CN205993020U - A kind of double-sided PCB structure - Google Patents
A kind of double-sided PCB structure Download PDFInfo
- Publication number
- CN205993020U CN205993020U CN201620847492.2U CN201620847492U CN205993020U CN 205993020 U CN205993020 U CN 205993020U CN 201620847492 U CN201620847492 U CN 201620847492U CN 205993020 U CN205993020 U CN 205993020U
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- China
- Prior art keywords
- hole
- cem
- piece
- sheet material
- heat conducting
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- Expired - Fee Related
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
This utility model is related to a kind of double-sided PCB structure, including substrate, PC piece, CEM 1 sheet material, copper clad layers, scolding tin circle and heat conducting sleeve, PC piece is provided with the upper and lower surface of substrate, the outside of PC piece is provided with CEM 1 sheet material, and the outside of CEM 1 sheet material is provided with copper clad layers；First through hole and two the second through holes are provided with substrate, PC piece, CEM 1 sheet material and copper clad layers, the side of the second through hole is provided with scolding tin circle, it is embedded with heat conducting sleeve in first through hole, heat conducting sleeve be provided centrally with the second through hole, second through hole can be used to threading so that the copper clad layers of both sides can be connected with each other.This utility model greatly improve speed of welding, the use of heat conducting sleeve makes this circuit board have good heat sinking function, simultaneously easy to process, low production cost, suits large area to popularize.
Description
Technical field
This utility model is related to a kind of circuit board, more particularly, to a kind of double-sided PCB structure.
Background technology
Development in Hi-Tech, people need the electronic product more than performance height, small volume, function, promote circuit board fabrication also to
Gently, thin, short, little development, the confined space, realize more multi-functional, wiring density becomes big, and aperture is less.Layer with interlayer interconnection institute according to
Bad plated through-hole, its quality direct relation printed board reliability, simultaneously its radiating effect directly affects circuit board and product
Service life.
In prior art, such as Patent No. 201520278363.1, the applying date is 2015.04.30《Two-side radiation type circuit
Plate》, the two-side radiation type circuit board of this utility model is covered with heat radiation protection device outside upper and lower circuit substrate, circuit board played
The effect being effectively protected, substantially increases the heat dispersion of circuit board, and extends its service life, and circuit board two ends are arranged
There is spliced eye, facilitate the grafting of circuit board, simple to operate.But this utility model complex structure, manufacturing cost is high, connection
Easily loosen, need further improvement.
Utility model content
For the present situation of above-mentioned prior art, technical problem to be solved in the utility model is to provide a kind of welding effect
Rate height, good heat dissipation effect, easy to process, the double-sided PCB structure of low production cost.
This utility model solves the technical scheme that adopted of above-mentioned technical problem：A kind of double-sided PCB structure, including
Substrate, PC piece, CEM-1 sheet material, copper clad layers, scolding tin circle and heat conducting sleeve it is characterised in that：The material of described substrate is aluminium oxide,
PC piece is provided with the upper and lower surface of described substrate, the outside of described PC piece is provided with CEM-1 sheet material, described CEM-1 piece
The outside of material is provided with copper clad layers；It is provided with the first through hole and two in described substrate, PC piece, CEM-1 sheet material and copper clad layers
Individual second through hole, the side of described second through hole is provided with scolding tin circle, described scolding tin circle be provided centrally with first through hole,
Be embedded with heat conducting sleeve in described first through hole, described heat conducting sleeve be provided centrally with the second through hole.
Further, the thickness of described substrate is 0.8mm, and the thickness of PC piece is 0.2mm, and the thickness of CEM-1 sheet material is
0.1mm.
Further, the top of described scolding tin circle is provided with frustum cone structure, and the basal diameter of described frustum cone structure is more than the
The diameter of two through holes.
Further, the material of described heat conducting sleeve is heat conductive silica gel.
Compared with prior art, the utility model has the advantage of：This utility model greatly improve speed of welding,
The use of heat conducting sleeve makes this circuit board have good heat sinking function, simultaneously easy to process, low production cost, suitable large area
Promote.
Brief description
Fig. 1 is structure chart of the present utility model.
Specific embodiment
As shown in figure 1, a kind of double-sided PCB structure, including substrate 1, PC piece 2, CEM-1 sheet material 3, copper clad layers 4, scolding tin
Circle 5 and heat conducting sleeve 6；The material of substrate 1 is aluminium oxide, and the thickness of substrate 1 is 0.8mm, and the upper and lower surface of substrate 1 is provided with
PC piece 2, the thickness of PC piece 2 is 0.2mm, and the outside of PC piece 2 is provided with CEM-1 sheet material 3, and the thickness of CEM-1 sheet material 3 is
The outside of 0.1mm, CEM-1 sheet material 3 is provided with copper clad layers 4；It is provided with substrate 1, PC piece 2, CEM-1 sheet material 3 and copper clad layers 4
First through hole 12 and two the second through holes 11, the side of the second through hole 11 is provided with scolding tin circle 5, the top of scolding tin circle 5
It is provided with frustum cone structure 52, the basal diameter of frustum cone structure 52 is more than the diameter of the second through hole 11；Scolding tin circle 5 centrally disposed
There is first through hole 51, after components and parts pin inserts in first through hole 51, with instrument, scolding tin circle 5 is melted and can be done directly weldering
Connect, convenient and swift；It is embedded with heat conducting sleeve 6, the material of heat conducting sleeve 6 is heat conductive silica gel in first through hole 12；The center of heat conducting sleeve 6
It is provided with the second through hole 61, the second through hole 61 can be used to threading so that the copper clad layers 4 of both sides can be connected with each other.
Finally it should be noted that：Above example only in order to the technical solution of the utility model to be described, is not intended to limit；
Although being described in detail to this utility model with reference to the foregoing embodiments, it will be understood by those of skill in the art that its according to
So the technical scheme described in foregoing embodiments can be modified, or wherein some technical characteristics are replaced on an equal basis
Change；And these modifications or replacement, do not make the essence of appropriate technical solution depart from this utility model each embodiment technical scheme
Spirit and scope.
Claims (4)
1. a kind of double-sided PCB structure, including substrate, PC piece, CEM-1 sheet material, copper clad layers, scolding tin circle and heat conducting sleeve, its feature
It is：The material of described substrate is aluminium oxide, the upper and lower surface of described substrate is provided with PC piece, the outside of described PC piece is equal
It is provided with CEM-1 sheet material, the outside of described CEM-1 sheet material is provided with copper clad layers；Described substrate, PC piece, CEM-1 sheet material and cover
First through hole and two the second through holes are provided with layers of copper, the side of described second through hole is provided with scolding tin circle, described
Scolding tin circle be provided centrally with first through hole, be embedded with heat conducting sleeve in described first through hole, described heat conducting sleeve centrally disposed
There is the second through hole.
2. a kind of double-sided PCB structure according to claim 1 it is characterised in that：The thickness of described substrate is 0.8mm,
The thickness of PC piece is 0.2mm, and the thickness of CEM-1 sheet material is 0.1mm.
3. a kind of double-sided PCB structure according to claim 1 it is characterised in that：The top of described scolding tin circle is provided with
Frustum cone structure, the basal diameter of described frustum cone structure is more than the diameter of the second through hole.
4. a kind of double-sided PCB structure according to claim 1 it is characterised in that：The material of described heat conducting sleeve is heat conduction
Silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847492.2U CN205993020U (en) | 2016-08-08 | 2016-08-08 | A kind of double-sided PCB structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620847492.2U CN205993020U (en) | 2016-08-08 | 2016-08-08 | A kind of double-sided PCB structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205993020U true CN205993020U (en) | 2017-03-01 |
Family
ID=58106263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620847492.2U Expired - Fee Related CN205993020U (en) | 2016-08-08 | 2016-08-08 | A kind of double-sided PCB structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205993020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110392484A (en) * | 2018-04-18 | 2019-10-29 | 北大方正集团有限公司 | Circuit board drilling method and device |
-
2016
- 2016-08-08 CN CN201620847492.2U patent/CN205993020U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110392484A (en) * | 2018-04-18 | 2019-10-29 | 北大方正集团有限公司 | Circuit board drilling method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170301 Termination date: 20190808 |