CN113079635A

CN113079635A - High-frequency high-speed PCB for 5G base station and manufacturing method thereof

Info

Publication number: CN113079635A
Application number: CN202110256298.2A
Authority: CN
Inventors: 杨兴德
Original assignee: Ganzhou Xin Lian Xing Technology Co ltd
Current assignee: Ganzhou Xin Lian Xing Technology Co ltd
Priority date: 2021-03-09
Filing date: 2021-03-09
Publication date: 2021-07-06
Anticipated expiration: 2041-03-09
Also published as: CN113079635B

Abstract

The invention discloses a high-frequency and high-speed PCB for a 5G base station, which comprises a combined PCB main body, a power consumption element and a heat conduction part, wherein the combined PCB main body comprises a plurality of inner core plates which are mutually stacked, and a heat dissipation layer which is arranged between the inner core plates and is used for improving the heat dissipation performance of the inner core plates. The power consumption component is arranged on the surface of the combined PCB body, and a heat conduction hole is formed in the combined PCB body at the position of the power consumption component. The heat conducting part is embedded in the heat conducting hole. Through the PCB board with single-deck inlayer core and heat dissipation lamination synthesis multilayer, improve the frequency of PCB board, and adopt interbedded heat dissipation layer to dispel the heat to inlayer core, set up the heat conduction hole and imbed the heat-conducting part in the combined PCB main part of consumption component below simultaneously, the heat that gives off the consumption component during operation through the heat-conducting part conducts and gives off, improve the heat dispersion of PCB board, and then can make the heat dispersion of PCB board better when satisfying the function of PCB board again, and then improve the life of PCB board.

Description

High-frequency high-speed PCB for 5G base station and manufacturing method thereof

Technical Field

The invention relates to the field of PCBs, in particular to a high-frequency and high-speed PCB for a 5G base station and a manufacturing method thereof.

Background

The PCB is also called a printed circuit board, and is an important electronic component, which is a support for electronic components and a carrier for electrical interconnection of the electronic components. It is called a "printed" circuit board because it is made using electronic printing. The current PCB board mainly adopts single-layer structure, but the individual layer PCB board frequency is lower, can't satisfy the fast-speed requirement of present 5G basic station high frequency, consequently in order to realize making the purpose of the high-speed function of PCB board arrival high frequency, prior art adopts the PCB board composition multilayer with original individual layer usually, and then improve the function of PCB board, but also make multilayer structure's PCB board heat-sinking capability relatively poor when improving the PCB board function, the temperature is higher when leading to PCB board work, damage the component on the PCB board easily and reduce the life of PCB board.

Disclosure of Invention

The invention aims to provide a high-frequency and high-speed PCB for a 5G base station, which is used for solving the technical problems that the existing multilayer PCB is poor in heat dissipation effect, so that elements on the PCB are easy to damage and the service life of the PCB is short.

In order to achieve the purpose, the invention adopts the technical scheme that: provided is a high-frequency high-speed PCB board for a 5G base station, comprising:

the combined PCB comprises a combined PCB body and a heat dissipation layer, wherein the combined PCB body comprises a plurality of inner core plates which are stacked mutually, and the heat dissipation layer is arranged between the inner core plates and used for improving the heat dissipation performance of the inner core plates;

the power consumption element is arranged on the surface of the combined PCB body and is electrically connected with the combined PCB body, and a heat conduction hole is formed in the combined PCB body at the position of the power consumption element and penetrates through the combined PCB body;

the heat conduction part is embedded in the heat conduction hole and used for conducting and radiating heat generated by the power consumption element quickly.

In one embodiment, a plurality of heat dissipation holes are disposed on the combined PCB body at positions close to the power dissipation elements, the heat dissipation holes penetrating through the combined PCB body, and the heat dissipation holes are used for improving heat dissipation capability of a heat dissipation layer inside the combined PCB body.

In one embodiment, the heat conducting portion includes:

the heat conduction block is embedded in the heat conduction hole;

the hot-pressing reciprocating structure is arranged in the heat conducting block, the moving directions of the hot-pressing reciprocating structure are the same, and the hot-pressing reciprocating structure spontaneously reciprocates under the action of the internal heat of the heat conducting block;

the heat dissipation piston part is arranged in the heat conduction block, one end of the heat dissipation piston part is in contact with the power dissipation element, and the heat dissipation piston part is connected with the hot-pressing reciprocating motion structure through a connecting rod, so that the heat dissipation piston part does reciprocating motion under the driving of the hot-pressing reciprocating motion structure, and the air flow circulation speed of the power dissipation element and the contact surface of the heat dissipation piston part is further improved.

In one embodiment, the heat conducting block comprises a large end and a small end, the small end of the heat conducting block is in contact with the power consumption element, and the large end is used for conducting and dissipating heat absorbed by the small end on the power consumption element;

the hot-pressing reciprocating structure is arranged in the small end of the heat conducting block.

In one embodiment, the hot press reciprocating structure includes:

a first piston chamber disposed within the heat conduction block;

the first piston is in sliding fit with the first piston cavity, the first piston divides the first piston cavity into two mutually independent cavities, and a first pressure relief hole communicated with the outside is formed in the side surface of the cavity far away from the power consumption element;

one end of the first elastic piece is connected with the inner wall of the first piston chamber close to the power consumption element, and the other end of the first elastic piece is connected with the end part of the first piston;

one end of the first piston rod is connected with the first piston, the other end of the first piston rod penetrates through one end, far away from the power consumption element, of the first piston chamber, and the first piston rod is connected with the radiating piston portion through a connecting rod.

In one embodiment, the first piston comprises:

the side surface of the first main piston is in sliding fit with the inner wall of the first piston chamber, one end of the first main piston is connected with the first piston rod, a groove is formed in one side, far away from the first piston rod, of the first main piston, a second pressure relief hole is formed in the first main piston, and the second pressure relief hole penetrates through the first main piston;

the first auxiliary piston is arranged on one side, far away from the first piston rod, of the first main piston, one side of the first auxiliary piston is connected with the first elastic piece, the other side of the first auxiliary piston covers the second pressure relief hole, and the first main piston is connected with the first auxiliary piston through the second elastic piece.

In one embodiment, the heat-dissipating piston portion includes:

the second piston chamber is arranged in the heat conduction block, and one end of the second piston chamber penetrates through the surface, in contact with the power consumption element, of the heat conduction block;

a second piston slidably engaged within the second piston chamber, the second piston dividing the second piston chamber into two portions;

and one end of the second piston rod is connected with the second piston, and the other end of the second piston rod penetrates through the second piston chamber and is connected with the hot-pressing reciprocating structure through a connecting rod.

In one embodiment, a plurality of metal heat conduction columns are arranged on the contact surface of the heat conduction block and the power consumption element, and gaps exist among the metal heat conduction columns, so that when the second piston in the heat dissipation piston part moves, external air can enter the second piston cavity through the gaps among the power consumption element and the heat conduction block more easily, and the gas circulation speed of the power consumption element close to the heat conduction block surface is further improved.

In one embodiment, a communicating air passage is arranged inside the heat conducting block, one end of the communicating air passage is communicated with the second piston chamber, and the other end of the communicating air passage is communicated with the heat dissipation layer;

the heat dissipation layer is internally provided with criss-cross heat dissipation channels, and the heat dissipation channels are communicated with the communication air passage, so that gas in the second piston cavity is introduced into the heat dissipation layer, and the heat dissipation performance of the heat dissipation layer is improved.

Another object of the present invention is to provide a method for manufacturing a PCB, which is used to manufacture the high-frequency and high-speed PCB for a 5G base station according to any of the above embodiments, and the method for manufacturing the PCB includes the following steps:

s1, manufacturing an inner core plate, a heat dissipation layer and a heat conduction part;

s2, forming heat conduction holes in corresponding positions of the inner-layer core plate and the heat dissipation layer;

s3, alternately stacking the inner core boards with the heat conduction holes and the heat dissipation layers, and adding prepregs on contact surfaces of the inner core boards and the heat dissipation layers;

s4, laminating the stacked inner core boards and the heat dissipation layer to manufacture a combined PCB main body;

s5, assembling the heat conducting part into the heat conducting hole;

s6, installing power consumption elements on the combined PCB body around the heat conducting part, and enabling the power consumption elements to be in contact with the heat conducting part;

and S7, detecting the function and the heat dissipation performance of the assembled PCB.

