CN204887677U - Sealed heat dissipation formula circuit board - Google Patents
Sealed heat dissipation formula circuit board Download PDFInfo
- Publication number
- CN204887677U CN204887677U CN201520572756.3U CN201520572756U CN204887677U CN 204887677 U CN204887677 U CN 204887677U CN 201520572756 U CN201520572756 U CN 201520572756U CN 204887677 U CN204887677 U CN 204887677U
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- CN
- China
- Prior art keywords
- circuit board
- layer
- heat dissipating
- heat
- dissipating layer
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- Expired - Fee Related
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Abstract
The utility model relates to a circuit board field, concretely relates to sealed heat dissipation formula circuit board, it includes the circuit board, circuit board upper surface is provided with the circuit layer, the termination has the device layer on the circuit board, the circuit layer surface is connected with first heat dissipation layer, including the device layer is wrapped up on first heat dissipation layer, first heat dissipation layer upper end is provided with second heat dissipation layer.
Description
Technical field
The utility model relates to field of circuit boards, is specifically related to a kind of sealed heat-dissipating formula circuit board.
Background technology
Printed circuit board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.Single sided board, double sided board, four laminates, six laminates and other multilayer circuit boards can be divided into according to the wiring board number of plies.
In recent ten years, rapidly, the gross output value, total output occupy the first in the world in pairs in China's printed circuit board (PrintedCircuitBoard is called for short PCB) manufacturing development.Because electronic product makes rapid progress, price war changes the structure of supply chain, and China has industry distribution, cost and the market advantage concurrently, has become global most important printed circuit board production base.
Printed circuit board develops into double sided board, multi-layer sheet and flex plate from individual layer, and constantly to high accuracy, high density and high reliability future development.Continuous reduced volume, minimizing cost, raising performance, make printed circuit board in the evolution of future electronic product, still keep powerful vitality.Following printed circuit board manufacturing technology development trend is to high density, high accuracy, fine pore, thin wire, Small Distance, highly reliable, multiple stratification, high-speed transfer, light weight, slim future development in performance.While high density, high accuracy, light weight and slim development, the heat of circuit board also can gather rising, along with temperature raises, the life-span of circuit board element declines greatly, meanwhile, the reduction of spacing between circuit board, its surface is easily subject to the impact of air plankton, causes the problem such as short circuit, open circuit.
Summary of the invention
The purpose of this utility model is defect for prior art and deficiency, there is provided a kind of structure simple, a kind of sealed heat-dissipating formula circuit board reasonable in design, easy to use, it adopts the heat dissipating layer being provided with coated device layer in circuit layer upper end, by double-deck heat dissipating layer, while can reaching quick heat radiating, greatly reduce the air plankton of device surface, improve useful life, and it has easy to use, simple to operate, structure is simple, the features such as practicality is good.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of sealed heat-dissipating formula circuit board described in the utility model, comprise circuit board, described circuit board upper surface is provided with circuit layer, described circuit board upper end is connected to device layer, described circuit layer surface is connected with the first heat dissipating layer, in device layer is wrapped in by described first heat dissipating layer, described first heat dissipating layer upper end is provided with the second heat dissipating layer.
Described first heat dissipating layer adopts heat conductive silica gel flaggy.
First heat dissipating layer of described device layer upper end is provided with device aperture.
Described second heat dissipating layer adopts Alumina Foam structure, and aperture is 20-300ppi.
Described first heat dissipating layer and the second heat dissipating layer adopt buckling groove 7 to be connected.
