned perforated membrane be transported between the parting surface of upper mould and lower die by the perforated membrane conveying mechanism.
40. mold apparatus as claimed in claim 35 is characterised in that: be provided with aspirator, link to each other, be used for adding press-fitted portions and forcibly air be drawn into its outside from described resin with described ventilation unit; Also be provided with the Compressed Gas feedway, link to each other, be used for that Compressed Gas is supplied with described resin and add press-fitted portions with described ventilation unit.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28327894 | 1994-11-17 | ||
| JP28327794 | 1994-11-17 | ||
| JP283277/94 | 1994-11-17 | ||
| JP283278/94 | 1994-11-17 | ||
| JP101833/95 | 1995-04-26 | ||
| JP224245/95 | 1995-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1131605A true CN1131605A (en) | 1996-09-25 |
Family
ID=26554969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 95119722 Pending CN1131605A (en) | 1994-11-17 | 1995-11-17 | Molding method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1131605A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100343033C (en) * | 2002-11-29 | 2007-10-17 | 陈特夫 | Metal mould capable of exhaust |
| CN100363163C (en) * | 2003-06-12 | 2008-01-23 | 东和株式会社 | Resin mold material and resin mold |
| CN102148175A (en) * | 2011-01-05 | 2011-08-10 | 无锡市玉祁红光电子有限公司 | Semiconductor chip template structure |
| CN102448698A (en) * | 2009-03-30 | 2012-05-09 | 法国圣戈班玻璃厂 | Method for moulding a plastic part with an insert held in place by means of suction, moulding device and use |
| CN102655098A (en) * | 2011-03-03 | 2012-09-05 | 三星电子株式会社 | Molding apparatus for semiconductor package |
| CN101264648B (en) * | 2004-03-26 | 2012-09-19 | 东和株式会社 | Resin shaping die |
| CN103522579A (en) * | 2013-10-10 | 2014-01-22 | 泉州三嘉机械有限公司 | Forming machine for vacuum insulated panel |
| CN106182581A (en) * | 2016-07-25 | 2016-12-07 | 胡小庆 | The preparation method of a kind of electronic chip and electronic chip |
| CN110544637A (en) * | 2019-08-28 | 2019-12-06 | 深圳赛意法微电子有限公司 | semiconductor device molding method and packaging mold used for same |
-
1995
- 1995-11-17 CN CN 95119722 patent/CN1131605A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100343033C (en) * | 2002-11-29 | 2007-10-17 | 陈特夫 | Metal mould capable of exhaust |
| CN100363163C (en) * | 2003-06-12 | 2008-01-23 | 东和株式会社 | Resin mold material and resin mold |
| CN101264648B (en) * | 2004-03-26 | 2012-09-19 | 东和株式会社 | Resin shaping die |
| CN102448698A (en) * | 2009-03-30 | 2012-05-09 | 法国圣戈班玻璃厂 | Method for moulding a plastic part with an insert held in place by means of suction, moulding device and use |
| CN102148175A (en) * | 2011-01-05 | 2011-08-10 | 无锡市玉祁红光电子有限公司 | Semiconductor chip template structure |
| CN102655098A (en) * | 2011-03-03 | 2012-09-05 | 三星电子株式会社 | Molding apparatus for semiconductor package |
| CN103522579A (en) * | 2013-10-10 | 2014-01-22 | 泉州三嘉机械有限公司 | Forming machine for vacuum insulated panel |
| CN103522579B (en) * | 2013-10-10 | 2015-05-20 | 泉州三嘉机械有限公司 | Forming machine for vacuum insulated panel |
| CN106182581A (en) * | 2016-07-25 | 2016-12-07 | 胡小庆 | The preparation method of a kind of electronic chip and electronic chip |
| CN110544637A (en) * | 2019-08-28 | 2019-12-06 | 深圳赛意法微电子有限公司 | semiconductor device molding method and packaging mold used for same |
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