One or more technical solutions described above in the embodiments of the present invention have at least the following technical effects or advantages:

the high-frequency and high-speed PCB for the 5G base station comprises a combined PCB main body, power consumption elements and a heat conducting part, wherein the combined PCB main body comprises a plurality of inner-layer core boards which are mutually stacked, and a heat dissipation layer which is arranged between the inner-layer core boards and used for improving the heat dissipation performance of the inner-layer core boards. The power consumption component is arranged on the surface of the combined PCB body and is electrically connected with the combined PCB body, and the combined PCB body at the position of the power consumption component is provided with a heat conduction hole which penetrates through the combined PCB body. The heat conduction portion is embedded in the heat conduction hole and used for conducting heat generated by the power consumption element fast and dissipating the heat. Through laminating into multilayer PCB board with individual layer inlayer core and heat dissipation, improve the frequency of PCB board, and adopt interbedded heat dissipation layer to dispel the heat to inlayer core, set up the heat conduction hole and imbed the heat-conducting part in the combined PCB main part of consumption component below simultaneously, the heat that the consumption component during operation gived off is conducted and is gived through the heat-conducting part, improve the heat dispersion of PCB board, and then can make the heat dispersion of PCB board better when satisfying the function of PCB board (high-frequency high reaction rate), avoid the PCB board when long-time work, lead to the PCB board impaired because of the heat dissipation problem, and then improve the life of PCB board.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a high-frequency and high-speed PCB board for a 5G base station according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a high-frequency high-speed PCB for a 5G base station when a piston in a hot-press reciprocating structure moves to a position farthest from a power consumption element according to an embodiment of the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 1 at A;

FIG. 4 is an enlarged partial view taken at B in FIG. 1;

FIG. 5 is a schematic structural view of the first piston when the first elastic member pulls the first piston to retract;

fig. 6 is a schematic structural diagram of a heat dissipation layer according to an embodiment of the invention.

Wherein, in the figures, the respective reference numerals:

1. a combined PCB body; 2. a power consumption element; 3. a heat conducting portion; 11. an inner core; 12. a heat dissipation layer; 13. heat dissipation holes; 31. a heat conducting block; 32. a hot-pressing reciprocating structure; 33. a heat dissipation piston portion; 34. a connecting rod; 35. a metal heat-conducting post; 121. a foam metal layer; 122. a heat dissipation channel; 123. a thermally conductive copper sheet; 311. is communicated with an air passage; 321. a first piston chamber; 322. a first piston; 323. a first elastic member; 324. a first piston rod; 331. a second piston chamber; 332. a second piston; 333. a second piston rod; 3211. a first pressure relief vent; 3221. a first master piston; 3222. a first secondary piston; 3223. a second elastic member; 32211. a second pressure relief vent.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1 to 2, an embodiment of the present invention provides a high-frequency and high-speed PCB for a 5G base station, which includes a combined PCB body 1, a power dissipation element 2, and a heat conduction portion 3, wherein the combined PCB body 1 includes a plurality of inner core boards stacked on each other, and a heat dissipation layer 12 disposed between the inner core boards 11 for improving heat dissipation performance of the inner core boards. The power consumption component 2 is arranged on the surface of the combined PCB body 1, the power consumption component 2 is electrically connected with the combined PCB body 1, a heat conduction hole is formed in the combined PCB body 1 at the position of the power consumption component 2, and the heat conduction hole penetrates through the combined PCB body 1. The heat conduction part 3 is embedded in the heat conduction hole, and the heat conduction part 3 is used for conducting heat generated by the power consumption element 2 quickly and dissipating the heat. Through pressing into multilayer PCB board with individual layer inlayer core 11 and heat dissipation layer 12, improve the frequency of PCB board, and adopt interbedded heat dissipation layer 12 to dispel the heat to inlayer core 11, set up the heat conduction hole and imbed conducting portion 3 on combined PCB main part 1 of consumption component 2 below simultaneously, the heat that gives off when consumption component 2 during operation is conducted through conducting portion 3 and is given off, improve the heat dispersion of PCB board, and then can make the heat dispersion of PCB board better when satisfying the function (high-frequency high reaction rate) of PCB board, avoid the PCB board when long-time during operation, lead to the PCB board impaired because of the heat dissipation problem, and then improve the life of PCB board.