After adopting said structure, the utility model beneficial effect is: its employing of the utility model is provided with the heat dissipating layer of coated device layer in circuit layer upper end, by double-deck heat dissipating layer, while can reaching quick heat radiating, greatly reduce the air plankton of device surface, improve useful life, and it has easy to use, simple to operate, structure is simple, the features such as practicality is good.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Description of reference numerals:
1, circuit board; 2 circuit layers; 3, device layer; 4, the first heat dissipating layer; 5, the second heat dissipating layer; 6, device aperture; 7, buckling groove.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1, a kind of sealed heat-dissipating formula circuit board described in the utility model, comprise circuit board 1, described circuit board 1 upper surface is provided with circuit layer 2, described circuit board 1 upper end is connected to device layer 3, described circuit layer 2 surface is connected with the first heat dissipating layer 4, and in device layer 3 is wrapped in by described first heat dissipating layer 4, described first heat dissipating layer 4 upper end is provided with the second heat dissipating layer 5.
Described first heat dissipating layer 4 adopts heat conductive silica gel flaggy.
First heat dissipating layer 4 of described device layer 3 upper end is provided with device aperture 6.
Described second heat dissipating layer 5 adopts Alumina Foam structure, and aperture is 20-300ppi.
Described first heat dissipating layer 4 adopts buckling groove 7 to be connected with the second heat dissipating layer 5.
Its employing of the utility model is provided with the heat dissipating layer of coated device layer in circuit layer upper end, by double-deck heat dissipating layer, while can quick heat radiating being reached, greatly reduce the air plankton of device surface, improve useful life, and it has easy to use, simple to operate, structure is simple, the features such as practicality is good.
The utility model adopts heat conductive silica gel flaggy at the first heat dissipating layer, while reaching sealing, can utilize the high-termal conductivity of material itself, can reach the effect of quick transferring heat; At device layer, place is provided with device aperture, is convenient to replacing during components and parts fault, improves overall can continuity using; Second heat dissipating layer adopts foaming structure, can greatly increase its radiating effect, and the aperture of 20-300ppi has relatively high radiating effect simultaneously, and its effect is greater than the radiating effect in below 200ppi or more than 300ppi aperture; Adopt buckling groove to be connected with the second heat dissipating layer by the first heat dissipating layer, substantially increase detachability and the convertibility of device heat dissipating layer, improve its practical value, the setting of buckling groove simultaneously also contributes to the replacing of components and parts.
The above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Claims (5)
1. a sealed heat-dissipating formula circuit board, it is characterized in that: it comprises circuit board (1), described circuit board (1) upper surface is provided with circuit layer (2), described circuit board (1) upper end is connected to device layer (3), described circuit layer (2) surface is connected with the first heat dissipating layer (4), device layer (3) wraps up by described first heat dissipating layer (4), and described first heat dissipating layer (4) upper end is provided with the second heat dissipating layer (5).
2. a kind of sealed heat-dissipating formula circuit board according to claim 1, is characterized in that: described first heat dissipating layer (4) adopts heat conductive silica gel flaggy.
3. a kind of sealed heat-dissipating formula circuit board according to claim 1, is characterized in that: first heat dissipating layer (4) of described device layer (3) upper end is provided with device aperture (6).
4. a kind of sealed heat-dissipating formula circuit board according to claim 1, is characterized in that: described second heat dissipating layer (5) adopts Alumina Foam structure, and aperture is 20-300ppi.
5. a kind of sealed heat-dissipating formula circuit board according to claim 1, is characterized in that: described first heat dissipating layer (4) and the second heat dissipating layer (5) adopt buckling groove (7) to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520572756.3U CN204887677U (en) | 2015-07-31 | 2015-07-31 | Sealed heat dissipation formula circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520572756.3U CN204887677U (en) | 2015-07-31 | 2015-07-31 | Sealed heat dissipation formula circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204887677U true CN204887677U (en) | 2015-12-16 |
Family
ID=54831994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520572756.3U Expired - Fee Related CN204887677U (en) | 2015-07-31 | 2015-07-31 | Sealed heat dissipation formula circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204887677U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
-
2015
- 2015-07-31 CN CN201520572756.3U patent/CN204887677U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455299A (en) * | 2016-10-31 | 2017-02-22 | 张昊辰 | Heat dissipation type double-layer PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20170731 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |