CN210609861U - Battery protection board with trapezoidal etching structure - Google Patents
Battery protection board with trapezoidal etching structure Download PDFInfo
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- CN210609861U CN210609861U CN201921241603.5U CN201921241603U CN210609861U CN 210609861 U CN210609861 U CN 210609861U CN 201921241603 U CN201921241603 U CN 201921241603U CN 210609861 U CN210609861 U CN 210609861U
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Abstract
The utility model discloses a battery protection shield with trapezoidal etching structure belongs to circuit board technical field. The battery protection board comprises a substrate layer and a copper foil layer connected with the substrate layer, wherein an etching line is formed in the copper foil layer, a plurality of transmission copper wires are arranged in the etching line, and the cross section of each transmission copper wire is trapezoidal; the thickness of the copper foil layer is a first thickness, a second thickness or a third thickness; the first thickness is 1-30 μm, the second thickness is 30-38 μm, and the third thickness is 38-48 μm; the distance between the lower bottom surfaces of the adjacent transmission copper wires is a line distance, the line distance comprises a basic line distance, and the line distance is greater than or equal to the basic line distance; when the thickness of the copper foil layer is the first thickness, the basic line distance is 0.05 mm; when the thickness of the copper foil layer is the second thickness, the basic line distance is 0.06 mm; when the thickness of the copper foil layer is the third thickness, the basic pitch is 0.07 mm. The utility model discloses can improve the internal resistance stability of battery protection shield, can promote the wainscot effect that covers the membrane.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a battery protection shield with trapezoidal etching structure.
Background
At present, for a chargeable and dischargeable battery (such as a lithium battery), overshoot protection, over-discharge protection, over-current protection and short-circuit protection need to be performed on the battery through an integrated circuit board, namely a battery protection board, the battery protection board is one of core components of the chargeable and dischargeable battery, and the stability of internal resistance is an important quality index of the battery protection board.
From the sheet material, the battery protection board can be divided into a hard board (PCB) and a flexible board (FPC), wherein the flexible battery protection board is a printed circuit having reliability and good flexibility, which is manufactured by forming a circuit on a copper foil by etching using a polyester film or polyimide as a base material.
However, the conventional etching structure of the battery protection plate has the following defects: the etching effect is unstable, and the internal resistance of the circuit is unstable.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a battery protection board with a trapezoidal etching structure, which can improve the stability of internal resistance.
The purpose of the utility model is realized by adopting the following technical scheme:
a battery protection board with a trapezoid etching structure comprises a substrate layer and a copper foil layer connected with the substrate layer, wherein an etching line is formed in the copper foil layer, a plurality of transmission copper wires are arranged in the etching line, and the cross section of each transmission copper wire is trapezoid; the lower bottom surface of the transmission copper wire is connected with the substrate layer, and the lower bottom surface of the transmission copper wire is larger than the upper bottom surface of the transmission copper wire;
the thickness of the copper foil layer is a first thickness, a second thickness or a third thickness; the first thickness is 1-30 μm, the second thickness is 30-38 μm, and the third thickness is 38-48 μm; the distance between the lower bottom surfaces of the adjacent transmission copper wires is a line distance, the line distance comprises a basic line distance, and the line distance is greater than or equal to the basic line distance;
when the thickness of the copper foil layer is the first thickness, the basic line distance is 0.05 mm; when the thickness of the copper foil layer is the second thickness, the basic line distance is 0.06 mm; when the thickness of the copper foil layer is the third thickness, the basic line distance is 0.07 mm.
Further, the etched line of the battery protection board has a dense line region when the line width is 0.01mm-0.1mm and/or the line distance is 0.01mm-0.1 mm;
the line spacing within the dense line region is configured to: the device also comprises a dense line compensation space, wherein the dense line compensation space is larger than or equal to 0.02 mm.
Further, when the thickness of the copper foil layer is a first thickness, the dense line compensation interval is 0.02 mm; when the thickness of the copper foil layer is a second thickness, the dense line compensation interval is 0.03 mm; when the thickness of the copper foil layer is a third thickness, the dense line compensation distance is 0.035 mm.
Further, the etched line of the battery protection board has a single-line region, and the line distance between the transmission copper line and the adjacent transmission copper line in the single-line region is greater than or equal to 5 mm;
a line pitch within the single wire region is configured to: the single-line compensation space is larger than or equal to 0.025 mm.
Further, when the thickness of the copper foil layer is a first thickness, the individual line compensation distance is 0.025 mm; when the thickness of the copper foil layer is a second thickness, the single line compensation distance is 0.035 mm; when the thickness of copper foil layer is the third thickness, individual line compensation interval is 0.045 mm.
Further, the etched wiring of the battery protection board has a BGA region;
the wire pitch within the BGA area is configured to: still include BGA compensation pitch, BGA compensation pitch is greater than or equal to 0.03 mm.
Further, when the thickness of the copper foil layer is a first thickness, the BGA compensation spacing is 0.03 mm; when the thickness of the copper foil layer is a second thickness, the BGA compensation spacing is 0.04 mm; when the thickness of copper foil layer is the third thickness, BGA compensation interval is 0.05 mm.
Further, the cross section of the transmission copper wire is isosceles trapezoid.
Further, the substrate layer is a PI layer, and the copper foil layer includes a bottom copper layer and a surface copper layer.
Further, still include the cover film, the copper foil layer is kept away from the one side of base plate layer and is covered with the cover film.
Compared with the prior art, the beneficial effects of the utility model reside in that: the internal resistance stability of the battery protection plate is improved, and the veneering effect of the covering film is improved.
Drawings
Fig. 1 is a battery protection plate with a trapezoidal etching structure according to the present invention;
FIG. 2 is a prior art etched structure on a battery protection plate;
in the figure: 10. a substrate layer; 20. a copper foil layer; 21. and (4) a transmission copper wire.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.
As shown in fig. 1, the present embodiment provides a battery protection plate with a trapezoid etching structure, the battery protection plate with a trapezoid etching structure includes a substrate layer 10, the substrate layer 10 in the present embodiment is a PI layer, and further includes a copper foil layer 20 connected to the substrate layer 10, the copper foil layer 20 in the present embodiment includes a bottom copper layer and a top copper layer, an etching line is formed in the copper foil layer 20, the etching line includes a plurality of transmission copper wires 21 etched by an etching process, and a cross section of the transmission copper wires 21 is in a trapezoid shape; the lower bottom surface of the transmission copper wire 21 is connected with the substrate layer 10, and the lower bottom surface of the transmission copper wire 21 is larger than the upper bottom surface of the transmission copper wire 21; in fig. 1, the substrate layer 10 has copper foil layers 20 on both sides, wherein the copper foil layer 20 is formed with an etching structure on one side and the etching structure is not formed on the other side;
the thickness of the copper foil layer 20 is a first thickness or a second thickness or a third thickness; the first thickness is 1-30 μm, the second thickness is 30-38 μm, and the third thickness is 38-48 μm; the distance between the lower bottom surfaces of the adjacent transmission copper wires 21 is a wire spacing S1, the wire spacing includes a basic wire spacing, and the wire spacing is greater than or equal to the basic wire spacing;
when the thickness of the copper foil layer 20 is the first thickness, the basic line pitch is 0.05 mm; when the thickness of the copper foil layer 20 is the second thickness, the basic line spacing is 0.06 mm; when the thickness of the copper foil layer 20 is the third thickness, the basic pitch is 0.07 mm.
Preferably, the cross section of the transmission copper wire 21 is an isosceles trapezoid.
Preferably, a covering film is further included, and the side of the copper foil layer 20 away from the substrate layer 10 is covered with the covering film.
On the basis of the structure, the etching structure (the transmission copper wire 21) with the trapezoidal structure has the advantages that the upper side of the etching structure is short, the lower side of the etching structure is long, and the side edge of the etching structure is gentle, so that when the circuit board is attached with the covering film, the covering film can be tightly and gently attached to the etching structure along the inclined surface, the attaching effect of the covering film is good, and meanwhile, the oil discharging effect during printing of an oil film is favorably improved.
Meanwhile, different basic line distances are set by matching the thicknesses of the copper foil layers 20, so that the stability of the internal resistance of the battery protection board can be ensured; as shown in fig. 1, the internal resistance of the panel refers to the internal resistance between transmission lines, and its influence factors include: copper conductivity (σ), line copper thickness (T1), line width (including lower width W1 and upper width W2), line length (L); and set up different basic line distances through the cooperation of different copper foil layer 20 thickness, can guarantee at the in-process of etching, effective control etching speed, guarantee that the side of the trapezoidal transmission copper line 21 structure that obtains after the etching is level and smooth, and side shape uniformity is high, can effectively avoid because basic line distance undersize leads to corroding the side tortuous (as shown in fig. 2) of the trapezoidal transmission copper line 21 structure that obtains, thereby can guarantee that the conductivity of copper is stable, thereby can avoid leading to the inconsistent problem of conductivity of transmission copper line 21 (as shown in fig. 2) because the etching effect is different, thereby guarantee the internal resistance stability of battery protection board.
On the basis of the structure, in order to avoid the problem that the etching effect of different areas is different due to the uneven arrangement requirement of the transmission copper wires 21, the line spacing comprises a basic spacing and a compensation spacing, and the compensation spacing is used for ensuring the stable etching effect.
When the arrangement requirement of the transmission copper wires 21 is close arrangement, the line spacing further includes a dense line compensation spacing, and the method is implemented specifically by the following steps:
preferably, the etched line of the battery protection plate has a dense line region defined as a region in which the line width/line distance is less than 0.1mm and the arrangement is dense, wherein, as shown in fig. 1, the line width may be a lower line width W2, or an average line width W ═ W1+ W2)/2.
The line spacing within the dense line region is configured to: the device also comprises a dense line compensation space, wherein the dense line compensation space is more than or equal to 0.02 mm.
Preferably, when the thickness of the copper foil layer 20 is the first thickness, the dense line compensation pitch is 0.02 mm; when the thickness of the copper foil layer 20 is the second thickness, the dense line compensation interval is 0.03 mm; when the thickness of the copper foil layer 20 is the third thickness, the dense line compensation pitch is 0.035 mm.
When the arrangement requirement of the transmission copper wires 21 is sparse, the circulation instability of the etching solution is larger, so the compensation distance further comprises an individual wire compensation distance, and the method is implemented by the following specific method:
preferably, the etched line of the battery protection plate has an independent line region, where the independent line region refers to a region without a line pattern within 5mm of three sides of the single transmission copper line 21, that is, when a line distance between the transmission copper line 21 and an adjacent transmission copper line 21 is greater than or equal to 5mm, the transmission copper line 21 is an independent line;
the line spacing within the individual line regions is configured to: the single-line compensation space is larger than or equal to 0.025 mm.
Preferably, when the thickness of the copper foil layer 20 is the first thickness, the individual line compensation pitch is 0.025 mm; when the thickness of the copper foil layer 20 is the second thickness, the single line compensation distance is 0.035 mm; when the thickness of the copper foil layer 20 is the third thickness, the individual line compensation pitch is 0.045 mm.
The compensation pitch also comprises the BGA compensation pitch due to the complex structure of the BGA packaging area, and the method is implemented in the following specific mode;
the compensation pitch comprises a BGA compensation pitch and is implemented by the following specific method:
preferably, the etched wiring of the battery protection board has a BGA region;
the wire pitch within the BGA area is configured to: the BGA compensation device further comprises a BGA compensation space, and the BGA compensation space is larger than or equal to 0.03 mm.
Preferably, when the thickness of the copper foil layer 20 is the first thickness, the BGA compensation pitch is 0.03 mm; when the thickness of the copper foil layer 20 is the second thickness, the BGA compensation spacing is 0.04 mm; when the thickness of the copper foil layer 20 is the third thickness, the BGA compensation pitch is 0.05 mm.
The line pitch configuration in this embodiment is shown in the following table:
the manufacturing process flow of the circuit board of the embodiment is as follows:
cutting → drying plate → drilling → black hole → electrocoppering → chemical cleaning → exposure → etching → internal resistance measurement → chemical cleaning → false paste → pressing → drying plate → punching → sandblasting → printing oil → exposure → developing → silk screen → curing → punching → electric measurement → sticking reinforcement → pressing → drying plate → gong plate → surface treatment → FQC → internal resistance measurement → warehousing.
In this embodiment, the etching method of the copper foil layer 20 includes attaching a dry film to the base material (the substrate layer 10 and the copper foil layer 20), exposing, and performing a DES (development-etching-stripping) process to form the conductive transmission copper wire 21 line, and the adjustment of the line pitch can be realized by adjusting the exposure position.
In the specific implementation process of the embodiment, a CCD integrated full-automatic exposure machine is adopted to carry out high-precision graphic alignment, the alignment precision reaches 0.05mm, and the automatic cleaning can be realized; high efficiency and high yield; the line width measurement technology of high-precision line width measurement, accurate focusing, automatic edge finding and sub-pixel algorithm is adopted, the accuracy and the rapidness are realized, and the error is less than 0.5 percent
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.
Claims (10)
1. The utility model provides a battery protection shield with trapezoidal etching structure, includes the base plate layer, still includes the copper foil layer that the base plate layer is connected, its characterized in that:
an etching line is formed in the copper foil layer, a plurality of transmission copper wires are arranged in the etching line, and the cross section of each transmission copper wire is trapezoidal; the lower bottom surface of the transmission copper wire is connected with the substrate layer, and the lower bottom surface of the transmission copper wire is larger than the upper bottom surface of the transmission copper wire;
the thickness of the copper foil layer is a first thickness, a second thickness or a third thickness; the first thickness is 1-30 μm, the second thickness is 30-38 μm, and the third thickness is 38-48 μm; the distance between the lower bottom surfaces of the adjacent transmission copper wires is a line distance, the line distance comprises a basic line distance, and the line distance is greater than or equal to the basic line distance;
when the thickness of the copper foil layer is the first thickness, the basic line distance is 0.05 mm; when the thickness of the copper foil layer is the second thickness, the basic line distance is 0.06 mm; when the thickness of the copper foil layer is the third thickness, the basic line distance is 0.07 mm.
2. The battery protection plate having a trapezoidal etching structure as set forth in claim 1, wherein:
the etched circuit of the battery protection board is provided with a dense line region; when the line width is 0.01mm-0.1mm and/or the line distance is 0.01mm-0.1mm in the dense line area;
the line spacing within the dense line region is configured to: the device also comprises a dense line compensation space, wherein the dense line compensation space is larger than or equal to 0.02 mm.
3. The battery protection plate having a trapezoidal etching structure as set forth in claim 2, wherein:
when the thickness of the copper foil layer is a first thickness, the dense line compensation distance is 0.02 mm; when the thickness of the copper foil layer is a second thickness, the dense line compensation interval is 0.03 mm; when the thickness of the copper foil layer is a third thickness, the dense line compensation distance is 0.035 mm.
4. The battery protection plate having a trapezoidal etching structure as set forth in claim 1, wherein:
the etched line of the battery protection board is provided with an independent line area, and the line distance between the transmission copper line and the adjacent transmission copper line in the independent line area is greater than or equal to 5 mm;
a line pitch within the single wire region is configured to: the single-line compensation space is larger than or equal to 0.025 mm.
5. The battery protection plate having a trapezoidal etching structure as set forth in claim 4, wherein:
when the thickness of the copper foil layer is a first thickness, the single line compensation distance is 0.025 mm; when the thickness of the copper foil layer is a second thickness, the single line compensation distance is 0.035 mm; when the thickness of copper foil layer is the third thickness, individual line compensation interval is 0.045 mm.
6. The battery protection plate having a trapezoidal etching structure as set forth in claim 1, wherein:
the etched circuit of the battery protection board is provided with a BGA area;
the wire pitch within the BGA area is configured to: still include BGA compensation pitch, BGA compensation pitch is greater than or equal to 0.03 mm.
7. The battery protection plate having a trapezoidal etching structure as set forth in claim 6, wherein:
when the thickness of the copper foil layer is a first thickness, the BGA compensation spacing is 0.03 mm; when the thickness of the copper foil layer is a second thickness, the BGA compensation spacing is 0.04 mm; when the thickness of copper foil layer is the third thickness, BGA compensation interval is 0.05 mm.
8. The battery protection plate having a trapezoidal etching structure as set forth in any one of claims 1 to 7, wherein:
the cross section of the transmission copper wire is isosceles trapezoid.
9. The battery protection plate having a trapezoidal etching structure as set forth in any one of claims 1 to 7, wherein:
the substrate layer is a PI layer, and the copper foil layer comprises a bottom copper layer and a surface copper layer.
10. The battery protection plate having a trapezoidal etching structure as set forth in any one of claims 1 to 7, wherein:
the copper foil layer is covered with the covering film on one side far away from the substrate layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241603.5U CN210609861U (en) | 2019-08-01 | 2019-08-01 | Battery protection board with trapezoidal etching structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921241603.5U CN210609861U (en) | 2019-08-01 | 2019-08-01 | Battery protection board with trapezoidal etching structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210609861U true CN210609861U (en) | 2020-05-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921241603.5U Active CN210609861U (en) | 2019-08-01 | 2019-08-01 | Battery protection board with trapezoidal etching structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210609861U (en) |
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2019
- 2019-08-01 CN CN201921241603.5U patent/CN210609861U/en active Active
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Address after: 510663 north of the first floor, No.9, Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangdong Province Patentee after: Guangzhou Yuankang Precision Electronics Co.,Ltd. Address before: 510700 north of the first floor of the first floor, No.9 Shenzhou Road, Guangzhou high tech Industrial Development Zone, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU JP-WH PRECISION CIRCUIT Co.,Ltd. |