In one embodiment, a plurality of heat dissipation holes 13 are formed on the combined PCB body 1 at positions close to the power consumption components 2, the heat dissipation holes 13 penetrate the combined PCB body 1, and the heat dissipation holes 13 are used for improving the heat dissipation capability of the heat dissipation layer 12 inside the combined PCB body 1. The inner wall of the heat dissipation hole 13 is coated with a heat dissipation coating, so that heat in the heat dissipation layer 12 can be better conducted to the heat dissipation hole 13, and the heat is conducted and dissipated to the surrounding environment through the heat dissipation hole 13, thereby improving the heat dissipation capability of the heat dissipation layer 12 and further improving the heat dissipation capability of the PCB.

In one embodiment, the heat conducting portion 3 includes a heat conducting block 31, a plurality of hot press reciprocating structures 32, and a heat dissipating piston portion 33. Wherein, the heat conduction block 31 is embedded in the heat conduction hole, and the heat conduction block 31 is used for conducting and dispersing the heat generated by the power consumption element 2 during operation, so as to avoid the power consumption element 2 gathering heat. The hot pressing cycle reciprocating structure is arranged inside the heat conducting block 31, the moving direction of the hot pressing reciprocating structure 32 is the same, the hot pressing reciprocating structure 32 automatically reciprocates under the effect of the internal heat of the heat conducting block 31, and the heat generated when the power consumption element 2 works is adopted by the hot pressing cycle reciprocating structure, so that the air inside the hot pressing cycle reciprocating structure expands, and further the heat dissipation piston part 33 moves. The heat dissipation piston part 33 is disposed in the heat conduction block 31, and one end of the heat dissipation piston part 33 contacts with the power dissipation element 2, the heat dissipation piston part 33 is connected with the hot-pressing reciprocating structure 32 through the connection rod 34, so that the heat dissipation piston part 33 also reciprocates under the driving of the hot-pressing reciprocating structure 32, the heat dissipation piston part 33 moves, so that the gas inside the heat dissipation piston part 33 enters and exits through the contact surface between the high-power-consumption element 2 and the heat dissipation piston part 33, thereby increasing the air flow speed on the contact surface between the power dissipation element 2 and the heat dissipation piston part 33, increasing the air flow speed can improve the ability of convective heat transfer, and further enhancing the heat dissipation ability of the power dissipation element 2.

Further, heat conduction portion 3 is still including setting up heat dissipation layer 12 keeping away from power consumption component 2 one end, and heat dissipation layer 12 adopts foam metal material to make (like foam aluminium foam magnesium etc.), improves the area of contact of heat dissipation layer 12 and outside air, and then improves the heat-sinking capability of heat dissipation layer 12, and then makes heat conduction piece 31 can be faster absorb the heat on power consumption component 2, improves the heat-sinking capability of PCB board.

In one embodiment, the heat conduction block 31 includes a large end and a small end, the small end of the heat conduction block 31 is in contact with the power consumption element 2, and the large end is used for conducting and dissipating heat absorbed by the small end on the power consumption element 2. The size of tip is close to consumption component 2's size, and with through setting heat conduction piece 31 to the structure that the big one end of one end is little, make when the tip of heat conduction piece 31 absorb the heat from consumption component 2 after, the area and the volume of the big end of heat conduction piece 31 all are greater than the tip of heat conduction piece 31, make the heat in the heat conduction piece 31 can be quick conduct and give off by the big end of heat conduction piece 31, guarantee heat conduction block 31's heat conduction effect. The hot press reciprocating structure 32 is disposed in the small end of the heat conducting block 31. Because the small end of the heat conducting block 31 is close to the power consumption element 2, the temperature of the small end of the heat conducting block 31 is higher than that of the large end of the heat conducting block 31, and the higher temperature is favorable for expanding the gas inside the hot-pressing reciprocating motion structure 32, so that the motion speed of the hot-pressing reciprocating motion structure 32 is improved, the motion speed of the radiating piston part 33 is further improved (the hot-pressing reciprocating motion structure 32 is connected with the radiating piston part 33), and the radiating and cooling capacity of the radiating piston part 33 is further improved.

Referring to fig. 1 or fig. 2, in one embodiment, the thermal reciprocating structure 32 includes a first piston chamber 321, a first piston 322, a first elastic element 323, and a first piston rod 324. The first piston chamber 321 is disposed inside the heat conducting block 31. It is preferred that the first piston chamber 321 is close to the power consuming element 2 such that the first piston chamber 321 is at a higher temperature (the heat in the heat conducting block 31 mainly originates from the power consuming element 2), thereby causing the gas in the first piston chamber 321 to expand more quickly. The first piston 322 is slidably fitted in the first piston chamber 321, and the first piston 322 divides the first piston chamber 321 into two independent chambers, wherein the chamber adjacent to the power consuming element 2 is a sealed chamber. A side surface of the first piston chamber 321 away from the power consumption element 2 is provided with a first pressure relief hole 3211 communicating with the outside, and one end of the first pressure relief hole 3211 communicates with the first piston chamber 321 and the other end communicates with the outside air. One end of the first elastic member 323 is connected to the inner wall of the first piston chamber 321 near the power consumption element 2, and the other end of the first elastic member 323 is connected to the end of the first piston 322, wherein the first elastic member 323 may be a spring, an elastic sheet, or other elastic structure. One end of the first piston rod 324 is connected to the first piston 322, the other end of the first piston rod 324 penetrates through one end of the first piston chamber 321 far away from the power consumption element 2, and the first piston rod 324 is connected to the heat dissipation piston portion 33 through the connecting rod 34.

When the PCB operates, the power consumption component 2 starts to generate heat, the heat is transferred to the heat conducting block 31, so that the temperature of the gas in the first piston chamber 321 rises, the gas in the first piston chamber 321 expands, and the gas pressure in the first piston chamber 321 increases and is greater than the external gas pressure, so that the first piston 322 slides in the direction away from the power consumption component 2 by overcoming the first elastic component 323 under the action of the pressure difference, the first piston 322 moves and drives the first piston rod 324 to move, the first piston rod 324 is connected with the heat dissipation piston part 33 through the connecting rod 34, and the heat dissipation piston part 33 moves along with the movement of the first piston rod 324. When the gas in the first piston chamber 321 continues to expand to cause the first piston 322 to move to the position of the first pressure relief hole 3211 (as shown in fig. 2), the first pressure relief hole 3211 communicates with the high pressure end in the first piston chamber 321, so that the high pressure gas in the first piston chamber 321 is discharged through the first pressure relief hole 3211, so that the gas in the first piston chamber 321 decreases to normal pressure, and then the first piston 322 moves toward the direction close to the power consumption element 2 under the action of the elastic force of the first elastic member 323, until the elastic force applied to the first piston 322 by the first elastic member 323 gradually decreases, the first piston stops moving and completes one reciprocating motion, and then the gas in the first piston chamber 321 expands again and repeats the above motion under the action of the heat given by the heat conduction block 31, so that the first piston rod 324 drives the heat dissipation piston portion 33 to perform a reciprocating linear motion.

Referring to fig. 4 or 5, in one embodiment, the first piston 322 includes a first main piston 3221 and a first sub-piston 3222. The side surface of the first main piston 3221 is slidably fitted on the inner wall of the first piston chamber 321, one end of the first main piston 3221 is connected to the first piston rod 324, a groove is formed on one side of the first main piston 3221 away from the first piston rod 324, a second pressure relief hole 32211 is formed in the first main piston 3221, and the second pressure relief hole 32211 penetrates through the first main piston 3221. The first sub-piston 3222 is disposed on a side of the first main piston 3221 away from the first piston rod 324, one side of the first sub-piston 3222 is connected to the first elastic member 323, the other side of the first sub-piston 3222 covers the second pressure relief hole 32211, and the first main piston 3221 is connected to the first sub-piston 3222 through the second elastic member 3223.

When the first piston 322 is under the push of the high pressure gas to move toward a direction away from the power consumption element 2, the first piston 322 is in the state shown in fig. 4, the pressure of the high-pressure gas mainly acts on the first sub-piston 3222, and the pressure is transmitted to the first main piston 3221 by the first sub-piston 3222, at this time, the second elastic member 3223 (an elastic member such as a spring or an elastic sheet) is in a stretched state, so that under the elastic force of the second elastic member 3223 and the pressure of the high-pressure gas in the first piston chamber 321, the first sub-piston 3222 is in close contact with the first main piston 3221, resulting in the second pressure relief hole 32211 being in a sealed state, so that the first piston chamber 321 between the first piston 322 and the power consumption element 2 is in a sealed state, so that the pressure of the air in the chamber can be kept high without leakage, thereby ensuring that the first piston 322 is movable under the pressure of the gas pressure in a direction away from the power consuming element 2.

When the first piston 322 moves to the first pressure relief hole 3211 and pressure relief is completed, the first piston 322 moves toward the power consumption element 2 by the elastic force of the first elastic member 323, and is in a state as shown in fig. 5. Because the air pressure in the first piston chamber 321 is lower at this time, under the action of the elastic force of the first elastic member 323, the first elastic member 323 pulls the first sub-piston 3222, the first sub-piston 3222 transmits the elastic force to the first main piston 3221 through the second elastic member 3223, because there is gas in the first piston chamber 321 (the section between the first piston 322 and the power consumption element 2) at this time, the first piston 322 is blocked by the air pressure during the movement, and there is a gap between the first sub-piston 3222 and the first main piston 3221 at this time, so that the gas in the first piston chamber 321 can be discharged through the second pressure relief hole 32211, thereby preventing the air pressure from blocking the first piston 322 from moving toward the power consumption element 2, and further making the movement amplitude of the first piston 322 larger, and further improving the movement amplitude of the heat dissipation piston portion 33, and further improving the heat dissipation performance of the heat dissipation piston portion 33, and further improve the heat dispersion of the PCB.

Referring to fig. 1 or fig. 2, in one embodiment, the heat dissipation piston portion 33 includes a second piston chamber 331, a second piston 332, and a second piston rod 333. The second piston chamber 331 is disposed inside the heat conduction block 31, and one end of the second piston chamber 331 penetrates a surface of the heat conduction block 31 that contacts the power consumption element 2. The second piston 332 is slidably fitted within the second piston chamber 331, and the second piston 332 divides the second piston chamber 331 into two portions. One end of the second piston rod 333 is connected to the second piston 332, and the other end of the second piston rod 333 passes through the second piston chamber 331 and is connected to the hot press reciprocating structure 32 through the connecting rod 34. Under the driving of the hot-pressing reciprocating structure 32, the second piston rod 333 drives the second piston 332 to reciprocate, and meanwhile, the second piston 332 moves to enable the gas in the second piston chamber 331 to enter and exit the second piston chamber 331 along the gap between the power consumption element 2 and the heat conducting block 31 due to the change of the chamber space, so that the gas flow rate on the surface of the power consumption element 2 is improved, the heat on the power consumption element 2 can be taken away by the gas more quickly, and the heat dissipation capacity of the PCB board is improved.

In one embodiment, a plurality of metal heat-conducting pillars 35 are disposed on a contact surface of the heat-conducting block 31 and the power dissipation element 2, and gaps exist between the metal heat-conducting pillars 35, so that when the second piston 332 in the heat-dissipation piston portion 33 moves, external air can enter the second piston chamber 331 more easily through the gaps between the power dissipation element 2 and the heat-conducting block 31, and further, the air circulation speed on the surface of the power dissipation element 2 close to the heat-conducting block 31 is increased. The metal heat-conducting pillar 35 can transfer heat from the power consumption component 2 to the heat-conducting block 31, so as to reduce heat in the power consumption component 2.

In one embodiment, the heat conducting block 31 is provided therein with a communicating air passage 311, one end of the communicating air passage 311 communicates with the second piston chamber 331, and the other end of the communicating air passage 311 communicates with the heat dissipation layer 12. The heat dissipation layer 12 comprises a foam metal layer 121 inside, the surface of the heat dissipation layer 12 is covered with a heat conduction copper sheet 123, a criss-cross heat dissipation channel 122 is further arranged inside the heat dissipation layer 12, and the heat dissipation channel 122 is communicated with a communication air passage 311, so that gas in the second piston cavity 331 is introduced into the heat dissipation layer 12, and the heat dissipation performance of the heat dissipation layer 12 is improved. When the hot-pressing reciprocating structure 32 drives the heat dissipation piston portion 33, the gas in the cavity of the second piston 332 can be discharged into the heat dissipation layer 12 through the communication air passage 311, so that the flow rate of the gas in the heat dissipation channel 122 inside the heat dissipation layer 12 is increased, the heat dissipation effect of the heat dissipation layer 12 is further improved, and the heat dissipation capacity of the PCB is further improved.

The embodiment of the application also provides a manufacturing method for manufacturing the PCB, which is used for manufacturing the high-frequency and high-speed PCB for the 5G base station in any one of the embodiments, and the manufacturing method for manufacturing the PCB comprises the following steps:

s1, manufacturing an inner core board, a heat dissipation layer 12 and a heat conduction part 3;

s2, forming heat conduction holes at corresponding positions of the inner-layer core plate and the heat dissipation layer 12;

s3, alternately stacking the inner core boards with the heat conduction holes and the heat dissipation layers 12, and adding prepregs on contact surfaces of the inner core boards and the heat dissipation layers 12;

s4, laminating the stacked inner core boards and the heat dissipation layer 12 to manufacture the combined PCB body 1;

s5, assembling the heat conducting part 3 into the heat conducting hole;

s6, mounting the power consumption element 2 on the combined PCB body 1 around the heat conduction part 3, and contacting the power consumption element 2 with the heat conduction part 3;

The PCB manufactured by the method can meet the high-frequency and high-speed requirements of the 5G base station, and meanwhile can ensure the heat dissipation performance of the PCB, so that the phenomenon that the high-frequency and high-speed PCB for the 5G base station is heated and damaged after long-time work is avoided, and the service life of the PCB is further prolonged.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-frequency high-speed PCB board for a 5G base station is characterized by comprising:

2. The high-frequency high-speed PCB board for the 5G base station according to claim 1, wherein:

the combined PCB comprises a combined PCB body and a plurality of radiating holes, wherein the combined PCB body is provided with a plurality of radiating holes at positions close to the power consumption elements, the radiating holes penetrate through the combined PCB body, and the radiating holes are used for improving the radiating capacity of a radiating layer inside the combined PCB body.

3. The high-frequency high-speed PCB board for the 5G base station as claimed in claim 1, wherein the heat conducting part comprises:

the heat conduction block is embedded in the heat conduction hole;

4. The high-frequency high-speed PCB board for the 5G base station according to claim 3, wherein:

the heat conducting block comprises a large end and a small end, the small end of the heat conducting block is in contact with the power consumption element, and the large end is used for conducting and dissipating heat absorbed by the small end on the power consumption element;

5. The high-frequency high-speed PCB board for the 5G base station as claimed in claim 3, wherein the hot-press reciprocating structure comprises:

a first piston chamber disposed within the heat conduction block;

the first piston is in sliding fit with the first piston cavity, the first piston divides the first piston cavity into two mutually independent cavities, and the side surface of the first piston cavity, which is far away from the power consumption element, is provided with a first pressure relief hole communicated with the outside;

6. A high-frequency high-speed PCB board for a 5G base station according to claim 5, wherein the first piston comprises:

7. A high-frequency high-speed PCB board for a 5G base station according to claim 3, wherein the heat-dissipating piston portion comprises:

8. The high-frequency high-speed PCB board for the 5G base station according to claim 7, wherein:

the heat-conducting block is provided with a plurality of metal heat-conducting columns on the contact surface with the power consumption element, and gaps exist among the metal heat-conducting columns, so that when a second piston in the heat-radiating piston part moves, external air can enter a second piston cavity more easily through the power consumption element and the gaps among the heat-conducting blocks, and the gas circulation speed of the power consumption element close to the surface of the heat-conducting block is further improved.

9. The high-frequency high-speed PCB board for the 5G base station according to claim 7, wherein:

a communicating air passage is arranged in the heat conducting block, one end of the communicating air passage is communicated with the second piston chamber, and the other end of the communicating air passage is communicated with the heat dissipation layer;

10. A method for manufacturing a PCB, which is used for manufacturing the high-frequency and high-speed PCB for the 5G base station as claimed in any one of claims 1 to 9, wherein the method for manufacturing the PCB comprises the following steps:

s5, assembling the heat conducting part into the heat conducting hole;